Phycomp Product specification
Surface-mount ceramic
multilayer capacitors Class 2, Y5V
6.3/10 V
2004 Apr 05 Rev.8 8 www.yageo.com
TESTS AND REQUIREME NTS
Table 2 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be
mounted on printed-circuit
boards or ceramic substrates
by applying wave soldering,
reflow soldering (including
vapour phase soldering) or
conductive adhesive
no visible damage
4.5 visual inspection and
dimension check any applicable method using
×10 magnification in accordance with
specification
4.6.1 capacitance at 25 °C
C < 22 µF, f = 1 kHz, 1 Vrms
C ≥ 22 µF, f = 120 Hz, 0.5 Vrms
within specified tolerance
4.6.2 tan
δ at 25 °C
C < 22 µF, f = 1 kHz, 1 Vrms
C ≥ 22 µF, f = 120 Hz, 0.5 Vrms
in accordance with
specification
4.6.3 insulation resistance
at Ur (DC) for 1 min u te in accordance with
specification
4.6.4 voltage proof 2.5 × Ur for 1 minute no breakdown or flashover
4.7.1 temperature
coefficient between minimum and
maximum temperature in accordance with
specification
4.8 adhesion a force of 5 N applied for 10 s
to the line joining the
terminations and in a plane
parallel to the substrate
no visible damage
mounted in accordance with
CECC 32 100, paragraph 4.4 no visible damage
4.9 bond strength of
plating on end face
conditions: bending 1 mm at a
rate of 1 mm/s, radius jig 340
mm
l∆C/Cl: ≤30%
resistance to
soldering heat preconditioning:
120 to 150 °C during 1 minute;
260 ±5 °C for 10 ±0.5 s in a
static solder bath
the terminations shall be well
tinned after recovery
l∆C/Cl: ±20%
tan δ: original specification
Rins: original specification
4.10 Tb
resistance to
leaching 260 ±5 °C for 30 ±1 s
in a static solder bath using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%