EVALUATION KIT AVAILABLE MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor General Description The MAX5924/MAX5925/MAX5926 1V to 13.2V hot-swap controllers allow the safe insertion and removal of circuit cards into live backplanes. These devices hot swap supplies ranging from 1V to 13.2V provided that the device supply voltage, VCC, is at or above 2.25V and the hot-swapped supply, VS, does not exceed VCC. The MAX5924/MAX5925/MAX5926 hot-swap controllers limit the inrush current to the load and provide a circuitbreaker function for overcurrent protection. The devices operate with or without a sense resistor. When operating without a sense resistor, load-probing circuitry ensures a short circuit is not present during startup, then gradually turns on the external MOSFET. After the load probing is complete, on-chip comparators provide overcurrent protection by monitoring the voltage drop across the external MOSFET on-resistance. In the event of a fault condition, the load is disconnected. The devices include many integrated features that reduce component count and design time, including configurable turn-on voltage, slew rate, and circuit-breaker threshold. An on-board charge pump provides the gate drive for a lowcost, external nMOSFET. The MAX5924/MAX5925/MAX5926 are available with open-drain PGOOD and/or PGOOD outputs. The MAX5925/MAX5926 also feature a circuit breaker with temperature-compensated RDS(ON) sensing. The MAX5926 features a selectable 0ppm/C or 3300ppm/C temperature coefficient. The MAX5924 temperature coefficient is 0ppm/C and the MAX5925 temperature coefficient is 3300ppm/C. Autoretry and latched faultmanagement configurations are available (see the Selector Guide). Applications Base Stations RAID Remote-Access Servers Network Routers and Switches Servers Portable Device Bays MAX is a registered trademark of Maxim Integrated Products, Inc. Selector Guide and Ordering Information appears at end of data sheet. 19-3443; Rev 4; 1/16 Benefits and Features Hot Swap 1V to 13.2V with VCC 2.25V Drive High-Side nMOSFET Operation With or Without RSENSE Temperature-Compensated RDS(ON) Sensing Protected During Turn-On into Shorted Load Adjustable Circuit-Breaker Threshold Programmable Slew-Rate Control Programmable Turn-On Voltage Autoretry or Latched Fault Management 10-Pin MAX(R) or 16-Pin QSOP Packages Typical Operating Circuits TYPICAL OPERATION WITHOUT RSENSE BACKPLANE VS VCC REMOVABLE CARD N 1V TO VCC RCB RSC CB VCC GND VOUT 2.25V TO 13.2V GATE SENSE OUT MAX5925 MAX5926 SC_DET GND SEE FIGURE 1 FOR A DETAILED TYPICAL OPERATING CIRCUIT WITHOUT RSENSE. BACKPLANE VS VCC TYPICAL OPERATION WITH RSENSE REMOVABLE CARD RSENSE 1V TO VCC VOUT 2.25V TO 13.2V RCB CB VCC GND N GND SENSE GATE OUT MAX5924 MAX5926 SEE FIGURE 2 FOR A DETAILED TYPICAL OPERATING CIRCUIT WITH RSENSE. MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Absolute Maximum Ratings (All voltages referenced to GND, unless otherwise noted.) VCC.........................................................................-0.3V to +14V GATE*.....................................................................-0.3V to +20V All Other Pins.......... -0.3V to the lower of (VCC + 0.3V) or +14V SC_DET Current (200ms pulse width, 15% duty cycle)...140mA Continuous Current (all other pins).....................................20mA Continuous Power Dissipation (TA = +70C) 10-Pin MAX (derate 6.9mW/C above +70C)...........556mW 16-Pin QSOP (derate 18.9mW/C above +70C)......1509mW Operating Temperature Range.......................... -40C to +105C Junction Temperature.......................................................+150C Storage Temperature Range............................. -65C to +150C Lead Temperature (soldering, 10s).................................. +300C Soldering Temperature (reflow)........................................+260C *GATE is internally driven and clamped. Do not drive GATE with external source. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (VCC, EN (MAX5924/MAX5925), EN1 (MAX5926) = +2.7V to +13.2V; EN2 (MAX5926) = 0V; VS (see Figure 1) = +1.05V to VCC; TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = 5V, RL = 500 from OUT to GND, CL = 1F, SLEW = open, TA = +25C, unless otherwise noted.) (Note 1) PARAMETER POWER SUPPLIES SYMBOL VCC Operating Range VCC Supply Current ICC VS Operating Range VS UNDERVOLTAGE LOCKOUT (UVLO) UVLO Threshold VCC UVLO Deglitch Time VCC UVLO Startup Delay LOAD-PROBE Load-Probe Resistance (Note 3) Load-Probe Timeout Load-Probe Threshold Voltage CIRCUIT BREAKER VUVLO tDG RLP tLP VLP,TH ICB25 ICB85 www.maximintegrated.com MIN TYP MAX UNITS V 2.7 13.2 VS as defined in Figure 1 1.0 VCC Default value, VS and VCC increasing, Figure 1 1.73 FET is fully enhanced, SC_DET = VCC 1.5 (Note 2) tD,UVLO ICB Circuit-Breaker Programming Current CONDITIONS 2.7V < VCC < 5V 5V < VCC < 13.2V 2.06 2.5 2.47 900 V mA V s 123 200 350 4 30 65 3 10 20 ms 43 102 205 ms (Note 4) 172 200 235 mV TC = high (MAX5926), VCC = 2.7V and VCB = 1V MAX5924 2.7V VCC 13.2V 34 37 42 VCC = 2.7V, VCB = 1V, TA = +25C 30 40 50 VCC = 2.7V, VCB = 1V, TA = +105C (MAX5925D) 45 60 80 2.7V VCC 13.2V, TA = +25C 40 50 60 2.7V VCC 13.2V, TA = +105C (MAX5925D) 40 60 80 VCC = 2.7V and VCB = 1V, TA = +85C 40 50 60 2.7V VCC 13.2V, TA = +85C 50 60 70 TC = low (MAX5926), MAX5925 (Note 5) TC = low (MAX5926), MAX5925 (Note 5) 37 A Maxim Integrated 2 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Electrical Characteristics (continued) (VCC, EN (MAX5924/MAX5925), EN1 (MAX5926) = +2.7V to +13.2V; EN2 (MAX5926) = 0V; VS (see Figure 1) = +1.05V to VCC; TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = 5V, RL = 500 from OUT to GND, CL = 1F, SLEW = open, TA = +25C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL Circuit-Breaker Programming Current During Startup ICB,SU Circuit-Breaker Enable Threshold VCB,EN Circuit-Breaker Comparator Offset Voltage VCB_OS CONDITIONS MIN VGATE - VOUT, rising gate voltage (Note 6) 2.3 RCBF Figure 3 1.2 Slow Circuit-Breaker Delay tCBS VCB - VSENSE = 10mV 0.95 VGATE = 2.5V, VCC = 13.2V, TA = -40C to +85C VGATE = 2.5V, VCC = 13.2V, TA = -40C to +105C (MAX5925D) Circuit-Breaker Trip Gate Pulldown Current Circuit-Breaker Temperature Coefficient OUT Current MOSFET DRIVER tCBF IGATE,PD TCICB VCB - VSENSE = 500mV Load Voltage Slew Rate Gate Pullup Current Capacity ENABLE COMPARATOR EN, EN1 Reference Threshold EN, EN1 Hysteresis SR IGATE VEN/UVLO VEN,HYS A 4.65 V 0.3 4.7 mV 1.9 2.7 k 1.6 2.95 ms 280 ns 13.5 27 mA 12 27 mA 0 MAX5925, TC = low (MAX5926) 3300 IOUT VGS ppm/C 120 VGATE - VOUT 2.7V VCC 13.2V, TA = -40C to +105C (MAX5925D) 4.2 5.5 A 7.2 V 4.0 SLEW = open, CGATE = 10nF 2.19 VGATE = 0V 239 CSLEW = 300nF, CGATE = 10nF (Note 8) UNITS 3.6 MAX5924, TC = high (MAX5926) 2.7V VCC 13.2V, TA = -40C to +85C External Gate Drive MAX 2 x ICB Fast Circuit-Breaker Offset Resistor Fast Circuit-Breaker Delay TYP 5.5 7.2 9.5 V/ms 0.84 A VEN (MAX5924/MAX5925) or VEN1 (MAX5926) rising, TA = -40C to +85C 0.747 0.795 0.850 VEN (MAX5925D) rising, TA = -40C to +105C 0.747 0.795 0.875 V 30 mV IEN EN (MAX5924/MAX5925) = VCC, EN1 (MAX5926) = VCC 8 50 nA Power-Good Output Low Voltage VOL IOL = 1mA 0.3 0.4 V Power-Good Output Open-Drain Leakage Current IOH PGOOD/PGOOD = 13.2V 0.2 1 A 3.6 4.7 V EN, EN1 Input Bias Current DIGITAL OUTPUTS (PGOOD, PGOOD) Power-Good Trip Point Power-Good Hysteresis www.maximintegrated.com VTHPGOOD VGATE - VOUT, rising gate voltage VPG,HYS VCB_EN 0.36 V Maxim Integrated 3 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Electrical Characteristics (continued) (VCC, EN (MAX5924/MAX5925), EN1 (MAX5926) = +2.7V to +13.2V; EN2 (MAX5926) = 0V; VS (see Figure 1) = +1.05V to VCC; TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = 5V, RL = 500 from OUT to GND, CL = 1F, SLEW = open, TA = +25C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS LOGIC AND TIMING (TC, LATCH (MAX5926), EN2 (MAX5926) Autoretry Delay tRETRY Autoretry mode VIH Input Voltage VIL TYP MAX UNITS 0.6 1.6 3.3 s 2.0 V 0.4 Input Bias Current IBIAS Logic high at 13.2V Time to Clear a Latched Fault TCLR MAX5924A/MAX5924B MAX5925A/MAX5925B MAX5926 in latched mode Note Note Note Note Note MIN 3 A 200 S 1: 2: 3: 4: 5: All devices are 100% tested at TA = +25C and +85C. All temperature limits at -40C are guaranteed by design. VCC drops 30% below the undervoltage lockout voltage during tDG are ignored. RLP is the resistance measured between VCC and SC_DET during the load-probing phase, tLP. Tested at +25C and +85C. Guaranteed by design at -40C. The circuit-breaker programming current increases linearly from VCC = 2.25V to 5V. See the Circuit-Breaker Current vs. Supply Voltage graph in the Typical Operating Characteristics. Note 6: See the Startup Mode section for more information. Note 7: VGATE is clamped to 17V (typ) above ground. Note 8: dv/dt = 330 x 10-9/CSLEW (V/ms), nMOS device used for measurement was IRF9530N. Slew rate is measured at the load. Typical Operating Characteristics (VCC = 5V, CL = 1F, CSLEW = 330nF, CGATE = 10nF, RL = 500, Figure 1, TA = +25C, unless otherwise noted.) VCC = VS 2.0 DISABLED 0.8 VCC = 5.0V 1.2 VCC = 3.0V 0.8 0.4 4 6 8 VCC (V) www.maximintegrated.com 10 12 14 0 6 5 VS = 1V VS = 3V 4 VS = 5V VS = VCC VCC = 2.25V 3 0.4 2 7 VCC = 13.2V 1.6 1.2 ICC (mA) ICC (mA) 1.6 0 2.4 VGATE - VS (V) ENABLED MAX5924 toc02 VCC = VS MAX5924 toc01 2.0 GATE-DRIVE VOLTAGE vs. SUPPLY VOLTAGE MAX5926 SUPPLY CURRENT vs. TEMPERATURE MAX5924 toc03 MAX5926 SUPPLY CURRENT vs. SUPPLY VOLTAGE -40 -15 10 35 60 TEMPERATURE (C) 85 2 2 4 6 8 10 12 14 VCC (V) Maxim Integrated 4 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Typical Operating Characteristics (continued) (VCC = 5V, CL = 1F, CSLEW = 330nF, CGATE = 10nF, RL = 500, Figure 1, TA = +25C, unless otherwise noted.) 52 ICB (A) VCC = 3.0V VCC = 13.2V 10 35 60 TEMPERATURE (C) 85 VCC = VS 4 6 8 10 12 80 CIRCUIT-BREAKER PROGRAMMING CURRENT vs. TEMPERATURE VCC = VS = 5V 70 ICB (A) 38.8 TC = 3300ppm/C 50 38.6 40 38.4 30 4 6 8 VCC (V) www.maximintegrated.com 10 12 2 4 6 14 20 TC = 0ppm/C -40 -15 10 8 10 12 14 VCC (V) 60 2 47 14 VS (V) 39.0 ICB (A) 2 0 CIRCUIT-BREAKER CURRENT vs. SUPPLY VOLTAGE (TC = 0ppm/C) 39.2 38.2 VCC = 13.2V 35 TEMPERATURE (C) 60 85 SLEW RATE vs. CSLEW 100 SLEW RATE (V/ms) -15 MAX5924 toc07 39.4 -40 36 51 49 TC = 0ppm/C 40 3.5 3.0 44 MAX5924 toc09 4.0 48 VCC = VS 53 MAX5924 toc08 VGS (V) 5.0 4.5 TC = 3300ppm/C CIRCUIT-BREAKER CURRENT vs. SUPPLY VOLTAGE (TC = 3300ppm/C) MAX5924 toc06 VCC = 5.0V 55 ICB (A) VCC = VS 5.5 56 MAX5924 toc04 6.0 CIRCUIT-BREAKER CURRENT vs. HOT-SWAP VOLTAGE MAX5924 toc05 GATE DRIVE VOLTAGE vs. TEMPERATURE 10 1 0.1 0 500 1000 1500 2000 CSLEW (nF) Maxim Integrated 5 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Typical Operating Characteristics (continued) (VCC = 5V, CL = 1F, CSLEW = 330nF, CGATE = 10nF, RL = 500, Figure 1, TA = +25C, unless otherwise noted.) TURN-ON WAVEFORM (CSLEW = OPEN) TURN-ON WAVEFORM (CSLEW = 330nF) MAX5924 toc10 GATE 5V/div MAX5924 toc11 GATE 5V/div 0V 0V OUT 5V/div 0V OUT 5V/div 0V PGOOD 5V/div 0V PGOOD 5V/div 0V 2ms/div 200s/div OVERCURRENT CIRCUIT-BREAKER EVENT TURN-OFF WAVEFORM MAX5924 toc13 MAX5924 toc12 1A/div EN1 5V/div 0V GATE 5V/div 0V IFET 0A tCBS 10V/div GATE 0V 10V/div 0V OUT PGOOD 5V/div 0V 2s/div AUTORETRY DELAY MAX5924 toc14 1A/div EN1 tD,UVLO 0A GATE 5V/div OUT 0V 5V/div 0V 2s/div www.maximintegrated.com 0V MAX5924 toc15 5V/div 0V tRETRY 5V/div SC_DET 0V OUT 100mV/div 5V/div PGOOD 0V 400s/div SHORT-CIRCUIT CIRCUIT-BREAKER EVENT IFET 5V/div PGOOD 0V 400ms/div Maxim Integrated 6 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Typical Operating Characteristics (continued) (VCC = 5V, CL = 1F, CSLEW = 330nF, CGATE = 10nF, RL = 500, Figure 1, TA = +25C, unless otherwise noted.) OVERCURRENT FAULT AND AUTORETRY DELAY UVLO DELAY AND LOAD PROBING MAX5924 toc16 EN1 GATE SC_DET MAX5924 toc17 5V/div 0V 5V/div 0V EN1 5V/div SC_DET 5V/div 0V tD,UVLO tLP 5V/div 0V OUT 200mV/div 0V OUT 100mV/div 0V 0V 400ms/div UVLO RESPONSE 40ms/div UVLO DEGLITCH RESPONSE MAX5924 toc18 MAX5924 toc19 >tDG 2V/div GATE 2V/div GATE <tDG 0V 1V/div VCC 1V/div VCC 0V 0V 200s/div www.maximintegrated.com 0V 200s/div Maxim Integrated 7 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Pin Configurations TOP VIEW VCC 1 VCC 1 SC_DET 2 EN 3 PGOOD (PGOOD) GND 10 CB 9 SENSE 8 OUT 4 7 GATE 5 6 SLEW MAX5924 MAX5925 MAX 16 CB 15 SENSE SC_DET 2 14 OUT EN1 3 PGOOD 4 MAX5926 13 GATE GND 5 12 SLEW EN2 6 11 N.C. PGOOD 7 EP LATCH 8 ( ) FOR THE MAX5924A, MAX5924C, MAX5925A, AND MAX5925C. 10 N.C. 9 TC QSOP Pin Description PIN MAX5924A/ MAX5924C/ MAX5925A/ MAX5925C 1 MAX5924B/ MAX5924D/ MAX5926 MAX5925B/ MAX5925D 1 1 2 2 2 3 3 -- NAME VCC FUNCTION Power-Supply Input. Connect VCC to a voltage between 2.47V and 13.2V. VCC must always be equal to or greater than VS (see Figure 1). Short-Circuit Detection Output. Connect SC_DET to VOUT through a series resistor, RSC, when not using RSENSE. SC_DET forces current (limited to 200mA) into the external load through RSC at startup to determine whether SC_DET there is a short circuit (load probing). Connect SC_DET directly to VCC when using RSENSE, Do not connect SC_DET to VCC when not using RSENSE in an attempt to disable load probing. EN ON/OFF Control Input. Drive EN high to enable the device. Drive EN low to disable the device. An optional external resistive-divider connected between VCC, EN, and GND sets the programmable turn-on voltage. 4 -- 4 PGOOD Open-Drain Active-Low Power-Good Output -- 4 7 PGOOD Open-Drain Active-High Power-Good Output 5 5 5 GND 6 6 12 SLEW Slew-Rate Adjustment Input. Connect an external capacitor between SLEW and GND to adjust the gate slew rate. Leave SLEW unconnected for the default slew rate. 7 7 13 GATE Gate-Drive Output. Connect GATE to the gate of the external n-channel MOSFET. 8 8 14 OUT Output Voltage. Connect OUT to the source of the external MOSFET. 9 9 15 SENSE 10 10 16 CB www.maximintegrated.com Ground Circuit-Breaker Sense Input. Connect SENSE to OUT when not using an external RSENSE (Figure 1). Connect SENSE to the drain of the external MOSFET when using an external RSENSE (Figure 2). Circuit-Breaker Threshold Programming Input. Connect an external resistor, RCB, from CB to VS to set the circuit-breaker threshold voltage. Maxim Integrated 8 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Pin Description (continued) PIN MAX5924A/ MAX5924C/ MAX5925A/ MAX5925C MAX5924B/ MAX5924D/ MAX5926 MAX5925B/ MAX5925D NAME FUNCTION -- -- 3 EN1 Active-High ON/OFF Control Input. Drive EN1 high to enable the device when EN2 is low. Drive EN1 low to disable the device, regardless of the state of EN2. An optional external resistive-divider between VCC, EN1, and GND sets the programmable turn-on voltage while EN2 is low. -- -- 6 EN2 Active-Low ON/OFF Control Input. Drive EN2 low to enable the device when EN1 is high. Drive EN2 high to disable the device, regardless of the state of EN1. -- -- 8 LATCH Latch Mode Input. Drive LATCH low for autoretry mode. Drive LATCH high for latched mode. -- -- 9 TC Circuit-Breaker Temperature Coefficient Selection Input. Drive TC low to select a 3300ppm/C temperature coefficient. Drive TC high to select a 0ppm/C temperature coefficient. -- -- 10, 11 N.C. -- -- EP EP www.maximintegrated.com No Connection. Not internally connected. Exposed Pad. Connect EP to GND. Maxim Integrated 9 MAX5924/MAX5925/ MAX5926 BACKPLANE VS VCC 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor REMOVABLE CARD 1V TO VCC 2.25V TO 13.2V RSC RCB 10 CB 1F GND GATE SENSE VCC 20k V+ OUT ON (ON*) SC_DET MAX5925 MAX5926 PGOOD** EN (EN1**) EN PGOOD (PGOOD*) EN2** EN2 TC** CL LATCH** GND GND SLEW CSLEW *MAX5925A AND MAX5925C. **MAX5926. DC-DC CONVERTER Figure 1. Typical Operating Circuit (Without RSENSE) BACKPLANE REMOVABLE CARD RSENSE 1V TO VCC VS 2.25V TO 13.2V VCC 20k RCB 10 GND 10 CB SENSE GATE VCC 1F MAX5924 MAX5926 EN (EN1**) EN VCC TC** ON (ON*) CL PGOOD** PGOOD (PGOOD*) EN2** EN2 V+ OUT SC_DET LATCH** *MAX5924A AND MAX5924C. **MAX5926. GND GND SLEW CSLEW DC-DC CONVERTER Figure 2. Typical Operating Circuit (With RSENSE) www.maximintegrated.com Maxim Integrated 10 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor GATE 50k VCC CHARGE PUMP SLEW VZ = 9V N A MAX5924 MAX5925 MAX5926 2A VCC N VCB,TH CB 75k RLP SC_DET SLOW COMPARATOR VS OUT TIMER RCBF VCBF,TH 75k FAST COMPARATOR 0.2V OSCILLATOR ICB TC*** PGOOD* SENSE VCC LOGIC CONTROL PGOOD** LATCH*** EN/(EN1***) VCC 0.8V VCC GND 1.24V EN2*** *MAX5924B, MAX5924D, MAX5925B, MAX5925D, MAX5926 ONLY. **MAX5924A, MAX5924C, MAX5925A, MAX5925C, MAX5926 ONLY. ***MAX5926 ONLY. Figure 3. Functional Diagram www.maximintegrated.com Maxim Integrated 11 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Detailed Description The MAX5924/MAX5925/MAX5926 are hot-swap controller ICs designed for applications where a line card is inserted into a live backplane. Normally, when a line card is plugged into a live backplane, the card's discharged filter capacitors provide a low impedance that can momentarily cause the main power supply to collapse. The MAX5924/ MAX5925/MAX5926 are designed to reside either in the backplane or in the removable card to provide inrush current limiting and short-circuit protection. This is achieved using an external nMOSFET and an optional external current-sense resistor. Several critical parameters can be configured: Slew rate (inrush current) Circuit-breaker threshold Turn-on voltage Fault-management mode (MAX5926) Circuit-breaker temperature coefficient (MAX5926) VCC RISES ABOVE VUVLO NO ENABLE TRUE? YES FAULT MANAGEMENT UVLO 200ms DELAY YES RSENSE PRESENT? NO ICB,SU = 2 x ICB DISABLE SLOW COMPARATOR See the Selector Guide for a device-specific list of factorypreset features and parameters. DISABLE FAULT PROTECTION, ENABLE LOAD PROBE LOAD PROBE SUCCESSFUL? NO YES SLEW-RATE-LIMITED STARTUP Startup Mode It is important that both VCC and VS rise at a minimum rate of 100mV/ms during the critical time when power voltages are below those values required for proper logic control of internal circuitry. This applies for 0.5V VCC 2.5V and 0.5V VS 0.8V. This is particularly true when LATCH is tied high. The MAX5924/MAX5925/MAX5926 control an external MOSFET placed in the positive power-supply pathway. When power is first applied, the MAX5924/MAX5925/ MAX5926 hold the MOSFET off indefinitely if the supply voltage is below the undervoltage lockout level or if the device is disabled (see the EN (MAX5924/MAX5925), EN1/EN2 (MAX5926) section). If neither of these conditions exist, the device enters a UVLO startup delay period for 200ms. Next, the MAX5924/MAX5925/MAX5926 detect whether an external sense resistor is present; and then autoconfigure accordingly (see Figure 4). If no sense resistor is present, bilevel fault protection is disabled and load-probing circuitry is enabled (see the Load Probing section). If load probing is not successful, the fault is managed according to the selected fault management mode (see the Latched and Autoretry Fault Management section). If load probing (see the Load Probing section) is successful, slew-rate limiting is employed to gradually turn on the MOSFET. www.maximintegrated.com NO VGS VCB,EN VGS VTHPGOOD YES ENABLE STANDARD BILEVEL FAULT PROTECTION BEGIN NORMAL OPERATION PGOOD Figure 4. Startup Flow Chart If the device detects an external RSENSE, circuitbreaker threshold is set at 2xICB, the slow comparator is disabled, the startup phase begins without delay for load probing, and slew-rate limiting is employed to gradually turn on the MOSFET. During the startup phase, the voltage at the load, VOUT, rises at a rate determined by the selected slew rate (see the Slew Rate section). The inrush current (IINRUSH) to the load is limited to a level proportional to the load capacitance (CL) and the slew rate: IINRUSH = C L x SR 1000 where SR is the slew rate in V/ms and CL is load capacitance in F. For operation with and without RSENSE, once VGATE VOUT exceeds VCB,EN, PGOOD and/or PGOOD assert. When VGATE - VOUT = VCB,EN, the devices enable standard bilevel fault protection with normal ICB (see the Bilevel Fault Protection section). Maxim Integrated 12 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Load Probing The devices' load-probing circuitry detects short-circuit conditions during startup. Load probing is active only when no external RSENSE is detected. As the device begins load probing, SC_DET is connected to VCC through an internal switch with an on-resistance of RLP (Figure 6). VCC then charges the load with a probe current limited at 200mA. IPROBE = (VCC - VOUT)/(RLP + RSC) (Figure 1) If the load voltage does not reach VLP,TH (0.2V typ) within tLP, a short-circuit fault is detected and the startup mode is terminated according to the selected fault-management mode (see the Latched and Autoretry Fault Management section and Figure 5). If no fault condition is present, PGOOD/PGOOD asserts at the end of the startup period (see the Turn-On Waveforms in the Typical Operating Characteristics). Load probing can only be, and must be, employed when not using an external RSENSE. VOUT SR = dV dt SR = dV dt Normal Operation In normal operation, after startup is complete, protection is provided by turning off the external MOSFET when a fault condition is encountered. Dual-speed/bilevel fault protection incorporates two comparators with different thresholds and response times to monitor the current: 1) Slow comparator. This comparator has a 1.6ms (typ) response time. The slow comparator ignores lowamplitude momentary current glitches. After an extended overcurrent condition, a fault is acknowledged and the MOSFET gate is discharged. 2) Fast comparator. This comparator has a quick response time and a higher threshold voltage. The fast comparator turns off the MOSFET immediately when it detects a large high-current event such as a short circuit. In each case, when a fault is encountered, the powergood output deasserts and the device drives GATE low. After a fault, the MAX5924A, MAX5924B, MAX5925A, and MAX5925B latch GATE low and the MAX5924C, MAX5924D, MAX5925C, and MAX5925D enter the autoretry mode. The MAX5926 has selectable latched CL = SMALL VLP,TH (0.2V typ) VOUT PGOOD* CL = LARGE IINRUSH CL = SMALL IPROBE ILOAD ILOAD tPROBE < tLP PGOOD** VGATE VTHPGOOD Figure 5. Startup Waveform 3.0V TO 6.7V 14 VOUT RLP () 12 10 8 ILIM ILOAD 6 4 VCC = VS 2 4 6 8 10 12 14 tCBS *MAX5924B, MAX5924D, MAX5925B, MAX5925D, AND MAX5926 ONLY. **MAX5924A, MAX5924C, MAX5925A, MAX5925C, AND MAX5926 ONLY. VCC (V) Figure 6. Load-Probe Resistance vs. Supply Voltage www.maximintegrated.com Figure 7. Slow Comparator Response to an Overcurrent Fault Maxim Integrated 13 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor or autoretry modes. Figure 7 shows the slow comparator response to an overcurrent fault. Bilevel Fault Protection Table 1. Selecting Fault Management Mode (MAX5926) LATCH Bilevel Fault Protection in Startup Mode Bilevel fault protection is disabled in startup mode, and is enabled when VGATE-VOUT exceeds VCB,EN at the end of the startup period. When no RSENSE is detected, neither slow nor fast comparator is active during startup because the high RD(ON) of the MOSFET when not fully enhanced would signal an artificially-high VIN-VSENSE voltage. Load probing prior to startup insures that the output is not shortcircuited. When RSENSE is detected, the slow comparator is disabled during startup while the fast comparator remains active. The overcurrent trip level is higher than normal during the startup period because the ICB is temporarily doubled to ICB,SU at this time. This allows higher than normal startup current to allow for output capacitor charging current. FAULT MANAGEMENT Low Autoretry mode High Latched mode Slow Comparator The slow comparator is disabled during startup while the external MOSFET turns on. If the slow comparator detects an overload condition while in normal operation (after startup is complete), it turns off the external MOSFET by discharging the gate capacitance with IGATE,PD. The magnitude of IGATE,PD depends on the external MOSFET gate-to-source voltage (VGS). The discharge current is strongest immediately following a fault and decreases as the MOSFET gate is discharged (Figure 8a). 60 VCC = 13.2V IGATE, PD (mA) 50 40 30 20 10 0 0 1 2 3 4 5 6 7 VGS (V) Figure 8a. Gate Discharge Current vs. MOSFET Gate-to-Source Voltage www.maximintegrated.com Maxim Integrated 14 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Fast Comparator The fast comparator is used for serious current overloads or short circuits. If the load current reaches the fast comparator threshold, the device quickly forces the MOSFET off. The fast comparator has a response time of 280ns, and discharges GATE with IGATE,PD (Figure 8a). The fast comparator is disabled during startup when no RSENSE is detected Latched and Autoretry Fault Management The MAX5924A, MAX5924B, MAX5925A, and MAX5925B latch the external MOSFET off when an overcurrent fault is detected. Following an overcurrent fault, the MAX5924C, MAX5924D, MAX5925C, and MAX5925D enter autoretry mode. The MAX5926 can be configured for either latched or autoretry mode (see Table 1). In autoretry, a fault turns the external MOSFET off then automatically restarts the device after the autoretry delay, tRETRY. During the autoretry delay, pull EN or EN1 low to restart the device. In latched mode, pull EN or EN1 low for at least 100s to clear a latched fault and restart the device. Power-Good Outputs The power-good output(s) are open-drain output(s) that deassert: When VCC < VUVLO During tD,UVLO When VGS < VTHPGOOD During load probing When disabled (EN = GND (MAX5924/MAX5925), EN1 = GND or EN2 = high (MAX5926)) During fault management During tRETRY or when latched off (MAX5924A, MAX5924B, MAX5925A, MAX5925B, or MAX5926 (LATCH = low)). PGOOD/PGOOD asserts only if the part is in normal mode and no faults are present. Undervoltage Lockout (UVLO) UVLO circuitry prevents the devices from turning on the external MOSFET until VCC exceeds the UVLO threshold, VUVLO, for tD,UVLO. UVLO protects the external MOSFET from insufficient gate-drive voltage, and tD,UVLO ensures that the board is fully plugged into the backplane and VCC is stable prior to powering the hot-swapped system. Any input voltage transient at VCC below the UVLO threshold for more than the UVLO deglitch period (tDG) resets the device and initiates a startup sequence. Device operation is protected from momentary inputvoltage steps extending below the UVLO threshold for a deglitch period, tDG. However, the power-good output(s) may momentarily deassert if the magnitude of a negative step in VCC exceeds approximately 0.5V, and VCC drops below VUVLO. Operation is unaffected and the power-good output(s) assert(s) within 200s, as shown in Figure 8b. This figure also shows that if the UVLO condition exceeds tDG = 900s (typ), the power-good output(s) again deassert(s) and the load is disconnected. Determining Inrush Current Determining a circuit's inrush current is necessary to choose a proper MOSFET. The MAX5924/MAX5925/ MAX5926 regulate the inrush current by controlling the output-voltage slew rate, but inrush current is also a function of load capacitance. Determine an anticipated inrush current using the following equation: = CL IINRUSH(A) dVOUT = C L x SR dt x 1000 VS = VCC = 13.2V CSLEW = 1F CL = 10F GATE VCC 1V/div PGOOD 1V/div VGATE 2V/div MOSFET ONLY MOSFET AND CGATE = 20nF 5V/div 0V 200s/div Figure 8b. PGOOD Behavior with Large Negative Input-Voltage Step when VS is Near VS(MIN) www.maximintegrated.com 0V 10ms/div Figure 9. Impact of CGATE on the VGATE Waveform Maxim Integrated 15 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor where CL is the load capacitance in F and SR is the selected device output slew rate in V/ms. For example, assuming a load capacitance of 100F and using the value of SR = 10V/ms, the anticipated inrush current is 1A. If a 16V/ms output slew rate is used, the inrush current increases to 1.6A. Choose SR so the maximum anticipated inrush current does not trip the fast circuitbreaker comparator during startup. SLEW sets the maximum slew rate to the minimum value. Calculate CSLEW using the following equation: Slew Rate A 2A (typ) pullup current clamped to 1.4V causes an initial jump in the gate voltage, VGATE, if CGATE is small and the slew rate is slow (Figure 3). Figure 9 illustrates how the addition of gate capacitance minimizes this initial jump. CGATE should not exceed 25nF. The MAX5924/MAX5925/MAX5926 limit the slew rate of VOUT. Connect an external capacitor, CSLEW, between SLEW and GND to adjust the slew-rate limit. Floating CSLEW = 330 10-9 / SR where, SR is the desired slew rate in V/ms and CSLEW is in nF. This equation is valid for CSLEW 100nF. For higher SR, see the Typical Operating Characteristics. EN (MAX5924/MAX5925), EN1/EN2 (MAX5926) VS The enable comparators control the on/off function of the MAX5924/MAX5925/MAX5926. Enable is also used to reset the fault latch in latch mode. Pull EN or EN1 low for 100s to reset the latch. A resistive divider between EN or EN1, VS, and GND sets the programmable turn-on voltage to a voltage greater than VUVLO (Figure 10). RCB R1 VCC CB GATE SENSE OUT EN (EN1) MAX5924_ MAX5925_ MAX5926 R2 (EN2) RSC SC_DET GND ( ) ARE FOR MAX5926 ONLY. VS,TURN-ON = (R2 + R1) VEN/UVLO R2 Figure 10. Adjustable Turn-On Voltage 15,000 Selecting a Circuit-Breaker Threshold The MAX5924/MAX5925/MAX5926 offer a circuit-breaker function to protect the external MOSFET and the load from the potentially damaging effects of excessive current. As load current flows through RDS(ON) (Figure 12) or RSENSE (Figure 13), a voltage drop is generated. After VGS exceeds VCB,EN, the MAX5924/MAX5925/MAX5926 monitor this voltage to detect overcurrent conditions. If this voltage exceeds the circuit-breaker threshold, the 15,000 TC = 0ppm/C 12,000 TC = 3300ppm/C VS = 1.5V 12,000 RCB(MAX) () RCB(MAX) () VS = 1.5V 9000 VS = 1.4V VS = 1.3V 6000 VS = 1.2V VS = 1.1V 3000 VS = 1.4V 9000 VS = 1.3V 6000 VS = 1.2V VS = 1.1V 3000 VS = 1.0V VS = 1.0V 0 -40 -15 10 35 60 85 TEMPERATURE (C) 0 -40 -15 10 35 60 85 TEMPERATURE (C) Figure 11. Maximum Circuit-Breaker Programming Resistor vs. Temperature www.maximintegrated.com Maxim Integrated 16 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor external MOSFET turns off and the power-good output(s) deassert(s). To accommodate different MOSFETs, sense resistors, and load currents, the MAX5924/MAX5925/ MAX5926 voltage across RCB can be set between 10mV and 500mV. The value of the circuit-breaker voltage must be carefully selected based on VS (Figure 11). No RSENSE Mode When operating without RSENSE, calculate the circuitbreaker threshold using the MOSFET's RDS(ON) at the worst possible operating condition, and add a 20% overcurrent margin to the maximum circuit current. For example, if a MOSFET has an RDS(ON) of 0.06 at TA = +25C, and a normalized on-resistance factor of 1.75 at TA = +105C, the RDS(ON) used for calculation is the product of these two numbers, or (0.06) x (1.75) = 0.105. Then, if the maximum current is expected to be 2A, using a 20% margin, the current for calculation is (2A) x (1.2) = 2.4A. The resulting minimum circuit-breaker threshold is then a product of these two numbers, or (0.105) x (2.4A) = 0.252V. Using this method to choose a circuit-breaker threshold allows the circuit to operate under worst-case conditions without causing a circuit-breaker fault, but the circuitbreaker function will still detect a short circuit or a gross overcurrent condition. To determine the proper circuit-breaker resistor value use the following equation, which refers to Figure 12: RCB = (ITRIPSLOW x RDS(ON)(T)) + VCB,OS ICB where ITRIPSLOW is the desired slow-comparator trip current. The fast-comparator trip current is determined by the selected RCB value and cannot be adjusted independently. The fast-comparator trip current is given by: ITRIPFAST = ICB x (R CBF + RCB) VCB,OS RDS(ON)(T) SC_DET must be connected to OUT through the selected RSC when not using RSENSE. RSENSE Mode When operating with RSENSE, calculate the circuit-breaker threshold using the worst possible operating conditions, and add a 20% overcurrent margin to the maximum circuit current. For example, with a maximum expected current of 2A, using a 20% margin, the current for calculation is (2A) x (1.2) = 2.4A. The resulting minimum circuit- ILOAD ILOAD RDS(ON) RSENSE VS VS VOUT VOUT RCB RCB SENSE CB CB GATE SENSE OUT VCB,TH MAX5925 MAX5926 RCBF SLOW COMPARATOR VCB,OS GATE VCB,TH MAX5925 MAX5926 RCBF ICB VCB,OS VCBF,TH Figure 12. Circuit Breaker Using RDS(ON) www.maximintegrated.com SLOW COMPARATOR VCB,OS FAST COMPARATOR TC SELECT OUT FAST COMPARATOR TC SELECT ICB VCB,OS VCBF,TH Figure 13. Circuit Breaker Using RSENSE Maxim Integrated 17 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor breaker threshold is then a product of this current and RSENSE = 0.06, or (0.06) x (2.4A) = 0.144V. Using this method to choose a false circuit-breaker threshold allows the circuit to operate under worst-case conditions without causing a circuit-breaker fault, but the circuitbreaker function will still detect a short-circuit or a gross overcurrent condition. Table 2. Programming the Temperature Coefficient (MAX5926) To determine the proper circuit-breaker resistor value, use the following equation, which refers to Figure 13: Table 3. Suggested External MOSFETs ICB where, ITRIPSLOW is the desired slow-comparator trip current. The fast-comparator trip current is determined by the selected RCB value and cannot be adjusted independently. The fast-comparator trip current is given by: ITRIPFAST = In applications where the external MOSFET's on-resistance is used as a sense resistor to determine overcurrent conditions, a 3300ppm/C temperature coefficient is desirable to compensate for the RDS(ON) temperature coefficient. Use the MAX5926's TC input to select the circuit-breaker programming current's temperature coefficient, TCICB (see Table 2). The MAX5924 temperature coefficient is preset to 0ppm/C, and the MAX5925's is preset to 3300ppm/C. Setting TCICB to 3300ppm/C allows the circuit-breaker threshold to track and compensate for the increase in the MOSFET's RDS(ON) with increasing temperature. Most MOSFETs have a temperature coefficient within a 3000ppm/C to 7000ppm/C range. Refer to the MOSFET data sheet for a device-specific temperature coefficent. RDS(ON) and ICB are temperature dependent, and can therefore be expressed as functions of temperature. At a given temperature, the MAX5925/MAX5926 indicate an overcurrent condition when: ITRIPSLOW x RDS(ON)(T) ICB(T) x RCB + |VCB,OS| www.maximintegrated.com 3300 APPLICATION CURRENT (A) PART DESCRIPTION 1 International Rectifier IRF7401 SO-8 2 Siliconix Si4378DY SO-8 5 Siliconix SUD40N02-06 DPAK 10 Siliconix SUB85N02-03 D2PAK 50 RSENSE Circuit-Breaker Temperature Coefficient 0 Low ICB x (R CBF + RCB) VCB,OS SC_DET should be connected to VCC when using RSENSE. TCICB (ppm/C) High 45 VCB AND VSENSE (mV) RCB = (ITRIPSLOW x RSENSE) + VCB,OS TC VS = VCC = 13.2V, RCB = 672, ITRIPSLOW = 5A, RDS(ON)(25) = 6.5m CIRCUIT-BREAKER TRIP REGION (VSENSE VCB) 40 35 30 VSENSE = RDS(ON)(T) x ILOAD(MAX) (4500ppm/C) 25 20 VCB = ICB(T) x RCB + VCB,OS (3300ppm/C) -40 -15 10 35 60 85 110 TEMPERATURE (C) Figure 14. Circuit-Breaker Trip Point and Current-Sense Voltage vs. Temperature where VCB,OS is the worst-case offset voltage. Figure 14 graphically portrays operating conditions for a MOSFET with a 4500ppm/C temperature coefficient. Applications Information Component Selection nMOSFET Most circuit component values may be calculated with the aid of the devices. The "Design calculator for choosing component values" software can be downloaded from the MAX5924-MAX5926 Quickview on the Maxim website. Maxim Integrated 18 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Table 4. Component Manufacturers COMPONENT MANUFACTURER PHONE Dale-Vishay 402-564-3131 www.vishay.com Sense Resistors MOSFETs WEBSITE IRC 828-264-8861 www.irctt.com Fairchild 888-522-5372 www.fairchildsemi.com International Rectifier 310-233-3331 www.irf.com Select the external nMOSFET according to the application's current and voltage level. Table 3 lists some recommended components. Choose the MOSFET's onresistance, RDS(ON), low enough to have a minimum voltage drop at full load to limit the MOSFET power dissipation. High RDS(ON) can cause undesired power loss and output ripple if the board has pulsing loads or triggers an external undervoltage reset monitor at full load. Determine the device power-rating requirement to accommodate a short circuit on the board at startup with the device configured in autoretry mode. Using the devices in latched mode allows the consideration of MOSFETs with higher RDS(ON) and lower power ratings. A MOSFET can typically withstand single-shot pulses with higher dissipation than the specified package rating. Low MOSFET gate capacitance is not necessary since the inrush current limiting is achieved by limiting the gate dv/ dt. Table 4 lists some recommended manufacturers and components. Be sure to select a MOSFET with an appropriate gate drive (see the Typical Operating Characteristics). Typically, for VCC less than 3V, select a 2.5V VGS MOSFET. charge to a voltage above VIN until the external MOSFET's body diode conducts to clamp the capacitor voltage at VIN plus the body-diode VF. When testing or operating with no load, it is therefore recommended that the output capacitor be paralleled with a resistor of value: R = VX/120A where VX is the maximum acceptable output voltage prior to hot-swap completion. Design Procedure Given: VCC = VS = 5V CL = 150F Full-Load Current = 5A No RSENSE IINRUSH = 500mA Procedures: 1) Calculate the required slew rate and corresponding CSLEW: = SR Optional Sense Resistor Select the sense resistor in conjunction with RCB to set the slow and fast circuit-breaker thresholds (see the Selecting a Circuit-Breaker Threshold section). The sense-resistor power dissipation depends on the device configuration. If latched mode is selected, PRSENSE = (IOVERLOAD)2 x RSENSE; if autoretry is selected, then PRSENSE = (IOVERLOAD)2 x RSENSE x (tON/tRETRY). Choose a sense-resistor power rating of twice the PRSENSE for long-term reliable operation. In addition, ensure that the sense resistor has an adequate I2T rating to survive instantaneous short-circuit conditions. No-Load Operation The internal circuitry is capable of sourcing a current at the OUT terminal of up to 120A from a voltage VIN + VGS. If there is no load on the circuit, the output capacitor will www.maximintegrated.com = C SLEW IINRUSH V = 3.3 1000 x C L ms 330 x 10 -9 330 x 10 -9 = = 0.1F SR 3.3 V ms 2) Select a MOSFET and determine the worst-case power dissipation. 3) Minimize power dissipation at full load current and at high temperature by selecting a MOSFET with an appropriate RDS(ON). Assume a 20C temperature difference between the devices and the MOSFET. For example, at room temperature the IRF7822's RDS(ON) = 6.5m. The temperature coefficient for this device is 4000ppm/C. The maximum RDS(ON) for the MOSFET at TJ(MOSFET) = +105C is: ppm R DS(ON)105 = 6.5m x 1 + (105C - 25C) x 4000 C = 8.58m Maxim Integrated 19 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor The power dissipation in the MOSFET at full load is: 2 P= R (5A) 2 x 8.58m= 215mW D I= 4) Select RCB. Since the MOSFET's temperature coefficient is 4000ppm/C, which is greater than TCICB (3300ppm/C), calculate the circuit-breaker threshold at high temperature so the circuit breaker is guaranteed not to trip at lower temperature during normal operation (Figure 15). ITRIPSLOW = IFULL LOAD + 20% = 5A + 20% = 6A RDS(ON)105 = 8.58m (max), from step 2 ICB85 = 58A x (1 + (3300ppm/C x (85 - 25)C) = 69.5A (min) RCB = (ITRIPSLOW x R DS(ON)105 ) + VCB,OS I CB85 RCB = ((6A x 8.58m) + 4.7mV)/69.5A = 808 Layout Considerations Keep all traces as short as possible and maximize the highcurrent trace dimensions to reduce the effect of undesirable parasitic inductance. Place the MAX5924/MAX5925/ MAX5926 close to the card's connector. Use a ground plane to minimize impedance and inductance. Minimize the current-sense resistor trace length (<10mm), and ensure accurate current sensing with Kelvin connections. When the output is short circuited, the voltage drop across the external MOSFET becomes large. Hence, the power dissipation across the switch increases, as does the die temperature. An efficient way to achieve good power dissipation on a surface-mount package is to lay out two copper pads directly under the MOSFET package on both sides of the board. Connect the two pads to the ground plane through vias, and use enlarged copper mounting pads on the top side of the board. It is important to maximize the thermal coupling between the MOSFET and the MAX5925/MAX5926 to balance the device junction temperatures. When the temperatures of the two devices are equal, the circuit-breaker trip threshold is most accurate. Keep the MOSFET and the MAX5925/MAX5926 as close to each other as possible to facilitate thermal coupling. HIGH-CURRENT PATH SENSE RESISTOR RCB MAX5924 MAX5925 MAX5926 Figure 15. Kelvin Connection for the Current-Sense Resistor www.maximintegrated.com Maxim Integrated 20 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Selector Guide POWER-GOOD OUTPUT CIRCUIT-BREAKER TEMPCO (ppm/C) FAULT MANAGEMENT MAX5924A 0 MAX5924B 0 MAX5924C PGOOD (OPEN-DRAIN) PGOOD (OPEN-DRAIN) Latched u -- Latched -- u 0 Autoretry u -- MAX5924D 0 Autoretry -- u MAX5925A 3300 Latched u -- MAX5925B 3300 Latched -- u MAX5925C 3300 Autoretry u -- MAX5925D 3300 Autoretry -- u 0 or 3300 (Selectable) Latched or Autoretry (Selectable) u u PART MAX5926 Ordering Information PART Chip Information TEMP RANGE PIN-PACKAGE MAX5924AEUB -40C to +85C 10 MAX MAX5924BEUB -40C to +85C 10 MAX MAX5924CEUB* -40C to +85C 10 MAX MAX5924DEUB* -40C to +85C 10 MAX MAX5925AEUB -40C to +85C 10 MAX MAX5925BEUB* -40C to +85C 10 MAX MAX5925CEUB* -40C to +85C 10 MAX MAX5925DEUB* -40C to +85C 10 MAX MAX5926EEE -40C to +85C 16 QSOP-EP** *Future product--contact factory for availability. **EP = Exposed pad. www.maximintegrated.com TRANSISTOR COUNT: 3751 PROCESS: BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 10 MAX U10CN+1 21-0061 10 QSOP-EP E16E-1 21-0112 Maxim Integrated 21 MAX5924/MAX5925/ MAX5926 1V to 13.2V, n-Channel Hot-Swap Controllers Require No Sense Resistor Revision History REVISION NUMBER REVISION DATE PAGES CHANGED 0 8/05 Initial release 1 6/06 Revised data sheet title, General Description, Features, EC table, Typical Operating Circuit, and added No-Load Operation section. 1-13, 15-18 2 10/06 Initial release of MAX5924BEUB and revised EC table. 1-4, 10-12 3 4/10 Revised EC table. 2-4 4 1/16 Updated Circuit-Breaker Programming Current, Circuit-Breaker Trip Gate Pulldown Current, External Gate Drive and EN, EN1 Reference Threshold specifications of the Electrical Characteristics table. 2-3 DESCRIPTION -- For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated's website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. (c) 2016 Maxim Integrated Products, Inc. 22 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Maxim Integrated: MAX5924AEUB+ MAX5924AEUB+T MAX5924BEUB+ MAX5924BEUB+T MAX5924CEUB+ MAX5924CEUB+T MAX5924DEUB+ MAX5924DEUB+T MAX5925AEUB+ MAX5925AEUB+T MAX5925BEUB+ MAX5925BEUB+T MAX5925CEUB+ MAX5925CEUB+T MAX5925DEUB+ MAX5925DEUB+T MAX5926EEE+ MAX5926EEE+T