EPF8282AVTC100-4 - Altera

Package Information Datasheet for

Mature Altera Devices

This datasheet provides package and thermal resistance information for mature

Altera®devices. Package information includes the ordering code reference, package

acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead

coplanarity, weight, moisture sensitivity level, and other special information. The

thermal resistance information includes device pin count, package name, and

resistance values.

This datasheet includes the following sections:

■“Device and Package Cross Reference” on page 1

■“Thermal Resistance” on page 23

■“Package Outlines” on page 44

fFor more package and thermal resistance information about Altera devices that are

not listed in this datasheet, refer to the Package and Thermal Resistance page of the

Altera website.

fFor information about trays, tubes, and dry packs, refer to AN 71: Guidelines for

Handling J-Lead, QFP, and BGA Devices.

fRoHS-compliant devices are compatible with leaded-reflow temperatures. For more

information, refer to Altera’s RoHS-Compliant Devices literature page.

Device and Package Cross Reference

Table 2 through Table 22 lists the device, package type, and number of pins for each

Altera device listed in this datasheet. Altera devices listed in this datasheet are

available in the following packages:

■Ball-Grid Array (BGA)

■Ceramic Pin-Grid Array (PGA)

■FineLine BGA (FBGA)

■Hybrid FineLine BGA (HBGA)

■Plastic Dual In-Line Package (PDIP)

■Plastic Enhanced Quad Flat Pack (EQFP)

■Plastic J-Lead Chip Carrier (PLCC)

■Plastic Quad Flat Pack (PQFP)

■Power Quad Flat Pack (RQFP)

■Thin Quad Flat Pack (TQFP)

■Ultra FineLine BGA (UBGA)

DS-PKG-16.8

2Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Table 1 lists the Altera devices and the associated table locations.

Table 1. Mature Altera Device and Package Cross Reference

Altera Device Table locations

Arria®series FPGAs ■Arria GX Devices: Table 2 on page 3

Stratix®series FPGAs

■Stratix II Devices: Table 3 on page 3

■Stratix Devices: Table 4 on page 5

Cyclone®series FPGAs

■Cyclone II Devices: Table 5 on page 7

■Cyclone Devices: Table 6 on page 8

MAX®series CPLDs

■MAX 9000 Devices: Table 7 on page 8

■MAX 7000 Devices: Table 8 on page 9

■MAX 3000A Devices: Table 9 on page 10

HardCopy®series ASICs

■HardCopy II Devices: Table 10 on page 11

■HardCopy Devices: Table 11 on page 11

■HardCopy APEX Devices: Table 12 on page 12

APEX™ series FPGAs

■APEX II Devices: Table 13 on page 13

■APEX 20KE Devices: Table 14 on page 13

■APEX 20KC Devices: Table 15 on page 15

■APEX 20K Devices: Table 16 on page 15

ACEX®1K FPGAs ACEX 1K Devices: Table 17 on page 16

Mercury™ FPGAs Mercury Devices: Table 18 on page 17

FLEX®series FPGAs

■FLEX 10KA Devices: Table 19 on page 17

■FLEX 10KS Devices: Table 20 on page 18

■FLEX 10KE Devices: Table 21 on page 18

Excalibur™ FPGAs Excalibur Devices: Table 22 on page 21

Configuration devices Configuration Devices: Table 23 on page 22

Enhanced configuration devices Enhanced Configuration Devices: Table 24 on page 22

Package Information Datasheet for Mature Altera Devices 3

Device and Package Cross Reference

Arria GX Devices

Table 2 lists the device name, package type, and number of pins for the Arria GX

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Stratix II Devices

Table 3 lists the device name, package type, and number of pins for the Stratix II

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 2. Arria GX Devices

Device Package Pins

EP1AGX20

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

EP1AGX35

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single- Piece Lid: FBGA, Flip Chip, Option 4 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

EP1AGX50

Channel Lid: FBGA, Flip Chip, Option 1 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1152

EP1AGX60

Channel Lid: FBGA, Flip Chip, Option 1 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1152

EP1AGX90 Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1152

Table 3. Stratix II Devices (Part 1 of 2)

Device Package Pins

EP2S15

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 672

4Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EP2S30

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 672

EP2S60

Dual-Piece Lid: FBGA, Flip Chip, Option 1 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, option 2 1020

EP2S90

Channel Lid: HBGA, Flip Chip 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP2S130

Channel Lid: FBGA, Flip Chip, Option 1 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP2S180

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP2SGX30 Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

EP2SGX60

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1152

EP2SGX90

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1152

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP2SGX130 Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

Table 3. Stratix II Devices (Part 2 of 2)

Device Package Pins

Package Information Datasheet for Mature Altera Devices 5

Device and Package Cross Reference

Stratix Devices

Table 4 lists the device name, package type, and number of pins for the Stratix device

family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 4. Stratix Devices (Part 1 of 2)

Device Package Pins

EP1SGX10 Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 672

EP1SGX25

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

EP1SGX40 Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

EP1S10

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 484

BGA, Wire Bond 672

FBGA, Wire Bond, Option 2 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

EP1S20

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 4 484

BGA, Wire Bond 672

FBGA, Wire Bond, Option 2 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

EP1S25

BGA, Wire Bond 672

FBGA, Wire Bond, Option 2 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

EP1S30

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: BGA, Flip Chip, Option 1

Single-Piece Lid: BGA, Flip Chip, Option 2 956

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

6Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EP1S40

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

Dual-Piece Lid: BGA, Flip Chip, Option 1

Single-Piece Lid: BGA, Flip Chip, Option 2 956

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP1S60

Dual-Piece Lid: BGA, Flip Chip, Option 1

Single-Piece Lid: BGA, Flip Chip, Option 2 956

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

EP1S80

Dual-Piece Lid: BGA, Flip Chip, Option 1

Single-Piece Lid: BGA, Flip Chip, Option 2 956

Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

Dual-Piece Lid: FBGA, Flip Chip, Option 1

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

Table 4. Stratix Devices (Part 2 of 2)

Device Package Pins

Package Information Datasheet for Mature Altera Devices 7

Device and Package Cross Reference

Cyclone II Devices

Table 5 lists the device name, package type, and number of pins for the Cyclone II

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 5. Cyclone II Devices

Device Package Pins

EP2C5

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 2, Thin 256

EP2C8

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 2, Thin 256

EP2C8A FBGA, Wire Bond, Option 2, Thin 256

EP2C15A FBGA, Wire Bond, Option 2, Thin 256

FBGA, Wire Bond, A:2.40 484

EP2C20

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 2, Thin 256

FBGA, Wire Bond, A:2.40 484

EP2C20A FBGA, Wire Bond, Option 2, Thin 256

FBGA, Wire Bond, A:2.40 484

EP2C35

FBGA, Wire Bond, A:2.40 484

UBGA, Wire Bond 484

FBGA, Wire Bond, A:2.40 672

EP2C50

FBGA, Wire Bond, A:2.40 484

UBGA, Wire Bond 484

FBGA, Wire Bond, A:2.40 672

EP2C70 FBGA, Wire Bond, A:2.40 672

FBGA, Wire Bond, A:2.40 896

8Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Cyclone Devices

Table 6 lists the device name, package type, and number of pins for the Cyclone

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

MAX 9000 Devices

Table 7 lists the device name, package type, and number of pins for the MAX 9000

device family.

MAX 7000 Devices

Table 8 lists the device name, package type, and number of pins for the MAX 7000

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 6. Cyclone Devices

Device Package Pins

EP1C3 TQFP, Wire Bond 100

TQFP, Wire Bond 144

EP1C4 FBGA, Wire Bond, Option 1 324

FBGA, Wire Bond 400

EP1C6

TQFP, Wire Bond 144

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

EP1C12

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

FBGA, Wire Bond, Option 1 324

EP1C20 FBGA, Wire Bond, Option 1 324

FBGA, Wire Bond 400

Table 7. MAX 9000 Devices

Device Package Pins

EPM9320 BGA, Wire Bond 356

EPM9320A BGA, Wire Bond 356

EPM9560 BGA, Wire Bond 356

Package Information Datasheet for Mature Altera Devices 9

Device and Package Cross Reference

Table 8. MAX 7000 Devices (Part 1 of 2)

Device Package Pins

EPM7032B

PLCC, Wire Bond 44

TQFP, Wire Bond 44

UBGA, Wire Bond 49

EPM7064B

TQFP, Wire Bond 44

UBGA, Wire Bond 49

FBGA, Wire Bond, Option 1 100

TQFP, Wire Bond 100

EPM7128B

UBGA, Wire Bond 49

TQFP, Wire Bond 100

FBGA, Wire Bond, Option 1 100

TQFP, Wire Bond 144

UBGA, Wire Bond 169

FBGA, Wire Bond, Option 1 256

EPM7256B

TQFP, Wire Bond 100

TQFP, Wire Bond 144

UBGA, Wire Bond 169

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EPM7512B

TQFP, Wire Bond 144

UBGA, Wire Bond 169

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond, Option 1 256

EPM7032AE PLCC, Wire Bond 44

TQFP, Wire Bond 44

EPM7064AE

PLCC, Wire Bond 44

UBGA, Wire Bond 49

FBGA, Wire Bond, Option 1 100

TQFP, Wire Bond 44

TQFP, Wire Bond 100

FBGA, Wire Bond, Option 1 256

EPM7128AE

PLCC, Wire Bond 84

FBGA, Wire Bond, Option 1 100

TQFP, Wire Bond 100

TQFP, Wire Bond 144

UBGA, Wire Bond 169

FBGA, Wire Bond, Option 1 256

10 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

MAX 3000A Devices

Table 8 lists the device name, package type, and number of pins for the MAX 3000A

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

EPM7256AE

TQFP, Wire Bond 100

FBGA, Wire Bond, Option 1 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EPM7512AE

TQFP, Wire Bond 144

PQFP, Wire Bond 208

BGA, Wire Bond, Option 1 256

FBGA, Wire Bond, Option 1 256

EPM7032A PLCC, Wire Bond 44

TQFP, Wire Bond 44

EPM7128A

PLCC, Wire Bond 84

TQFP, Wire Bond 100

FBGA, Wire Bond 100

TQFP, Wire Bond 144

FBGA, Wire Bond, Option 1 256

EPM7256A

TQFP, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EPM7192E PGA, Wire Bond 160

PQFP, Wire Bond 160

Table 8. MAX 7000 Devices (Part 2 of 2)

Device Package Pins

Table 9. MAX 3000A Devices (Part 1 of 2)

Device Package Pins

EPM3032A PLCC, Wire Bond 44

TQFP, Wire Bond 44

EPM3064A

TQFP, Wire Bond 44

PLCC, Wire Bond 44

TQFP, Wire Bond 100

EPM3128A TQFP, Wire Bond 100

Package Information Datasheet for Mature Altera Devices 11

Device and Package Cross Reference

HardCopy II Devices

Table 10 lists the device name, package type, and number of pins for the HardCopy II

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

HardCopy Devices

Table 11 lists the device name, package type, and number of pins for the HardCopy

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

EPM3256A TQFP, Wire Bond 144

PQFP, Wire Bond 208

EPM3512A PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

Table 9. MAX 3000A Devices (Part 2 of 2)

Device Package Pins

Table 10. HardCopy II Devices

Device Package Pins

HC210 FBGA, Wire Bond, A:2.40 484

HC220 Single-Piece Lid: FBGA, Flip Chip, Option 4 672

Single-Piece Lid: FBGA, Flip Chip, Option 3 780

HC230 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

HC240 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020

Single-Piece Lid: FBGA, Flip Chip, Option 2 1508

Table 11. HardCopy Devices

Device Package Pins

HC1S25 FBGA, Wire Bond, A:2.40 672

BGA, Wire Bond 672

HC1S30 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780

HC1S40 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780

HC1S60 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

HC1S80 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

12 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

HardCopy APEX Devices

Table 12 lists the device name, package type, and number of pins for the

HardCopy APEX device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 12. HardCopy APEX Devices

Device Package Pins

HC20K400 BGA, Wire Bond, Option 3 652

HC20K600 BGA, Wire Bond, Option 3 652

Dual-Piece Lid: FBGA, Flip Chip, Option 1 672

Package Information Datasheet for Mature Altera Devices 13

Device and Package Cross Reference

APEX II Devices

Table 13 lists the device name, package type, and number of pins for the APEX II

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

APEX 20KE Devices

Table 14 lists the device name, package type, and number of pins for the APEX 20KE

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 13. APEX II Devices

Device Package Pins

EP2A15 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672

Dual-Piece Lid: BGA, Flip Chip 724

EP2A25

Channel Lid: FBGA, Flip Chip, Option 1 672

Dual-Piece Lid: BGA, Flip Chip 724

Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

EP2A40

Channel Lid: FBGA, Flip Chip, Option 1 672

Dual-Piece Lid: BGA, Flip Chip 724

Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

EP2A70 Dual-Piece Lid: BGA, Flip Chip 724

Dual-Piece Lid: FBGA, Flip Chip, Option 1 1508

Table 14. APEX 20KE Devices (Part 1 of 2)

Device Package Pins

EP20K30E

FBGA, Wire Bond 144

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 324

EP20K60E

FBGA, Wire Bond 144

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 324

BGA, Wire Bond 356

14 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EP20K100E

FBGA, Wire Bond 144

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 324

BGA, Wire Bond 356

EP20K160E

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EP20K200E

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

BGA, Wire Bond, Option 2 652

FBGA, Wire Bond, Option 2 672

EP20K300E

PQFP, Wire Bond 240

BGA, Wire Bond, Option 2 652

FBGA, Wire Bond, Option 2 672

EP20K400E BGA, Wire Bond, Option 3 652

FBGA, Flip Chip, Option 1 672

EP20K600E

BGA, Wire Bond, Option 3 652

FBGA, Flip Chip, Option 1 672

FBGA, Flip Chip, Option 1 1020

EP20K1000E

BGA, Flip Chip 652

FBGA, Flip Chip, Option 1 672

FBGA, Flip Chip, Option 1 1020

EP20K1500E BGA, Flip Chip 652

FBGA, Flip Chip, Option 1 1020

Table 14. APEX 20KE Devices (Part 2 of 2)

Device Package Pins

Package Information Datasheet for Mature Altera Devices 15

Device and Package Cross Reference

APEX 20KC Devices

Table 15 lists the device name, package type, and number of pins for the APEX 20KC

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

APEX 20K Devices

Table 16 lists the device name, package type, and number of pins for the APEX 20K

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 15. APEX 20KC Devices

Device Package Pins

EP20K200C

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EP20K400C BGA, Wire Bond, Option 3 652

FBGA, Flip Chip, Option 1 672

EP20K600C

BGA, Wire Bond, Option 3 652

FBGA, Flip Chip, Option 1 672

FBGA, Flip Chip, Option 1 1020

EP20K1000C

BGA, Flip Chip 652

FBGA, Flip Chip, Option 1 672

FBGA, Flip Chip, Option 1 1020

Table 16. APEX 20K Devices (Part 1 of 2)

Device Package Pins

EP20K100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 324

BGA, Wire Bond 356

EP20K160 PQFP, Wire Bond 240

TQFP, Wire Bond 144

16 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

ACEX 1K Devices

Table 17 lists the device name, package type, and number of pins for the ACE 1K

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

EP20K200

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EP20K300 FBGA, Wire Bond, Option 2 672

EP20K400

BGA, Wire Bond, Option 3 652

PGA, Wire Bond 655

FBGA, Flip Chip, Option 1 672

Table 16. APEX 20K Devices (Part 2 of 2)

Device Package Pins

Table 17. ACEX 1K Devices

Device Package Pins

EP1K10

TQFP, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EP1K30

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EP1K50

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

FBGA, Wire Bond, Option 2 484

EP1K100

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

FBGA, Wire Bond, Option 2 484

Package Information Datasheet for Mature Altera Devices 17

Device and Package Cross Reference

Mercury Devices

Table 18 lists the device name, package type, and number of pins for the Mercury

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

FLEX 10KA Devices

Table 19 lists the device name, package type, and number of pins for the FLEX 10KA

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 18. Mercury Devices

Device Package Pins

EP1M120 Dual-Piece Lid: FBGA, Flip Chip, Option 1 484

EP1M350 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780

Table 19. FLEX 10KA Devices

Device Package Pins

EPF10K10A

TQFP, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EPF10K30A

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EPF10K100A

RQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

BGA, Wire Bond 600

EPF10K250A PGA, Wire Bond 599

BGA, Wire Bond 600

18 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

FLEX 10KS Devices

Table 20 lists the device name, package type, and number of pins for the FLEX 10KS

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

FLEX 10KE Devices

Table 21 lists the device name, package type, and number of pins for the FLEX 10KE

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 20. FLEX 10KS Devices

Device Package Pins

EPF10K50S

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EPF10K200S

RQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

BGA, Wire Bond 600

FBGA, Wire Bond, Option 2 672

Table 21. FLEX 10KE Devices (Part 1 of 3)

Device Package Pins

EPF10K30E

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

FBGA, Wire Bond, Option 2 484

EPF10K50E

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

Package Information Datasheet for Mature Altera Devices 19

Device and Package Cross Reference

EPF10K100E

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EPF10K130E

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

BGA, Wire Bond 600

FBGA, Wire Bond, Option 2 672

EPF10K200E

PGA, Wire Bond 599

BGA, Wire Bond 600

FBGA, Wire Bond, Option 2 672

EPF10K10

PLCC, Wire Bond 84

TQFP, Wire Bond 144

PQFP, Wire Bond 208

EPF10K20

TQFP, Wire Bond 144

RQFP, Wire Bond 208

RQFP, Wire Bond 240

EPF10K30

RQFP, Wire Bond 208

RQFP, Wire Bond 240

BGA, Wire Bond 356

EPF10K40 RQFP, Wire Bond 208

RQFP, Wire Bond 240

EPF10K50

RQFP, Wire Bond 240

BGA, Wire Bond 356

PGA, Wire Bond 403

EPF10K50V

RQFP, Wire Bond 240

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond 484

EPF10K70 RQFP, Wire Bond 240

PGA, Wire Bond 503

EPF10K100 PGA, Wire Bond 503

EPF10K130V PGA, Wire Bond 599

BGA, Wire Bond 600

EPF6010A

TQFP, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

Table 21. FLEX 10KE Devices (Part 2 of 3)

Device Package Pins

20 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EPF10K100E

PQFP, Wire Bond 208

PQFP, Wire Bond 240

FBGA, Wire Bond, Option 1 256

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

EPF10K130E

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond, Option 2 484

BGA, Wire Bond 600

FBGA, Wire Bond, Option 2 672

EPF10K200E

PGA, Wire Bond 599

BGA, Wire Bond 600

FBGA, Wire Bond, Option 2 672

EPF10K10

PLCC, Wire Bond 84

TQFP, Wire Bond 144

PQFP, Wire Bond 208

EPF10K20

TQFP, Wire Bond 144

RQFP, Wire Bond 208

RQFP, Wire Bond 240

EPF10K30

RQFP, Wire Bond 208

RQFP, Wire Bond 240

BGA, Wire Bond 356

EPF10K40 RQFP, Wire Bond 208

RQFP, Wire Bond 240

EPF10K50

RQFP, Wire Bond 240

BGA, Wire Bond 356

PGA, Wire Bond 403

EPF10K50V

RQFP, Wire Bond 240

PQFP, Wire Bond 240

BGA, Wire Bond 356

FBGA, Wire Bond 484

EPF10K70 RQFP, Wire Bond 240

PGA, Wire Bond 503

EPF10K100 PGA, Wire Bond 503

EPF10K130V PGA, Wire Bond 599

BGA, Wire Bond 600

EPF6010A

TQFP, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

Table 21. FLEX 10KE Devices (Part 2 of 3)

Device Package Pins

Package Information Datasheet for Mature Altera Devices 21

Device and Package Cross Reference

Excalibur Devices

Table 22 lists the device name, package type, and number of pins for the Excalibur

device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

EPF6016

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond, Option 2 256

EPF6016A

TQFP, Wire Bond 100

FBGA, Wire Bond 100

TQFP, Wire Bond 144

PQFP, Wire Bond 208

FBGA, Wire Bond, Option 1 256

EPF6024A

TQFP, Wire Bond 144

PQFP, Wire Bond 208

PQFP, Wire Bond 240

BGA, Wire Bond, Option 2 256

FBGA, Wire Bond, Option 1 256

EPF8282A PLCC, Wire Bond 84

TQFP, Wire Bond 100

EPF8452A TQFP, Wire Bond 100

PQFP, Wire Bond 160

Table 21. FLEX 10KE Devices (Part 3 of 3)

Device Package Pins

Table 22. Excalibur Devices

Device Package Pins

EPXA1 FBGA, Wire Bond, Option 2 484

Dual-Piece Lid: FBGA, Flip Chip, Option 1 672

EPXA4 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672

Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

EPXA10 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020

22 Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Configuration Devices

Table 23 lists the device name, package type, and number of pins for the

Configuration device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Enhanced Configuration Devices

Table 24 lists the device name, package type, and number of pins for the Enhanced

configuration device family.

1The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

Table 23. Configuration Devices

Device Package Pins

EPC1 PDIP, Wire Bond 8

PLCC, Wire Bond 20

EPC2 PLCC, Wire Bond 20

TQFP, Wire Bond 32

EPC1064 PDIP, Wire Bond 8

PLCC, Wire Bond 20

EPC1213 PDIP, Wire Bond 8

PLCC, Wire Bond 20

EPC1441

PDIP, Wire Bond 8

PLCC, Wire Bond 20

TQFP, Wire Bond 32

Table 24. Enhanced Configuration Devices

Device Package Pins

EPC4 PQFP, Wire Bond 100

EPC8 PQFP, Wire Bond 100

EPC16 UBGA, Wire Bond 88

PQFP, Wire Bond 100

Package Information Datasheet for Mature Altera Devices 23

Thermal Resistance

Altera follows JEDEC JESD51 series standards to provide thermal resistances. The

purpose of the JESD51 standards is to compare the thermal performance of various

packagesunderstandardizedtestconditions.Whilestandardizedthermalresistances

canhelp comparetherelative thermalperformance of differentpackages, theycannot

apply directly to the many specific applications because JESD51 test conditions may

not match a specific application. Several factors affect the thermal performance of a

device in a user’s application. These include power dissipation in the component;

airflow velocity, direction and turbulence level; power in adjacent components;

two-sided vs. one-sided active component mounting; printed circuit board (PCB)

orientation & construction; and adjacent boards and their power dissipation. It may

be necessary to test or model specific applications. This testing and modeling of a

component user’s specific applications is the user’s responsibility.

Table 26throughTable 43provideJA(junction-to-ambientthermalresistance)andJC

(junction-to-case thermal resistance) values for the Altera device families. Altera

reserves the right to make changes to thermal resistances without notice in the future.

Table 25 lists the mature Altera devices and the associated table locations.

Altera is transitioning to an industry-standard copper lid for its thermally enhanced

BGA and thermally enhanced Flip Chip FBGA package offerings.

fFor more information, refer to Process Change Notice PCN0214.

Table 25. Thermal Resistance

Altera Device Table Location

Arria series FPGAs ■Arria GX Devices: Table 26 on page 24

Stratix series FPGAs

■Stratix II Devices: Table 27 on page 25

■Stratix Devices: Table 28 on page 26

Cyclone series FPGAs

■Cyclone II Devices: Table 29 on page 27

■Cyclone Devices: Table 30 on page 28

MAX series CPLDs

■MAX 9000 Devices: Table 31 on page 29

■MAX 7000 Devices: Table 32 on page 30

■MAX 3000A Devices: Table 33 on page 33

HardCopy series ASICs

■HardCopy II Devices: Table 34 on page 34

■HardCopy Devices: Table 35 on page 34

APEX series FPGAs

■APEX II Devices: Table 36 on page 35

■APEX 20K: Table 37 on page 36

ACEX 1K FPGAs ACEX 1K Devices: Table 38 on page 38

Mercury FPGAs Mercury Devices: Table 39 on page 39

FLEX series FPGAs

■FLEX 10K Devices: Table 40 on page 39

■FLEX 8000 Devices: Table 41 on page 41

■FLEX 6000 Devices: Table 42 on page 42

Excalibur FPGAs Excalibur Devices: Table 43 on page 43

24 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur

device families. Therefore, two thermal resistance specifications are provided for

devices affected by this change. The older packages are identified as using the

aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as

using the copper (Cu) lid.

Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered

in the newer Altera families, including Stratix and Stratix GX, were introduced using

an industry-standard Cu lid. Therefore, these device specifications include only a

single thermal resistance specification.

1Contact Altera if you need typical +/– values of A dimensions for thermal analysis.

The max numbers are provided for physical layout.

Arria Series Devices Thermal Resistance

Table 26 provides thermal resistance values for Arria series devices.

Arria GX Devices

Table 26 lists the thermal resistance of Arria GX devices.

Table 26. Thermal Resistance of Arria GX Devices

Device Package Pin

Count

JA

(° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA

(° C/W)

400 ft./min.

JC

(° C/W)

JB

(° C/W)

EP1AGX20 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1

FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1

EP1AGX35 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1

FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1

EP1AGX50

FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9

FBGA 780 10.9 8.4 6.9 5.8 0.2 2.9

FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5

EP1AGX60

FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9

FBGA 780 10.9 8.4 6.9 5.8 0.2 2.8

FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5

EP1AGX90 FBGA 1152 9.6 7.3 5.9 4.9 0.1 2.3

Package Information Datasheet for Mature Altera Devices 25

Thermal Resistance

Stratix Series Devices Thermal Resistance

Table 27 to Table 28 provide thermal resistance values for Stratix series devices.

Stratix II Devices

Table 27 lists the thermal resistance of Stratix II devices.

Table 27. Thermal Resistance of Stratix II Devices (Part 1 of 2)

Device Package Pin

Count

JC

(° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

JB

(° C/W)

EP2S15

FBGA, Flip

Chip 484 0.4 13.1 11.1 9.6 8.3 4.2

FBGA, Flip

Chip 672 0.4 12.2 10.2 8.8 7.6 4.1

EP2S30

FBGA, Flip

Chip 484 0.2 12.6 10.6 9.1 7.9 3.7

FBGA, Flip

Chip 672 0.2 11.7 9.7 8.3 7.1 3.4

EP2S60

FBGA, Flip

Chip 484 0.1 12.3 10.3 8.8 7.5 3.4

FBGA, Flip

Chip 672 0.1 11.4 9.4 7.8 6.7 3.0

FBGA, Flip

Chip 1020 0.1 10.4 8.4 7.0 5.9 2.7

EP2S90

HBGA, Flip

Chip 484 0.1 12.0 9.9 8.3 7.1 3.7

FBGA, Flip

Chip 780 0.1 10.8 8.8 7.3 6.1 2.6

FBGA, Flip

Chip 1020 0.1 10.2 8.2 6.8 5.7 2.4

FBGA, Flip

Chip 1508 0.1 9.3 7.4 6.1 5.0 2.2

EP2S130

FBGA, Flip

Chip 780 0.1 10.1 8.7 7.2 6.0 2.4

FBGA, Flip

Chip 1020 0.1 9.5 8.1 6.7 5.5 2.2

FBGA, Flip

Chip 1508 0.1 8.6 7.3 6.0 4.8 2.1

EP2S180

FBGA, Flip

Chip 1020 0.1 9.0 7.9 6.5 5.4 2.1

FBGA, Flip

Chip 1508 0.1 8.1 7.1 5.8 4.7 1.9

EP2SGX30 FBGA,

Flip Chip 780 0.2 11.1 8.6 7.2 6.0 3.1

EP2SGX60

FBGA,

Flip Chip 780 0.2 10.9 8.4 6.9 5.8 2.8

FBGA,

Flip Chip 1152 0.2 9.9 7.5 6.1 5.0 2.5

26 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Stratix Devices

Table 28 lists the thermal resistance of Stratix devices.

EP2SGX90

FBGA,

Flip Chip 1152 0.1 9.6 7.3 5.9 4.9 2.3

FBGA,

Flip Chip 1508 0.1 9.0 6.7 5.4 4.4 1.9

EP2SGX130 FBGA,

Flip Chip 1508 0.1 8.3 6.6 5.3 4.3 1.8

Table 27. Thermal Resistance of Stratix II Devices (Part 2 of 2)

Device Package Pin

Count

JC

(° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

JB

(° C/W)

Table 28. Thermal Resistance of Stratix Devices (Part 1 of 2)

Device Package Pin

Count JC (° C/W) JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1SGX10C

EP1SGX10D

FBGA,

Flip Chip 672 0.4 11.1 9.1 7.7 6.5

EP1SGX25C

EP1SGX25D

FBGA,

Flip Chip 672 0.2 10.8 8.8 7.4 6.2

EP1SGX25D

EP1SGX25F

FBGA,

Flip Chip 1020 0.2 9.9 7.9 6.5 5.4

EP1SGX40D

EP1SGX40G

FBGA,

Flip Chip 1020 0.2 9.8 7.7 6.4 5.3

EP1S10

FBGA,

Flip Chip 484 0.4 11.9 9.8 8.4 7.2

BGA 672 3.2 16.8 13.7 11.9 10.5

FBGA 672 3.4 17.2 14.0 12.2 10.8

FBGA,

Flip Chip 780 0.4 10.9 8.8 7.4 6.3

EP1S20

FBGA,

Flip Chip 484 0.3 11.8 9.7 8.3 7.1

BGA 672 2.5 15.5 12.4 10.7 9.3

FBGA 672 2.7 16.0 12.8 11.0 9.6

FBGA,

Flip Chip 780 0.3 10.7 8.6 7.2 6.1

EP1S25

BGA 672 2.2 14.8 11.7 10.0 8.7

FBGA 672 2.3 15.3 12 10.4 9.0

FBGA,

Flip Chip 780 0.3 10.5 8.5 7.1 6.0

FBGA,

Flip Chip 1020 0.3 10.0 8.0 6.6 5.5

Package Information Datasheet for Mature Altera Devices 27

Thermal Resistance

Cyclone Series Devices Thermal Resistance

Table 29 to Table 30 provide thermal resistance values for Cyclone series devices.

Cyclone II Devices

Table 29 lists the thermal resistance of Cyclone II devices.

Device Package Pin Count JC (° C/W) JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1S30

FBGA,

Flip Chip 780 0.2 10.4 8.4 7.0 5.9

BGA,

Flip Chip 956 0.2 9.1 7.1 5.8 4.8

FBGA,

Flip Chip 1020 0.2 9.9 7.9 6.5 5.4

EP1S40

FBGA,

Flip Chip 780 0.2 10.4 8.3 6.9 5.8

BGA,

Flip Chip 956 0.2 9.0 7.0 5.7 4.7

FBGA,

Flip Chip 1020 0.2 9.8 7.8 6.4 5.3

FBGA,

Flip Chip 1508 0.2 9.1 7.1 5.8 4.7

EP1S60

BGA,

Flip Chip 956 0.1 8.9 6.9 5.6 4.6

FBGA,

Flip Chip 1020 0.1 9.7 7.7 6.3 5.2

FBGA,

Flip Chip 1508 0.1 8.9 7.0 5.6 4.6

EP1S80

BGA,

Flip Chip 956 0.1 8.8 6.8 5.5 4.5

FBGA,

Flip Chip 1020 0.1 9.6 7.6 6.2 5.1

FBGA,

Flip Chip 1508 0.1 8.8 6.9 5.5 4.5

Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2)

Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2)

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP2C5

TQFP,

Wire Bond 144 10.0 31.0 29.3 27.9 25.5

PQFP,

Wire Bond 208 5.5 30.4 29.2 27.3 22.3

FBGA,

Wire Bond 256 8.7 30.2 26.1 23.6 21.7

28 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Cyclone Devices

Table 30 lists the thermal resistance of Cyclone devices.

EP2C8

TQFP,

Wire Bond 144 9.9 29.8 28.3 26.9 24.9

PQFP,

Wire Bond 208 5.4 30.2 28.8 26.9 21.7

FBGA,

Wire Bond 256 7.1 27.0 23.0 20.5 18.5

EP2C15

FBGA,

Wire Bond 256 5.5 24.2 20.0 17.8 16.0

FBGA,

Wire Bond 484 4.2 21.0 17.0 14.8 13.1

EP2C20

PQFP,

Wire Bond 240 4.2 26.6 24.0 21.4 17.4

FBGA,

Wire Bond 256 5.5 24.2 20.0 17.8 16.0

FBGA,

Wire Bond 484 4.2 21.0 17.0 14.8 13.1

EP2C35

FBGA,

Wire Bond 484 3.3 19.4 15.4 13.3 11.7

UBGA,

Wire Bond 484 5.0 20.6 16.6 14.5 12.8

FBGA,

Wire Bond 672 3.1 18.6 14.6 12.6 11.1

EP2C50

FBGA,

Wire Bond 484 2.8 18.4 14.4 12.4 10.9

UBGA,

Wire Bond 484 4.4 19.6 15.6 13.6 11.9

FBGA,

Wire Bond 672 2.6 17.7 13.7 11.8 10.2

EP2C70

FBGA,

Wire Bond 672 2.2 16.9 13.0 11.1 9.7

FBGA,

Wire Bond 896 2.1 16.3 11.9 10.5 9.1

Table 29. Thermal Resistance of Cyclone II Devices (Part 2 of 2)

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

Table 30. Thermal Resistance of Cyclone Devices (Part 1 of 2)

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1C3 TQFP 100 11.0 37.5 35.4 33.4 29.8

TQFP 144 10.0 31.1 29.4 27.9 25.5

EP1C6

TQFP 144 9.8 29.4 28.0 26.7 24.7

PQFP 240 4.3 27.2 24.7 22.1 17.8

FBGA 256 8.8 28.7 24.5 22.3 20.5

Package Information Datasheet for Mature Altera Devices 29

Thermal Resistance

MAX Series Devices Thermal Resistance

Table 31 through Table 33 provide thermal resistance values for MAX series devices.

MAX 9000 Devices

Table 31 lists the thermal resistance of MAX 9000 devices.

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1C12

PQFP 240 4.0 26.0 23.4 20.8 17.1

FBGA 256 6.6 24.3 20.2 18.1 16.4

FBGA 324 6.1 23.0 19.8 17.7 16.1

EP1C20 FBGA 324 5.0 21.0 17.7 15.6 14.1

FBGA 400 4.7 20.7 17.5 15.5 13.9

Table 30. Thermal Resistance of Cyclone Devices (Part 2 of 2)

Table 31. Thermal Resistance of MAX 9000 Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPM9320

PLCC 84 9.0 29.0 27.0 25.0 23.0

RQFP 208 1.0 17.0 16.0 15.0 13.0

PGA 280 2.0 14.0 10.0 7.0 5.0

BGA 356 2.0 14.0 12.0 11.0 10.0

EPM9320A

PLCC 84 9.0 29.0 27.0 26.0 23.0

RQFP 208 2.0 17.0 16.0 15.0 13.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EPM9400

PLCC 84 9.0 29.0 27.0 25.0 23.0

RQFP 208 1.0 17.0 16.0 15.0 13.0

RQFP 240 1.0 14.0 12.0 11.0 10.0

EPM9480 RQFP 208 1.0 17.0 16.0 15.0 12.0

RQFP 240 1.0 12.0 11.0 10.0 9.0

EPM9560

RQFP 208 1.0 17.0 16.0 15.0 12.0

RQFP 240 1.0 12.0 11.0 10.0 9.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EPM9560A

RQFP 208 1.0 17.0 16.0 15.0 12.0

RQFP 240 1.0 11.0 10.0 9.0 8.0

BGA 356 1.0 12.0 11.0 10.0 9.0

30 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

MAX 7000 Devices

Table 32 lists the thermal resistance of MAX 7000 devices.

Table 32. Thermal Resistance of MAX 7000 Devices (Part 1 of 3)

Device Package Pin

Count JC (° C/W) JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPM7032

PLCC

10.0 33.0 31.0 30.0 27.0

PQFP 15.0 48.0 46.0 45.0 42.0

TQFP 14.0 46.0 44.0 43.0 40.0

EPM7032B

PLCC 44 10.0 33.0 31.0 30.0 27.0

TQFP 14.0 46.0 44.0 43.0 40.0

UBGA 49 23.0 69.0 67.0 66.0 62.0

EPM7032S PLCC 44 10.0 33.0 31.0 30.0 27.0

TQFP 14.0 46.0 44.0 43.0 40.0

EPM7032V PLCC 44 9.0 31.0 30.0 28.0 25.0

TQFP 14.0 45.0 44.0 42.0 39.0

EPM7032AE PLCC 44 9.0 31.0 30.0 28.0 25.0

TQFP 14.0 46.0 45.0 43.0 40.0

EPM7064S

PLCC 44 9.0 31.0 30.0 28.0 25.0

TQFP 14.0 46.0 44.0 43.0 40.0

PLCC 84 9.0 28.0 26.0 25.0 23.0

TQFP 100 11.0 39.0 37.0 35.0 32.0

EPM7064

PLCC 44 9.0 31.0 30.0 28.0 25.0

TQFP 13.0 44.0 43.0 41.0 38.0

PLCC 84 9.0 28.0 26.0 25.0 22.0

PQFP 100 6.0 33.0 32.0 31.0 30.0

EPM7064AE

EPM7064B

PLCC 44 9.0 31.0 30.0 28.0 25.0

TQFP 14.0 46.0 45.0 43.0 40.0

UBGA 49 23.0 56.0 53.0 51.0 47.0

TQFP 100 12.0 39.0 37.0 35.0 31.0

FBGA 21.0 49.0 47.0 44.0 40.0

EPM7096 PLCC 68 9.0 29.0 27.0 26.0 23.0

PLCC 84 9.0 28.0 26.0 24.0 22.0

EPM7128A

PLCC 84 9.0 28.0 26.0 25.0 22.0

TQFP 100 11.0 37.0 35.0 33.0 30.0

FBGA 18.0 44.0 42.0 39.0 35.0

TQFP 144 9.0 31.0 29.0 28.0 25.0

FBGA 256 12.0 38.0 36.0 34.0 31.0

Package Information Datasheet for Mature Altera Devices 31

Thermal Resistance

EPM7128B

UBGA 49 22.0 53.0 50.0 48.0 44.0

TQFP 100 11.0 38.0 36.0 34.0 31.0

FBGA 19.0 46.0 44.0 41.0 37.0

TQFP 144 9.0 32.0 30.0 29.0 26.0

UBGA 169 16.0 44.0 42.0 39.0 35.0

FBGA 256 13.0 40.0 38.0 36.0 33.0

EPM7128E

PLCC 84 10.0 29.0 28.0 26.0 23.0

PQFP 100 6.0 32.0 31.0 30.0 29.0

PQFP 160 6.0 32.0 31.0 30.0 28.0

EPM7128S

PLCC 84 10.0 30.0 28.0 26.0 23.0

TQFP 100 12.0 38.0 36.0 34.0 30.0

PQFP 10.0 35.0 34.0 33.0 32.0

PQFP 160 7.0 33.0 32.0 31.0 30.0

EPM7128AE

PLCC 84 11.0 30.0 28.0 26.0 23.0

TQFP 100 12.0 38.0 36.0 34.0 30.0

FBGA 14.0 43.0 40.0 38.0 37.0

TQFP 144 11.0 33.0 30.0 28.0 26.0

UBGA 169 14.0 42.0 40.0 38.0 36.0

FBGA 256 12.0 39.0 37.0 35.0 31.0

EPM7160E

PLCC 84 10.0 29.0 28.0 26.0 23.0

PQFP 100 6.0 32.0 31.0 30.0 29.0

PQFP 160 6.0 33.0 32.0 31.0 30.0

EPM7160S

PLCC 84 10.0 35.0 28.0 26.0 23.0

TQFP 100 12.0 37.0 35.0 33.0 30.0

PQFP 160 6.0 33.0 32.0 31.0 30.0

EPM7192S PQFP 160 6.0 32.0 31.0 30.0 29.0

EPM7192E PGA 160 6.0 20.0 13.0 10.0 8.0

PQFP 6.0 32.0 31.0 30.0 26.0

EPM7256A

TQFP 100 9.0 36.0 34.0 32.0 30.0

TQFP 144 8.0 32.0 27.0 25.0 24.0

PQFP 208 5.0 30.0 28.0 26.0 21.0

FBGA 256 12.0 34.0 32.0 29.0 28.0

EPM7256B

TQFP 100 12.0 37.0 35.0 33.0 30.0

TQFP 144 9.0 33.0 29.0 27.0 25.0

UBGA 169 13.0 40.0 38.0 36.0 34.0

PQFP 208 5.0 31.0 29.0 27.0 22.0

FBGA 256 9.0 34.0 32.0 30.0 28.0

Table 32. Thermal Resistance of MAX 7000 Devices (Part 2 of 3)

Device Package Pin

Count JC (° C/W) JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

32 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EPM7256E

PGA 192 6.0 20.0 13.0 10.0 8.0

PQFP 160 6.0 31.0 30.0 29.0 25.0

RQFP 208 1.0 17.0 16.0 15.0 13.0

EPM7256S PQFP 208 5.0 30.0 29.0 26.0 21.0

RQFP 1.0 18.0 17.0 16.0 15.0

EPM7256AE

FBGA 100 13.0 42.0 39.0 37.0 36.0

TQFP 100 12.0 37.0 35.0 33.0 30.0

TQFP 144 9.0 33.0 29.0 27.0 25.0

PQFP 208 5.0 31.0 29.0 27.0 22.0

FBGA 256 9.0 34.0 32.0 30.0 28.0

EPM7512AE

TQFP 144 10.0 32.0 27.0 25.0 23.0

PQFP 208 5.0 30.0 28.0 25.0 21.0

BGA 256 1.2 14.0 12.0 11.0 10.0

FBGA 11.0 32.0 30.0 28.0 22.0

EPM7512B

TQFP 144 10.0 32.0 27.0 25.0 24.0

UBGA 169 12.0 35.0 33.0 31.0 30.0

PQFP 208 5.0 30.0 28.0 25.0 21.0

BGA 256 1.2 14.0 12.0 11.0 10.0

FBGA 256 11.0 32.0 30.0 28.0 27.0

Table 32. Thermal Resistance of MAX 7000 Devices (Part 3 of 3)

Device Package Pin

Count JC (° C/W) JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

Package Information Datasheet for Mature Altera Devices 33

Thermal Resistance

MAX 3000A Devices

Table 33 lists the thermal resistance of MAX 3000A devices.

HardCopy Series Devices Thermal Resistance

Table 34 to Table 35 provide thermal resistance values for HardCopy series devices.

Table 33. Thermal Resistance of MAX 3000A Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPM3032A TQFP 44 14.0 46.0 45.0 43.0 40.0

PLCC 9.0 31.0 30.0 28.0 25.0

EPM3064A

TQFP 44 14.0 46.0 45.0 43.0 40.0

PLCC 9.0 31.0 30.0 28.0 25.0

TQFP 100 12.0 39.0 37.0 35.0 31.0

EPM3128A TQFP 100 12.0 38.0 36.0 34.0 30.0

EPM3256A TQFP 144 9.0 33.0 29.0 27.0 25.0

PQFP 208 5.0 31.0 29.0 27.0 22.0

EPM3512A PQFP 208 5.0 30.0 28.0 25.0 21.0

FBGA 256 11.0 32.0 30.0 28.0 22.0

34 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

HardCopy II Devices

Table 34 lists the thermal resistance of HardCopy II devices.

HardCopy Devices

Table 35 lists the thermal resistance of HardCopy devices.

Table 34. Thermal Resistance of HardCopy II Devices

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min. JB (° C/W)

HC210 FBGA,

Wire Bond 484 5.5 21.3 17.4 15.3 13.8 9.6

HC220

FBGA,

Flip Chip 672 0.5 12.1 9.9 8.3 7.1 3.6

FBGA,

Flip Chip 780 0.5 11.7 9.5 8.0 6.8 3.5

HC230 FBGA,

Flip Chip 1020 0.3 10.8 8.6 7.1 6.0 2.9

HC240

FBGA,

Flip Chip 1020 0.2 10.6 8.4 6.9 5.8 2.7

FBGA,

Flip Chip 1508 0.2 9.7 7.5 6.1 5.0 2.6

Table 35. Thermal Resistance of HardCopy Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

HC20K400 BGA, Flip Chip 652 0.5 9.1 7.9 6.4 5.3

HC20K600 FBGA, Flip Chip 672 1.0 13.0 10.2 8.6 7.3

HC1S25 FBGA, Wire Bond 672 3.7 19.7 15.8 13.9 12.4

BGA, Wire Bond 3.4 19.3 15.6 13.8 12.3

HC1S30 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3

HC1S40 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3

HC1S60 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8

HC1S80 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8

Package Information Datasheet for Mature Altera Devices 35

Thermal Resistance

APEX Series Devices Thermal Resistance

Table 36 to Table 37 list thermal resistance values for APEX series devices.

APEX II Devices

Table 36 lists the thermal resistance of APEX II devices.

Table 36. Thermal Resistance of APEX II Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP2A15

FBGA, Flip Chip (Cu lid) 672 0.2 10.8 8.8 7.4 6.2

FBGA, Flip Chip (AlSiC lid) 0.3 11.6 9.6 8.0 6.6

BGA, Flip Chip (Cu lid) 724 0.2 9.7 7.7 6.4 5.3

BGA, Flip Chip (AlSiC lid) 0.4 10.0 8.2 6.6 5.4

EP2A25

FBGA (Cu lid) 672 0.2 10.7 8.7 7.2 6.1

FBGA, Flip Chip (AlSiC lid) 0.3 11.5 9.6 8.0 6.6

BGA, Flip Chip (Cu lid) 724 0.2 9.6 7.6 6.2 5.2

BGA, Flip Chip (AlSiC lid) 0.3 10.0 8.2 6.6 5.4

FBGA, Flip Chip (Cu lid) 1020 0.2 9.8 7.8 6.4 5.3

FBGA, Flip Chip (AlSiC lid) 0.3 10.4 8.5 6.9 5.7

EP2A40

FBGA, Flip Chip (Cu lid) 672 0.2 10.0 8.2 6.9 5.9

FBGA, Flip Chip (AlSiC lid) 0.2 10.0 8.2 6.9 5.9

BGA, Flip Chip (Cu lid) 724 0.2 9.5 7.5 6.1 5.1

BGA, Flip Chip (AlSiC lid) 0.2 9.5 7.5 6.1 5.1

FBGA, Flip Chip (Cu lid) 1020 0.2 9.7 7.7 6.3 5.2

FBGA, Flip Chip (AlSiC lid) 0.2 9.7 7.7 6.3 5.2

EP2A70

BGA, Flip Chip (Cu lid) 724 0.1 9.3 7.3 6.0 4.9

BGA, Flip Chip (AlSiC lid) 0.1 10.0 7.9 6.4 5.3

FBGA, Flip Chip (Cu lid) 1508 0.1 8.8 6.8 5.5 4.5

FBGA, Flip Chip (AlSiC lid) 0.1 9.3 7.3 5.8 4.7

36 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

APEX 20K Devices

Table 37 lists the thermal resistance of APEX 20KE, 20KC, and 20K devices.

Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 1 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP20K30E

TQFP 144 8.0 29.0 28.0 26.0 25.0

PQFP 208 5.0 30.0 29.0 27.0 22.0

FBGA 144 14.0 36.0 34.0 32.0 29.0

FBGA 324 9.0 31.0 29.0 28.0 25.0

EP20K60E

TQFP 144 7.0 28.0 26.0 25.0 24.0

FBGA 144 11.0 33.0 32.0 30.0 27.0

PQFP 208 5.0 30.0 28.0 26.0 21.0

PQFP 240 4.0 26.0 24.0 21.0 17.0

FBGA 324 7.0 29.0 28.0 26.0 24.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EP20K100

TQFP 144 7.0 26.0 25.0 24.0 23.0

PQFP 208 5.0 29.0 27.0 25.0 20.0

PQFP 240 4.0 25.0 23.0 20.0 17.0

FBGA 324 6.0 28.0 26.0 25.0 23.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EP20K100E

TQFP 144 7.0 26.0 25.0 24.0 23.0

FBGA 144 9.0 32.0 30.0 29.0 26.0

PQFP 208 5.0 29.0 27.0 25.0 20.0

PQFP 240 4.0 25.0 23.0 20.0 17.0

FBGA 324 6.0 28.0 26.0 25.0 23.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EP20K160E

TQFP 144 6.0 25.0 24.0 23.0 22.0

PQFP 208 5.0 28.0 26.0 23.0 19.0

PQFP 240 4.0 24.0 21.0 19.0 16.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 24.0 23.0 22.0 21.0

EP20K200

PQFP 208 4.0 25.0 23.0 20.0 17.0

PQFP 240 3.0 21.0 19.0 17.0 15.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 22.0 21.0 20.0 19.0

EP20K200E

PQFP 208 4.0 25.0 23.0 20.0 17.0

PQFP 240 3.0 22.0 19.0 18.0 16.0

BGA 356 2.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 23.0 22.0 21.0 20.0

BGA 652 1.0 12.0 11.0 10.0 9.0

FBGA 672 5.0 21.0 20.0 19.0 18.0

Package Information Datasheet for Mature Altera Devices 37

Thermal Resistance

EP20K200C

PQFP 208 4.0 25.0 23.0 20.0 17.0

PQFP 240 3.0 22.0 19.0 18.0 16.0

BGA 356 2.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 23.0 22.0 21.0 20.0

EP20K300E

PQFP 240 3.0 19.0 18.0 16.0 15.0

BGA 652 1.0 12.0 11.0 10.0 9.0

FBGA 672 5.0 20.0 19.0 18.0 17.0

EP20K400

BGA 652 0.5 9.0 8.0 7.0 6.0

PGA 655 1.0 8.0 7.0 6.0 4.0

FBGA 672 0.4 11.6 9.6 7.9 6.5

FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6

EP20K400E

EP20K400C

BGA 652 0.5 9.0 8.0 7.0 6.0

FBGA (Cu lid) 672 0.3 10.9 8.8 7.4 6.3

FBGA (AlSiC lid) 0.4 11.7 9.7 8.0 6.7

FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6

EP20K600E

EP20K600C

BGA 652 0.5 9.0 8.0 7.0 6.0

FBGA (Cu lid) 672 0.2 10.8 8.7 7.3 6.1

FBGA (AlSiC lid) 0.3 11.6 9.6 7.9 6.5

FBGA w/ fin (1) 672 0.5 5.0 3.0 3.0 2.0

FBGA (Cu lid) 1,020 0.2 9.9 7.8 6.5 5.4

FBGA (AlSiC lid) 0.3 10.4 8.4 6.8 5.6

FBGA w/ fin (1) 1,020 0.5 5.0 3.0 3.0 2.0

EP20K1000E

EP20K1000C

BGA (Cu lid) 652 0.1 8.3 7.0 5.6 4.5

BGA (AlSiC lid) 0.2 9.3 7.4 6.0 4.9

FBGA w/ fin (1) 652 0.5 4.0 3.0 3.0 2.0

FBGA (Cu lid) 672 0.1 10.6 8.6 7.2 6.0

FBGA (AlSiC lid) 0.2 11.4 9.4 7.7 6.3

FBGA w/ fin (1) 672 0.5 6.0 4.0 3.0 2.0

FBGA (Cu lid) 1,020 0.1 9.7 7.7 6.3 5.2

FBGA (AlSiC lid) 0.2 10.2 8.2 6.6 5.4

FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.0 2.0

Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 2 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

38 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

ACEX 1K Devices Thermal Resistance

Table 38 provides thermal resistance values for ACEX 1K devices.

EP20K1500E

BGA (Cu lid) 652 0.1 8.2 6.9 5.5 4.4

BGA (AlSiC lid) 0.2 9.2 7.3 5.8 4.8

FBGA 652 0.1 9.2 7.3 5.8 4.8

FBGA w/ fin (1) 652 0.5 4.0 3.0 2.5 2.0

FBGA (Cu lid) 1,020 0.1 9.6 7.6 6.2 5.1

FBGA (AlSiC lid) 0.2 10.1 8.1 6.4 5.3

FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.5 2.0

Note to Table 37:

(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera

performed the thermal calculations in Table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base

thickness: 0.5 mm.

Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 3 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

Table 38. Thermal Resistance of ACEX 1K Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1K10

TQFP 100 11.0 37.0 35.0 33.0 29.0

TQFP 144 8.0 31.0 29.0 28.0 25.0

PQFP 208 6.0 30.0 29.0 27.0 22.0

FBGA 256 12.0 37.0 35.0 33.0 30.0

EP1K30

TQFP 144 8.0 28.0 27.0 26.0 24.0

PQFP 208 5.0 30.0 28.0 26.0 21.0

FBGA 256 9.0 31.0 29.0 28.0 25.0

EP1K50

TQFP 144 7.0 26.0 25.0 24.0 23.0

PQFP 208 5.0 29.0 28.0 25.0 20.0

FBGA 256 7.0 30.0 28.0 27.0 24.0

FBGA 484 5.0 25.0 24.0 23.0 22.0

EP1K100

PQFP 208 5.0 28.0 26.0 23.0 18.0

FBGA 256 6.0 28.0 26.0 25.0 23.0

FBGA 484 5.0 24.0 23.0 22.0 21.0

Package Information Datasheet for Mature Altera Devices 39

Thermal Resistance

Mercury Devices Thermal Resistance

Table 39 provides thermal resistance values for Mercury devices.

FLEX Series Devices Thermal Resistance

Table 40 through Table 42 provide thermal resistance values for FLEX series devices.

FLEX 10K Devices

Table 40 lists the thermal resistance of FLEX 10K devices.

Table 39. Thermal Resistance of Mercury Devices

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EP1M120 FBGA (Cu lid) 484 0.6 12.2 10.1 8.7 7.5

FBGA (AlSiC lid) 484 0.9 13.0 11.1 9.3 7.9

EP1M350 FBGA (Cu lid) 780 0.2 10.5 8.5 7.1 5.9

FBGA (AlSiC lid) 780 0.3 11.0 9.2 7.6 6.3

Table 40. Thermal Resistance of FLEX 10K Devices (Part 1 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPF10K10

PLCC 84 9.0 28.0 26.0 24.0 22.0

TQFP 144 7.0 26.0 25.0 24.0 23.0

PQFP 208 5.0 29.0 27.0 25.0 20.0

EPF10K10A

TQFP 100 10.0 35.0 33.0 31.0 28.0

TQFP 144 7.0 29.0 28.0 26.0 25.0

PQFP 208 5.0 30.0 29.0 27.0 21.0

FBGA 256 7.0 33.0 30.0 28.0 26.0

EPF10K20

TQFP 144 6.0 24.0 23.0 22.0 21.0

RQFP 208 1.0 17.0 16.0 15.0 13.0

RQFP 240 1.0 14.0 12.0 11.0 10.0

EPF10K30

RQFP 208 1.0 17.0 16.0 15.0 12.0

RQFP 240 1.0 13.0 12.0 11.0 10.0

BGA 356 1.0 12.0 11.0 10.0 9.0

EPF10K30A

TQFP 144 7.0 25.0 24.0 23.0 22.0

PQFP 208 5.0 29.0 27.0 24.0 19.0

PQFP 240 4.0 25.0 22.0 20.0 17.0

FBGA 256 6.0 28.0 26.0 24.0 23.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 24.0 22.0 21.0 20.0

EPF10K30E

TQFP 144 9.0 28.0 27.0 26.0 24.0

PQFP 208 5.0 30.0 28.0 26.0 21.0

FBGA 256 9.0 31.0 29.0 28.0 25.0

FBGA 484 6.0 26.0 25.0 24.0 22.0

40 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

EPF10K40 RQFP 208 1.0 17.0 16.0 15.0 12.0

RQFP 240 1.0 13.0 12.0 11.0 10.0

EPF10K50

RQFP 240 1.0 12.0 11.0 10.0 9.0

BGA 356 1.0 12.0 11.0 10.0 9.0

PGA 403 3.0 12.0 10.0 9.0 8.0

PGA (1) 3.0 10.0 8.0 7.0 6.0

EPF10K50V

PQFP 240 4.0 25.0 22.0 20.0 17.0

RQFP 240 1.0 13.0 12.0 11.0 10.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 23.0 22.0 21.0 20.0

EPF10K50E

TQFP 144 9.0 26.0 25.0 24.0 23.0

PQFP 208 5.0 29.0 27.0 24.0 19.0

PQFP 240 4.0 25.0 22.0 20.0 17.0

FBGA 256 6.0 29.0 27.0 26.0 24.0

FBGA 484 5.0 25.0 24.0 23.0 21.0

EPF10K50S

TQFP 144 9.0 26.0 25.0 24.0 23.0

PQFP 208 5.0 29.0 28.0 25.0 20.0

PQFP 240 4.0 26.0 23.0 20.0 17.0

FBGA 256 7.0 30.0 28.0 27.0 24.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 25.0 24.0 23.0 22.0

EPF10K70 RQFP 240 1.0 12.0 11.0 10.0 9.0

PGA 503 1.0 8.0 7.0 6.0 4.0

EPF10K100

PGA

503

1.0 8.0 7.0 6.0 4.0

PGA (1) 1.0 6.0 5.0 4.0 3.0

PGA (2) — 2.0 — — —

EPF10K100A

RQFP 240 1.0 13.0 11.0 10.0 9.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 22.0 21.0 20.0 18.0

BGA 600 0.5 10.0 9.0 8.0 7.0

EPF10K100E

PQFP 208 5.0 28.0 26.0 23.0 18.0

PQFP 240 4.0 23.0 21.0 19.0 16.0

FBGA 256 6.0 28.0 26.0 25.0 23.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 24.0 23.0 22.0 21.0

EPF10K130V PGA 599 1.0 8.0 7.0 6.0 4.0

BGA 600 0.5 10.0 9.0 8.0 7.0

Table 40. Thermal Resistance of FLEX 10K Devices (Part 2 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

Package Information Datasheet for Mature Altera Devices 41

Thermal Resistance

FLEX 8000 Devices

Table 41 lists the thermal resistance of FLEX 8000 devices.

EPF10K130E

PQFP 240 4.0 21.0 19.0 17.0 15.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 23.0 22.0 21.0 20.0

BGA 600 0.5 10.0 9.0 8.0 7.0

FBGA 672 5.0 21.0 20.0 19.0 18.0

EPF10K200E

PGA 599 1.0 8.0 7.0 6.0 4.0

BGA 600 0.5 10.0 9.0 8.0 7.0

FBGA 672 5.0 20.0 19.0 18.0 17.0

EPF10K200S

RQFP 240 1.0 13.0 11.0 10.0 9.0

BGA 356 1.0 12.0 11.0 10.0 9.0

FBGA 484 5.0 22.0 21.0 20.0 19.0

BGA 600 0.5 10.0 9.0 8.0 7.0

FBGA 672 5.0 21.0 20.0 19.0 18.0

EPF10K250A PGA 599 1.0 8.0 7.0 6.0 4.0

BGA 600 0.5 10.0 9.0 8.0 7.0

Notes to Table 40:

(1) With attached pin-fin heat sink.

(2) With attached motor-driven fan heat sink.

Table 40. Thermal Resistance of FLEX 10K Devices (Part 3 of 3)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

Table 41. Thermal Resistance of FLEX 8000 Devices (Part 1 of 2)

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPF8282A PLCC 84 10.0 30.0 28.0 26.0 23.0

TQFP 100 11.0 36.0 34.0 32.0 29.0

EPF8452A

PLCC 84 10.0 30.0 28.0 26.0 23.0

TQFP 100 11.0 35.0 33.0 31.0 28.0

PQFP 160 6.0 32.0 31.0 30.0 28.0

EPF8636A

PLCC 84 10.0 29.0 28.0 26.0 23.0

PQFP 160 6.0 32.0 31.0 30.0 27.0

PGA 192 6.0 16.0 11.0 8.0 6.0

PQFP 208 5.0 30.0 38.0 26.0 20.0

RQFP 208 1.0 17.0 16.0 15.0 14.0

42 Package Information Datasheet for Mature Altera Devices

Thermal Resistance

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

FLEX 6000 Devices

Table 42 lists the thermal resistance of FLEX 6000 devices.

Excalibur Devices Thermal Resistance

Table 43 provides thermal resistance values for Excalibur devices.

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPF8820A

TQFP 144 9.0 26.0 25.0 24.0 23.0

PQFP 160 6.0 32.0 31.0 30.0 27.0

PQFP 208 5.0 29.0 27.0 25.0 20.0

RQFP 208 1.0 17.0 16.0 15.0 14.0

BGA 225 6.0 28.0 19.0 14.0 11.0

EPF81188A

PQFP 208 5.0 28.0 26.0 24.0 19.0

PGA 232 2.0 14.0 10.0 7.0 5.0

PQFP 240 4.0 24.0 21.0 19.0 16.0

RQFP 240 1.0 14.0 12.0 11.0 10.0

EPF81500A

PQFP 240 4.0 22.0 20.0 19.0 16.0

RQFP 240 1.0 13.0 12.0 11.0 10.0

PGA 280 2.0 14.0 10.0 7.0 5.0

Table 41. Thermal Resistance of FLEX 8000 Devices (Part 2 of 2)

Table 42. Thermal Resistance of FLEX 6000 Devices

Device Package Pin Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPF6010A TQFP 100 11.0 35.0 33.0 31.0 28.0

TQFP 144 10.0 28.0 26.0 25.0 24.0

EPF6016

TQFP 144 10.0 28.0 26.0 25.0 24.0

PQFP 208 5.0 30.0 28.0 26.0 21.0

PQFP 240 4.0 26.0 24.0 21.0 17.0

BGA 256 6.0 28.0 22.0 20.0 19.0

EPF6016A

TQFP 100 11.0 35.0 33.0 31.0 28.0

FBGA 14.0 36.0 34.0 32.0 29.0

TQFP 144 10.0 29.0 28.0 26.0 24.0

PQFP 208 5.0 30.0 29.0 26.0 21.0

FBGA 256 10.0 32.0 30.0 29.0 26.0

EPF6024A

TQFP 144 10.0 27.0 26.0 25.0 24.0

PQFP 208 5.0 29.0 28.0 26.0 20.0

PQFP 240 4.0 26.0 23.0 21.0 17.0

BGA 256 6.0 28.0 22.0 20.0 19.0

FBGA 8.0 30.0 29.0 27.0 25.0

Package Information Datasheet for Mature Altera Devices 43

Thermal Resistance

Table 43. Thermal Resistance of Excalibur Embedded Processor Solutions

Device Package

Count JC (° C/W)

JA (° C/W)

Still Air

JA (° C/W)

100 ft./min.

JA (° C/W)

200 ft./min.

JA (° C/W)

400 ft./min.

EPXA1

FBGA 484 4.0 20.0 18.3 15.8 13.9

FBGA, Flip Chip (Cu lid) 672 0.5 11.3 9.3 7.9 6.7

FBGA, Flip Chip (AlSiC lid) 672 0.8 12.2 10.2 8.6 7.2

EPXA4

FBGA, Flip Chip (Cu lid) 672 0.2 10.8 8.8 7.3 6.2

FBGA, Flip Chip (AlSiC lid) 672 0.3 11.6 9.6 7.9 6.6

FBGA, Flip Chip (Cu lid) 1,020 0.2 9.9 7.9 6.5 5.4

FBGA, Flip Chip (AlSiC lid) 1,020 0.3 10.4 8.5 6.9 5.7

EPXA10 FBGA, Flip Chip (Cu lid) 1,020 0.1 9.6 7.6 6.2 5.1

FBGA, Flip Chip (AlSiC lid) 1,020 0.2 10.0 8.0 6.4 5.7

44 Package Information Datasheet for Mature Altera Devices

Package Outlines

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outlines

The package outlines on the following pages are listed in order of ascending pin

count. Altera package outlines meet the requirements of JEDEC Publication No. 95.

1All lidless flip chip and wire bond packages are non-vented packages. All other flip

chip packages are vented packages.

Package Information Datasheet for Mature Altera Devices 45

8-Pin Plastic Dual In-Line Package (PDIP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in inches.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference P

Package Acronym PDIP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-001 Variation: BA

Lead Coplanarity NA

Weight 0.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A — — 0.170

A1 0.015 — —

A2 0.130 TYP

D 0.360 — 0.380

E 0.300 0.310 0.325

E1 0.240 0.250 0.260

L 0.125 — 0.135

b 0.016 0.018 0.020

c 0.008 0.010 0.014

e 0.100 BSC

46 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin 1 ID

Pin 1

Pin 4

Pin 8

Package Information Datasheet for Mature Altera Devices 47

20-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's

proximity, on package surface.

Package Information

Description Specification

Ordering Code Reference L

Package Acronym PLCC

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-018 Variation: AA

Lead Coplanarity 0.004 inches (0.10mm)

Weight 0.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A 0.165 0.172 0.180

A1 0.020 — —

A2 0.150 TYP

D 0.385 0.390 0.395

D1 0.350 0.353 0.356

D2 0.290 0.310 0.330

E 0.385 0.390 0.395

E1 0.350 0.353 0.356

E2 0.290 0.310 0.330

b 0.013 — 0.021

c 0.010 TYP

e 0.050 TYP

48 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 49

32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference T

Package Acronym TQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: ABA

Lead Coplanarity 0.004 inches (0.1mm)

Weight 0.2 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.20

A1 0.05 — 0.15

A2 0.95 1.00 1.05

D 9.00 BSC

D1 7.00 BSC

E 9.00 BSC

E1 7.00 BSC

L 0.45 0.60 0.75

L1 1.00 REF

S 0.20 — —

b 0.30 0.37 0.45

c 0.09 — 0.20

e 0.80 BSC

03.57

50 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 51

44-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in inches.

■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1’s

proximity, on package surface.

Package Information

Description Specification

Ordering Code Reference L

Package Acronym PLCC

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-018 Variation: AC

Lead Coplanarity 0.004 inches (0.10 mm)

Weight 2.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A 0.165 0.172 0.180

A1 0.020 — —

A2 0.150 TYP

D 0.685 0.690 0.695

D1 0.650 0.653 0.656

D2 0.582 0.610 0.638

E 0.685 0.690 0.695

E1 0.650 0.653 0.656

E2 0.582 0.610 0.638

b 0.013 — 0.021

c 0.010 TYP

e 0.050 TYP

52 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin 1 ID

Pin 7

Pin 17

Pin 44

Pin 1

Package Information Datasheet for Mature Altera Devices 53

44-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference T

Package Acronym TQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: ACB

Lead Coplanarity 0.004 inches (0.1mm)

Weight 0.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.20

A1 0.05 — 0.15

A2 0.95 — —

D 12.00 BSC

D1 10.00 BSC

E 12.00 BSC

E1 10.00 BSC

L 0.45 0.60 0.75

L1 1.00 REF

S 0.20 — —

b 0.30 0.37 0.45

c 0.09 — 0.20

e 0.80 BSC

03.57

54 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 55

49-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference U

Package Acronym UBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-216 Variation: BAB-2

Lead Coplanarity 0.005 inches (0.12mm)

Weight 0.2 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.55

A1 0.20 — —

A2 — — 1.35

A3 0.70 TYP

D 7.00 BSC

E 7.00 BSC

b 0.40 0.50 0.60

e 0.80 BSC

56 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 57

64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference E

Package Acronym EQFP

Leadframe Material Copper

Lead Finish (plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: ABD-HD

Lead Coplanarity 0.003 inch (0.08 mm)

Weight 0.15 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.20

A1 0.05 — 0.15

A2 0.95 1.00 1.05

D 9.00 BSC

D1 7.00 BSC

D2 3.50 4.50 5.50

E 9.00 BSC

E1 7.00 BSC

E2 3.50 4.50 5.50

L0.45 0.60 0.75

L1 1.00 REF

S 0.20 ——

b 0.13 0.18 0.23

c 0.09 — 0.20

e 0.40 BSC

0° 3.5° 7°

58 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin 1 ID

Pin 1

Pin 16

Pin 64 Pin 64

Pin 16

Pin 1

Detail A

See Detail A

TOP VIEW BOTTOM VIEW

Package Information Datasheet for Mature Altera Devices 59

84-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's

proximity, on package surface.

Package Information

Description Specification

Ordering Code Reference L

Package Acronym PLCC

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-018 Variation: AF

Lead Coplanarity 0.004 inches (0.10mm)

Weight 7.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A 0.165 0.172 0.180

A1 0.020 — —

A2 0.150 TYP

D 1.185 1.190 1.195

D1 1.150 1.154 1.158

D2 1.082 1.110 1.138

E 1.185 1.190 1.195

E1 1.150 1.154 1.158

E2 1.082 1.110 1.138

b 0.013 — 0.021

c 0.008 TYP

e 0.050 TYP

60 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 61

88-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference U

Package Acronym UBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline MO-219

Lead Coplanarity 0.005 inches (0.12 mm)

Weight 0.4 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.40

A1 0.25 — —

A2 0.80 — —

A3 0.70 REF

D 11.00 BSC

E 8.00 BSC

b 0.40 0.45 0.50

e 0.80 BSC

62 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

432

Pin A1

Corner

12 11 10 98

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 63

100-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

1This POD is applicable to F100 packages of all products except MAX II, which is

assembled in Option 2 package outlines.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder ball composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: AAC-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 0.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.70

A1 0.30 — —

A2 0.25 — 1.10

A3 — — 0.80

D 11.00 BSC

E 11.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

64 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

A3 A1

Pin A1

Corner

TOP VIEW BOTTOM VIEW

Package Information Datasheet for Mature Altera Devices 65

100-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

Package Information

Description Specification

Ordering Code Reference Q

Package Acronym PQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-022 Variation: GC-1

Lead Coplanarity 0.004 inches (0.10mm)

Weight 1.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.40

A1 0.25 — 0.50

A2 2.50 2.70 2.90

D 17.20 BSC

D1 14.00 BSC

E 23.20 BSC

E1 20.00 BSC

L 0.73 0.88 1.03

L1 1.60 REF

S 0.20 — —

b 0.22 — 0.40

c 0.11 — 0.23

e 0.65 BSC

0—7

66 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

0.25mm

See Detail A

Detail A

Gage

Plane

Pin 100

Pin 30

Pin 1

Pin 1 ID

Package Information Datasheet for Mature Altera Devices 67

100-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference T

Package Acronym TQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: AED

Lead Coplanarity 0.003 inches (0.08mm)

Weight 0.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.20

A1 0.05 — 0.15

A2 0.95 1.00 1.05

D 16.00 BSC

D1 14.00 BSC

E 16.00 BSC

E1 14.00 BSC

L 0.45 0.60 0.75

L1 1.00 REF

S 0.20 — —

b 0.17 0.22 0.27

c 0.09 — 0.20

e 0.50 BSC

03.57

68 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 69

144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference E

Package Acronym EQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: BFB

Lead Coplanarity 0.003 inches (0.08mm)

Weight 1.1 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.60

A1 0.05 — 0.15

A2 1.35 1.40 1.45

D 22.00 BSC

D1 20.00 BSC

D2 4.00 — —

E 22.00 BSC

E1 20.00 BSC

E2 4.00 — —

L 0.45 0.60 0.75

L1 1.00 REF

S 0.20 — —

b 0.17 0.22 0.27

c 0.09 — 0.20

e 0.50 BSC

03.57

70 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 71

144-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: AAD-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 0.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.20

A1 0.30 — —

A2 0.25 — 1.80

A3 0.70 REF

D 13.00 BSC

E 13.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

72 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 73

144-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference T

Package Acronym TQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-026 Variation: BFB

Lead Coplanarity 0.003 inches (0.08mm)

Weight 1.1 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.60

A1 0.05 — 0.15

A2 1.35 1.40 1.45

D 22.00 BSC

D1 20.00 BSC

E 22.00 BSC

E1 20.00 BSC

L 0.45 0.60 0.75

L1 1.00 REF

S 0.20 — —

b 0.17 0.22 0.27

c 0.09 — 0.20

e 0.50 BSC

03.57

74 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 75

160-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference G

Package Acronym PGA

Leadframe Material Alloy 42

Lead Finish Gold Over Nickel Plate

JEDEC Outline Reference MO-067 Variation: AG

Lead Coplanarity N/A

Weight 19.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A 0.160 0.190 0.220

A1 0.050 TYP

A2 0.120 0.140 0.160

D 1.540 1.560 1.580

E 1.540 1.560 1.580

L 0.130 TYP

b 0.016 0.018 0.020

e 0.100 BSC

76 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 77

160-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference Q

Package Acronym PQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-022 Variation: DD-1

Lead Coplanarity 0.004 inches (0.10mm)

Weight 6.2 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 4.10

A1 0.25 — 0.50

A2 3.20 3.40 3.60

D 31.20 BSC

D1 28.00 BSC

E 31.20 BSC

E1 28.00 BSC

L 0.50 — 1.03

L1 1.60 REF

S 0.20 — —

b 0.22 — 0.40

c 0.09 — 0.23

e 0.65 BSC

0—7

78 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 79

169-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference U

Package Acronym UBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-216 Variation: BAF-1

Lead Coplanarity 0.005 inches (0.12mm)

Weight 0.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.70

A1 0.20 — —

A2 0.65 — —

A3 0.70 TYP

D 11.00 BSC

E 11.00 BSC

b 0.40 0.50 0.60

e 0.80 BSC

80 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 81

208-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot in its proximity on package surface.

Package Information

Description Specification

Ordering Code Reference Q

Package Acronym PQFP

Lead Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-029 Variation: FA-1

Lead Coplanarity 0.003 inches (0.08 mm)

Weight 6.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 4.10

A1 0.25 — 0.50

A2 3.20 3.40 3.60

D 30.60 BSC

D1 28.00 BSC

E 30.60 BSC

E1 28.00 BSC

L 0.50 0.60 0.75

L1 1.30 REF

S 0.20 — —

b 0.17 — 0.27

c 0.09 — 0.20

e 0.50 BSC

0° 3.5° 8°

82 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin 1 ID

Pin 208

Detail A

Gage

Plane

0.25mm

See Detail A

Pin 1

Pin 52

Package Information Datasheet for Mature Altera Devices 83

208-Pin Power Quad Flat Pack (RQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference R

Package Acronym RQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-029 Variation: FA-1

Lead Coplanarity 0.003 inches (0.08mm)

Weight 11.0 g (Typ.) or 6.4 g (Typ.) (1)

Moisture Sensitivity Level Printed on moisture barrier bag

Note:

(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized

aluminum). Refer to PCN1002.

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 4.10

A1 0.25 — 0.50

A2 3.20 3.40 3.60

D 30.60 BSC

D1 28.00 BSC

E 30.60 BSC

E1 28.00 BSC

L 0.45 0.60 0.75

L1 1.30 REF

S 0.20 — —

b 0.17 — 0.27

c 0.09 — 0.20

e 0.50 BSC

03.58

84 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 85

240-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference Q

Package Acronym PQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-029 Variation: GA

Lead Coplanarity 0.003 inches (0.08mm)

Weight 8.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 4.10

A1 0.25 — 0.50

A2 3.20 3.40 3.60

D 34.60 BSC

D1 32.00 BSC

E 34.60 BSC

E1 32.00 BSC

L 0.45 0.60 0.75

L1 1.30 REF

S 0.20 — —

b 0.17 — 0.27

c 0.09 — 0.20

e 0.50 BSC

03.58

86 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 87

240-Pin Power Quad Flat Pack (RQFP)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference R

Package Acronym RQFP

Leadframe Material Copper

Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference MS-029 Variation: GA

Lead Coplanarity 0.003 inches (0.08mm)

Weight 15.4 g (Typ.) or 8.5 g (Typ.) (1)

Moisture Sensitivity Level Printed on moisture barrier bag

Note:

(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized

aluminum). Refer to PCN1002.

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 4.10

A1 0.25 — 0.50

A2 3.20 3.40 3.60

D 34.60 BSC

D1 32.00 BSC

E 34.60 BSC

E1 32.00 BSC

L 0.45 0.60 0.75

L1 1.30 REF

S 0.20 — —

b 0.17 — 0.27

c 0.09 — 0.20

e 0.50 BSC

03.58

88 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 89

256-Pin Ball-Grid Array (BGA), Option 1—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT or tape

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: BAL-2

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 4.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.70

A1 0.35 — —

A2 0.25 — 1.10

D 27.00 BSC

E 27.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

90 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

Pin A1

Corner

610 8

911

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 91

256-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAL-2

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 2.2 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.60

A1 0.35 — —

A2 — — 2.20

A3 — — 1.80

D 27.00 BSC

E 27.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

92 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

Pin A1

Corner

1018

TOP VIEW BOTTOM VIEW

Package Information Datasheet for Mature Altera Devices 93

256-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

1This POD is applicable to F256 packages of all products listed in this datasheet except

Cyclone II, which are assembled in Option 2 package outlines.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAF-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 1.5 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.20

A1 0.30 — —

A2 — — 1.80

A3 0.70 REF

D 17.00 BSC

E 17.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

94 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEW

TOP VIEW

Package Information Datasheet for Mature Altera Devices 95

256-Pin FineLine Ball-Grid Array (FBGA), Option 2—Thin—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

1This POD is applicable to F256 packages of the Cyclone II devices only.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: DAF-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 1.5 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.55

A1 0.25 — —

A2 1.05 REF

A3 — — 0.80

D 17.00 BSC

E 17.00 BSC

b 0.45 0.50 0.55

e 1.00 BSC

96 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 97

324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAG-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 1.4 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.20

A1 0.30 — —

A2 — — 1.80

A3 0.70 REF

D 19.00 BSC

E 19.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

98 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 99

356-Pin Ball-Grid Array (BGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT or tape

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: BAR-2

Lead Coplanarity 0.008 inches (0.20mm)

Weight 7.7 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 1.70

A1 0.35 — —

A2 0.25 — 1.10

D 35.00 BSC

E 35.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

100 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 101

400-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAH-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 2.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeteres

Min. Nom. Max.

A — — 2.20

A1 0.30 — —

A2 — — 1.80

A3 0.80 REF

D 21.00 BSC

E 21.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

102 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

A3 A1

Pin A1

Corner

BOTTOM VIEW

TOP VIEW

Package Information Datasheet for Mature Altera Devices 103

403-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference G

Package Acronym PGA

Leadframe Material Alloy 42

Lead Finish Gold Over Nickel Plate

JEDEC Outline Reference MO-128 Variation: AL

Lead Coplanarity N/A

Weight 47.7 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A 0.157 0.180 0.203

A1 0.050 TYP

A2 0.117 0.130 0.143

D 1.940 1.960 1.980

E 1.940 1.960 1.980

L 0.130 TYP

b 0.016 0.018 0.020

e 0.100 BSC

104 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 105

484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAJ-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 6.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 23.00 BSC

E 23.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

106 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 107

484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-034 Variation: AAJ-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 6.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A 2.95 3.15 3.35

A1 0.40 0.50 0.60

A2 2.35 2.65 2.95

A3 1.35 1.45 1.55

D 23.00 BSC

E 23.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

108 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 109

484-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAJ-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 2.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.60

A1 0.30 — —

A2 — — 2.20

A3 — — 1.80

D 23.00 BSC

E 23.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

110 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

BOTTOM VIEW

TOP VIEW

Pin A1 ID

Pin A1

Corner

Package Information Datasheet for Mature Altera Devices 111

484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAJ-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 5.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 23.00 BSC

D1 17.00 BSC

E 23.00 BSC

E1 17.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

112 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

Package Information Datasheet for Mature Altera Devices 113

484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAJ-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 2.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A 2.10 2.25 2.40

A1 0.40 0.50 0.60

A2 1.50 1.75 2.00

A3 1.12 1.17 1.22

D 23.00 BSC

E 23.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

114 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

A3 A1

Package Information Datasheet for Mature Altera Devices 115

484-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference H

Package Acronym HBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAL-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 11.3 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 27.00 BSC

E 27.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

116 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

BOTTOM VIEWTOP VIEW

Pin A1 ID

Pin A1

Corner

Package Information Datasheet for Mature Altera Devices 117

484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference U

Package Acronym UBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-216 Variation: BAP-2

Lead Coplanarity 0.005 inches (0.12mm)

Weight 1.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.20

A1 0.20 — —

A2 0.65 — —

A3 0.95 TYP

D 19.00 BSC

E 19.00 BSC

b 0.40 0.50 0.60

e 0.80 BSC

118 Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation

Package Outline

BOTTOM VIEWTOP VIEW

Pin A1 ID

Pin A1

Corner

Package Information Datasheet for Mature Altera Devices 119

503-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in inches.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference G

Package Acronym PGA

Leadframe Material Alloy 42

Lead Finish Gold Over Nickel Plate

JEDEC Outline Reference MO-128 Variation: AN

Lead Coplanarity N/A

Weight 59.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A — — 0.205

A1 0.050 TYP

A2 — — 0.145

D 2.245 2.260 2.275

E 2.245 2.260 2.275

L 0.130 TYP

b 0.016 0.018 0.020

e 0.100 BSC

120 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

EA1

19 15 11 7 321 17 13 9 5 1

2329 27 25

3133

37 35

36 34 32 28

30 26 22

24 20 16

18 14 10

12 8 4

3941

TOP VIEW BOTTOM VIEW

Pin A1

Corner

Package Information Datasheet for Mature Altera Devices 121

599-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference G

Package Acronym PGA

Leadframe Material Alloy 42

Lead Finish Gold over Nickel Plate

JEDEC Outline Reference MO-128 Variation: AP

Lead Coplanarity N/A

Weight 69.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A — — 0.205

A1 0.050 TYP

A2 — — 0.145

D 2.445 2.460 2.475

E 2.445 2.460 2.475

L 0.130 TYP

b 0.016 0.018 0.020

e 0.100 BSC

122 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 123

600-Pin Ball-Grid Array (BGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT or tape

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: BAW-1

Lead Coplanarity 0.008 inches (0.20mm)

Weight 12.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.00

A1 0.35 — —

A2 0.25 — 1.10

D 45.00 BSC

E 45.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

124 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

34 12

610 8

911

21 19

32 30

3133

TOP VIEW BOTTOM VIEW

Package Information Datasheet for Mature Altera Devices 125

652-Pin Ball-Grid Array (BGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAW-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 23.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 45.00 BSC

E 45.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

126 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 127

652-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAW-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 15.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.20

A1 0.35 — —

A2 — — 2.80

A3 — — 2.40

D 45.00 BSC

E 45.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

128 Package Information Datasheet for Mature Altera Devices

Package Outline

TOP VIEW BOTTOM VIEW

AG AH

AA AB

Pin A1 ID

Pin A1

Corner

AN AP

Package Information Datasheet for Mature Altera Devices 129

652-Pin Plastic Ball-Grid Array (BGA), Option 3—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT or tape

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-192 Variation: BAW-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 15.1 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.00

A1 0.35 — —

A2 0.25 — 1.10

D 45.00 BSC

E 45.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

130 Package Information Datasheet for Mature Altera Devices

Package Outline

BOTTOM VIEWTOP VIEW

Pin A1 ID

Pin A1

Corner

34 12

10 8

911

21 19

32 30

3335

Package Information Datasheet for Mature Altera Devices 131

655-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in inches.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference G

Package Acronym PGA

Leadframe Material Alloy 42

Lead Finish Gold over Nickel Plate

JEDEC Outline Reference MO-128 Variation: AP

Lead Coplanarity N/A

Weight 74.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Inches

Min. Nom. Max.

A — — 0.205

A1 0.050 TYP

A2 — — 0.145

D 2.445 2.460 2.475

E 2.445 2.460 2.475

L 0.130 TYP

b 0.016 0.018 0.020

e 0.100 BSC

132 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 133

672-Pin Plastic Ball-Grid Array (BGA)—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAR-2

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 5.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.60

A1 0.35 — —

A2 — — 2.20

A3 — — 1.80

D 35.00 BSC

E 35.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

134 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

TOP VIEW BOTTOM VIEW

2426

23 15

1820

1214

Package Information Datasheet for Mature Altera Devices 135

672-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAL-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 9.5 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 27.00 BSC

E 27.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

136 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 137

672-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAL-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 3.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 2.60

A1 0.30 — —

A2 — — 2.20

A3 — — 1.80

D 27.00 BSC

E 27.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

138 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEW

TOP VIEW

Package Information Datasheet for Mature Altera Devices 139

672-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAL-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 7.1 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 27.00 BSC

D1 20.00 BSC

E 27.00 BSC

E1 20.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

140 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 141

672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAL-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 3.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A 2.10 2.25 2.40

A1 0.40 0.50 0.60

A2 1.50 1.75 2.00

A3 1.12 1.17 1.22

D 27.00 BSC

E 27.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

142 Package Information Datasheet for Mature Altera Devices

Package Outline

A3 A1

Package Information Datasheet for Mature Altera Devices 143

724-Pin Ball-Grid Array (BGA)—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAR-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 13.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 35.00 BSC

E 35.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

144 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 145

780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAM-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 10.7 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 29.00 BSC

E 29.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

146 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 147

780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MO-034 Variation: AAM-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 9.5 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A 3.05 3.25 3.45

A1 0.40 0.50 0.60

A2 2.45 2.75 3.05

A3 1.45 1.55 1.65

D 29.00 BSC

E 29.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

148 Package Information Datasheet for Mature Altera Devices

Package Outline

Pin A1 ID

Pin A1

Corner

BOTTOM VIEWTOP VIEW

Package Information Datasheet for Mature Altera Devices 149

780-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAM-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 8.2 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 29.00 BSC

D1 21.00 BSC

E 29.00 BSC

E1 21.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

150 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 151

896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40

■All dimensions and tolerances conform to ASME Y14.5M – 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAN-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 3.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A 2.10 2.25 2.40

A1 0.40 0.50 0.60

A2 1.50 1.75 2.00

A3 1.12 1.17 1.22

D 31.00 BSC

E 31.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

152 Package Information Datasheet for Mature Altera Devices

Package Outline

A3 A1

Package Information Datasheet for Mature Altera Devices 153

956-Pin Ball-Grid Array (BGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAU-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 19.6 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 40.00 BSC

E 40.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

154 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 155

956-Pin Ball-Grid Array (BGA), Option 2—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference B

Package Acronym BGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: BAU-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 17.0 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 40.00 BSC

D1 30.00 BSC

E 40.00 BSC

E1 30.00 BSC

b 0.60 0.75 0.90

e 1.27 BSC

156 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 157

1020-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAP-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 13.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 33.00 BSC

E 33.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

158 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 159

1020-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAP-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 10.8 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 33.00 BSC

D1 26.00 BSC

E 33.00 BSC

E1 26.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

160 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 161

1152-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAR-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 15.5 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 35.00 BSC

E 35.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

162 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 163

1152-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAR-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 12.4 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 35.00 BSC

D1 27.00 BSC

E 35.00 BSC

E1 27.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

164 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 165

1508-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAU-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 18.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 40.00 BSC

E 40.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

166 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices 167

1508-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip

■All dimensions and tolerances conform to ASME Y14.5M - 1994.

■Controlling dimension is in millimeters.

■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description Specification

Ordering Code Reference F

Package Acronym FBGA

Substrate Material BT

Solder Ball Composition Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference MS-034 Variation: AAU-1

Lead Coplanarity 0.008 inches (0.20 mm)

Weight 15.9 g (Typ.)

Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min. Nom. Max.

A — — 3.50

A1 0.30 — —

A2 0.25 — 3.00

A3 — — 2.50

D 40.00 BSC

D1 30.00 BSC

E 40.00 BSC

E1 30.00 BSC

b 0.50 0.60 0.70

e 1.00 BSC

168 Package Information Datasheet for Mature Altera Devices

Package Outline

Package Information Datasheet for Mature Altera Devices i

Additional Information

This section contains revision history and contact information.

Revision History

Table 60 lists the revision history for this document.

Table 60. Document Revision History (1) (Part 1 of 13)

Date and Document

Version Changes Made Summary of Changes

December 2011 ■Added “896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—

A:2.40”,“484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—

A:2.40”, and “672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—

A:2.40”.

Updated for version 16.8

November 2011 ■Added Table 9 on page 10. Updated for version 16.7

August 2011 ■Removed HardCopy III, HardCopy IV, MAX V, MAX II, Classic, and

EPCS devices’ package listing and thermal resistance values.

Updated for version 16.6

July 2011 ■Removed Arria II, Stratix V, Stratix IV, Stratix III, Cyclone IV, and

Cyclone III devices’ package listing and thermal resistance values.

Updated for version 16.5

ii Package Information Datasheet for Mature Altera Devices

Additional Information

June 2011 ■Updated package diagram in “780-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)” and “780-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid

(EP3SE110)”

■Added Table 30 and Table 58.

■Updated the A and A2 dimension values in “780-Pin FineLine Ball-

Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SGX230)” and “780-

Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid

(EP4SE230)”.

■Updated the D1 and E1 dimension values in “1152-Pin FineLine Ball-

Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)” and

“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece

Lid (EP4SGX360)”.

■Updated Table 13.

■Updated the b, A, and A2 dimension values in “256-Pin Ultra FineLine

Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C10)”, “256-Pin

Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C16)”

and “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—

Thin (EP3C25)”.

■Updated information in “Package Outlines”.

■Added new package diagram for “1152-Pin FineLine Ball-Grid Array

(HBGA)—Flip Chip—Dual-Piece Lid (EP3SL340)”, and “780-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid

(EP4SGX180)”.

■Added new 1760-pin packages for 5SGXB5 and 5SGXB6 devices:

“1760-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece

Lid—A:3.40” to replace the 1932-pin packages for 5SGXB5 and

5SGXB6 devices.

■Updated cross reference for 5SGXB5 and 5SGXB6 1517-pin package

diagram in Table 3.

■Updated table Table 33.

Updated for version 16.4

Table 60. Document Revision History (1) (Part 2 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices iii

Additional Information

December 2010 ■Updated document title and metadata.

■Updated Table 43 with new thermal resistance value for EP3C16

(U484 Wire Bond package) and EP3C40 (U484 Wire Bond and F780

Wire Bond packages).

■Updated note 3 in Table 9.

■Updated Table 19 and Table 53 to remove dual-piece lid options for

HardCopy II devices.

■Added Arria II GZ device package listing in Table 2 and Arria II GZ

thermal resistance in Table 35.

■Added Stratix V device package listing in Table 4 and Stratix V thermal

resistance in Table 37.

■Added MAX V device package listing in Table 13 and MAX V thermal

resistance in Table 46.

■Added new Cyclone IV device package in Table 9 and thermal

resistance values in Table 42.

■Updated lead coplanarity and A3 dimension values in 358-Pin Ultra

FineLine Ball-Grid Array (UBGA)—Flip Chip, 358-Pin Ultra FineLine

Ball-Grid Array (UBGA)—Flip Chip—Lidless (EP2AGX45), and 358-

Pin Ultra FineLine Ball-Grid Array (UBGA)—Flip Chip—Lidless

(EP2AGX65).

■Added new package diagram for 1932-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360), 324-Pin

FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210), and 324-

Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210G).

Updated for version 16.3

Table 60. Document Revision History (1) (Part 3 of 13)

Date and Document

Version Changes Made Summary of Changes

iv Package Information Datasheet for Mature Altera Devices

Additional Information

September 2010 ■Updated JEDEC Outline Reference for “144-Pin Plastic Enhanced

Quad Flat Pack (EQFP)—Wire Bond (EP3C10)”, “144-Pin Plastic

Enhanced Quad Flat Pack (EQFP)—Wire Bond—(EP3C16)”, and

“144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—

(EP3C25)”.

■Updated dimension value for Arria II GX devices: “572-Pin FineLine

Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX95)”, “780-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX95)”,

“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(EP2AGX95)”, “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—

Flip Chip (EP2AGX65)”, “780-Pin FineLine Ball-Grid Array (FBGA)—

Flip Chip—Lidless (EP2AGX65)”, “572-Pin FineLine Ball-Grid Array

(FBGA)—Lidless—Flip Chip (EP2AGX45)”,“780-Pin FineLine Ball-

Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”, “1152-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX260)”,

“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(EP2AGX260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Lidless (EP2AGX190)”, “780-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Lidless (EP2AGX190)”, “1152-Pin FineLine Ball-

Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”, “780-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”,

and “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip

(EP2AGX125)”.

■Updated dimension value for HardCopy devices: “1517-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”, “1152-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”,

“1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC335)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—

Lidless (HC335)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Lidless (HC325)”, “484-Pin FineLine Ball-Grid Array (FBGA)—

Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Lidless (HC4GX15)”, “780-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, “1152-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”,

“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC4GX35)”, and “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Lidless (HC4GX35)”.

■Revised the unit weight info for: “484-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “484-Pin FineLine Ball-Grid Array

(FBGA), Option 4—Flip Chip”, “572-Pin FineLine Ball-Grid Array

(FBGA)—Option 1, Flip Chip”, “572-Pin FineLine Ball-Grid Array

(FBGA)—Option 2, Flip Chip”, “672-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “672-Pin FineLine Ball-Grid Array

(FBGA), Option 4—Flip Chip”, “780-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “780-Pin FineLine Ball-Grid Array

(FBGA), Option 3—Flip Chip”, “780-Pin FineLine Ball-Grid Array

(FBGA), Option 4—Flip Chip”“1020-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, and “1020-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”.

Updated for version 16.2

Table 60. Document Revision History (1) (Part 4 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices v

Additional Information

■Revised the unit weight info for: “1152-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “1152-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”, “1152-Pin FineLine Ball-Grid Array

(FBGA), Option 3—Flip Chip”, “1508-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “1508-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”, “1517-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “1517-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”, “1760-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “1760-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”, “1932-Pin FineLine Ball-Grid Array

(FBGA), Option 1—Flip Chip”, “1932-Pin FineLine Ball-Grid Array

(FBGA), Option 2—Flip Chip”, “484-Pin Hybrid FineLine Ball-Grid

Array (HBGA)—Flip Chip”, “780-Pin Hybrid FineLine Ball-Grid Array

(HBGA)—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid Array

(HBGA), Option 1—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid

Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid FineLine Ball-

Grid Array (HBGA), Option 1—Flip Chip”, “1152-Pin Hybrid FineLine

Ball-Grid Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid

FineLine Ball-Grid Array (HBGA), Option 3—Flip Chip”, and “1152-Pin

Hybrid FineLine Ball-Grid Array (HBGA), Option 4—Flip Chip”.

■Added package diagram: “144-Pin Plastic Enhanced Quad Flat Pack

(EQFP)—Wire Bond (EP3C10)”, “148-Pin Quad Flat No-Lead Package

(QFN)—Wire Bond”, “780-Pin FineLine Ball-Grid Array (FBGA),

Option 4—Flip Chip”, “1152-Pin FineLine Ball-Grid Array (FBGA),

Option 3—Flip Chip”, and “572-Pin FineLine Ball-Grid Array

(FBGA)—Option 2, Flip Chip”.

■Added package diagram for Stratix IV devices: “1152-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)”,

“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece

Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Single-Piece Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Channel Lid (EP4SGX180)”,“1152-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid

(EP4SGX180)”, “1932-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Single-Piece Lid (EP4SGX290)”, “780-Pin Hybrid FineLine

Ball-Grid Array (HBGA)—Flip Chip—Channel Lid (EP4SGX360)”,

“1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece

Lid (EP4SGX360)”, “1760-Pin FineLine Ball-Grid Array (FBGA) — Flip

Chip — Single-Piece Lid (EP4SGX360)”, “1517-Pin Hybrid FineLine

Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP4SE530)”,

“1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—

Single-Piece Lid (EP4SE530)”, “780-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Channel Lid (EP4SE230)”, and “1152-Pin Hybrid

Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4SE530)”.

Table 60. Document Revision History (1) (Part 5 of 13)

Date and Document

Version Changes Made Summary of Changes

vi Package Information Datasheet for Mature Altera Devices

Additional Information

■Added package diagram for Stratix III devices: “780-Pin FineLine Ball-

Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)”, “780-

Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece

Lid (EP3SL200)”,“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin

Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid

(EP3SE260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Channel Lid (EP3SE260)”, and “1152-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE260)”.

■Added package diagram for Cyclone IV devices: “780-Pin FineLine

Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP4CE115)”.

■Added package diagram for Cyclone III devices :“780-Pin FineLine

Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”, “144-Pin

Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—

(EP3C16)”,“256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire

Bond—Thin (EP3C10)”, “780-Pin FineLine Ball-Grid Array (FBGA)—

Wire Bond—OMPAC (EP3C55)”, “144-Pin Plastic Enhanced Quad

Flat Pack (EQFP)—Wire Bond—(EP3C25)”, “256-Pin FineLine Ball-

Grid Array (FBGA)—Wire Bond—Thin (EP3C10)”, “780-Pin FineLine

Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”,“484-Pin

FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”,

“256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Thin

(EP3C16)”, “256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—

Thin (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire

Bond (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire

Bond (EP3C40)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire

Bond—OMPAC (EP3C16)”, “484-Pin FineLine Ball-Grid Array

(FBGA)—Wire Bond—OMPAC (EP3C40)”, “484-Pin FineLine Ball-

Grid Array (FBGA)—Wire Bond—OMPAC (EP3C55)”, “484-Pin

FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”,

“484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond

(EP3CLS100)”, “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—

Wire Bond—Thin (EP3C16)”, “484-Pin Ultra FineLine Ball-Grid Array

(UBGA)—Wire Bond (EP3C16)”, “256-Pin Ultra FineLine Ball-Grid

Array (UBGA)—Wire Bond—Thin (EP3C25)”, “484-Pin Ultra FineLine

Ball-Grid Array (UBGA)—Wire Bond (EP3C55)”, and “484-Pin Ultra

FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3C80)”.

■Added package diagram for MAX II devices: “100-Pin FineLine Ball-

Grid Array (FBGA)—Wire Bond—Thin (EPM240)”, “100-Pin FineLine

Ball-Grid Array (FBGA)—Wire Bond—Thin (EPM570)”.

■Updated A3 dimension for “572-Pin FineLine Ball-Grid Array

(FBGA)—Lidless—Flip Chip (EP2AGX45)”, “572-Pin FineLine Ball-

Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX65)”, “780-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”,

and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(EP2AGX65)”.

Table 60. Document Revision History (1) (Part 6 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices vii

Additional Information

■Added package diagram for HardCopy III devices: “484-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC325)” and

“484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC325)”.

■Updated D1/E1 values in “1517-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Single-Piece Lid (EP4S40G2)”, “1517-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid

(EP4S100G2)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Single-Piece Lid (EP4SGX180)”, “1517-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX230)”, “484-Pin

FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”,

“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC4E25)”, and “1020-Pin FineLine Ball-Grid Array (FBGA), Option

2—Flip Chip”.

■Updated Table 7.

■Updated Table 10 footnote.

■Updated thermal resistance values of EP3CLS70, EP3CLS100,

EP3CLS150, and EP3CLS200 devices F484 pin package in Table 42.

■Updated package diagram in “1152-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360)”

■Updated the notes in “256-Pin FineLine Ball-Grid Array (FBGA),

Option 1—Wire Bond” and “256-Pin FineLine Ball-Grid Array (FBGA),

Option 2—Thin—Wire Bond” to include Cyclone IV devices.

■Updated EP4SE230 device package to Channel Lid from Dual-Piece

Lid in Table 4.

■Updated package diagram in “1517-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180)”.

■Updated EP1AGX50 and EP1AGX60 F484 pin package description

from dual-piece lid to channel lid in Table 3.

■Updated EP4SGX180 and EP4SGX230 device package description in

Table 4.

■Added note 1 to Table 6.

■Deleted HC315WF484 from Table 18.

■Added additional information to “148-Pin Quad Flat No-Lead Package

(QFN)—Wire Bond—(EP4CGX15)” and “148-Pin Quad Flat No-Lead

Package (QFN)—Wire Bond”

Table 60. Document Revision History (1) (Part 7 of 13)

Date and Document

Version Changes Made Summary of Changes

viii Package Information Datasheet for Mature Altera Devices

Additional Information

April 2010 ■Added Table 1 and Table 38

■Updated Table 2 through Table 37

■Updated values in Table 49, Table 50, Table 58

■Removed 148-pin Quad Flat No-Lead Package (QFN)—Wire Bond,

484-Pin FBGA, Flip Chip, Dual-Piece Lid (EP2S15), 484-Pin FBGA,

Flip Chip, Single-Piece Lid (EP2S15), 672-Pin FBGA, Flip Chip, Dual-

Piece Lid (EP2S15), 672-Pin FBGA, Flip Chip, Single-Piece Lid

(EP2S15) package outlines.

■Corrected title in 1152-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Single-Piece Lid (HC4E35)

■Added 148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond—

(EP4CGX15)

■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-

Piece Lid (EP4S40G2), 1517-Pin FineLine Ball-Grid Array (FBGA)—

Flip Chip—Single-Piece Lid (EP4S100G2), 1517-Pin Hybrid FineLine

Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4S40G5),

and 1932-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-

Piece Lid (EP4S100G4)

■Added 1152-Pin Hybrid Ball-Grid Array (HBGA)—Flip Chip—Single-

Piece Lid (EP4SE820), 1517-Pin Hybrid Ball-Grid Array (HBGA)—Flip

Chip—Single-Piece Lid (EP4SE820), and 1760-Pin FineLine Ball-Grid

Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SE820)

■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-

Piece Lid (EP4SGX180) and 1517-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180)

■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-

Piece Lid (EP4SGX230)

■Added “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC4E25)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—

Single-Piece Lid (HC4E25)”, and “780-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Lidless (HC4E25)”

■Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC4GX15)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip

Chip—Single-Piece Lid (HC4GX15)”

■Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless

(HC4GX25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—

Single-Piece Lid (HC4GX25)”, “1152-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Lidless (HC4GX25)”, and “1152-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX25)”

Updated for version 16.1

Table 60. Document Revision History (1) (Part 8 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices ix

Additional Information

■Added “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—

Single-Piece Lid (HC4GX35)”, “1517-Pin FineLine Ball-Grid Array

(FBGA)—Flip Chip—Lidless (HC4GX35)”, and “1517-Pin FineLine

Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX35)”

■Updated 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—

Single-Piece Lid (EP4SGX230)

■Corrected title for 324-Pin FineLine Ball-Grid Array (FBGA)—Wire

Bond—Option 1 from 324-Pin FineLine Ball-Grid Array (FBGA)

■Corrected title for 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)

— Flip Chip — Single-Piece Lid (EP4SE820) from 1517-Pin Hybrid

FineLine Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid

(EP4SGX820)

■Corrected weight in 324-Pin FBGA Data Sheet

■Added thermal resistance disclaimer at the beginning of the Thermal

Resistance section

■Moved EPC1, EPC2, EPC1441 entries from Table 27 to Table 37

December 2009 ■Added notes for preliminary thermal information (Table 36, Table 37,

Table 46, and Table 47)

Updated for version 16.0

Table 60. Document Revision History (1) (Part 9 of 13)

Date and Document

Version Changes Made Summary of Changes

xPackage Information Datasheet for Mature Altera Devices

Additional Information

November 2009 ■Added Cyclone IV information

■Added notes to 1152-Pin HBGA Option 3 Data Sheet

■Corrected drawings for 358-Pin UBGA—Lidless (EP2AGX45),

358-Pin UBGA—Lidless (EP2AGX65), and 1152-Pin FBGA—Lidless

(EP2AGX95) Data Sheets

■Added 148-Pin QFN, 169-Pin FBGA, and 324-Pin FBGA Option 2 Data

Sheets

■Added 1517-Pin—Lidless (HC4E35) and 1517-Pin Single-Piece Lid

(HC4E35) Data Sheets

■Added 780-pin FBGA—Channel Lid (EP4SGX230), 780-Pin HBGA—

Channel Lid (EP4SGX 360), 1152-Pin FBGA—Channel Lid

(EP4SGX230), 1152-Pin FBGA—Channel Lid (EP4SGX360),

1152-Pin FBGA—Dual-Piece Lid (EP4SGX230), 1152-Pin FBGA—

Single-Piece Lid (EP4SGX230), 1152-Pin FBGA—Single-Piece Lid

(EP4SGX360), 1152-Pin HBGA—Single-Piece Lid (EP4SGX530),

1152-Pin HBGA—Single-Piece Lid (EP4SGX820), 1517-Pin FBGA—

Dual-Piece Lid (EP4SGX230),

1517-Pin FBGA—Single-Piece Lid (EP4SGX230), 1517-Pin FBGA—

Single-Piece Lid (EP4SGX360), 1517-Pin HBGA—Dual-Piece Lid

(EP4SGX530), 1517-Pin HBGA—Single-Piece Lid (EP4SGX530),

1517-Pin HBGA—Single-Piece Lid (EP4S40G2 and EP4S100G2),

1517-Pin HBGA—Single-Piece Lid (EP4S100G5), 1517-Pin HBGA—

Single-Piece Lid (EP4SGX820), 1760-Pin FBGA—Dual-Piece Lid

(EP4SGX530), 1760-Pin FBGA—Single-Piece Lid (EP4SGX360),

1760-Pin FBGA—Single-Piece Lid (EP4SGX820), 1932-Pin FBGA—

Dual-Piece Lid (EP4SGX530), 1932-Pin FBGA—Single-Piece Lid

(EP4SGX530), 1932-Pin FBGA—Single-Piece Lid (EP4S100G2) Data

Sheets

■Added 484-Pin FBGA—Dual-Piece Lid (EP2S15), 484-Pin FBGA—

Single-Piece Lid (EP2S15), 672-Pin FBGA—Dual-Piece Lid (EP2S15),

672-Pin FBGA—Single-Piece Lid (EP2S15), 164-Pin MBGA

(EP3C16), and 484-Pin UBGA (EP3C40) Data Sheets

Updated for version 15.9

Table 60. Document Revision History (1) (Part 10 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices xi

Additional Information

October 2009 ■Added 1152-Pin HBGA Option 3, 1152-Pin HBGA Option 4, 1517-Pin

HBGA Option 2, 1760-Pin FBGA Option 2, and 1932-Pin FBGA Option

2 Data Sheets

■Added 358-Pin UBGA—Lidless (EP2AGX45), 358-Pin UBGA—Lidless

(EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX45), 572-Pin FBGA—

Lidless (EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX95), 572-Pin

FBGA—Lidless (EP2AGX125), 780-Pin FBGA—Lidless (EP2AGX45),

780-Pin FBGA—Lidless (EP2AGX65), 780-Pin FBGA—Lidless

(EP2AGX95), 780-Pin FBGA—Lidless (EP2AGX125), 780-Pin

FBGA—Lidless (EP2AGX190), 780-Pin FBGA—Lidless

(EP2AGX260), 1152-Pin FBGA—Lidless (EP2AGX95), 1152-Pin

FBGA—Lidless (EP2AGX125), 1152-Pin FBGA—Lidless

(EP2AGX190), and 1152-Pin FBGA—Lidless (EP2AGX260) Data

Sheets

■Added 780-Pin FBGA—Lidless (HC325), 780-Pin FBGA—Single-

Piece Lid (HC325), 1152-Pin FBGA—Lidless (HC335), 1152-Pin

FBGA—Single-Piece Lid (HC335), 1152-Pin FBGA—Lidless

(HC4E35), 1152-Pin FBGA—Single-Piece Lid (HC4E35), 1517-Pin

FBGA—Lidless (HC335), and 1517-Pin FBGA—Single-Piece Lid

(HC335) Data Sheets

■Removed EP2AGX20 and EP2AGX30 entries from Table 2 and

Table 39

■Added EP4SE820 entries to Table 41

■Added Stratix IV GT devices to Table 4; added option references

■Updated thermal resistance values in Table 39

Updated for version 15.8

June 2009 ■Made three corrections to Stratix III thermal resistance table

■Added Cyclone III LS information

■Added Stratix IV GT thermal resistance values

■Added and/or HardCopy III and IV cross-reference and thermal

resistance tables

■Updated HardCopy III and IV part numbers

■Added Cyclone III M164 package information

■Added 484-Pin FBGA Option 4, 672-Pin FBGA Option 4, 1020-Pin

FBGA Option 2, 1508-Pin FBGA Option 2, and 1517-Pin Option 2

FBGA Data Sheets

■Revised 1508-Pin FBGA Option 1, 1020-Pin FBGA Option 1, 1517-Pin

FBGA Option 1, 572-Pin FBGA, and 1152-Pin FBGA Option 2 Data

Sheets

■Added 956-Pin BGA Option 2 Data Sheet

Updated for version 15.7

March 2009 ■Corrected “b Nom.” value in 358-Pin UBGA Data Sheet

■Corrected “A Max.” value and replaced package drawing in 780-Pin

FBGA - Option 3 Data Sheet

■Corrected “A Max.” value in 256-Pin UBGA Data Sheet

■Modified thermal resistance values for EP3SL200 device in Stratix III

thermal resistance table

Updated for version 15.6

Table 60. Document Revision History (1) (Part 11 of 13)

Date and Document

Version Changes Made Summary of Changes

xii Package Information Datasheet for Mature Altera Devices

Additional Information

March 2009 ■Fixed theta symbols in several data sheet Dimension Tables

■Updated dimensions in 256-Pin UBGA Data Sheet

■Added 358-Pin UBGA Data Sheet, 572-Pin, 780-Pin Option 3, and

1152-Pin Option 2 FBGA Data Sheets

■Added Arria II GX thermal resistance table

■Added Arria II GX device and package cross-reference table

■Added EP3SL50, EP3SE80, and EP3SL110 devices to Stratix III

thermal resistance table

■Added EP4SGX70, EP4SGX180, and EP4SGX290 devices and

updated Stratix IV GX thermal resistance table

■Added HardCopy III and HardCopy IV thermal resistance table

■Miscellaneous formatting changes

Updated for version 15.5

December 2008 ■Changed dimension “A” Max. value in 1932-Pin FBGA Data Sheet Updated for version 15.4

November 2008 ■Moved Revision History to the end and added “How to Contact Altera”

section

■Added subheadings in Thermal Resistance section

■Converted to 8-1/2 x 11 page size

■Changed “Maximum Lead Coplanarity” to “Lead Coplanarity” and

added “(Typ.)” to weights for all packages

■Added EP2C15 information to Cyclone II tables

Updated for version 15.3

September 2008 ■Added thermal resistance values for Stratix IV

■Added new 1152-Pin HBGA Option 2 (42.5 MM SQ.) Data Sheet

■Added new 1517-Pin HBGA (42.5 MM SQ.) Data Sheet

■Added theta-JB thermal resistance values for Stratix II

■Added HardCopy II thermal resistance values

■Revised weights for 256-Pin BGA Option 2, 652-Pin BGA Option 2,

652-Pin BGA Option 3, 208-Pin RQFP, 240-Pin RQFP, and 304-Pin

RQFP Data Sheets

■Added notes to 1152-Pin FBGA, 1517-Pin FBGA, 1760-Pin FBGA;

changed dimension “A” thickness and “A2” thickness in 1932-Pin

FBGA Data Sheet

Updated for version 15.2

May 2008 ■Added 1932-Pin FBGA Data Sheet

■Added Device and Package Cross Reference table for Stratix IV

Updated for version 15.1

April 2008 ■Revised Maximum Lead Coplanarity values for 1517-Pin FBGA and

1760-Pin FBGA Data Sheets

■Added three entries to Table 3

■Corrected minor typos in Table 4 and Table 10

■Corrected HC210W package in Table 12

■Many tables updated for formatting consistency

Updated for version 15.0

Table 60. Document Revision History (1) (Part 12 of 13)

Date and Document

Version Changes Made Summary of Changes

Package Information Datasheet for Mature Altera Devices xiii

Additional Information

February 2008 ■Added 164-Pin MBGA information in Table 8

■Added HardCopy II device information in Table 12

■Updated Stratix III thermal resistance values in Table 22

■Added 164-Pin MBGA Data Sheet

■Corrected 8-Pin SOIC Data Sheet (changed “B” to “b” in Package

Outline Dimension Table)

■Corrected 68-Pin MBGA Data Sheet (changed “Inches” to

“Millimeters” in Package Outline Dimension Table)

Updated for version 14.9

October 2007 ■Removed note from 100-Pin PQFP Option 1 Data Sheet

■Removed 100-Pin PQFP Option 2 Data Sheet

■Updated 88-Pin UBGA, 144-Pin EQFP, 256-Pin FBGA Option 1, 256-

Pin FBGA Option 2, 256-Pin UBGA, 1517-Pin FBGA, and 1760-Pin

FBGA Data Sheets

■Added 780-Pin HBGA and 1152-Pin HBGA Data Sheets

Updated for version 14.8

May 2007 v14.7 ■Added Arria™GX information

■Added Cyclone III tables

■Revised D2 and E2 dimensions for 144-Pin EQFP

■Revised 100-Pin MBGA - Wire Bond and 256-Pin MBGA - Wire Bond

■Added 780-Pin FBGA option 2 - Wire Bond,

256-Pin UBGA - Wire Bond, 68-Pin MBGA - Wire Bond, and 144-Pin

MBGA - Wire Bond

Changes and additions as

described in “Changes

Made” section

February 2007

v14.6

■Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet to

correct title and ordering code reference

■Added revision history

Revised one data sheet

(144-Pin Plastic Thin Quad

Flat Pack (TQFP) Data

Sheet), added revision

history

December 2006

v14.5

■Table 2 was added for Stratix III Device and Package Cross-Reference

■Tables 16, 17, and 18 were added for Stratix III Thermal Resistance

information

■1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was

added

■1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was

added

■"Wire Bond" and "Flip Chip" was added to title of each data sheet, as

appropriate

■"BGA" was spelled out as "Ball-Grid Array" in all titles

■Some package outline drawings were reformatted

■Weights were updated for many packages

Added Tables for

Stratix III, updated other

data sheets

Note to Table 60:

(1) Formal revision history for this document began with version 14.5.

Table 60. Document Revision History (1) (Part 13 of 13)

Date and Document

Version Changes Made Summary of Changes

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