B
BR
RI
IG
GH
HT
T
L
LE
ED
D
E
EL
LE
EC
CT
TR
RO
ON
NI
IC
CS
S
C
CO
OR
RP
P.
.
B
BL
L-
-C
C3
38
8H
H/
/G
G-
-4
41
1A
A-
-L
LG
G-
-D
DP
P-
-6
6F
F-
-A
AA
A-
-1
16
60
0-
-T
TB
BS
S2
22
2A
A
Ver.1.0 Page: 1 of 4
SINCE 1981
*9.36 0.5
(.369 .02)
25.4(1.0)MIN.
1.0(.039)MIN.
5.3(.209)
4.06(.160")
0.5(.02)
SQ.TYP
3.9(.153)
2.54(.01).NOM.
3.1(.122)
4.0(.157)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Features: ●Package dimensions:
1. Chip material: GaP/GaP
2. Emitted color : Green
3. Lens Appearance : Light Green Diffused
4. Designed for ease in circuit board assembly.
5. Black case enhance contrast ratio.
6. Solid state light source.
7. Reliable and rugged.
8. This product don’t contained restriction
substance, compliance ROHS standard.
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
● Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Rating Unit
Power Dissipation Pd 80 mW
Forward Current IF 30 mA
Peak Forward Current*1 I
FP 150 mA
Reverse Voltage V
R 5 V
Operating Temperature Topr -40℃~80℃
Storage Temperature Tstg -40℃~85℃
Soldering Temperature Tsol 260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.