T4-LDS-0279, Rev. 1 (121565) ©2012 Microsemi Corporation Page 1 of 4
1N914
Availa ble on
commercial
version
Glass Axial Switching Di ode
Qualified per MIL-PRF-19500/116
Qualified Levels:
JAN, JANTX, and
JANTXV
DESCRIPTION
This 1N914 JEDEC registered switc h ing /s ignal di ode features internal metallurgical bonded
construction for military grade products per MIL-PRF-19500/116. This small low capacitance
diode, with very fast switching speeds, is hermetically sealed and bonded into a double-plug
DO-35 package. It may be used in a variety of very high speed applications including
switchers, detectors, transient OR'ing, logic arrays, blocking, as well as low-capacitance
steering diodes, etc. Microsemi also offers a variety of other switching/signal diodes.
DO-35 (DO-204AH)
Package
Also available in:
DO-213AA package
(surface mount)
1N914UR
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• JEDEC registered 1N914 number.
• Hermetically sealed glass construction.
• Metallurgically bonded.
• Double plug cons tr uc tion .
• Very low capacitance.
• Very fast switching speeds with minimal reverse recovery times.
• JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
(See part nomenclature for all available options.)
• RoHS compliant version available (commercial grade only).
APPLICATIONS / BENEFITS
• High frequency data lines.
• Small size for high density mounting using flexible thru-hole leads (see package ill ustration) .
• RS-232 & RS–422 interface networks.
• Ethernet 10 base T.
• Low-capac itan ce ste er ing diod es.
• LAN.
• Computers.
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ & TSTG
-65 to +175
oC
Thermal Resi stan ce Jun cti on-to-Lead (1)
RӨJL
250
oC/W
Thermal Resi stan ce Jun cti on-to-Ambient (2)
RӨJA
325
oC/W
Maximum Breakdown Voltage
V(BR)
100
V
Working Peak Reverse Voltage
VRWM
75
V
Average Rectified Current @ TA = 75 ºC (3)
IO
200
mA
Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms)
IFSM
2
A (pk)
NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves.
2. TA = +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu,
horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance
conditi on included, is meas ured at IO = 200 mA.
3. See Figure 1 for derating.
T4-LDS-0279, Rev. 1 (121565) ©2012 Microsemi Corporation Page 2 of 4
1N914
MECHANICAL and PACKAGING
• CASE: Hermetically sealed glass package.
• TERMINALS: Tin/lead plated or RoHS compliant matte-tin (commercial grade only) over copper clad steel. Soldera ble p er M I L-
STD-750, method 2026.
• POLARITY: Cathode indicated by band.
• MARKING: Part number.
• TAPE & REEL option: Standard per EIA-296. Consult factory for quantities.
• WEIGHT: 0.2 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
JAN 1N914 (e3)
Reliability Level
JAN = JAN level
JANTX = JANTX level
JANTXV = JANTXV level
Blank = Commercial grade
JEDEC type number
(see Electrical Characteristics
table)
RoHS Compli ance
e3 = RoHS compliant (on
commercial grade only)
Blank = non-RoHS compliant
SYMBOLS & DEFINITIONS
Symbol
Definition
IR
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
IO
Average Rectified Forward Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
input and a 180 degree conduction angle.
t
rr
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs.
V
F
Forward Voltage: The forward voltage the device will exhibit at a specified current (typically shown as maximum
value).
VR
Reverse Voltage: The reverse voltage dc value, no alternating component.
VRWM
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B). Also sometimes known as PIV.
ELECTRICA L CHARACTERISTICS @ 25 ºC unless otherwise noted
FORWARD
VOLTAGE
VF1 @
IF=10 mA
FORWARD
VOLTAGE
VF2 @
IF=50 mA
REVERSE
RECOVERY
TIME
trr
(Note 1)
FORWARD
RECOVERY
TIME
tfr
(Note 2)
REVERSE
CURRENT
IR1 @ 20 V
REVERSE
CURRENT
IR2 @ 75 V
REVERSE
CURRENT
IR3
@ 20 V
TA=150
o
C
REVERSE
CURRENT
IR4
@ 75 V
TA=150
o
C
CAPACI-
TANCE
C
(Note 3)
CAPACI-
TANCE
C
(Note 4)
V
V
ns
ns
nA
µA
µA
µA
pF
pF
0.8 1.2 5 20 25 0.5 35 75 4.0 2.8
NOTE 1: IF = IR = 10 mA, RL = 100 Ohms. NOTE 3: VR = 0 V, f = 1 MHz, VSIG = 50 mV (pk to pk).
NOTE 2: IF = 50 mA. NOTE 4: VR = 1.5V, f = 1 MHz, VSIG = 50 mV (pk to pk).
T4-LDS-0279, Rev. 1 (121565) ©2012 Microsemi Corporation Page 3 of 4
1N914
GRAPHS
TA (ºC) (Ambient)
FIGURE 1 – Temperature – Current Derating
Time (s)
FIGURE 2 – Thermal Impedance
DC Operation Maximum Io Rating (mA)
Theta (°C/W)
T4-LDS-0279, Rev. 1 (121565) ©2012 Microsemi Corporation Page 4 of 4
1N914
PACKAGE DIMENSIONS
Ltr
Dimensions
Notes
Inch
Millimeters
Min
Max
Min
Max
BD
.056
.075
1.42
1.91
3
BL
.140
.180
3.56
4.57
3
LD
.018
.022
0.46
0.56
LL
1.000
1.500
25.40
38.10
LL1
.050
1.27
4
NOTES:
1. Dimensions are in inch.
2. Millimeters are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder
but shall not be subject to minimum limit of BD. The BL dimension shall include the entire body including
slugs.
4. Within this zone lead, diameter may vary to allow for lead finishes and i rregularities other than heat slugs.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
