1206Y6300100KXB - Syfer Technology Limited

X7R

Surface Mount Chip Capacitors

10pF

100pF

120

150

180

220

270

330

390

470

560

680

820

1.0nF

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

100

120

150

180

220

270

330

390

470

560

680

820

1.0µF

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

Capacitance

0805

1206

100V

25V

50/63V

16V

25V

50/63V

100V

16V

1210

16V

25V

0603

100V

50/63V

X7R

100V

50/63V

25V

16V

200V

500V

630V

1KV

2KV

500V

630V

250V

2KV

1808

1KV

2KV

3KV

630V

500V

250V

MLCC’s are widely used in electronic circuit design for a multitude of

applications. Their small package size, technical performance and

suitability for automated assembly makes them the component of

choice for the specifier.

However, despite the technical benefits, ceramic components are brittle

and need careful handling on the production floor. In some

circumstances they may be prone to mechanical stress damage if not

used in an appropriate manner. Board flexing, depanelisation,

mounting through hole components, poor storage and automatic

testing may all result in cracking.

Careful process control is important at all stages of circuit board

assembly and transportation - from component placement to test and

packaging. Any significant board flexing may result in stress fractures

Polymer Termination - a lead free termination

in ceramic devices that may not always be evident during the board

assembly process. Sometimes it may be the end customer who

finds out - when equipment fails!

Capacitor Body and Electrodes

Termination

Solder Fillet

Substrate

Force

Crack Initiation

Fig 1. Typical Mechanical Crack

Surface Mount Chip Capacitors

X7R

10pF

100pF

120

150

180

220

270

330

390

470

560

680

820

1.0nF

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

100

120

150

180

220

270

330

390

470

560

680

820

1.0µF

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

notes

Shown above are standard and high voltage ranges of X7R chip capacitors

which are available with FlexiCapTM terminations. Please refer to our sales

office if you require other products in our range with this new termination.

For all other mechanical and electrical details please refer to the relevant

sections of this catalogue.

For ordering information see page 30.

With traditional termination materials and assembly, the chain of

materials from bare PCB to soldered termination, provides no

flexibility. In circumstances where excessive stress is applied - the

weakest link fails. This means the ceramic itself, which may fail

short circuit.

Syfer has the solution -

FlexiCapTM has been developed as a result of listening to customers’

experiences of stress damage to MLCC’s from many manufacturers,

often caused by variations in production processes.

Our answer is a proprietary flexible epoxy polymer termination

material, that is applied to the device under the usual nickel barrier

finish. FlexiCapTM will accommodate a greater degree of board

bending than conventional capacitors.

Fired ceramic

dielectric

FlexiCap

termination

base

Intermediate

nickel layer

Tin outer

layer

Metal

electrodes

Fig 2. FlexiCap

MLCC cross section

16V

25V

50/63V

100V

200V

1812

1KV

2KV

3KV

630V

500V

250V

2220

16V

25V

50/63V

100V

200V

3KV

500V

630V

1KV

2KV

250V

2225

50/63V

100V

200V

25V

16V

250V

3KV

2KV

1KV

630V

500V

4KV

3KV

2KV

1KV

3640

630V

500V

Surface Mount Chip Capacitors

Application Notes

Summary of PCB bend test results

The bend tests conducted have proved that the FlexiCapTM

termination withstands a greater level of mechanical stress before

mechanical cracking occurs.

Typical examples:

Product Mean bend Mean bend Improvement

(mm) (mm) with

Standard Term. FlexiCapTM FlexiCapTM

0603 X7R 1.6 6.4 + 400%

0805 X7R 3.6 6.3 + 75%

1206 X7R 3.4 6.4 + 88%

1812 X7R 3.2 6.0 + 88%

2220 X7R 3.2 6.1 + 91%

Application Notes

FlexiCapTM may be handled, stored and transported in the same

manner as standard terminated capacitors. The requirements for

mounting and soldering FlexiCapTM are the same as for standard

SMD capacitors.

For customers currently using standard terminated capacitors there

should be no requirement to change the assembly process when

converting to FlexiCapTM.

Based upon board bend tests in accordance with IEC 60384-1 the

amount of board bending required to mechanically crack a polymer

terminated capacitor is significantly increased compared with

standard terminated capacitors.

It must be stressed however, that capacitor users must not assume

that the use of FlexiCapTM terminated capacitors will totally eliminate

mechanical cracking. Good process controls are still required for this

objective to be achieved.

notes

1. For details of the FlexiCap™ range see pages 28/29.

● Picture taken at 1,000x magnification using a SEM to demonstrate the fibrous

nature of the FlexiCapTM termination that absorbs increased levels of mechanical

stress.

benefits

The benefit to the user is to facilitate a wider process window -

giving a greater safety margin and substantially reducing the typical

root causes of mechanical stress cracking.

FlexiCapTM may be soldered using your traditional wave or reflow

solder techniques and needs no adjustment to equipment or current

processes.

Syfer has delivered millions of FlexiCapTM components and during

that time has collected substantial test and reliability data, working

in partnership with customers world wide, to eliminate mechanical

cracking.

Ordering Information

0805

Type No

Chip Size

Termination

Y = FlexiCapTM

100

Voltage

016 =16V

025 =25V

050 = 50V

063 = 63V

100 = 100V

200 = 200V

250 = 250V

500 = 500V

630 = 630V

1K0 =1kV

2K0 =2kV

3K0 =3kV

4K0 =4kV

5K0 =5kV

0101

Capacitance

First digit - 0

Second digit - First significant

figure of

capacitance value

Third digit - Second significant

figure of

capacitance value

Fourth digit - Number of zeros

following.

For values that do not fit the

model above, insert the

capacitance code letter for the

decimal point

e.g. 13N6 = 13.6nF

Tolerance

Stable class

J=±5%

K = ±10%

M = ±20%

Dielectric

X = X7R

Packaging

T =178mm

(7”) reel

R =330mm

(13”) reel

B =Bulk pack

tubs

Suffix Code

Used for

specific

customer

requirements

FlexiCapTM is a registered trade mark of Syfer Technology Limited.