FLAG1 6
EN 5FLAG2
1
4FLAG3
VCC
Power
Supply 2
Enable
3
GND
2
Enable
Input Supply
Power
Supply 1
Enable
Power
Supply 3
Enable
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3880
SNVS451L –AUGUST 2006–REVISED NOVEMBER 2018
LM3880 Three-Rail Simple Power Sequencer
1
1 Features
1• Qualified for Automotive Applications
• Simple Solution for Sequencing 3 Voltage Rails
from a Single Input Signal
• Easily Cascade up to 3 Devices to Sequence as
Many as 9 Voltage Rails
• Power-Up and Power-Down Control
• Tiny 2.9-mm x 1.9-mm Footprint
• Low Quiescent Current of 25 µA
• Input Voltage Range of 2.7 V to 5.5 V
• Standard Timing Options Available
2 Applications
• Advanced Driver Assistance Systems (ADAS)
• Automotive Camera Modules
• Security Cameras
• Servers
• Networking Elements
• FPGA Power Supply Sequencing
• Microprocessor and Microcontroller Sequencing
• Multiple Supply Sequencing
3 Description
The LM3880 simple power supply sequencer offers
the easiest method to control power up sequencing
and power down sequencing of multiple Independent
voltage rails. By staggering the startup sequence, it is
possible to avoid latch conditions or large in-rush
currents that can affect the reliability of the system.
Available in a 6-pin SOT-23-6 package, the Simple
Sequencer contains a precision enable pin and three
open-drain output flags. The open-drain output flags
permit that they can be pulled up to distinct voltage
supplies separate from the sequencer VDD (so long
as they do not exceed the recommended maximum
voltage of 0.3V greater than VDD), so as to interface
with ICs requiring a range of different enable signals.
When the LM3880 is enabled, the three output flags
will sequentially release, after individual time delays,
thus permitting the connected power supplies to start
up. The output flags will follow a reverse sequence
during power down to avoid latch conditions.
EPROM capability allows every delay and sequence
to be fully adjustable. Contact Texas Instruments if a
nonstandard configuration is required.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM3880 DBV SOT (6) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simple Power Supply Sequencing
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 7
7 Detailed Description.............................................. 9
7.1 Overview................................................................... 9
7.2 Functional Block Diagram......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 12
8 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application.................................................. 13
8.3 Do's and Don'ts ...................................................... 15
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 Device and Documentation Support................. 19
11.1 Device Support...................................................... 19
11.2 Community Resources.......................................... 20
11.3 Trademarks........................................................... 20
11.4 Electrostatic Discharge Caution............................ 20
11.5 Glossary................................................................ 20
12 Mechanical, Packaging, and Orderable
Information........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (February 2016) to Revision L Page
• Updated Features to specify how many rails can be sequenced by a single device ............................................................ 1
• Added feature that devices can be cascaded ....................................................................................................................... 1
• Specified device dimensions in Features............................................................................................................................... 1
• Specified FPGA Power Supply Sequencing in Applications .................................................................................................. 1
• Added note in description about open drain FLAG pins......................................................................................................... 1
• Added I/O column to Pin Functions table............................................................................................................................... 3
• Changed Part Nomenclature section to Device Nomenclature section................................................................................ 19
Changes from Revision J (December 2014) to Revision K Page
• Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum Ratings..................... 4
• Removed “Customized Timing and Sequence” section ...................................................................................................... 12
• Added cross references to timing diagrams......................................................................................................................... 19
Changes from Revision I (March 2013) to Revision J Page
• Added Handling Rating table, Feature Description section, Device Functional Modes,Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 4
Changes from Revision H (March 2013) to Revision I Page
• Changed layout of National Data Sheet to TI format. .......................................................................................................... 19
FLAG1
FLAG2
FLAG3
VCC
GND
EN
1
2
3
6
5
4
3
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(1) I = input, O = output, G = ground
5 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
EN 3 I Precision enable pin
FLAG1 6 O Open-drain output 1
FLAG2 5 O Open-drain output 2
FLAG3 4 O Open-drain output 3
GND 2 G Ground
VCC 1 I Input supply
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) (1)(2)
MIN MAX UNIT
VCC –0.3 6 V
EN, FLAG1, FLAG2, FLAG3 –0.3 6 V
Maximum Flag ON current 50 mA
Maximum Junction temperature 150 °C
Lead temperature (Soldering, 5 s) 260 °C
Storage temperature Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2 kV
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC to GND 2.7 5.5 V
EN, FLAG1, FLAG2, FLAG3 –0.3 VCC + 0.3 V
Junction temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM3880
UNITDBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 187.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 127.4 °C/W
RθJB Junction-to-board thermal resistance 31.5 °C/W
ψJT Junction-to-top characterization parameter 23.3 °C/W
ψJB Junction-to-board characterization parameter 31.0 °C/W
EN
FLAG1
FLAG2
FLAG3
td1 td2 td3
5
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(1) Limits are 100% production tested at 25°. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
6.5 Electrical Characteristics
Limits apply to all timing options and VCC = 3.3 V, unless otherwise specified. Minimum and Maximum limits apply over the full
Operating Temperature Range (TJ= -40°C to +125°C) and are specified through test, design or statistical correlation. Typical
values represent the most likely parametric norm at TJ= 25°C and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
IQOperating Quiescent current 25 80 µA
OPEN-DRAIN FLAGS
IFLAG FLAGx Leakage Current VFLAGx = 3.3 V 1 20 nA
VOL FLAGx Output Voltage Low IFLAGx = 1.2 mA 0.4 V
POWER-UP SEQUENCE
td1 Timer delay 1 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
td2 Timer delay 2 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
td3 Timer delay 3 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
POWER-DOWN SEQUENCE
td4 Timer delay 4 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
td5 Timer delay 5 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
td6 Timer delay 6 accuracy All Other Timing Options –15% 15%
2 ms Timing Option –20% 20%
TIMING DELAY ERROR
(td(x) – 400
µs) / td(x+1) Ratio of timing delays For x = 1 or 4 95% 105%
For x = 1 or 4, 2 ms option 90% 110%
td(x) / td(x+1) Ratio of timing delays For x = 2 or 5 95% 105%
For x = 2 or 5, 2 ms option 90% 110%
ENABLE PIN
VEN EN pin threshold 1.0 1.25 1.4 V
IEN EN pin pullup current VEN = 0 V 7 µA
Timing Requirements
All standard options use Sequence 1 for output flags rise and fall order. Refer to section 11.1.2 for details of different
sequences possible.
Figure 1. Power-Up Sequence
EN
FLAG1
FLAG2
FLAG3
td4 td5 td6
6
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All standard options use Sequence 1 for output flags rise and fall order. Refer to section 11.1.2 for details of different
sequences possible.
Figure 2. Power-Down Sequence
2.5 3 3.5 4 4.5 5 5.5
20
21
22
23
24
25
26
27
28
29
30
IQ (PA)
VCC (V)
-40 125
IQ (PA)
TEMPERATURE (oC)
5 35 65 95
-10 20 50 80 110-25
20
26
21
23
24
25
22
7
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6.6 Typical Characteristics
Figure 3. Quiescent Current vs VCC Figure 4. Quiescent Current vs Temperature (VCC = 3.3 V)
Figure 5. Enable Threshold vs Temperature Figure 6. Time Delay (30 ms) vs Vcc
Figure 7. Time Delay Ratio vs Temperature Figure 8. Time Delay (30 ms) vs Temperature
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Typical Characteristics (continued)
Figure 9. Flag VOL vs Vcc (RFLAG = 100 kΩ) Figure 10. Flag Voltage vs Current
FLAG1
7 µA
GND
tD1
EN
Master
Clock
FLAG2
FLAG3
Sequence
Control
EEPROM
(Factory Set)
Timing
Delay
Generation
tD2
tD3
tD4
tD5
tD6
+
1.25 V
VCC
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7 Detailed Description
7.1 Overview
The LM3880 simple power supply sequencer provides a simple solution for sequencing multiple rails in a
controlled manner. Six independent timers are integrated to control the timing sequence (power up and power
down) of three open-drain output flags. These flags permit connection to either a shutdown or enable pin of linear
regulators and switchers to control the operation of the power supplies. This allows design of a complete power
system without concern for large inrush currents or latch-up conditions that can occur.
The timing sequence of the device is controlled entirely by the enable (EN) pin. Upon power up, all the flags are
held low until this precision enable is pulled high. When the EN pin is asserted, the power-up sequence starts.
An internal counter delays the first flag (FLAG1) from rising until a fixed time period has expired. When the first
flag is released, another timer will begin to delay the release of the second flag (FLAG2). This process repeats
until all three flags have sequentially been released.
The power-down sequence is the same as power-up sequence, but in reverse. When the EN pin is deasserted a
timer will begin that delays the third flag (FLAG3) from pulling low. The second and first flag will then follow in a
sequential manner after their appropriate delays. The three timers that are used to control the power-down
scheme can also be individually programmed and are completely independent of the power-up timers.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Enable Pin Operation
The timing sequence of the LM3880 is controlled by the assertion of the enable signal. The enable pin is
designed with an internal comparator, referenced to a bandgap voltage (1.25 V), to provide a precision threshold.
This allows a delayed timing to be externally set using a capacitor or to start the sequencing based on a certain
event, such as a line voltage reaching 90% of nominal. For an additional delayed sequence from the rail
powering VCC, simply attach a capacitor to the EN pin as shown in Figure 11.
EN
FLAG1
td1
tenable_delay = 1.25V x CEN
7 PA
7 µA
+
1.25 V
EN
Enable
CEN
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Feature Description (continued)
Figure 11. Capacitor Timing
Using the internal pullup current source to charge the external capacitor (CEN) the enable pin delay can be
calculated by Equation 1:
(1)
A resistor divider can also be used to enable the device based on a certain voltage threshold. Take care when
sizing the resistor divider to include the effects of the internal current source.
One of the features of the EN pin is that it provides glitch free operation. The first timer will start counting at a
rising threshold, but will always reset if the EN pin is deasserted before the first output flag is released. This can
be shown in Figure 12:
Figure 12. EN Glitch
7.3.2 Incomplete Sequence Operation
If the enable signal remains high for the entire power-up sequence, then the part will operate as shown in the
standard timing diagrams. However, if the enable signal is de-asserted before the power-up sequence is
completed the part will enter a controlled shutdown. This allows the system to walk through a controlled power
cycling, preventing any latch conditions from occurring. This state only occurs if the enable pin is deasserted
after the completion of timer 1, but before the entire power-up sequence is completed.
When this event occurs, the falling edge of EN pin resets the current timer and will allow the remaining power-up
cycle to complete before beginning the power-down sequence. The power down sequence starts approximately
120 ms after the final power-up flag. This allows output voltages in the system to stabilize before everything is
shut down. An example of this operation can be seen in Figure 13:
FLAG1
FLAG2
FLAG3
EN
ttd1t ttd2t ttd3tt120 mstttd4t ttd5t ttd6t
EN
FLAG1
FLAG2
FLAG3
td2
td1 td3 120 ms td4 td5 td6
11
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Feature Description (continued)
Figure 13. Incomplete Power-Up Sequence
When the enable signal is deasserted, the part will commence its power-down sequence. If the enable signal is
pulled high before the power-down sequence is completed, the part will ensure completion of the power-down
sequence before starting power-up. This ensures that the system does not partially power down and power up
and helps prevent latch-up events, such as in FPGAs and microprocessors. This state only occurs if the enable
pin is pulled high after the completion of timer 1, but before the entire power-down sequence is completed.
When this event occurs, the rising edge of enable pin resets the current timer and will allow the remaining power-
down cycle to complete before beginning the power-up sequence. The power-up sequence starts approximately
120 ms after the final power-down flag. This allows the system to fully shut down before it is powered up. An
example of this operation can be seen in Figure 14:
Figure 14. Incomplete Power-Down Sequence
All the internal timers are generated by a master clock that has an extremely low tempco. This allows for tight
accuracy across temperature and a consistent ratio between the individual timers. There is a slight additional
delay of approximately 400 µs to timers 1 and 4, which is a result of the EPROM refresh. This refresh time is in
addition to the programmed delay time and will be almost insignificant to all but the shortest of timer delays.
12
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7.4 Device Functional Modes
7.4.1 Power Up With EN Pin
The timing sequence of the Simple Power Supply Sequencer is controlled entirely by the enable (EN) pin. Upon
power up, all the flags are held low until this precision enable is pulled high. After the EN pin is asserted, the
power-up sequence will commence.
7.4.2 Power Down With EN Pin
When EN pin is deasserted, the power down sequence will commence. A timer will begin that delays the third
flag (FLAG3) from pulling low. The second and first flag will then follow in a sequential manner after their
appropriate delays.
13
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Open Drain Flags Pullup
The Simple Power Supply Sequencer contains three open-drain output flags which need to be pulled up for
proper operation. 100-kΩresistors can be used as pullup resistors.
8.1.2 Enable the Device
See Enable Pin Operation.
8.2 Typical Application
8.2.1 Simple Sequencing of Three Power Supplies
The Simple Power Supply Sequencer is used to implement a power-up and power-down sequence of three
power supplies.
Sequence 1 for the LM3880, e.g. orderable part number LM3880MF-1AA has a power-up sequence (1 – 2 – 3)
and power-down sequence (3 – 2 –1). See Table 3 and Table 4 for other sequence options or contact TI if other
sequence options are desired.
Figure 15. Typical Application Circuit
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Typical Application (continued)
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters. The circuit shown in
Figure 15 can have various power-down sequences depending on the sequence the part is programmed for. See
Table 3 for different power-down sequence options.
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input Supply voltage range 2.7 V to 5.5 V
Flag Output voltage, EN high Input Supply
Flag Output voltage, EN low 0 V
Flag Timing Delay 30 ms
Power-Up Sequence 1 - 2 - 3
Power-Down Sequence 3 - 2 - 1
8.2.1.2 Detailed Design Procedure
Table 2. Bill of Materials
DESIGNATOR DESCRIPTION DEVICE QUANTITY MANUFACTURER
U1 LM3880, Sequence 1, 30 ms timing LM3880 1 Texas Instruments
R1 100-kΩResistor, 0603 CRCW0603100KFKEA 1 Vishay
R2 100-kΩResistor, 0603 CRCW0603100KFKEA 1 Vishay
R3 100-kΩResistor, 0603 CRCW0603100KFKEA 1 Vishay
This application uses the Sequence 1 and 30-ms timing options of the Simple Power Supply Sequencer. See
Application Curves for details on the sequence and timing option.
8.2.1.3 Application Curves
Figure 16. Power-Up Sequence for
LM3880MF-1AE Figure 17. Power-Down Sequence for
LM3880MF-1AE
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8.2.2 Sequencing Using Independent Flag Supply
For applications requiring a flag output voltage that is different from the VCC, a separate Flag Supply may be
used to pullup the open-drain outputs of the simple power supply sequencer. This is useful when interfacing the
flag outputs with inputs that require a different voltage than VCC. The designer must ensure the flag supply
voltage is not taken above VCC + 0.3 V as specified in the Recommended Operating Conditions.
Figure 18. Sequencing Using Independent Flag Supply
8.3 Do's and Don'ts
Connecting the EN pin to VCC is not recommended. During power up, the EN voltage should be kept below the
EN threshold until VCC rises above the minimum operating voltage. This will be violated if EN is connected to
VCC, and undefined operation at the flag outputs can occur, especially during slow VCC rising slew rates. For
systems requiring only power-up sequencing, a capacitor at the EN pin can be used to create a delay or a
resistor divider can be used to enable the device based on a certain voltage threshold. While these solutions will
work for power-up, it will not power-down the flag outputs in sequential fashion since the flag outputs will simply
follow the input supply. For systems requiring both power-up and power-down sequencing, an external enable
signal should be used, such as a GPIO signal from a microcontroller, to properly control power-up and power-
down of the flag outputs.
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Do's and Don'ts (continued)
Figure 19. Recommended EN Connection
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9 Power Supply Recommendations
The VCC pin should be located as close as possible to the input supply (2.7–5.5 V). An input capacitor is not
required but is recommended when noise might be present on the VCC pin. A 0.1-μF ceramic capacitor may be
used to bypass this noise.
10 Layout
10.1 Layout Guidelines
• Pullup resistors should be connected between the flag output pins and a positive input supply, usually VCC.
An independent flag supply may also be used. These resistors should be placed as close as possible to the
Simple Power Supply Sequencer and the flag supply. Minimal trace length is recommended to make the
connections. A typical value for the pullup resistors is 100 kΩ.
• For very tight sequencing requirements, minimal and equal trace lengths should be used to connect the flag
outputs to the desired inputs. This will reduce any propagation delay and timing errors between the flag
outputs along the line.
10.2 Layout Example
Figure 20 and Figure 21 are layout examples for the LM3880. These examples are taken from the LM3880EVAL.
Figure 20. LM3880 Top
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Layout Example (continued)
Figure 21. LM3880 Bottom
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(1) See Figure 1 and Figure 2.
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Device Nomenclature
The list of parts available to order appear in the Package Option Addendum.
Figure 22. Device Nomenclature
Table 3. Sequence Designator Table (1)
SEQUENCE NUMBER FLAG ORDER
POWER UP POWER DOWN
1 1 - 2 - 3 3 - 2 - 1
2 1 - 2 - 3 3 - 1 - 2
3 1 - 2 - 3 2 - 3 - 1
4 1 - 2 - 3 2 - 1 - 3
5 1 - 2 - 3 1 - 3 - 2
6 1 - 2 - 3 1 - 2 - 3
(1) See Figure 1 and Figure 2.
Table 4. Timing Designator Table(1)
TIMING
DESIGNATOR DELAYS (ms)
td1 td2 td3 td4 td5 td6
AA 10 10 10 10 10 10
AB 30 30 30 30 30 30
AC 60 60 60 60 60 60
AD 120 120 120 120 120 120
AE 2 2 2 2 2 2
AF 16 16 16 16 16 16
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11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3880MF-1AA NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 125 F20A
LM3880MF-1AA/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F20A
LM3880MF-1AB/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F21A
LM3880MF-1AC/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F22A
LM3880MF-1AD/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F23A
LM3880MF-1AE/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F25A
LM3880MF-1AF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F31A
LM3880MFE-1AA/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F20A
LM3880MFE-1AB/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F21A
LM3880MFE-1AC/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F22A
LM3880MFE-1AD/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F23A
LM3880MFE-1AE/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F25A
LM3880MFE-1AF/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F31A
LM3880MFX-1AA/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F20A
LM3880MFX-1AB/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F21A
LM3880MFX-1AC/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F22A
LM3880MFX-1AD/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F23A
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3880MFX-1AE/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F25A
LM3880MFX-1AF/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 F31A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM3880 :
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 3
•Automotive: LM3880-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3880MF-1AA SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AA/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AB/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AC/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AD/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AE/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MF-1AF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AA/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AB/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AC/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AD/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AE/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFE-1AF/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFX-1AA/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFX-1AB/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFX-1AC/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFX-1AD/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM3880MFX-1AE/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3880MFX-1AF/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3880MF-1AA SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AA/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AB/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AC/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AD/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AE/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MF-1AF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM3880MFE-1AA/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFE-1AB/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFE-1AC/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFE-1AD/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFE-1AE/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFE-1AF/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0
LM3880MFX-1AA/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LM3880MFX-1AB/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LM3880MFX-1AC/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3880MFX-1AD/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LM3880MFX-1AE/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LM3880MFX-1AF/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 3
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/B 03/2018
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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