NRND
DS90LV027AH
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
DS90LV027AH High Temperature LVDS Dual Differential Driver
Check for Samples: DS90LV027AH
1FEATURES DESCRIPTION
The DS90LV027AH is a dual LVDS driver device
2•−40°C to +125°C operating temperature range optimized for high data rate and low power
• >600 Mbps (300MHz) switching rates applications. The device is designed to support data
• 0.3 ns typical differential skew rates in excess of 600Mbps (300MHz) utilizing Low
Voltage Differential Signaling (LVDS) technology. The
• 0.7 ns maximum differential skew DS90LV027AH is a current mode driver allowing
• 3.3V power supply design power dissipation to remain low even at high
• Low power dissipation (46 mW @ 3.3V static) frequency. In addition, the short circuit fault current is
also minimized.
• Flow-through design simplifies PCB layout
• Power Off Protection (outputs in high The device is in a 8-lead SOIC package. The
impedance) DS90LV027AH has a flow-through design for easy
PCB layout. The differential driver outputs provides
• Conforms to TIA/EIA-644 Standard low EMI with its typical low output swing of 360 mV. It
• 8-Lead SOIC package saves space is perfect for high speed transfer of clock and data.
The DS90LV027AH can be paired with its companion
dual line receiver, the DS90LV028AH, or with any of
TI's LVDS receivers, to provide a high-speed point-to-
point LVDS interface.
Connection Diagram
Figure 1. Dual-In-Line
See Package Number D (R-PDSO-G8)
Functional Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
NRND
DS90LV027AH
SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
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Absolute Maximum Ratings (1)
Supply Voltage (VCC)−0.3V to +4V
Input Voltage (DI) −0.3V to +3.6V
Output Voltage (DO±) −0.3V to +3.9V
Maximum Package Power Dissipation @ +25°C
D Package 1190 mW
Derate D Package 9.5 mW/°C above +25°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range Soldering
(4 sec.) +260°C
ESD Ratings
(HBM 1.5 kΩ, 100 pF) ≥8kV
(EIAJ 0 Ω, 200 pF) ≥1000V
(CDM) ≥1000V
(IEC direct 330 Ω, 150 pF) ≥4kV
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
Recommended Operating Conditions Min Typ Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Temperature (TA)−40 25 +125 °C
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (3)
Symbol Parameter Conditions Pin Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD Output Differential Voltage RL= 100ΩDO+, 250 360 450 mV
(Figure 2) DO−
ΔVOD VOD Magnitude Change 1 35 mV
VOH Output High Voltage 1.4 1.6 V
VOL Output Low Voltage 0.9 1.1 V
VOS Offset Voltage 1.125 1.2 1.375 V
ΔVOS Offset Magnitude Change 0 3 25 mV
IOXD Power-off Leakage VOUT = VCC or GND, VCC = 0V ±1 ±10 μA
IOSD Output Short Circuit Current −5.7 −8 mA
VIH Input High Voltage DI 2.0 VCC V
VIL Input Low Voltage GND 0.8 V
IIH Input High Current VIN = 3.3V or 2.4V ±2 ±10 μA
IIL Input Low Current VIN = GND or 0.5V ±1 ±10 μA
VCL Input Clamp Voltage ICL =−18 mA −1.5 −0.6 V
ICC Power Supply Current No Load VIN = VCC or GND VCC 8 14 mA
RL= 100Ω14 20 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD.
(2) All typicals are given for: VCC = +3.3V and TA= +25°C.
(3) The DS90LV027AH is a current mode device and only function with datasheet specification when a resistive load is applied to the
drivers outputs.
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (1) (2) (3) (4)
Symbol Parameter Conditions Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
tPHLD Differential Propagation Delay High to Low RL= 100Ω, CL= 15 pF 0.3 0.8 2.0 ns
(Figure 3 and Figure 4)
tPLHD Differential Propagation Delay Low to High 0.3 1.1 2.0 ns
tSKD1 Differential Pulse Skew |tPHLD −tPLHD|(5) 0 0.3 0.7 ns
tSKD2 Channel to Channel Skew (6) 0 0.4 0.8 ns
tSKD3 Differential Part to Part Skew (7) 0 1.0 ns
tSKD4 Differential Part to Part Skew (8) 0 1.2 ns
tTLH Transition Low to High Time 0.2 0.5 1.0 ns
tTHL Transition High to Low Time 0.2 0.5 1.0 ns
fMAX Maximum Operating Frequency (9) 350 MHz
(1) All typicals are given for: VCC = +3.3V and TA= +25°C.
(2) These parameters are ensured by design. The limits are based on statistical analysis of the device over PVT (process, voltage,
temperature) ranges.
(3) CLincludes probe and fixture capacitance.
(4) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO= 50Ω, tr≤1 ns, tf≤1 ns (10%-90%).
(5) tSKD1, |tPHLD −tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(6) tSKD2 is the Differential Channel to Channel Skew of any event on the same device.
(7) tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(8) tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max −Min|
differential propagation delay.
(9) fMAX generator input conditions: tr= tf< 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD >
250mV, all channels switching.
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PARAMETER MEASUREMENT INFORMATION
Figure 2. Differential Driver DC Test Circuit
Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit
Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms
APPLICATION INFORMATION
Table 1. Device Pin Descriptions
Pin # Name Description
2, 3 DI TTL/CMOS driver input pins
6, 7 DO+ Non-inverting driver output pin
5, 8 DO−Inverting driver output pin
4 GND Ground pin
1 VCC Positive power supply pin, +3.3V ± 0.3V
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
TYPICAL PERFORMANCE CURVES
Output High Voltage vs Output Low Voltage vs
Power Supply Voltage Power Supply Voltage
Output Short Circuit Current vs Differential Output Voltage
Power Supply Voltage vs Power Supply Voltage
Differential Output Voltage Offset Voltage vs
vs Load Resistor Power Supply Voltage
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
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TYPICAL PERFORMANCE CURVES (continued)
Power Supply Current Power Supply Current vs
vs Frequency Power Supply Voltage
Power Supply Current vs Differential Propagation Delay vs
Ambient Temperature Power Supply Voltage
Differential Propagation Delay vs Differential Skew vs
Ambient Temperature Power Supply Voltage
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DS90LV027AH
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
TYPICAL PERFORMANCE CURVES (continued)
Differential Skew vs Transition Time vs
Ambient Temperature Power Supply Voltage
Transition Time vs
Ambient Temperature
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SNLS206A –SEPTEMBER 2005–REVISED APRIL 2013
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REVISION HISTORY
Changes from Original (April 2013) to Revision A Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 7
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS90LV027AHM/NOPB NRND SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM LV27A
HM
DS90LV027AHMX/NOPB NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM LV27A
HM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 30-Oct-2013
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90LV027AHMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90LV027AHMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 2
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