CREAT BY ART
- Glass passivated junction
- Ideal for printed circuit board
- High case dielectric strength
- Typical IR less than 0.1μA
- High surge current capability
- UL Recognized File # E-326243
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
I
2
t A
2
s
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1409012 Version: H14
KBU
MECHANICAL DATA
Case: KBU
Mounting torque: 0.56 Nm max.
KBU801G thru KBU807G
Taiwan Semiconductor
Glass Passivated Brid
g
e Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Weight: 7.2 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25
o
C unless otherwise noted)
PARAMETER SYMBOL KBU
801G
KBU
802G
KBU
803G
KBU
804G
KBU
805G
KBU
806G
KBU
807G Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 8
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
200 A
Rating for fusing (t<8.3mS) 166
Maximum instantaneous forward voltage (Note 1)
I
F
= 4 A
I
F
= 8 A
V
F
1.0
1.1
V
Maximum DC reverse current T
J
=25
o
C
at rated DC blocking voltage T
J
=125
o
CI
R
5
500 μA
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
Note 2: Measured at 1MHz and applied Reverse Voltage of 4.0V D.C.
Typical thermal resistance R
θJC
R
θJA
3
18
O
C/W
Operating junction temperature range - 55 to +150
Typical junction capacitance per leg 400
Storage temperature range - 55 to +150
PART NO.
PART NO.
KBU807G
KBU807G
(T
A
=25
o
C unless otherwise noted)
Document Number: DS_D1409012 Version: H14
PACKING CODE
SUFFIX DESCRIPTION
KBU807G T0G T0 G Green compound
KBU807G T0 T0
RATINGS AND CHARACTERISTICS CURVES
EXAMPLE
PREFERRED P/N PACKING CODE
KBU80xG
(Note 1)
PACKAGE PACKING
G KBU 500 / TrayT0
Note 1: "x" defines voltage from 50V (KBU801G) to 1000V (KBU807G)
KBU801G thru KBU807G
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE PACKING CODE
SUFFIX
0
2
4
6
8
0 20 40 60 80 100 120 140 160
AVERAGE FORWARD A
CURRENT (A)
AMBIENT TEMPERATURE (oC)
FIG.1 MAXIMUM DERATING CURVE FOR
OUTPUT CURRNET
RESISTIVE OR
INDUCTIVELOAD
WITH HEATSINK
0
25
50
75
100
125
150
175
200
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM FORWARD SURGE CURRENT
PER LEG
8.3ms Single
Half Sine Wave
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (V)
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
PER LEG
TJ=25oC
TJ=125oC
0.1
1
10
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
PER LEG
Min Max Min Max
A 18.8 19.8 0.740 0.780
B 4.6 5.6 0.181 0.220
C
D 1.2 1.3 0.047 0.051
E 20.0 - 0.787 -
F 6.8 7.1 0.268 0.280
G 22.7 23.7 0.894 0.933
H 4.6 5.0 0.181 0.197
P/N = Specific Device Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1409012 Version: H14
MARKING DIAGRAM
KBU801G thru KBU807G
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
8.2 (TYP.) 0.322 (TYP.)
KBU
10
100
1000
0.1 1 10 100
JUNCTION CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vslg=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1409012 Version: H14
KBU801G thru KBU807G
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
