© 2010 Microchip Technology Inc. DS21667F-page 1
MCP2551
Features
Supports 1 Mb/s operation
Implements ISO-11898 standard physical layer
requirements
Suitable for 12V and 24V systems
Externally-controlled slope for reduced RFI
emissions
Detection of ground fault (permanent Dominant)
on TXD input
Power-on Reset and voltage brown-out protection
An unpowered node or brown-out event will not
disturb the CAN bus
Low current standby operation
Protection against damage due to short-circuit
conditions (positive or negative battery voltage)
Protection against high-voltage transients
Automatic thermal shutdown protection
Up to 112 nodes can be connected
High-noise immunity due to differential bus
implementation
Temperature ranges:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
Package Types
Block Diagram
RS
CANH
CANL
VREF
TXD
VSS
VDD
RXD
1
2
3
4
8
7
6
5
PDIP/SOIC
MCP2551
Thermal
Shutdown
VDD
VSS
CANH
CANL
TXD
RS
RXD
VREF
VDD
Slope
Control Power-On
Reset
Reference
Voltage Receiver
GND
0.5 VDD
TXD
Dominant
Detect
Driver
Control
High-Speed CAN Transceiver
MCP2551
DS21667F-page 2 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS21667F-page 3
MCP2551
1.0 DEVICE OVERVIEW
The MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN
proto col controller and the ph ysical bus. The MCP2551
device provides differential transmit and receive
capability for the CAN protocol controller, and is fully
comp atible with the ISO-11898 stan dard, inc luding 2 4V
requirements. It will operate at speeds of up to 1 Mb/s.
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a
CAN co ntroller to si gnals suit able fo r transmissio n over
the bus cabling (differential output). It also provides a
buff er between the CA N controller and the hi gh-voltag e
spikes that can be generated on the CAN bus by
outside sources (EMI, ESD, electrical transients, etc.).
1.1 Transmitter Function
The CAN bus has two states: Dominant and
Recessive. A Dominant state occurs when the
differential voltage between CANH and CANL is
great er than a defined v oltag e (e.g.,1.2 V). A Rece ssive
state occ urs wh en the di ffer en tia l v ol t age is le ss th an a
defined voltage (typically 0V). The Dominant and
Reces sive sta tes correspon d to the Low and High stat e
of the TXD input pin, respectively. However, a
Dominant state initiated by another CAN node will
override a Recessive state on the CAN bus.
1.1.1 MAXIMUM NUMBER OF NODES
The MCP2551 CAN outputs will drive a minimum load
of 45Ω, allowing a maximum of 112 nodes to be
connected (given a minimum differential input
resistance of 20 kΩ and a nominal termination resistor
value of 120Ω).
1.2 Receiver Function
The RXD output pin reflects the differential bus voltage
between CA NH and CANL. The Low and Hi gh states of
the RXD output pin correspond to the Dominant and
Recessi ve states of the CAN bus, respectivel y.
1.3 Internal Protection
CANH and CANL are protected against battery short-
circuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmi tter out put stage duri ng such a fault condi tion.
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
outp ut dri vers w hen th e junc tion te mpera ture e xceeds
a nominal limit of 165°C. All other parts of the chip
remain operational, and the chip temperature is low-
ered due to the decreased power dissipation in the
transmitter outputs. This protection is essential to
protect against bus line short-circuit-induced damage.
1.4 Operating Modes
The RS pin allows three modes of operation to be
selected:
•High-Speed
Slope-Control
Standby
These mode s are sum m ariz ed in Table 1-1.
When in High-Speed or Slope-Control mode, the
drivers for the CANH and CANL signals are internally
regulated to provide controlled symmetry in order to
minimize EMI emissions.
Additionally, the slope of the signal transitions on
CANH and CANL can be controlled with a resistor
connected from pin 8 (RS) to ground. The slope must
be proportional to the current output at RS, which will
further reduce EMI emissions.
1.4.1 HIGH-SPEED
High-Speed mod e is se lected by co nnecti ng the R S pin
to VSS. In this mode, the transmitter output drivers have
fast output rise and fall times to support high-speed
CAN bus rates.
1.4.2 SLOPE-CONTROL
Slope-C ontrol mode further red uces EMI by limiting the
rise and fall times of CANH and CANL. The slope, or
slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The slope is proportional to th e current outpu t at the RS
pin. Since the current is primarily determined by the
slope-c ontrol resis tance va lue REXT, a ce rtain sle w rate
is achieved by applying a specific resistance.
Figure 1-1 illustrates typical slew rate values as a
function of the slope-control resistance value.
1.4.3 STANDBY MODE
The device may be placed in Standby or SLEEP mode
by applyi ng a high-leve l to the RS pin. In SL EEP mode,
the transmitter is switched off an d the receiver operates
at a lower current. The receive pin on the controller side
(RXD) is still functional, but will operate at a slower
rate. The att ach ed microcont roller can mo nitor RXD for
CAN bus activity and place the transceiver into normal
operation via the RS pin (at higher bus rates, the first
CAN message ma y be lost).
MCP2551
DS21667F-page 4 © 2010 Microchip Technology Inc.
TABLE 1-1: MODES OF OPERATION
TABLE 1-2: TRANSCEIVER TRUTH TABLE
FIGURE 1-1: SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE
Mode Current at Rs Pin Resulting Voltage at RS Pin
Standby -IRS < 10 µA VRS > 0.75 VDD
Slope-Control 10 µA < -IRS < 200 µA 0.4 VDD < VRS < 0.6 VDD
High-Speed -IRS < 610 µA 0 < VRS < 0.3VDD
VDD VRS TXD CANH CANL Bus State(1) RXD(1)
4.5V VDD 5.5V VRS < 0.75 VDD 0 HIGH LOW Dominant 0
1 or floating Not Driven Not Driven Recessive 1
VRS > 0.75 VDD X Not Driven Not Driven Recessive 1
VPOR < VDD < 4.5V
(See Note 3)VRS < 0.75 VDD 0 HIGH LOW Dominant 0
1 or floating Not Driven Not Driven Recessive 1
VRS > 0.75 VDD X Not Driven Not Driven Recessive 1
0 < VDD < VPOR XX
Not Driven/
No Load Not Driven/
No Load High Impedance X
Note 1: If another bus node is transmitting a Dominant bit on the CAN bus, then RXD is a logic ‘0’.
2: X = “don’t care”.
3: Device drivers will function, although outputs are not ensured to meet the ISO-11898 specification.
0
5
10
15
20
25
10 20 30 40 49 60 70 76 90 100 110 120
Resistance (k)
Slew Rate V/μs
© 2010 Microchip Technology Inc. DS21667F-page 5
MCP2551
1.5 TXD Permanent Dominant
Detection
If the MCP2551 detects an extended Low state on the
TXD input, it will disable the CANH and CANL output
drivers in orde r to preven t th e c orrup tio n o f da ta on th e
CAN bus. The drivers are disabled if TXD is Low for
more than 1.25 ms (minimum). This implies a
maximum bit time of 62.5 µs (16 kb/s bus rate),
allowing up to 20 consecutive transmitted Dominant
bits during a m ultiple bit e rror and error f rame scenari o.
The drivers remain disabled as long as TXD remains
Low. A rising edge on TXD wil l reset the t imer logic an d
enable the C AN H and CANL outp ut driv ers .
1.6 Power-on Reset
When the device is powered on, CANH and CANL
remain in a hig h-impedance state u ntil VDD reaches th e
voltage-level VPORH. In addition, CANH and CANL will
remain in a high-impedance state if TXD is Low when
VDD reaches VPORH. CANH and CANL will become
activ e on ly a fter TXD i s as ser ted Hig h. O nce powe red
on, CA NH and CANL will e nter a high-imp edanc e st ate
if the voltage level at VDD falls below VPORL, providing
voltage brown-out protection during normal operation.
1.7 Pin Descriptions
The 8-pin pinout is listed in Table 1-3.
TABLE 1-3: MCP2551 PINOUT
1.7.1 TRANSMITTER DATA INPUT (TXD)
TXD is a TTL-comp atible in put pin . The dat a on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data
output o f th e CAN c ontrol ler devic e. Whe n T XD is Lo w,
CANH and CANL ar e in the Dominant st ate. When TXD
is High, CANH and CANL are in the Recessive state,
provi ded th at ano ther C AN no de is no t d riving the CA N
bus w ith a D omi nan t s t ate . TXD has a n i ntern al pu ll-up
resistor (nominal 25 kΩ to VDD).
1.7.2 GROUND SUPPLY (VSS)
Ground sup ply pin.
1.7.3 SUPPLY VOLTAGE (VDD)
Positive supply voltage pin.
1.7. 4 R ECEI VER DATA OUTPUT (RXD)
RXD is a CMOS-compatible output that drives High or
Low d ependi ng on the d if feren tial s ignal s on the C ANH
and CANL pins and is usually connected to the receiver
data input of the CAN controller device. RXD is High
when the CAN bus is Recessive and Low in the
Dominant state.
1.7. 5 REFERENCE VOLTAGE (VREF)
Reference Voltage Output (defined as VDD/2).
1.7.6 CAN LOW (CANL)
The CANL output drives the Low side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator.
1.7.7 CAN HIGH (CANH)
The CANH output drives the high-side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator.
1.7.8 SLOPE RESISTOR INPUT (RS)
The RS pin is used to s elect High- S peed, Slo pe-Control
or Standby modes via an external biasing resistor.
Pin
Number Pin
Name Pin Function
1 TXD Tran smit Da t a Inpu t
2V
SS Ground
3V
DD Supply Voltage
4 RXD Receive Data Output
5VREF Reference Ou tput Voltage
6 CANL CAN Low-Level Voltage I/O
7 CANH CAN High -Level Voltage I/O
8R
SSlope-Control Input
MCP2551
DS21667F-page 6 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS21667F-page 7
MCP2551
2.0 ELECTRICAL
CHARACTERISTICS
2.1 Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to d escri be the e lectri cal ch aracteris tics o f a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.1.1 BUS VOLTAGE
VCANL and VCANH denote the voltages of the bus line
wires CANL and CANH relative to ground of each
individual CAN node.
2.1.2 COMMON MO DE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANL and VCANH with
respect to ground, for wh ich proper operation will occur ,
if up to the maximum number of CAN nodes are
connec ted to the bus.
2.1.3 DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF
(OF A CAN NODE)
Capacitance seen between CANL and CANH during
the Recessive state when the CAN node is
disconnected from the bus (see Figure 2-1).
2.1.4 DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF
(OF A CAN NODE)
Resis ta nce see n betwe en CANL an d CANH du ring the
Recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).
2.1.5 DIFFERENTIAL VOLTAGE, VDIFF
(OF CAN BU S)
Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH - VCANL.
2.1.6 INTERNAL CAPACITANCE, CIN
(OF A CAN NODE)
Capacitance seen between CANL (or CANH) and
groun d during the Reces sive st ate wh en the CA N node
is disconnected from the bus (see Figure 2-1).
2.1.7 INTERNAL RESISTANCE, RIN
(OF A CAN NODE)
Resistance seen between CANL (or CANH) and
groun d during the Reces sive st ate wh en the CA N node
is disconnected from the bus (see Figure 2-1).
FIGURE 2-1: PHYSICAL LAYER
DEFINITIONS
RIN
RIN RDIFF
CIN CIN
CDIFF
CANL
CANH
GROUND
ECU
MCP2551
DS21667F-page 8 © 2010 Microchip Technology Inc.
Absolute Maximum Ratings†
VDD.............................................................................................................................................................................7.0V
DC Voltage at TXD, RXD, VREF and VS............................................................................................ -0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1)..........................................................................................................-42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2).............................................................................................-250V to +250V
Storage temperature ...............................................................................................................................-55°C to +150°C
Operati ng amb ie nt temp era ture...................................... ............................ ................................ ............-40°C to +125°C
Virtual Junction Temperature, TVJ (Note 3).............................................................................................-40°C to +150°C
Soldering temperature of leads (10 seconds).......................................................................................................+300°C
ESD protection on CANH and CANL pins (Note 4) ...................................................................................................6 kV
ESD protection on all other pins (Note 4) ..................................................................................................................4 kV
Note 1: Short-circuit applied when TXD is High and Low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stres s ra tin g on ly a nd functio nal ope r ati on of the device at those or an y ot her c onditions abo ve those i ndi ca ted in
the opera tional li stings of this s pecificatio n is not implie d. Exposure to maximum ra ting conditi ons for extend ed periods
may affect devi ce re liabi lity.
© 2010 Microchip Technology Inc. DS21667F-page 9
MCP2551
2.2 DC Characteristics
DC Specifications Electrical Ch arac ter is tics :
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param
No. Sym Characteristic Min Max Units Conditions
Supply
D1
IDD Supply Current
75 mA Dominant; VTXD = 0.8V; VDD
D2 10 mA Recessive; V TXD = +2V;
RS = 47 kW
D3 —365µA
-40°C TAMB + 85°C, S tandby;
(Note 2)
—465µA
-40°C TAMB +125°C,
Standby; (Note 2)
D4 VPORH High-level of the Power-on
Reset comparator 3.8 4.3 V CANH, CANL output s are active
when VDD > VPORH
D5 VPORL Low-level of the Power-on
Reset comparator 3.4 4.0 V CANH, CANL outputs are not
active when VDD < VPORL
D6 VPORD Hysteresis of Power-on
Reset comparator 0.3 0.8 V Note 1
Bus Line (CANH; CANL) Transmitter
D7 VCANH(r);
VCANL(r)
CANH, CANL Recessive
bus voltage 2.0 3.0 V VTXD = VDD; no load.
D8 IO(CANH)(reces)
IO(CANL)(reces) Recessive output current -2 +2 mA -2V < V(CAHL,CANH) < +7V,
0V <VDD < 5.5V
D9 -10 +10 mA -5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V
D10 VO(CANH)CA NH Dominant
output voltage 2.75 4.5 V VTXD = 0.8V
D11 VO(CANL)CANL Dominant
output voltage 0.5 2.25 V VTXD = 0.8V
D12 VDIFF(r)(o) Recessive differential
output voltage -500 +50 mV VTXD = 2V; no loa d
D13 VDIFF(d)(o) Dominant differential
output voltage 1.5 3.0 V VTXD = 0.8V; VDD = 5V
40W < RL < 60W (Note 2)
D14 IO(SC)(CANH)CANH short-circuit
output cur rent
-200 mA VCANH = -5V
D15 -100
(typical) mA VCANH = -40V, +40V. (Note 1)
D16 IO(SC)(CANL)l CANL short-circuit
output cur rent —200mAV
CANL = -40V, +40V. (Note 1)
D17 VDIFF(r)(i) Recessive differential
input voltage
-1.0 +0.5 V -2V < V(CANL, CANH) < +7V
(Note 3)
-1.0 +0.4 V -12V < V(CANL, CANH) < +12V
(Note 3)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; V RS = VDD.
3: This is valid for the receiver in all modes; High-speed, Slope-control and Standby.
MCP2551
DS21667F-page 10 © 2010 Microchip Technology Inc.
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D18 VDIFF(d)(i) Dominant differential
input voltage
0.9 5.0 V -2V < V(CANL, CANH) < +7V
(Note 3)
1.0 5.0 V -12V < V(CANL, CANH) < +12V
(Note 3)
D19 VDIFF(h)(i) Differential input hysteresis 100 200 mV See Figure 2-3 (Note 1)
D20 RIN CANH, CANL Common-
mode input resistance 550kW
D21 RIN(d) Deviation between C AN H
and CANL Common-mode
input resistance -3 +3 % VCANH = VCANL
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22 RDIFF Differential input resistance 20 100 kW
D24 ILI CANH, CANL input leakage
current —150µA
VDD < VPOR;
VCANH = VCANL = +5V
Transmitter Data Input (TXD)
D25 VIH High-level input voltage 2.0 VDD V Output Recessive
D26 VIL Low-level input voltage VSS +0.8 V Output Dominant
D27 IIH High-level input current -1 +1 µA VTXD = VDD
D28 IIL Low-level input current -100 -400 µA VTXD = 0V
Receiver Data Output (RXD)
D31 VOH High-level output voltage 0.7 VD
D—VIOH = 8 mA
D32 VOL Low-level output voltage 0.8 V IOL = 8 mA
Volt a ge Refer en ce Ou tput (VREF)
D33 VREF Reference output voltage 0.45 V
DD 0.55 VD
DV-50µA < IVREF < 50 µA
Standby/Slope-Control (RS pin)
D34 VSTB Input voltage for standby
mode 0.75 V
DD —V
D35 ISLOPE Slope-control mo de curre nt -10 -200 µ A
D36 VSLOPE Slope-cont rol mo de vol t ag e 0.4 VD
D0.6 VDD V
Thermal Shutdown
D37 TJ(sd) Shutdown junction
temperature 155 180 oCNote 1
D38 TJ(h) Shutdown temperature
hysteresis 20 30 oC -12V < V(CANL, CANH) < +12V
(Note 3)
2.2 DC Characteristics (Continued)
DC Specifications (Continued) Electrical Ch arac ter is tics :
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param
No. Sym Characteristic Min Max Units Conditions
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; V RS = VDD.
3: This is valid for the receiver in all modes; High-speed, Slope-control and Standby.
© 2010 Microchip Technology Inc. DS21667F-page 11
MCP2551
FIGURE 2-1: TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
FIGURE 2-2: TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
FIGURE 2-3: HYSTERES IS OF THE RECEIVE R
RS
Rext
GND
RXD
VREF
TXD
60 Ω100 pF
30 pF
CANH
CANL
CAN
Transceiver
Note: RS may be connected to VDD or GND via a load resistor depending on desired
operating mode as descri be d in Section 1.7.3 “Supply Voltage (VDD)”.
0.1µF
VDD
RS
Rext
GND
RXD
VREF
TXD
60Ω
500 pF
500 pF
Note: RS may be connected to VDD or
GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8 “Slope
Resistor Input (Rs)”.
CANH
CANL
CAN
Transceiver
Schaffner
Generator
The wave forms of the applied transients shall be in accordance with “ISO-7637, Part 1”, test pulses 1, 2, 3a and 3b.
VOH
VOL
0.5 0.9
hysteresis
D19
VDIFF (V)
RXD (receive data
output voltage) VDIFF (r)(i) VDIFF (d)(i)
MCP2551
DS21667F-page 12 © 2010 Microchip Technology Inc.
2.3 AC Characteristics
AC Specifications Electrical Charact eris tics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
Param
No. Sym Characteristic Min Max Units Conditions
1t
BIT Bit time 1 62.5 µs VRS = 0V
2fBIT Bit frequency 16 1000 kHz VRS = 0V
3 TtxL2bus(d) Delay TXD to bus active 70 ns -40°C TAMB +125°C,
VRS = 0V
4 TtxH2bus(r) Delay TXD to bus inactive 125 ns -40°C TAMB +85°C,
VRS = 0V
170 ns -40°C TAMB +125°C,
VRS = 0V
5 TtxL2rx(d) Delay TXD to receive active 130 ns -40°C TAMB +125°C,
VRS = 0V
250 ns -40°C TAMB +125°C,
RS = 47 kΩ
6 TtxH2rx(r) Delay TXD to receiver
inactive
175 ns -40°C TAMB +85°C,
VRS = 0V
225 ns -40°C TAMB +85°C,
RS = 47 kΩ
235 ns -40°C TAMB +125°C,
VRS = 0V
400 ns -40°C TAMB +125°C,
RS = 47 kΩ
7 SR CANH, CANL slew rate 5.5 8.5 V/µs Refer to Figure 2-1;
RS = 47 kΩ, (Note 1)
10 tWAKE Wake-up time from standby
(Rs pin) —5µsSee Figure 2-5
11 TbusD2rx(s) Bus Domin ant to RXD Low
(Standby mode) 550 ns VRS = +4V; (See Figure 2-6)
12 CIN(CANH)
CIN(CANL)CANH; CANL input
capacitance 20
(typical) pF 1 Mb/s data rate;
VTXD = VDD, (Note 1)
13 CDIFF Differential input
capacitance 10
(typical) pF 1 Mb/s data rate
(Note 1)
14 TtxL2busZ TX Permanent Dominant
Timer Disable Time 1.25 4 ms
15 TtxR2pdt(res) TX Permanent Dominant
Timer Reset Time —1µs
Rising edge on TXD while
device is in permanent
Dominant state
Note 1: This parameter is periodically sampled and not 100% tested.
© 2010 Microchip Technology Inc. DS21667F-page 13
MCP2551
2.4 Timing Diagrams and Specifications
FIGURE 2-4: TIMING DIAGRAM FOR AC CHARACTERISTICS
FIGURE 2-5: TIMING DIAGRAM FOR WAKE-UP FROM STANDBY
FIGURE 2-6: TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)
3
546
0.9V 0.5V
0V
VDD
TXD (transmit data
input voltage)
VDIFF (CANH,
CANL differential
voltage)
RXD (receive dat a
output voltage) 0.3 VDD 0.7 VDD
VTXD = 0.8V 10
0V
VDD
VRS Slope resistor
input voltage
VRXD Receive data
output voltage
0.6 VDD
0.3 VDD
VRS = 4V; VTXD = 2V
1.5V
0V
11
VDIFF, Differential
voltage
Receive data
output vol t ag e
0.9V
0.3 VDD
MCP2551
DS21667F-page 14 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS21667F-page 15
MCP2551
3.0 PACKAGING INFORMATION
3.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
MCP2551
I/P ^^256
1019
MCP2551E
SN ^^1019
256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event th e full Mi croch ip pa rt numbe r can not be ma rked on one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
MCP2551
DS21667F-page 16 © 2010 Microchip Technology Inc.


  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#/!#
 '!#&.0
1,21!'!&$& "!**&"&&!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 7,8.
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
&& = = 
##44!!   - 
1!&&   = =
"#&"#>#& .  - -
##4>#& .   <
: 9& -< -? 
&& 9  - 
9#4!! <  
69#>#& )  ? 
9*9#>#& )  < 
: *+ 1 = = -
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
  * ,<
1
© 2010 Microchip Technology Inc. DS21667F-page 17
MCP2551
 ! ""#$%& !'

  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
: 8& = = 
##44!!   = =
&#%%+  = 
: >#& . ?1,
##4>#& . -1,
: 9& 1,
,'%@&A  = 
3&9& 9  = 
3&& 9 .3
3& IB = <B
9#4!!  = 
9#>#& ) - = 
#%& DB = B
#%&1&&' EB = B
D
N
e
E
E1
NOTE 1
12 3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
  * ,1
MCP2551
DS21667F-page 18 © 2010 Microchip Technology Inc.
 ! ""#$%& !'
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
© 2010 Microchip Technology Inc. DS21667F-page 19
MCP2551
APPENDIX A: REVISION HISTORY
Revision F (July 2010)
The following is the list of modifications:
1. Updates to the packaging diagrams.
Revision E (January 2007)
The following is the list of modifications:
1. Updates to the packaging diagrams.
Revision D (October 2003)
The following is the list of modifications:
1. Undocum ent ed cha nges.
Revision C (November 2002)
The following is the list of modifications:
1. Undocum ent ed cha nges.
Revision B (June 2002)
The following is the list of modifications:
1. Undocum ent ed cha nges.
Revision A (June 2001)
Original Release of this Document.
MCP2551
DS21667F-page 20 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS21667F-page 21
MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. -X /XX XXX
PatternPackageTemperature
Range
Device
D evice: MCP2551: High-Speed CAN Transceiver
MCP2551T: High-Speed CAN Transceiver
(Tape and Reel)
Temperature
Range: I = -40°C to +85°C
E = -40°C to +125°C
Package: P = Plastic DIP (300 mil Body) 8-lead
SN = Plastic SOIC (150 mil Bo dy) 8-lead
Examples:
a) M CP2551-I /P: Industrial temperature,
PDIP package.
b) M CP2551-E /P : Extended temperature,
PDIP package.
c) MCP2551-I/ SN: Industrial temperature,
SOIC package.
d) M CP2551T-I/SN: Tape and Reel,
Industrial Tem perature,
SOIC package.
e) M CP2551T-E/SN: Tape and Reel,
Extended Temperature,
SOIC package.
f) MCP2551-E/SN: Extended Temperature,
SOIC package.
MCP2551
DS21667F-page 22 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS21667F-page 23
Information contained in this publication regarding device
applications a nd the lik e is p rovided on ly for your convenien ce
and may be supers eded by update s . I t is y our responsibil i ty to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PI CSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Contr ol
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLA B Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Inc orporated, Pr inted in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN:
Note the following details of the code protection feature on Microchip devices:
M icrochip products meet the specification contained in their particular Microchip Data Sheet.
M icrochip believes that its family of products is one of t he most secure famili es of its kind on t he market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
M icrochip is willing to work with the customer who is concerned about the integrity of their code.
Neit her Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Mill ennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and d sPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21667F-page 24 © 2010 Microchip Technology Inc.
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Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11- 4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Taiwan - Kaohsi ung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Ma dri d
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
WORLDWIDE SALES AND SERVICE
01/05/10