LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 LM6172 Dual High Speed, Low Power, Low Distortion, Voltage Feedback Amplifiers Check for Samples: LM6172 FEATURES DESCRIPTION * * * * * * * The LM6172 is a dual high speed voltage feedback amplifier. It is unity-gain stable and provides excellent DC and AC performance. With 100MHz unity-gain bandwidth, 3000V/s slew rate and 50mA of output current per channel, the LM6172 offers high performance in dual amplifiers; yet it only consumes 2.3mA of supply current each channel. 1 2 (Typical Unless Otherwise Noted) Easy to Use Voltage Feedback Topology High Slew Rate 3000V/s Wide Unity-Gain Bandwidth 100MHz Low Supply Current 2.3mA/Channel High Output Current 50mA/channel Specified for 15V and 5V Operation APPLICATIONS * * * * * * * Scanner I-to-V Converters ADSL/HDSL Drivers Multimedia Broadcast Systems Video Amplifiers NTSC, PAL and SECAM Systems ADC/DAC Buffers Pulse Amplifiers and Peak Detectors The LM6172 operates on 15V power supply for systems requiring large voltage swings, such as ADSL, scanners and ultrasound equipment. It is also specified at 5V power supply for low voltage applications such as portable video systems. The LM6172 is built with TI's advanced VIP III (Vertically Integrated PNP) complementary bipolar process. See the LM6171 datasheet for a single amplifier with these same features. LM6172 Driving Capacitive Load Connection Diagram Figure 1. Top View 8-Pin See Package Numbers P (PDIP) and D (SOIC) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model 3kV Machine Model 300V Supply Voltage (V+ - V-) 36V Differential Input Voltage 10V V+ +0.3V to V- -0.3V Common Mode Voltage Range Input Current 10mA Output Short Circuit to Ground (4) Continuous -65C to +150C Storage Temp. Range Maximum Junction Temperature (5) Soldering Information (1) 150C Infrared or Convection Reflow (20 sec.) 235C Wave Soldering Lead Temp (10 sec.) 260C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human body model, 1.5k in series with 100pF. Machine Model, 200 in series with 100pF. Continuous short circuit operation can result in exceeding the maximum allowed junction temperature of 150C. The maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) - TA)/JA. All numbers apply for packages soldered directly into a PC board. (2) (3) (4) (5) Operating Ratings (1) 5.5V VS 36V Supply Voltage -40C to +85C Operating Temperature Range LM6172I Thermal Resistance (JA) P Package, 8-Pin PDIP 95C/W D Package, 8-Pin SOIC 160C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. 15V DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C,V+ = +15V, V- = -15V, VCM = 0V, and RL = 1k. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6172I Limit Units 3 mV (2) VOS Input Offset Voltage 0.4 TC VOS Input Offset Voltage Average Drift IB Input Bias Current 1.2 IOS Input Offset Current 0.02 4 RIN RO (1) (2) 2 Input Resistance Common Mode 40 Differential Mode 4.9 Open Loop Output Resistance 14 max V/C 6 3 A 4 max 2 A 3 max M Typical Values represent the most likely parametric normal. All limits are guaranteed by testing or statistical analysis. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 15V DC Electrical Characteristics (continued) Unless otherwise specified, all limits guaranteed for TJ = 25C,V+ = +15V, V- = -15V, VCM = 0V, and RL = 1k. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6172I Limit Units (2) CMRR Common Mode Rejection Ratio VCM = 10V 110 PSRR Power Supply Rejection Ratio VS = 15V to 5V VCM Input Common Mode Voltage Range CMRR 60dB AV Large Signal Voltage Gain (3) RL = 1k 86 RL = 100 78 VO Output Swing RL = 1k RL = 100 95 (Open Loop) (4) ISC IS (3) (4) Current Output Short Circuit Supply Current Sourcing, RL = 100 dB 65 min 75 dB 70 min 80 dB 75 min 13.5 V 65 dB 60 min 13.2 12.5 V 12 min -13.1 -12.5 V -12 max 9 -8.5 Continuous Output Current 70 90 6 V 5 min -6 V -5 max 60 mA 50 min -60 mA -50 max Sinking, RL = 100 -85 Sourcing 107 mA Sinking -105 mA Both Amplifiers 4.6 8 mA 9 max Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = 15V, VOUT = 5V. For VS = 5V, VOUT = 1V. The open loop output current is the output swing with the 100 load resistor divided by that resistor. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 3 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com 15V AC Electrical Characteristics Unless otherwise specified, TJ = 25C, V+ = +15V, V- = -15V, VCM = 0V, and RL = 1k Symbol Parameter Conditions LM6172I Typ Units AV = +2, VIN = 13 VPP 3000 V/s AV = +2, VIN = 10 VPP 2500 V/s (1) SR Slew Rate Unity-Gain Bandwidth -3 dB Frequency 100 MHz AV = +1 160 MHz AV = +2 62 MHz Bandwidth Matching between Channels 2 MHz m Phase Margin 40 Deg ts Settling Time (0.1%) 65 ns AD Differential Gain (2) 0.28 % D Differential Phase (2) 0.6 Deg en Input-Referred Voltage Noise f = 1kHz 12 nV/Hz in Input-Referred Current Noise f = 1kHz 1 pA/Hz Second Harmonic f = 10kHz -110 dB Distortion (3) f = 5MHz -50 dB Third Harmonic f = 10kHz -105 dB f = 5MHz -50 dB Distortion (1) (2) (3) 4 (3) AV = -1, VOUT = 5V, RL = 500 Typical Values represent the most likely parametric normal. Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58MHz and both input and output 75 terminated. Harmonics are measured with AV = +2, VIN = 1 VPP and RL = 100. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 5V DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = +5V, V- = -5V, VCM = 0V, and RL = 1 k. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6172I Limit Units (2) VOS Input Offset Voltage TC VOS Input Offset Voltage Average Drift IB Input Bias Current IOS Input Offset Current RIN Input Resistance RO Output Resistance CMRR Common Mode Rejection Ratio 0.1 1.4 0.02 Common Mode 40 Differential Mode 4.9 VCM = 2.5V 105 VS = 15V to 5V VCM Input Common Mode Voltage Range CMRR 60dB AV Large Signal Voltage Gain (3) RL = 1k 82 RL = 100 78 RL = 1k RL = 100 95 ISC IS (1) (2) (3) (4) Output Short Circuit Current Supply Current V/C 2.5 A 3.5 max 1.5 A 2.2 max M Sourcing, RL = 100 70 dB 65 min 75 dB 70 min 70 dB 65 min 3.7 V 65 dB 60 min 3.4 3.1 V 3 min -3.3 -3.1 V -3 max 2.9 -2.7 Continuous Output Current (Open Loop) (4) max 14 Power Supply Rejection Ratio Output Swing mV 4 4 PSRR VO 3 29 2.5 V 2.4 min -2.4 V -2.3 max 25 mA 24 min -24 mA -23 max Sinking, RL = 100 -27 Sourcing 93 mA Sinking -72 mA Both Amplifiers 4.4 6 mA 7 max Typical Values represent the most likely parametric normal. All limits are guaranteed by testing or statistical analysis. Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = 15V, VOUT = 5V. For VS = 5V, VOUT = 1V. The open loop output current is the output swing with the 100 load resistor divided by that resistor. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 5 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com 5V AC Electrical Characteristics Unless otherwise specified, TJ = 25C, V+ = +5V, V- = -5V, VCM = 0V, and RL = 1 k. Symbol Parameter Conditions LM61722 Typ Units (1) SR Slew Rate AV = +2, VIN = 3.5 VPP 750 V/s 70 MHz AV = +1 130 MHz AV = +2 45 MHz 57 Deg 72 ns Unity-Gain Bandwidth -3 dB Frequency m Phase Margin ts Settling Time (0.1%) AD Differential Gain (2) 0.4 % D Differential Phase (2) 0.7 Deg en Input-Referred Voltage Noise f = 1kHz 11 nV/Hz in Input-Referred Current Noise f = 1kHz 1 pA/Hz Second Harmonic Distortion (3) f = 10kHz -110 dB f = 5MHz -48 dB f = 10kHz -105 dB f = 5MHz -50 dB Third Harmonic Distortion (1) (2) (3) 6 AV = -1, VOUT = 1V, RL = 500 (3) Typical Values represent the most likely parametric normal. Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58MHz and both input and output 75 terminated. Harmonics are measured with AV = +2, VIN = 1 VPP and RL = 100. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Typical Performance Characteristics unless otherwise noted, TA = 25C Supply Voltage vs. Supply Current Supply Current vs. Temperature Figure 2. Figure 3. Input Offset Voltage vs. Temperature Input Bias Current vs. Temperature Figure 4. Figure 5. Short Circuit Current vs. Temperature (Sourcing) Short Circuit Current vs. Temperature (Sinking) Figure 6. Figure 7. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 7 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C 8 Output Voltage vs. Output Current (VS = 15V) Output Voltage vs. Output Current (VS = 5V) Figure 8. Figure 9. CMRR vs. Frequency PSRR vs. Frequency Figure 10. Figure 11. PSRR vs. Frequency Open-Loop Frequency Response Figure 12. Figure 13. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C Open-Loop Frequency Response Gain-Bandwidth Product vs. Supply Voltage at Different Temperature Figure 14. Figure 15. Large Signal Voltage Gain vs. Load Large Signal Voltage Gain vs. Load Figure 16. Figure 17. Input Voltage Noise vs. Frequency Input Voltage Noise vs. Frequency Figure 18. Figure 19. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 9 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C 10 Input Current Noise vs. Frequency Input Current Noise vs. Frequency Figure 20. Figure 21. Slew Rate vs. Supply Voltage Slew Rate vs. Input Voltage Figure 22. Figure 23. Large Signal Pulse Response AV = +1, VS = 15V Small Signal Pulse Response AV = +1, VS = 15V Figure 24. Figure 25. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C Large Signal Pulse Response AV = +1, VS = 5V Small Signal Pulse Response AV = +1, VS = 5V Figure 26. Figure 27. Large Signal Pulse Response AV = +2, VS = 15V Small Signal Pulse Response AV = +2, VS = 15V Figure 28. Figure 29. Large Signal Pulse Response AV = +2, VS = 5V Small Signal Pulse Response AV = +2, VS = 5V Figure 30. Figure 31. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 11 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C 12 Large Signal Pulse Response AV = -1, VS = 15V Small Signal Pulse Response AV = -1, VS = 15V Figure 32. Figure 33. Large Signal Pulse Response AV = -1, VS = 5V Small Signal Pulse Response AV = -1, VS = 5V Figure 34. Figure 35. Closed Loop Frequency Response vs. Supply Voltage (AV = +1) Closed Loop Frequency Response vs. Supply Voltage (AV = +2) Figure 36. Figure 37. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Typical Performance Characteristics (continued) unless otherwise noted, TA = 25C Harmonic Distortion vs. Frequency (VS = 15V) Harmonic Distortion vs. Frequency (VS = 5V) Figure 38. Figure 39. Crosstalk Rejection vs. Frequency Maximum Power Dissipation vs. Ambient Temperature Figure 40. Figure 41. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 13 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com LM6172 Simplified Schematic (Each Amplifier) Figure 42. APPLICATION NOTES LM6172 PERFORMANCE DISCUSSION The LM6172 is a dual high-speed, low power, voltage feedback amplifier. It is unity-gain stable and offers outstanding performance with only 2.3mA of supply current per channel. The combination of 100MHz unity-gain bandwidth, 3000V/s slew rate, 50mA per channel output current and other attractive features makes it easy to implement the LM6172 in various applications. Quiescent power of the LM6172 is 138mW operating at 15V supply and 46mW at 5V supply. LM6172 CIRCUIT OPERATION The class AB input stage in LM6172 is fully symmetrical and has a similar slewing characteristic to the current feedback amplifiers. In Figure 42, Q1 through Q4 form the equivalent of the current feedback input buffer, RE the equivalent of the feedback resistor, and stage A buffers the inverting input. The triple-buffered output stage isolates the gain stage from the load to provide low output impedance. LM6172 SLEW RATE CHARACTERISTIC The slew rate of LM6172 is determined by the current available to charge and discharge an internal high impedance node capacitor. This current is the differential input voltage divided by the total degeneration resistor RE. Therefore, the slew rate is proportional to the input voltage level, and the higher slew rates are achievable in the lower gain configurations. When a very fast large signal pulse is applied to the input of an amplifier, some overshoot or undershoot occurs. By placing an external series resistor such as 1k to the input of LM6172, the slew rate is reduced to help lower the overshoot, which reduces settling time. REDUCING SETTLING TIME The LM6172 has a very fast slew rate that causes overshoot and undershoot. To reduce settling time on LM6172, a 1k resistor can be placed in series with the input signal to decrease slew rate. A feedback capacitor can also be used to reduce overshoot and undershoot. This feedback capacitor serves as a zero to increase the stability of the amplifier circuit. A 2pF feedback capacitor is recommended for initial evaluation. When the LM6172 is configured as a buffer, a feedback resistor of 1k must be added in parallel to the feedback capacitor. 14 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Another possible source of overshoot and undershoot comes from capacitive load at the output. Please see DRIVING CAPACITIVE LOADS for more detail. DRIVING CAPACITIVE LOADS Amplifiers driving capacitive loads can oscillate or have ringing at the output. To eliminate oscillation or reduce ringing, an isolation resistor can be placed as shown in Figure 43. The combination of the isolation resistor and the load capacitor forms a pole to increase stability by adding more phase margin to the overall system. The desired performance depends on the value of the isolation resistor; the bigger the isolation resistor, the more damped (slow) the pulse response becomes. For LM6172, a 50 isolation resistor is recommended for initial evaluation. Figure 43. Isolation Resistor Used to Drive Capacitive Load Figure 44. The LM6172 Driving a 510pF Load with a 30 Isolation Resistor Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 15 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com Figure 45. The LM6172 Driving a 220 pF Load with a 50 Isolation Resistor LAYOUT CONSIDERATION PRINTED CIRCUIT BOARDS AND HIGH SPEED OP AMPS There are many things to consider when designing PC boards for high speed op amps. Without proper caution, it is very easy to have excessive ringing, oscillation and other degraded AC performance in high speed circuits. As a rule, the signal traces should be short and wide to provide low inductance and low impedance paths. Any unused board space needs to be grounded to reduce stray signal pickup. Critical components should also be grounded at a common point to eliminate voltage drop. Sockets add capacitance to the board and can affect frequency performance. It is better to solder the amplifier directly into the PC board without using any socket. USING PROBES Active (FET) probes are ideal for taking high frequency measurements because they have wide bandwidth, high input impedance and low input capacitance. However, the probe ground leads provide a long ground loop that will produce errors in measurement. Instead, the probes can be grounded directly by removing the ground leads and probe jackets and using scope probe jacks. COMPONENTS SELECTION AND FEEDBACK RESISTOR It is important in high speed applications to keep all component leads short because wires are inductive at high frequency. For discrete components, choose carbon composition-type resistors and mica-type capacitors. Surface mount components are preferred over discrete components for minimum inductive effect. Large values of feedback resistors can couple with parasitic capacitance and cause undesirable effects such as ringing or oscillation in high speed amplifiers. For LM6172, a feedback resistor less than 1k gives optimal performance. COMPENSATION FOR INPUT CAPACITANCE The combination of an amplifier's input capacitance with the gain setting resistors adds a pole that can cause peaking or oscillation. To solve this problem, a feedback capacitor with a value CF > (RG x CIN)/RF (1) can be used to cancel that pole. For LM6172, a feedback capacitor of 2pF is recommended. Figure 46 illustrates the compensation circuit. 16 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Figure 46. Compensating for Input Capacitance POWER SUPPLY BYPASSING Bypassing the power supply is necessary to maintain low power supply impedance across frequency. Both positive and negative power supplies should be bypassed individually by placing 0.01F ceramic capacitors directly to power supply pins and 2.2F tantalum capacitors close to the power supply pins. Figure 47. Power Supply Bypassing TERMINATION In high frequency applications, reflections occur if signals are not properly terminated. Figure 48 shows a properly terminated signal while Figure 49 shows an improperly terminated signal. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 17 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com Figure 48. Properly Terminated Signal Figure 49. Improperly Terminated Signal To minimize reflection, coaxial cable with matching characteristic impedance to the signal source should be used. The other end of the cable should be terminated with the same value terminator or resistor. For the commonly used cables, RG59 has 75 characteristic impedance, and RG58 has 50 characteristic impedance. POWER DISSIPATION The maximum power allowed to dissipate in a device is defined as: PD = (TJ(max) - TA)/JA 18 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 LM6172 www.ti.com SNOS792D - MAY 1999 - REVISED MARCH 2013 Where * * * * PD is the power dissipation in a device TJ(max) is the maximum junction temperature TA is the ambient temperature JA is the thermal resistance of a particular package For example, for the LM6172 in a SOIC-8 package, the maximum power dissipation at 25C ambient temperature is 780mW. Thermal resistance, JA, depends on parameters such as die size, package size and package material. The smaller the die size and package, the higher JA becomes. The 8-pin DIP package has a lower thermal resistance (95C/W) than that of 8-pin SO (160C/W). Therefore, for higher dissipation capability, use an 8pin DIP package. The total power dissipated in a device can be calculated as: PD = PQ + PL (2) PQ is the quiescent power dissipated in a device with no load connected at the output. PL is the power dissipated in the device with a load connected at the output; it is not the power dissipated by the load. Furthermore, PQ = supply current x total supply voltage with no load PL = output current x (voltage difference between supply voltage and output voltage of the same supply) For example, the total power dissipated by the LM6172 with VS = 15V and both channels swinging output voltage of 10V into 1k is PD = PQ + PL = 2[(2.3mA)(30V)] + 2[(10mA)(15V - 10V)] = 138mW + 100mW = 238mW Application Circuits Figure 50. I-to-V Converters Figure 51. Differential Line Driver Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 19 LM6172 SNOS792D - MAY 1999 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D * 20 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 19 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM6172 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM6172IM NRND SOIC D 8 95 Non-RoHS & Non-Green Call TI Call TI -40 to 85 LM61 72IM LM6172IM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM61 72IM LM6172IMX NRND SOIC D 8 2500 Non-RoHS & Non-Green Call TI Call TI -40 to 85 LM61 72IM LM6172IMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM61 72IM LM6172IN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 85 LM6172IN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM6172IMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6172IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM6172IMX SOIC D 8 2500 367.0 367.0 35.0 LM6172IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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