PD -2.451 rev. B 03/99
Reduced RFI and EMI
Reduced Snubbing
Extensive Characterization of
Recovery Parameters
Features
Description
HEXFREDTM
diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
Ultrafast, Soft Recovery DiodeHEXFREDTM
HFA180NH40R
HALF-PAK
da
BASE ANODE
LUG
TERMINAL
CATHODE
VR = 400V
VF(typ.) = 1.1V
IF(AV) = 180A
Qrr (typ.) = 420nC
IRRM(typ.) = 8.7A
trr(typ.) = 45ns
di(rec)M/dt (typ.) = 280A/µs
Thermal - Mechanical Characteristics
Absolute Maximum Ratings (per Leg)
lbfin
(Nm)
°C/W
K/W
Parameter Min. Typ. Max. Units
RthJC Junction-to-Case 0.20
RthCS Case-to-Sink, Flat, Greased Surface 0.15
Wt Weight 26 (0.9) g (oz)
Mounting Torque 15 (1.7) 25 (2.8)
Terminal Torque 30 (3.4) 40 (4.6)
Vertical Pull 80
2 inch Lever Pull 40
Parameter Max. Units
VRCathode-to-Anode Voltage 400 V
IF @ TC = 25°C Continuous Forward Current 280
IF @ TC = 100°C Continuous Forward Current 138
IFSM Single Pulse Forward Current 1200
EAS Non-Repetitive Avalanche Energy 1.4 mJ
PD @ TC = 25°C Maximum Power Dissipation 521
PD @ TC = 100°C Maximum Power Dissipation 208
TJOperating Junction and
TSTG Storage Temperature Range -55 to +150
W
A
°C
lbfin
Note: Limited by junction temperature Mounting surface must be smooth, flat, free or burrs or other
L = 100µH, duty cycle limited by max TJprotrusions. Apply a thin even film or thermal grease to mounting
125°C surface. Gradually tighten each mounting bolt in 5-10 lbfin steps
until desired or maximum torque limits are reached. Module
1