MMBD4148TW / BAS16TW
Document number: DS30154 Rev. 13 - 2 1 of 3
www.diodes.com January 2009
© Diodes Incorporated
MMBD4148TW / BAS16TW
SURFACE MOUNT FAST SWITCHING DIODE ARRAY
Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• High Conductance
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage VRM 100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 75 V
RMS Reverse Voltage VR
RMS
53 V
Forward Continuous Current (Note 1) IFM 300 mA
Average Rectified Output Current (Note 1) IO 150 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0
s
@ t = 1.0s IFSM 2.0
1.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 200 mW
Thermal Resistance Junction to Ambient Air (Note 1) R
JA 625 °C/W
Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V
BR
R 75 ⎯ V IR = 1μA
Forward Voltage VF ⎯
0.715
0.855
1.0
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Reverse Current (Note 2) IR ⎯
1.0
50
30
25
μA
μA
μA
nA
VR = 75V
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Total Capacitance CT ⎯ 2.0 pF VR = 0, f = 1.0MHz
Reverse Recovery Time trr ⎯ 4.0 ns IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prio r to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
TOP VIEW
SOT-363
Internal Schematic
TOP VIEW
C
1
C
2
C
3
A
3
A
1
A
2