ECCM1C-15-24.000M Pb RoHS ECCM1 C -15 -24.000M Series RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic SMD Crystal Nominal Frequency 24.000MHz Load Capacitance 15pF Parallel Resonant Frequency Tolerance/Stability 30ppm at 25C, 50ppm over 0C to +70C Mode of Operation AT-Cut Fundamental ELECTRICAL SPECIFICATIONS Nominal Frequency 24.000MHz Frequency Tolerance/Stability 30ppm at 25C, 50ppm over 0C to +70C Aging at 25C 3ppm/year Maximum Load Capacitance 15pF Parallel Resonant Shunt Capacitance (C0) 7pF Maximum Equivalent Series Resistance 30 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 50Watts Maximum, 50Watts Correlation Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm) Storage Temperature Range -40C to +85C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.00 0.15 7.00 0.15 2 MARKING ORIENTATION 1 2.54 0.20 1.2 0.1 (x4) 4 4 1 PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground LINE MARKING 4.6 0.2 3 1.3 MAX 3 2 1 E24.00 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.0 0.2 (x4) Note: Chamfer and index mark not shown. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 1 of 4 ECCM1C-15-24.000M Suggested Solder Pad Layout All Dimensions in Millimeters 1.4 (x4) 2.2 (X4) Solder Land (X4) 3.6 1.1 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 2 of 4 ECCM1C-15-24.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 3 of 4 ECCM1C-15-24.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 4 of 4