DATASHEET BoardLevelCooling-HighRise5308 BOARDLEVELCOOLING-HighRise5308 HighRise5308isaseriesofnarrowhighrisechannelboardlevelheatsinks designedtocoolTO218,TO220,TO220singlegauge,andTO247devices. Representativeimageonly. ORDERINGINFORMATION PartNumber DeviceType 530801B05150G 530861B05162G TO220,TO220singlegauge TO218,TO247 HEATSINKDETAILS Property Details Property Details Material Finishing DeviceAttachmentOptions ThermalInterfaceMaterial Aluminum BlackAnodize KoolClip62 HeatSinkWidth(mm) HeatSinkLength(mm) HeatSinkHeight(mm) HeatSinkMountingDirection 45.70 12.45 44.45 Vertical MECHANICAL&PERFORMANCE Drawingdimensionsareshowninmm,(in) PartNumber "A"Dim "X"Dim "YT"Dim "Y"Dim 530801B05150G 530861B05162G 21.8 21.8 21.56(0.849) 12.70(0.500) 6.35(0.250) "Z"Dim 2.95(0.116) PartNumber:530801B05150G MountingDetails: USA:1.855.322.2843 EUROPE:39.051.764002 ASIA:86.21.6115.2000x8122 BoardLevelCooling www.aavid.com DATASHEET BoardLevelCooling-HighRise5308 PartNumber:530861B05162G USA:1.855.322.2843 EUROPE:39.051.764002 ASIA:86.21.6115.2000x8122 BoardLevelCooling www.aavid.com