TC4011BP/BF/BFN/BFT
2006-02-01
1
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC4011BP,TC4011BF,TC4011BFN,TC4011BFT
TC4011B Quad 2 Input NAND Gate
The TC4011B is 2-input positive logic NAND gate respectively.
Since all the outputs of these gates are provided with the
inverters as buffers, the input/output characteristics have been
improved and the variation of propagation delay time due to the
increase in load capacity is kept down to the minimum.
Pin Assignment
Lo g ic Di agr a m
Weight
DIP14-P-300-2.54 : 0.96 g (typ.)
SOP14-P-300-1.27A : 0.18 g (typ.)
SOP14-P-300-1.27 : 0.18 g (typ.)
SOL14-P-150-1.27 : 0.12 g (typ.)
TSSOP14-P-0044-0.65A : 0.06 g (typ.)
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC4011BP
TC4011BF
TC4011BFN
TC4011BFT
VDD
9
B4
X4
8
14
13
12
11
10
1
2
3
4
5
6
7
B2
A
2
VSS
B3
A3
(top view)
B1
X1
A
1
X2
A4
X3
A
X = BA･
X
B
TC4011BP/BF/BFN/BFT
2006-02-01
2
Absolute Maximum Ratings (Note)
Characteristics Symbol Rating Unit
DC supply voltage VDD V
SS − 0.5 to VSS + 20 V
Input voltage VIN V
SS − 0.5 to VDD + 0.5 V
Output voltage VOUT V
SS − 0.5 to VDD + 0.5 V
DC input current IIN ±10 mA
Power dissipation PD 300 (DIP)/180 (SOIC) mW
Operating temperature range Topr −40 to 85 °C
Storage temperature range Tstg −65 to 150 °C
Note: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or
even destruction.
Recomm end ed Operating Co ndi tions (VSS = 0 V) (Note)
Characteristics Symbol Test Condition Min Typ. Max Unit
DC supply voltage VDD ― 3 ― 18 V
Input voltage VIN ― 0 ― V
DD V
Note: The recommended operating conditions are required to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
TC4011BP/BF/BFN/BFT
2006-02-01
3
Stati c Electric al Charac teri stics (VSS = 0 V)
Test Condition −40°C 25°C 85°C
Characteristics Symbol
VDD
(V) Min Max Min Typ. Max Min Max
Unit
High-level
output voltage VOH
|IOUT| < 1 µA
VIN = VSS, VDD
5
10
15
4.95
9.95
14.95
―
―
―
4.95
9.95
14.95
5.00
10.00
15.00
―
―
―
4.95
9.95
14.95
―
―
―
V
Low-level
output voltage VOL
|IOUT| < 1 µA
VIN = VSS, VDD
5
10
15
―
―
―
0.05
0.05
0.05
―
―
―
0.00
0.00
0.00
0.05
0.05
0.05
―
―
―
0.05
0.05
0.05
V
VOH = 4.6 V
VOH = 2.5 V
VOH = 9.5 V
VOH = 13.5 V
5
5
10
15
−0.61
−2.50
−1.50
−4.00
―
―
―
―
−0.51
−2.10
−1.30
−3.40
−1.0
−4.0
−2.2
−9.0
―
―
―
―
−0.42
−1.70
−1.10
−2.80
―
―
―
―
Output high
current IOH
VIN = VSS, VDD
mA
VOL = 0.4 V
VOL = 0.5 V
VOL = 1.5 V
5
10
15
0.61
1.50
4.00
―
―
―
0.51
1.30
3.40
1.2
3.2
12.0
―
―
―
0.42
1.10
2.80
―
―
―
Output low
current IOL
VIN = VDD
mA
VOUT = 0.5 V
VOUT = 1.0 V
VOUT = 1.5 V
5
10
15
3.5
7.0
11.0
―
―
―
3.5
7.0
11.0
2.75
5.50
8.25
―
―
―
3.5
7.0
11.0
―
―
―
Input high
voltage VIH
|IOUT| < 1 µA
V
VOUT = 4.5 V
VOUT = 9.0 V
VOUT = 13.5 V
5
10
15
―
―
―
1.5
3.0
4.0
―
―
―
2.25
4.50
6.75
1.5
3.0
4.0
―
―
―
1.5
3.0
4.0
Input low
voltage VIL
|IOUT| < 1 µA
V
“H”
level IIH VIH = 18 V 18 ― 0.1 ― 10−50.1 ― 1.0
Input
current “L”
level IIL V
IL = 0 V 18 ― −0.1 ― −10−5−0.1 ― −1.0
µA
Quiescent
supply current IDD
VIN = VSS, VDD
(Note)
5
10
15
―
―
―
0.25
0.50
1.00
―
―
―
0.001
0.001
0.002
0.25
0.50
1.00
―
―
―
7.5
15.0
30.0
µA
Note: All valid input combinations.
TC4011BP/BF/BFN/BFT
2006-02-01
4
Dynami c Electr ic al Charact eri stics (Ta = 25°C, VSS = 0 V, CL = 50 pF)
Test Condition
Characteristics Symbol
V
DD (V)
Min Typ. Max Unit
Output transition time tTLH ―
5
10
15
―
―
―
70
35
30
200
100
80
ns
Output transition time tTHL ―
5
10
15
―
―
―
70
35
30
200
100
80
ns
Propagation delay time tpLH ―
5
10
15
―
―
―
65
30
25
200
100
80
ns
Propagation delay time tpHL ―
5
10
15
―
―
―
65
30
25
200
100
80
ns
Input capacitance CIN ― ― 5 7.5 pF
Ci rcuit and Wave f o rm f o r Me as u re me n t of Dynami c Chara cteris t i cs
Circuit Waveform
Output
Input
20 ns 20 ns
50％
10％
90％
tpLH tpHL
50％
10％
90％
50％
10％
90％
50％
10％
90％
tTLH
tTHL
VDD
Output
VSS
Input
P.G.
CL = 50 pF
TC4011BP/BF/BFN/BFT
2006-02-01
5
Package Dimensions
Weight: 0.96 g (typ.)
TC4011BP/BF/BFN/BFT
2006-02-01
6
Package Dimensions
Weight: 0.18 g (typ.)
TC4011BP/BF/BFN/BFT
2006-02-01
7
Package Dimensions
Weight: 0.18 g (typ.)
TC4011BP/BF/BFN/BFT
2006-02-01
8
Package Dimensions (Note)
Note: This package is not available in Japan.
Weight: 0.12 g (typ.)
TC4011BP/BF/BFN/BFT
2006-02-01
9
Package Dimensions
Weight: 0.06 g (typ.)
TC4011BP/BF/BFN/BFT
2006-02-01
10
Note: Lead (Pb)-Free Packages
DIP14-P-300-2.54 SOP14-P-300-1.27A SOL14-P-150-1.27 TSSOP14-P-0044-0.65A
RESTRICTION S ON PRODUCT USE 060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
