LMZ14203TZX-ADJ/NOPB - NATIONAL SEMICONDUCTOR

LMZ14203

LMZ14203 3A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage

Literature Number: SNVS632K

LMZ14203

June 16, 2011

3A SIMPLE SWITCHER® Power Module with 42V Maximum

Input Voltage

Easy To Use 7 Pin Package

30107086

TO-PMOD 7 Pin Package

10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)

θJA = 20°C/W, θJC = 1.9°C/W

RoHS Compliant

Electrical Specifications

■18W maximum total output power

■Up to 3A output current

■Input voltage range 6V to 42V

■Output voltage range 0.8V to 6V

■Efficiency up to 90%

Key Features

■Integrated shielded inductor

■Simple PCB layout

■Flexible startup sequencing using external soft-start and

precision enable

■Protection against inrush currents and faults such as input

UVLO and output short circuit

■– 40°C to 125°C junction temperature range

■Single exposed pad and standard pinout for easy

mounting and manufacturing

■Fast transient response for powering FPGAs and ASICs

■Low output voltage ripple

■Pin-to-pin compatible family:

LMZ14203/2/1 (42V max 3A, 2A, 1A)

LMZ12003/2/1 (20V max 3A, 2A, 1A)

■Fully enabled for Webench® Power Designer

Applications

■Point of load conversions from 12V and 24V input rail

■Time critical projects

■Space constrained / high thermal requirement applications

■Negative output voltage applications (See AN-2027)

Performance Benefits

■Operates at high ambient temperature with no thermal

derating

■High efficiency reduces system heat generation

■Low radiated emissions (EMI) complies with EN55022

class B standard

■Passes 10V/m radiated immunity EMI test standard

EN61000 4-3

System Performance

Efficiency VIN = 24V VOUT = 5.0V

30107036

Thermal Derating Curve

VIN = 24V, VOUT = 5.0V,

30107037

Radiated Emissions (EN 55022 Class B)

from Evaluation Board

30107038

LMZ14203 3A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage

Simplified Application Schematic

30107001

Connection Diagram

30107002

Top View

7-Lead TO-PMOD

Ordering Information

Order Number Package Type NSC Package Drawing Supplied As

LMZ14203TZ-ADJ TO-PMOD-7 TZA07A 250 Units on Tape and Reel

LMZ14203TZX-ADJ TO-PMOD-7 TZA07A 500 Units on Tape and Reel

LMZ14203TZE-ADJ TO-PMOD-7 TZA07A 45 Units in a Rail

Pin Descriptions

Pin Name Description

1 VIN Supply input — Nominal operating range is 6V to 42V . A small amount of internal capacitance is contained within the

package assembly. Additional external input capacitance is required between this pin and exposed pad.

2 RON On Time Resistor — An external resistor from VIN to this pin sets the on-time of the application. Typical values range

from 25k to 124k ohms.

3 EN Enable — Input to the precision enable comparator. Rising threshold is 1.18V nominal; 90 mV hysteresis nominal.

Maximum recommended input level is 6.5V.

4 GND Ground — Reference point for all stated voltages. Must be externally connected to EP.

5 SS Soft-Start — An internal 8 µA current source charges an external capacitor to produce the soft-start function. This node

is discharged at 200 µA during disable, over-current, thermal shutdown and internal UVLO conditions.

www.national.com 2

LMZ14203

Pin Name Description

6 FB Feedback — Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation

reference point is 0.8V at this input pin. Connected the feedback resistor divider between the output and ground to set

the output voltage.

7 VOUT Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad.

EP EP Exposed Pad — Internally connected to pin 4. Used to dissipate heat from the package during operation. Must be

electrically connected to pin 4 external to the package.

3 www.national.com

LMZ14203

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN, RON to GND -0.3V to 43.5V

EN, FB, SS to GND -0.3V to 7V

Junction Temperature 150°C

Storage Temperature Range -65°C to 150°C

ESD Susceptibility(Note 2) ± 2 kV

For soldering specifications:

see product folder at www.national.com and

www.national.com/ms/MS/MS-SOLDERING.pdf

Operating Ratings (Note 1)

VIN 6V to 42V

EN 0V to 6.5V

Operation Junction Temperature −40°C to 125°C

Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the

junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design or statistical

correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.

Unless otherwise stated the following conditions apply: VIN = 24V, Vout = 3.3V

Symbol Parameter Conditions Min

(Note 3)

Typ

(Note 4)

Max

(Note 3)Units

SYSTEM PARAMETERS

Enable Control

VEN EN threshold trip point VEN rising 1.1 1.18 1.25 V

VEN-HYS EN threshold hysteresis VEN falling 90 mV

Soft-Start

ISS SS source current VSS = 0V 5811 µA

ISS-DIS SS discharge current -200 µA

Current Limit

ICL Current limit threshold d.c. average

VIN= 12V to 24V

3.2 4.2 5.25 A

ON/OFF Timer

tON-MIN ON timer minimum pulse width 150 ns

tOFF OFF timer pulse width 260 ns

Regulation and Over-Voltage Comparator

VFB In-regulation feedback voltage VSS >+ 0.8V

TJ = -40°C to 125°C

IO = 3A

0.784 0.804 0.825 V

VSS >+ 0.8V

TJ = 25°C

IO = 10 mA

0.786 0.802 0.818 V

VFB-OV Feedback over-voltage

protection threshold

0.92 V

IFB Feedback input bias current 5 nA

IQNon Switching Input Current VFB= 0.86V 1 mA

ISD Shut Down Quiescent Current VEN= 0V 25 μA

Thermal Characteristics

TSD Thermal Shutdown Rising 165 °C

TSD-HYST Thermal shutdown hysteresis Falling 15 °C

θJA Junction to Ambient 4 layer JEDEC Printed Circuit Board,

100 vias, No air flow

19.3 °C/W

2 layer JEDEC Printed Circuit Board, No

air flow

21.5 °C/W

θJC Junction to Case No air flow 1.9 °C/W

PERFORMANCE PARAMETERS

ΔVOOutput Voltage Ripple 8 mV PP

ΔVO/ΔVIN Line Regulation VIN = 12V to 42V, IO= 3A .01 %

ΔVO/IOUT Load Regulation VIN = 24V 1.5 mV/A

www.national.com 4

LMZ14203

Symbol Parameter Conditions Min

(Note 3)

Typ

(Note 4)

Max

(Note 3)Units

ηEfficiency VIN = 24V VO = 3.3V IO = 1A 92 %

ηEfficiency VIN = 24V VO = 3.3V IO = 3A 85 %

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the

device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.

Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical

Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).

Note 4: Typical numbers are at 25°C and represent the most likely parametric norm.

Note 5: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test.

Note 6: Theta JA measured on a 1.705” x 3.0” four layer board, with one ounce copper, thirty five 12 mil thermal vias, no air flow, and 1W power dissipation.

Refer to PCB layout diagrams

Typical Performance Characteristics

Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tam-

bient = 25 C for efficiency curves and waveforms.

Efficiency 6V Input @ 25°C

30107031

Dissipation 6V Input @ 25°C

30107032

Efficiency 12V Input @ 25°C

30107003

Dissipation 12V Input @ 25°C

30107004

5 www.national.com

LMZ14203

Efficiency 24V Input @ 25°C

30107026

Dissipation 24V Input @ 25°C

30107027

Efficiency 36V Input @ 25°C

30107029

Dissipation 36V Input @ 25°C

30107030

Efficiency 6V Input @ 85°C

30107033

Dissipation 6V Input @ 85°C

30107034

www.national.com 6

LMZ14203

Efficiency 8V Input 85°C

30107040

Dissipation 8V Input 85°C

30107041

Efficiency 12V Input@ 85°C

30107042

Dissipation 12V Input @ 85°C

30107043

Efficiency 24V Input @ 85°C

30107044

Dissipation 24V Input @ 85°C

30107045

7 www.national.com

LMZ14203

Efficiency 36V Input @ 85°C

30107046

Dissipation 36V Input @ 85°C

30107047

Line and Load Regulation @ 25°C

30107048

Output Ripple

24VIN 3.3VO 3A, BW = 200 MHz

30107005

Transient Response

24VIN 3.3VO 0.6A to 3A Step

30107006

Thermal Derating VOUT = 3.3V

30107051

www.national.com 8

LMZ14203

Application Block Diagram

30107008

COT Control Circuit Overview

Constant On Time control is based on a comparator and an

on-time one shot, with the output voltage feedback compared

with an internal 0.8V reference. If the feedback voltage is be-

low the reference, the main MOSFET is turned on for a fixed

on-time determined by a programming resistor RON. RON is

connected to VIN such that on-time is reduced with increasing

input supply voltage. Following this on-time, the main MOS-

FET remains off for a minimum of 260 ns. If the voltage on the

feedback pin falls below the reference level again the on-time

cycle is repeated. Regulation is achieved in this manner.

Design Steps for the LMZ14203

Application

The LMZ14203 is fully supported by Webench® and offers

the following: Component selection, electrical and thermal

simulations as well as the build-it board for a reduction in de-

sign time. The following list of steps can be used to manually

design the LMZ14203 application.

• Select minimum operating VIN with enable divider resistors

• Program VO with divider resistor selection

• Program turn-on time with soft-start capacitor selection

• Select CO

• Select CIN

• Set operating frequency with RON

• Determine module dissipation

• Layout PCB for required thermal performance

ENABLE DIVIDER, RENT AND RENB SELECTION

The enable input provides a precise 1.18V band-gap rising

threshold to allow direct logic drive or connection to a voltage

divider from a higher enable voltage such as VIN. The enable

input also incorporates 90 mV (typ) of hysteresis resulting in

a falling threshold of 1.09V. The maximum recommended

voltage into the EN pin is 6.5V. For applications where the

midpoint of the enable divider exceeds 6.5V, a small zener

can be added to limit this voltage.

The function of this resistive divider is to allow the designer to

choose an input voltage below which the circuit will be dis-

abled. This implements the feature of programmable under

voltage lockout. This is often used in battery powered systems

to prevent deep discharge of the system battery. It is also

useful in system designs for sequencing of output rails or to

prevent early turn-on of the supply as the main input voltage

rail rises at power-up. Applying the enable divider to the main

input rail is often done in the case of higher input voltage sys-

tems such as 24V AC/DC systems where a lower boundary

of operation should be established. In the case of sequencing

supplies, the divider is connected to a rail that becomes active

earlier in the power-up cycle than the LMZ14203 output rail.

The two resistors should be chosen based on the following

ratio:

RENT / RENB = (VIN UVLO/ 1.18V) – 1 (1)

The LMZ14203 demonstration and evaluation boards use

11.8kΩ for RENB and 68.1kΩ for RENT resulting in a rising UV-

LO of 8V. This divider presents 6.25V to the EN input when

the divider input is raised to 42V.

The EN pin is internally pulled up to VIN and can be left float-

ing for always-on operation.

OUTPUT VOLTAGE SELECTION

Output voltage is determined by a divider of two resistors

connected between VO and ground. The midpoint of the di-

vider is connected to the FB input. The voltage at FB is

compared to a 0.8V internal reference. In normal operation

an on-time cycle is initiated when the voltage on the FB pin

falls below 0.8V. The main MOSFET on-time cycle causes the

output voltage to rise and the voltage at the FB to exceed

0.8V. As long as the voltage at FB is above 0.8V, on-time

cycles will not occur.

The regulated output voltage determined by the external di-

vider resistors RFBT and RFBB is:

VO = 0.8V * (1 + RFBT / RFBB) (2)

Rearranging terms; the ratio of the feedback resistors for a

desired output voltage is:

RFBT / RFBB = (VO / 0.8V) - 1 (3)

9 www.national.com

LMZ14203

These resistors should be chosen from values in the range of

1.0 kohm to 10.0 kohm.

For VO = 0.8V the FB pin can be connected to the output di-

rectly so long as an output preload resistor remains that draws

more than 20uA. Converter operation requires this minimum

load to create a small inductor ripple current and maintain

proper regulation when no load is present.

A feed-forward capacitor is placed in parallel with RFBT to im-

prove load step transient response. Its value is usually deter-

mined experimentally by load stepping between DCM and

CCM conduction modes and adjusting for best transient re-

sponse and minimum output ripple.

A table of values for RFBT , RFBB , CFF and RON is included in

the applications schematic.

SOFT-START CAPACITOR SELECTION

Programmable soft-start permits the regulator to slowly ramp

to its steady state operating point after being enabled, thereby

reducing current inrush from the input supply and slowing the

output voltage rise-time to prevent overshoot.

Upon turn-on, after all UVLO conditions have been passed,

an internal 8uA current source begins charging the external

soft-start capacitor. The soft-start time duration to reach

steady state operation is given by the formula:

tSS = VREF * CSS / Iss = 0.8V * CSS / 8uA (4)

This equation can be rearranged as follows:

CSS = tSS * 8 μA / 0.8V (5)

Use of a 0.022μF capacitor results in 2.2 msec soft-start du-

ration. This is recommended as a minimum value.

As the soft-start input exceeds 0.8V the output of the power

stage will be in regulation. The soft-start capacitor continues

charging until it reaches approximately 3.8V on the SS pin.

Voltage levels between 0.8V and 3.8V have no effect on other

circuit operation. Note that the following conditions will reset

the soft-start capacitor by discharging the SS input to ground

with an internal 200 μA current sink.

• The enable input being “pulled low”

• Thermal shutdown condition

• Over-current fault

• Internal Vcc UVLO (Approx 4V input to VIN)

CO SELECTION

None of the required CO output capacitance is contained with-

in the module. At a minimum, the output capacitor must meet

the worst case minimum ripple current rating of 0.5 * ILR P-P,

as calculated in equation (19) below. Beyond that, additional

capacitance will reduce output ripple so long as the ESR is

low enough to permit it. A minimum value of 10 μF is generally

required. Experimentation will be required if attempting to op-

erate with a minimum value. Ceramic capacitors or other low

ESR types are recommended. See AN-2024 for more detail.

The following equation provides a good first pass approxima-

tion of CO for load transient requirements:

CO≥ISTEP*VFB*L*VIN/ (4*VO*(VIN—VO)*VOUT-TRAN)(6)

Solving:

CO≥ 3A*0.8V*6.8μH*24V / (4*3.3V*( 24V — 3.3V)*33mV)

≥ 43μF (7)

The LMZ14203 demonstration and evaluation boards are

populated with a 100 uF 6.3V X5R output capacitor. Locations

for extra output capacitors are provided.

CIN SELECTION

The LMZ14203 module contains an internal 0.47 µF input ce-

ramic capacitor. Additional input capacitance is required ex-

ternal to the module to handle the input ripple current of the

application. This input capacitance should be located in very

close proximity to the module. Input capacitor selection is

generally directed to satisfy the input ripple current require-

ments rather than by capacitance value. Worst case input

ripple current rating is dictated by the equation:

I(CIN(RMS)) ≊ 1 /2 * IO * √ (D / 1-D) (8)

where D ≊ VO / VIN

(As a point of reference, the worst case ripple current will oc-

cur when the module is presented with full load current and

when VIN = 2 * VO).

Recommended minimum input capacitance is 10uF X7R ce-

ramic with a voltage rating at least 25% higher than the

maximum applied input voltage for the application. It is also

recommended that attention be paid to the voltage and tem-

perature deratings of the capacitor selected. It should be

noted that ripple current rating of ceramic capacitors may be

missing from the capacitor data sheet and you may have to

contact the capacitor manufacturer for this rating.

If the system design requires a certain minimum value of input

ripple voltage ΔVIN be maintained then the following equation

may be used.

CIN ≥ IO * D * (1–D) / fSW-CCM * ΔVIN(9)

If ΔVIN is 1% of VIN for a 24V input to 3.3V output application

this equals 240 mV and fSW = 400 kHz.

CIN≥ 3A * 3.3V/24V * (1– 3.3V/24V) / (400000 * 0.240 V)

≥ 3.7μF

Additional bulk capacitance with higher ESR may be required

to damp any resonant effects of the input capacitance and

parasitic inductance of the incoming supply lines.

RON RESISTOR SELECTION

Many designs will begin with a desired switching frequency in

mind. For that purpose the following equation can be used.

fSW(CCM) ≊ VO / (1.3 * 10-10 * RON) (10)

This can be rearranged as

RON ≊ VO / (1.3 * 10 -10 * fSW(CCM) (11)

The selection of RON and fSW(CCM) must be confined by limi-

tations in the on-time and off-time for the COT control section.

The on-time of the LMZ14203 timer is determined by the re-

sistor RON and the input voltage VIN. It is calculated as follows:

tON = (1.3 * 10-10 * RON) / VIN (12)

The inverse relationship of tON and VIN gives a nearly constant

switching frequency as VIN is varied. RON should be selected

such that the on-time at maximum VIN is greater than 150 ns.

The on-timer has a limiter to ensure a minimum of 150 ns for

tON. This limits the maximum operating frequency, which is

governed by the following equation:

fSW(MAX) = VO / (VIN(MAX) * 150 nsec) (13)

This equation can be used to select RON if a certain operating

frequency is desired so long as the minimum on-time of 150

ns is observed. The limit for RON can be calculated as follows:

RON ≥ VIN(MAX) * 150 nsec / (1.3 * 10 -10) (14)

If RON calculated in (11) is less than the minimum value de-

termined in (14) a lower frequency should be selected. Alter-

www.national.com 10

LMZ14203

natively, VIN(MAX) can also be limited in order to keep the

frequency unchanged.

Additionally note, the minimum off-time of 260 ns limits the

maximum duty ratio. Larger RON (lower FSW) should be se-

lected in any application requiring large duty ratio.

Discontinuous Conduction and Continuous Conduction

Modes

At light load the regulator will operate in discontinuous con-

duction mode (DCM). With load currents above the critical

conduction point, it will operate in continuous conduction

mode (CCM). When operating in DCM the switching cycle

begins at zero amps inductor current; increases up to a peak

value, and then recedes back to zero before the end of the

off-time. Note that during the period of time that inductor cur-

rent is zero, all load current is supplied by the output capacitor.

The next on-time period starts when the voltage on the at the

FB pin falls below the internal reference. The switching fre-

quency is lower in DCM and varies more with load current as

compared to CCM. Conversion efficiency in DCM is main-

tained since conduction and switching losses are reduced

with the smaller load and lower switching frequency. Operat-

ing frequency in DCM can be calculated as follows:

fSW(DCM)≊VO*(VIN-1)*6.8μH*1.18*1020*IO/(VIN–VO)*RON2 (15)

In CCM, current flows through the inductor through the entire

switching cycle and never falls to zero during the off-time. The

switching frequency remains relatively constant with load cur-

rent and line voltage variations. The CCM operating frequen-

cy can be calculated using equation 7 above.

Following is a comparison pair of waveforms of the showing

both CCM (upper) and DCM operating modes.

CCM and DCM Operating Modes

VIN = 24V, VO = 3.3V, IO = 3A/0.4A 2 μsec/div

30107012

The approximate formula for determining the DCM/CCM

boundary is as follows:

IDCB≊VO*(VIN–VO)/(2*6.8 μH*fSW(CCM)*VIN) (16)

Following is a typical waveform showing the boundary condi-

tion.

Transition Mode Operation

VIN = 24V, VO = 3.3V, IO = 0.5 A 2 μsec/div

30107014

The inductor internal to the module is 6.8 μH. This value was

chosen as a good balance between low and high input voltage

applications. The main parameter affected by the inductor is

the amplitude of the inductor ripple current (ILR). ILR can be

calculated with:

ILR P-P=VO*(VIN- VO)/(6.8µH*fSW*VIN) (17)

Where VIN is the maximum input voltage and fSW is deter-

mined from equation 10.

If the output current IO is determined by assuming that IO =

IL, the higher and lower peak of ILR can be determined. Be

aware that the lower peak of ILR must be positive if CCM op-

eration is required.

POWER DISSIPATION AND BOARD THERMAL

REQUIREMENTS

For the design case of VIN = 24V, VO = 3.3V, IO = 3A, TAMB

(MAX) = 85°C , and TJUNCTION = 125°C, the device must see a

thermal resistance from case to ambient of:

θCA< (TJ-MAX — TAMB(MAX)) / PIC-LOSS - θJC (18)

Given the typical thermal resistance from junction to case to

be 1.9 °C/W. Use the 85°C power dissipation curves in the

Typical Performance Characteristics section to estimate the

PIC-LOSS for the application being designed. In this application

it is 2.25W.

θCA <(125 — 85) / 2.25W — 1.9 = 15.8

To reach θCA = 15.8, the PCB is required to dissipate heat

effectively. With no airflow and no external heat, a good esti-

mate of the required board area covered by 1 oz. copper on

both the top and bottom metal layers is:

Board Area_cm2 > 500°C x cm2/W / θCA (19)

As a result, approximately 31.5 square cm of 1 oz copper on

top and bottom layers is required for the PCB design. The

PCB copper heat sink must be connected to the exposed pad.

Approximately thirty six, 10mils (254 μm) thermal vias spaced

59mils (1.5 mm) apart must connect the top copper to the

bottom copper. For an example of a high thermal performance

PCB layout, refer to the Evaluation Board application note

AN-2024.

PC BOARD LAYOUT GUIDELINES

PC board layout is an important part of DC-DC converter de-

sign. Poor board layout can disrupt the performance of a DC-

DC converter and surrounding circuitry by contributing to EMI,

ground bounce and resistive voltage drop in the traces. These

can send erroneous signals to the DC-DC converter resulting

11 www.national.com

LMZ14203

in poor regulation or instability. Good layout can be imple-

mented by following a few simple design rules.

30107011

1. Minimize area of switched current loops.

From an EMI reduction standpoint, it is imperative to minimize

the high di/dt paths during PC board layout. The high current

loops that do not overlap have high di/dt content that will

cause observable high frequency noise on the output pin if

the input capacitor (Cin1) is placed at a distance away from

the LMZ14203. Therefore place CIN1 as close as possible to

the LMZ14203 VIN and GND exposed pad. This will minimize

the high di/dt area and reduce radiated EMI. Additionally,

grounding for both the input and output capacitor should con-

sist of a localized top side plane that connects to the GND

exposed pad (EP).

2. Have a single point ground.

The ground connections for the feedback, soft-start, and en-

able components should be routed to the GND pin of the

device. This prevents any switched or load currents from

flowing in the analog ground traces. If not properly handled,

poor grounding can result in degraded load regulation or er-

ratic output voltage ripple behavior. Provide the single point

ground connection from pin 4 to EP.

3. Minimize trace length to the FB pin.

Both feedback resistors, RFBT and RFBB, and the feed forward

capacitor CFF, should be located close to the FB pin. Since

the FB node is high impedance, maintain the copper area as

small as possible. The trace are from RFBT, RFBB, and CFF

should be routed away from the body of the LMZ14203 to

minimize noise.

4. Make input and output bus connections as wide as

possible.

This reduces any voltage drops on the input or output of the

converter and maximizes efficiency. To optimize voltage ac-

curacy at the load, ensure that a separate feedback voltage

sense trace is made to the load. Doing so will correct for volt-

age drops and provide optimum output accuracy.

5. Provide adequate device heat-sinking.

Use an array of heat-sinking vias to connect the exposed pad

to the ground plane on the bottom PCB layer. If the PCB has

a plurality of copper layers, these thermal vias can also be

employed to make connection to inner layer heat-spreading

ground planes. For best results use a 6 x 6 via array with

minimum via diameter of 10mils (254 μm) thermal vias spaced

59mils (1.5 mm). Ensure enough copper area is used for heat-

sinking to keep the junction temperature below 125°C.

Additional Features

OUTPUT OVER-VOLTAGE COMPARATOR

The voltage at FB is compared to a 0.92V internal reference.

If FB rises above 0.92V the on-time is immediately terminat-

ed. This condition is known as over-voltage protection (OVP).

It can occur if the input voltage is increased very suddenly or

if the output load is decreased very suddenly. Once OVP is

activated, the top MOSFET on-times will be inhibited until the

condition clears. Additionally, the synchronous MOSFET will

remain on until inductor current falls to zero.

CURRENT LIMIT

Current limit detection is carried out during the off-time by

monitoring the current in the synchronous MOSFET. Refer-

ring to the Functional Block Diagram, when the top MOSFET

is turned off, the inductor current flows through the load, the

PGND pin and the internal synchronous MOSFET. If this cur-

rent exceeds 4.2A (typical) the current limit comparator dis-

ables the start of the next on-time period. The next switching

cycle will occur only if the FB input is less than 0.8V and the

inductor current has decreased below 4.2A. Inductor current

is monitored during the period of time the synchronous MOS-

FET is conducting. So long as inductor current exceeds 4.2A,

further on-time intervals for the top MOSFET will not occur.

Switching frequency is lower during current limit due to the

longer off-time. It should also be noted that current limit is

dependent on both duty cycle and temperature.

THERMAL PROTECTION

The junction temperature of the LMZ14203 should not be al-

lowed to exceed its maximum ratings. Thermal protection is

implemented by an internal Thermal Shutdown circuit which

activates at 165 °C (typ) causing the device to enter a low

power standby state. In this state the main MOSFET remains

off causing VO to fall, and additionally the CSS capacitor is

discharged to ground. Thermal protection helps prevent

catastrophic failures for accidental device overheating. When

the junction temperature falls back below 145 °C (typ Hyst =

20 °C) the SS pin is released, VO rises smoothly, and normal

operation resumes.

Applications requiring maximum output current especially

those at high input voltage may require application derating

at elevated temperatures.

ZERO COIL CURRENT DETECTION

The current of the lower (synchronous) MOSFET is monitored

by a zero coil current detection circuit which inhibits the syn-

chronous MOSFET when its current reaches zero until the

next on-time. This circuit enables the DCM operating mode,

which improves efficiency at light loads.

www.national.com 12

LMZ14203

PRE-BIASED STARTUP

The LMZ14203 will properly start up into a pre-biased output.

This startup situation is common in multiple rail logic applica-

tions where current paths may exist between different power

rails during the startup sequence. The following scope cap-

ture shows proper behavior during this event.

Pre-Biased Startup

30107025

13 www.national.com

LMZ14203

Evaluation Board Schematic Diagram

30107007

Ref Des Description Case Size Case Size Manufacturer P/N

U1 SIMPLE SWITCHER ® TO-PMOD-7 National Semiconductor LMZ14203TZ

Cin1 1 µF, 50V, X7R 1206 Taiyo Yuden UMK316B7105KL-T

Cin2 10 µF, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T

CO1 1 µF, 50V, X7R 1206 Taiyo Yuden 'UMK316B7105KL-T

CO2 100 µF, 6.3V, X7R 1210 Taiyo Yuden JMK325BJ107MM-T

RFBT 3.32 kΩ0603 Vishay Dale CRCW06033K32FKEA

RFBB 1.07 kΩ0603 Vishay Dale CRCW06031K07FKEA

RON 61.9 kΩ0603 Vishay Dale CRCW060361k9FKEA

RENT 68.1 kΩ0603 Vishay Dale CRCW060368k1FKEA

RENB 11.8 kΩ0603 Vishay Dale CRCW060311k8FKEA

CFF 22 nF, ±10%, X7R, 16V 0603 TDK C1608X7R1H223K

CSS 22 nF, ±10%, X7R, 16V 0603 TDK C1608X7R1H223K

www.national.com 14

LMZ14203

30107016

30107017

15 www.national.com

LMZ14203

Physical Dimensions inches (millimeters) unless otherwise noted

7-Lead TZA Package

NS Package Number TZA07A

www.national.com 16

LMZ14203

Notes

17 www.national.com

LMZ14203

Notes

LMZ14203 3A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage

For more National Semiconductor product information and proven design tools, visit the following Web sites at:

www.national.com

Products Design Support

Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench

Audio www.national.com/audio App Notes www.national.com/appnotes

Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns

Data Converters www.national.com/adc Samples www.national.com/samples

Interface www.national.com/interface Eval Boards www.national.com/evalboards

LVDS www.national.com/lvds Packaging www.national.com/packaging

Power Management www.national.com/power Green Compliance www.national.com/quality/green

Switching Regulators www.national.com/switchers Distributors www.national.com/contacts

LDOs www.national.com/ldo Quality and Reliability www.national.com/quality

LED Lighting www.national.com/led Feedback/Support www.national.com/feedback

Voltage References www.national.com/vref Design Made Easy www.national.com/easy

PowerWise® Solutions www.national.com/powerwise Applications & Markets www.national.com/solutions

Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero

Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic

PLL/VCO www.national.com/wireless PowerWise® Design

University

www.national.com/training

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Technical

Support Center

Email: support@nsc.com

Tel: 1-800-272-9959

National Semiconductor Europe

Technical Support Center

Email: europe.support@nsc.com

National Semiconductor Asia

Pacific Technical Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Technical Support Center

Email: jpn.feedback@nsc.com

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265