MC14049B, MC14050B Hex Buffer The MC14049B Hex Inverter/Buffer and MC14050B Noninverting Hex Buffer are constructed with MOS P-Channel and N-Channel enhancement mode devices in a single monolithic structure. These complementary MOS devices find primary use where low power dissipation and/or high noise immunity is desired. These devices provide logic level conversion using only one supply voltage, VDD. The input-signal high level (VIH) can exceed the VDD supply voltage for logic level conversions. Two TTL/DTL loads can be driven when the devices are used as a CMOS-to-TTL/DTL converter (VDD = 5.0 V, VOL 0.4 V, IOL 3.2 mA). Note that pins 13 and 16 are not connected internally on these devices; consequently connections to these terminals will not affect circuit operation. http://onsemi.com SOIC-16 D SUFFIX CASE 751B * TSSOP-16 DT SUFFIX CASE 948F PIN ASSIGNMENT Features * * * * * * * SOEIAJ-16 F SUFFIX CASE 966 High Source and Sink Currents High-to-Low Level Converter Supply Voltage Range = 3.0 V to 18 V VIN can exceed VDD Meets JEDEC B Specifications Improved ESD Protection On All Inputs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable These Devices are Pb-Free and are RoHS Compliant Parameter Value Unit VDD DC Supply Voltage Range -0.5 to +18.0 V Vin Input Voltage Range (DC or Transient) -0.5 to +18.0 V Vout Output Voltage Range (DC or Transient) -0.5 to VDD + 0.5 V Input Current (DC or Transient) per Pin 10 mA Iout Output Current (DC or Transient) per Pin 45 mA PD Power Dissipation, per Package (Note 1) (Plastic) (SOIC) NC 15 OUTF INA 3 14 INF OUTB 4 13 NC INB 5 12 OUTE OUTC 6 11 INE INC 7 10 OUTD VSS 8 9 IND 16 16 140xxBG AWLYWW MC140xxB ALYWG 1 1 SOEIAJ-16 16 14 050B ALYWG G mW 825 740 TA Ambient Temperature Range -55 to +125 C Tstg Storage Temperature Range -65 to +150 C TL Lead Temperature (8-Second Soldering) 260 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Temperature Derating: See Figure 3. This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields referenced to the VSS pin only. Extra precautions must be taken to avoid applications of any voltage higher than the maximum rated voltages to this high-impedance circuit. For proper operation, the ranges VSS Vin 18 V and VSS Vout VDD are recommended. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. August, 2014 - Rev. 9 16 2 SOIC-16 Iin (c) Semiconductor Components Industries, LLC, 2014 1 MARKING DIAGRAMS MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol VDD OUTA 1 1 TSSOP-16 xx A WL, L YY, Y WW, W G or G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Indicator (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Publication Order Number: MC14049B/D MC14049B, MC14050B LOGIC DIAGRAM MC14049B MC14050B 3 2 3 2 5 4 5 4 7 6 7 6 9 10 9 10 11 12 11 12 14 15 14 15 NC = PIN 13, 16 VSS = PIN 8 VDD = PIN 1 NC = PIN 13, 16 VSS = PIN 8 VDD = PIN 1 ORDERING INFORMATION Package Shipping MC14049BDG SOIC-16 (Pb-Free) 48 Units / Rail MC14049BDR2G SOIC-16 (Pb-Free) 2500 Units / Tape & Reel NLV14049BDR2G* SOIC-16 (Pb-Free) 2500 Units / Tape & Reel SOEIAJ-16 (Pb-Free) 2000 Units / Tape & Reel MC14050BDG SOIC-16 (Pb-Free) 48 Units / Rail NLV14050BDG* SOIC-16 (Pb-Free) 48 Units / Rail MC14050BDR2G SOIC-16 (Pb-Free) 2500 Units / Tape & Reel NLV14050BDR2G* SOIC-16 (Pb-Free) 2500 Units / Tape & Reel MC14050BDTG TSSOP-16 (Pb-Free) 96 Units / Rail NLV14050BDTG* TSSOP-16 (Pb-Free) 96 Units / Rail MC14050BDTR2G TSSOP-16 (Pb-Free) 2500 Units / Tape & Reel MC14050BFELG SOEIAJ-16 (Pb-Free) 2000 Units / Tape & Reel Device MC14049BFELG For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable. http://onsemi.com 2 MC14049B, MC14050B ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) -55_C Characteristic Output Voltage Vin = VDD Symbol +25_C VDD Vdc Min Max Min Typ (Note 2) +125_C Max Min Max Unit "0" Level VOL 5.0 10 15 - - - 0.05 0.05 0.05 - - - 0 0 0 0.05 0.05 0.05 - - - 0.05 0.05 0.05 Vdc "1" Level VOH 5.0 10 15 4.95 9.95 14.95 - - - 4.95 9.95 14.95 5.0 10 15 - - - 4.95 9.95 14.95 - - - Vdc "0" Level VIL 5.0 10 15 - - - 1.5 3.0 4.0 - - - 2.25 4.50 6.75 1.5 3.0 4.0 - - - 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 - - - 3.5 7.0 11 2.75 5.50 8.25 - - - 3.5 7.0 11 - - - 5.0 10 15 -1.6 -1.6 -4.7 - - - -1.25 -1.30 -3.75 -2.5 -2.6 -10 - - - -1.0 -1.0 -3.0 - - - IOL 5.0 10 15 3.75 10 30 - - - 3.2 8.0 24 6.0 16 40 - - - 2.6 6.6 19 - - - mAdc Input Current Iin 15 - 0.1 - 0.00001 0.1 - 1.0 mAdc Input Capacitance (Vin = 0) Cin - - - - 10 20 - - pF Quiescent Current (Per Package) IDD 5.0 10 15 - - - 1.0 2.0 4.0 - - - 0.002 0.004 0.006 1.0 2.0 4.0 - - - 30 60 120 mAdc Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, per package) (CL = 50 pF on all outputs, all buffers switching IT 5.0 10 15 Vin = 0 Input Voltage (VO = 4.5 Vdc) (VO = 9.0 Vdc) (VO = 13.5 Vdc) "1" Level VIH (VO = 0.5 Vdc) (VO = 1.0 Vdc) (VO = 1.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc Vdc IOH Source Sink mAdc IT = (1.8 mA/kHz) f + IDD IT = (3.5 mA/kHz) f + IDD IT = (5.3 mA/kHz) f + IDD mAdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at +25_C 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk Where: IT is in mA (per Package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency and k = 0.002. http://onsemi.com 3 MC14049B, MC14050B AC SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = + 25_C) Characteristic Symbol Output Rise Time tTLH = (0.7 ns/pF) CL + 65 ns tTLH = (0.25 ns/pF) CL + 37.5 ns tTLH = (0.2 ns/pF) CL + 30 ns tTLH Output Fall Time tTHL = (0.2 ns/pF) CL + 30 ns tTHL = (0.06 ns/pF) CL + 17 ns tTHL = (0.04 ns/pF) CL + 13 ns tTHL Propagation Delay Time tPLH = (0.33 ns/pF) CL + 63.5 ns tPLH = (0.19 ns/pF) CL + 30.5 ns tPLH = (0.06 ns/pF) CL + 27 ns tPLH Propagation Delay Time tPHL = (0.2 ns/pF) CL + 30 ns tPHL = (0.1 ns/pF) CL + 15 ns tPHL = (0.05 ns/pF) CL + 12.5 ns tPHL VDD Vdc Min Typ (Note 6) Max 5.0 10 15 - - - 100 50 40 160 80 60 5.0 10 15 - - - 40 20 15 60 40 30 5.0 10 15 - - - 80 40 30 140 80 60 5.0 10 15 - - - 40 20 15 80 40 30 Unit ns ns ns ns 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labeled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. MC14049B VDD MC14050B VDD 1 1 IOH 8 MC14049B VDD 1 IOL VOH VSS 8 1 IOL VOL VSS 8 VDS = VOH - VDD IOH VOL VSS 8 VOH VSS VDD = VOL 160 I OL, OUTPUT SINK CURRENT (mAdc) 0 I OH , OUTPUT SOURCE CURRNT (mAdc) MC14050B VDD VGS = 5.0 Vdc -10 VGS = 15 Vdc 120 -20 VGS = 10 Vdc -30 -40 VGS = 15 Vdc -50 -10 MAXIMUM CURRENT LEVEL -8.0 -6.0 -4.0 -2.0 VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc) MAXIMUM CURRENT LEVEL 40 VGS = 5.0 Vdc 0 0 VGS = 10 Vdc 80 0 Figure 1. Typical Output Source Characteristics 2.0 4.0 6.0 8.0 VDS, DRAIN-TO-SOURCE VOLTAGE (Vdc) Figure 2. Typical Output Sink Characteristics http://onsemi.com 4 10 PD , MAXIMUM POWER DISSIPATION (mW) PER PACKAGE MC14049B, MC14050B 1200 1100 1000 900 825 800 740 700 600 (P) PDIP 500 400 300 (D) SOIC 200 100 0 25 175 mW (P) 120 mW (D) 50 75 100 125 TA, AMBIENT TEMPERATURE (C) 150 175 Figure 3. Ambient Temperature Power Derating 20 ns 20 ns INPUT VDD 10% # Vin Vout VSS tPLH CL tTHL tPHL 10% tTLH Figure 4. Switching Time Test Circuit and Waveforms http://onsemi.com 5 tTLH tPHL 90% 50% OUTPUT MC14050B #Invert on MC14049B only VOH 90% 50% 10% OUTPUT MC14049B 8 VSS tPLH tPHL 1 PULSE GENERATOR VDD 90% 50% VOL VOH VOL tTHL MC14049B, MC14050B PACKAGE DIMENSIONS SOIC-16 D SUFFIX CASE 751B-05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 16 9 -B- 1 P 8 PL 0.25 (0.010) 8 B M S G R K F X 45 _ C -T- SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC14049B, MC14050B PACKAGE DIMENSIONS TSSOP-16 DT SUFFIX CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U T U M S V S S K EEE CCC CCC EEE CCC K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N DIM A B C D F G H J J1 K K1 L M F DETAIL E -W- C 0.10 (0.004) -T- SEATING PLANE H D DETAIL E G SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC14049B, MC14050B PACKAGE DIMENSIONS SOEIAJ-16 F SUFFIX CASE 966 ISSUE A 16 LE 9 Q1 M_ E HE 1 L 8 DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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