All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS FUTURE BUS CONNECTOR
1F Series
Header Press Fit Type
2.0mm Pitch
8 Rows
Mechanical
Contact Retention Force: 1.0Kg min.
Electrical
Voltage Rating: 750V
Current Rati ng: 1A
Contact Resistance: 55m
Ω
max.
Dielectrical Withstanding V oltage: 1000V
Insulation Resistance: 1000M
Ω
min.
Physical
Housing: LCP, UL 94-0 rated, Ivory White
Contact: Phosphor Bronze
Plating: See “ORDERING INFORMATION”
DRAWING
ORDERING INFORMATION
Selective Pin Pattern
(Detail Please R efer To
Customer Drawing)
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u" )MIN. GOLD IN CL UDED
PRODUCT NO.: 1 F 4 * 1 0 8 * - P * * 1 S * - * *
POS. NO.:
108=108 pos.
Lead Free Code:
N=None
F=Lead Free
Package Type:
A=Tube
Extension Code:
N=Normal Plating
T=Selective Plating
L=Normal Plat ing With Lubrican t
M=Se le c t iv e Plating With Lubri ca nt
Tail Style:
P=Press Fit
BODY STYLE
1=W/O S HIELDING
5=W/ SHIELDING