TD62064AF(5,J,S) - TOSHIBA

TD62064APG/AFG

2011-01-14

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

TD62064APG, TD62064AFG

4ch High-Current Darlington Sink Driver

The TD62064APG/AFG are high-voltage, high-current

darlington drivers comprised of four NPN darlington pairs.

All units feature integral clamp diodes for switching inductive

loads.

Applications include relay, hammer, lamp and stepping motor

drivers.

Features

• Output current (single output) 1.5 A (max)

• High sustaining voltage output 50 V (min)

• Output clamp diodes

• Input compatible with TTL and 5 V CMOS

• GND terminal = Heat sink

• Package type-APG: DIP-16 pin

• Package type-AFG: HSOP-16 pin

Pin Assignment (top view)

TD62064APG

TD62064AFG

TD62064APG

TD62064AFG

Weight

DIP16-P-300-2.54A: 1.11 g (typ.)

HSOP16-P-300-1.00: 0.50 g (typ.)

16 15 14 13 12 11 10 9

1 2 3 4 5 678

NC I4

Heat sink

& GND I3 NC O3

COM O1 I1 Heat sink

& GND

I2 O2 COM

16 15 14 13 12 11 10 9

1 2 3 4 567 8

NC I4 I3 NC O3

COM O1 I1 I2 O2 COM

Heat sink

& GND

Heat sink

& GND

NC NC

NCNC

TD62064APG/AFG

2011-01-14

Schematics (each driver)

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Precautions for Using

(1) This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed

due to short-circuit between outputs, air contamination fault, or fault by improper grounding.

(2) This IC is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that

the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the counter

electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.

Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary power

supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please

adhere to the device’s absolute maximum ratings.

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Output sustaining voltage VCE (SUS) −0.5 to 50 V

Output current IOUT 1.5 A/ch

Input current IIN 50 mA

Input voltage VIN −0.5 to 17 V

Clamp diode reverse voltage VR 50 V

Clamp diode forward current IF 1.5 A

APG 1.47/2.7 (Note 1)

Power dissipation

AFG

0.9/1.4 (Note 2)

Operating temperature Topr −40 to 85 °C

Storage temperature Tstg −55 to 150 °C

Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)

Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)

Input

Output

GND

1.1 kΩ

COMMON

230 Ω

8.2 kΩ

TD62064APG/AFG

2011-01-14

Operating Conditions (Ta = −40 to 85°C)

Characteristics Symbol Test Condition

Min Typ. Max Unit

Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V

DC1 circuit, Ta = 25°C 0 ⎯ 1250

Duty = 10% 0 ⎯ 1250

APG (Note 1)

Duty = 50% 0 ⎯ 390

Duty = 10% 0 ⎯ 907

Output current

AFG (Note 2)

IOUT

tpw = 25 ms

4 circuits

Tj = 120°C

Ta = 85°C Duty = 50% 0 ⎯ 172

mA/ch

IN ⎯ 0 ⎯ 8

Output ON VIN (ON) IOUT = 1.25 A 2.5 ⎯ 8

Input voltage

Output OFF VIN (OFF) ⎯ 0 ⎯ 0.4

Input current IIN ⎯ 0 ⎯ 20 mA

Clamp diode reverse voltage VR ⎯ 0 ⎯ 50 V

Clamp diode forward current IF ⎯ ⎯ ⎯ 1.25

APG Ta = 85°C (Note 1) ⎯ ⎯ 1.4

Power dissipation

AFG

Ta = 85°C (Note 2) ⎯ ⎯ 0.7

Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)

Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol

Te s t

Circuit Test Condition Min Typ. Max Unit

VCE = 50 V, Ta = 25°C ⎯ ⎯ 50

Output leakage current ICEX 1

VCE = 50 V, Ta = 85°C ⎯ ⎯ 500

μA

IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 1.6

Output saturation voltage VCE (sat) 2

IOUT = 0.75 A, IIN = 935 μA ⎯ ⎯ 1.25

IOUT = 1.0 A ⎯ 800 ⎯

DC current transfer ratio hFE 2 VCE = 2 V

IOUT = 1.25 A ⎯ 1500 ⎯

⎯

Input voltage (output on) VIN (ON) 3 IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 2.4 V

VR = 50 V, Ta = 25°C ⎯ ⎯ 50

Clamp diode leakage current IR 4

VR = 50 V, Ta = 85°C ⎯ ⎯ 100

μA

Clamp diode forward voltage VF 5 IF = 1.25 A ⎯ ⎯ 2.0 V

Input capacitance CIN 6 VIN = 0 V, f = 1 MHz ⎯ 15 ⎯ pF

Turn-ON delay tON 7 CL = 15 pF, VOUT = 50 V,

RL = 42 Ω ⎯ 0.1 ⎯ μs

Turn-OFF delay tOFF 7 CL = 15 pF, VOUT = 50 V,

RL = 42 Ω ⎯ 1.0 ⎯ μs

TD62064APG/AFG

2011-01-14

Test Circuit

1. ICEX

2. VCE (sat), hFE 3. VIN (ON)

4. IR

5. VF 6. CIN

7. tON, tOFF

Note 1: Pulse Width 50 μs, Duty Cycle 10%

Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Note 2: CL includes probe and jig capacitance

ICEX

Open

VCE VCE, VCE (sat)

Open

IIN IOUT

Open

VIN (ON) VCE

IOUT

Open

VR Open

Open

Capacitance

bridge

Open

VIN

Input

CL = 15 pF

(Note 2)

(Note 1)

Open VOUT

Output

VIN

Pulse

generator

10% 10%

50%

tON tOFF

VIH

2.4 V

VOH

VOL

Input 50%

90% 90%

Output 50% 50%

(Note 1)

TD62064APG/AFG

2011-01-14

Collector-emitter saturation voltage

VCE (sat) (V)

IOUT – VCE (sat)

Output current IOUT (A)

Input voltage VIN (V)

IIN – VIN

Input current IIN (mA)

Input current IIN (μA)

IOUT – IIN

Output current IOUT (mA)

Ambient temperature Ta (°C)

PD – Ta

Power dissipation PD (W)

Duty Cycle (%)

IOUT – Duty cycle

Output current IOUT (mA)

Duty Cycle (%)

IOUT – Duty cycle

Output current IOUT (mA)

VCE = 2 V

400

300

100

150 200

200

100

Ta = 75 °C 25 −30

1.0

max

TD62064APG

2.0 3.0 4.0 5.0

typ. min

1.5

TD62064APG

1.0

0.5

0.5 1.0 1.5 2.0

25°C max

typ.

1500

900

300

60 100

600

n = 1

1200

20 80

n = 2 n = 3 n = 4

TD62064APG

Ta = 85°C

n-ch ON

TD62064APG

Ta = 25°C

n-ch ON

1500

900

300

60 100

600

n = 1

1200

20 80

n = 2

n = 3

n = 4

(1)

(2)

(3)

(4)

(1) DIP-16 pin

on glass epoxy PCB

(50 × 50 × 1.6 mm Cu 50%)

(2) DIP-16 pin free air

(3) HSOP-16 pin

on glass epoxy PCB

(60 × 30 × 1.6 mm Cu 30%)

(4) HSOP-16 pin free air

3.0

1.8

0.6

120 200

1.2

2.4

40 160

TD62064APG/AFG

2011-01-14

Duty Cycle (%)

IOUT – Duty cycle

Output current IOUT (mA)

Duty Cycle (%)

IOUT – Duty cycle

Output current IOUT (mA)

1500

900

300

60 100

600

1200

20 80

n = 1

n = 2

n = 3

TD62064AFG

Ta = 85°C

n-ch ON

n = 4

1500

900

300

60 100

600

n = 1

1200

20 80

n = 2 n = 3 n = 4

TD62064AFG

Ta = 25°C

n-ch ON

TD62064APG/AFG

2011-01-14

Package Dimensions

Weight: 1.11 g (typ.)

TD62064APG/AFG

2011-01-14

Package Dimensions

Weight: 0.50 g (typ.)

TD62064APG/AFG

2011-01-14

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case

of over current and/or IC failure. The IC will fully break down when used under conditions that exceed

its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise

occurs from the wiring or load, causing a large current to continuously flow and the breakdown can

lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,

appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation or

incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load

(BTL) connection type IC that inputs output DC voltage to a speaker directly.

TD62064APG/AFG

2011-01-14

Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device

so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time

and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation

design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,

please design the device taking into considerate the effect of IC heat radiation with peripheral

components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the

motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply

is small, the device’s motor power supply and output pins might be exposed to conditions beyond

maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system

design.

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

TD62064APG/AFG

2011-01-14

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,

or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all

relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for

Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for

the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product

design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or

applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,

programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for

such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public

impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the

aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign

Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software

or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.