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FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1A
1Y
1Z
G
2Z
2Y
2A
GND
VCC
4A
4Y
4Z
G
3Z
3Y
3A
D OR NS PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
•Switching Rates up to 32 MHz•Operate From a Single 3.3-V Supply•Propagation Delay Time . . . 8 ns Typ•Pulse Skew Time . . . 500 ps Typ•High Output-Drive Current . . . ±30 mA•Controlled Rise and Fall Times . . . 3 ns Typ•Differential Output Voltage With 100- ΩLoad . . . 1.5 V Typ•Ultra-Low Power Dissipation– dc, 0.3 mW Max– 32 MHz All Channels (No Load), 385 mW Typ•Accept 5-V Logic Inputs With 3.3-V Supply•Low-Voltage Pin-to-Pin CompatibleReplacement for AM26C31, AM26LS31, MB571•High Output Impedance in Power-OffCondition
•Driver Output Short-Protection Circuit•Package Options Include PlasticSmall-Outline (D, NS) Packages
The AM26LV31C and AM26LV31I are BiCMOS quadruple differential line drivers with 3-state outputs. They aredesigned to be similar to TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply-voltagerange.
The devices are optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have veryhigh current capability for driving balanced lines such as twisted-pair transmission lines and provide a highimpedance in the power-off condition. The enable function is common to all four drivers and offers the choice ofactive-high or active-low enable inputs. The AM26LV31C and AM26LV31I are designed using Texas Instrumentsproprietary LinIMPACT-C60™ technology, facilitating ultra-low power consumption without sacrificing speed.These devices offer optimum performance when used with the AM26LV32 quadruple line receivers.
The AM26LV31C is characterized for operation from 0 °C to 70 °C. The AM26LV31I is characterized for operationfrom –45 °C to 85 °C
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
AM26LV31CDSOIC – D Tape and reel AM26LV31CAM26LV31CDR0°C to 70 °C
AM26LV31CNSSOIC – NS Tape and reel 26LV31AM26LV31CNSR
AM26LV31IDSOIC – D Tape and reel AM26LV31IAM26LV31IDR–45 °C to 85 °C
AM26LV31INSSOIC – NS Tape and reel 26LV31IAM26LV31INSR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.LinIMPACT-C60 is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1995–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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4Z
4Y
3Z
3Y
2Z
2Y
1Z
1Y
13
14
11
10
5
6
3
2
4A
3A
2A
1A
G
G
15
9
7
1
12
4
Input
VCC
TYPICAL OF ALL OUTPUTS (Y AND Z)
Output
VCC
GND GND
EQUIVALENT OF EACH INPUT (A, G, OR G)
100 Ω40 kΩ6 Ω
All resistor values are nominal.
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
FUNCTION TABLE
(1)
ENABLES OUTPUTSINPUT
A
G G Y Z
H H X H LL H X L HH X L H LL X L L HX L H Z Z
(1) H = high level, L = low level, X = irrelevant,Z = high impedance (off)
LOGIC DIAGRAM (POSITIVE LOGIC)
SCHEMATIC (EACH DRIVER)
2
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
Electrical Characteristics
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
–0.3 6 VV
I
Input voltage range –0.3 6 VV
O
Output voltage range –0.3 6 VD package 73θ
JA
Package thermal impedance
(3)
°C/WNS package 64Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to GND.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN NOM MAX UNIT
V
CC
Supply voltage 3 3.3 3.6 VV
IH
High-level input voltage 2 VV
IL
Low-level input voltage 0.8 VI
OH
High-level output current –30 mAI
OL
Low-level output current 30 mAAM26LV31C 0 70T
A
Operating free-air temperature °CAM26LV31I –45 85
over recommended operating supply-voltage and free-air temperature ranges (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
IK
Input clamp voltage I
I
= 18 mA –1.5 VV
OH
High-level output voltage V
IH
= 2 V, I
OH
= –12 mA 1.85 2.3 VV
OL
Low-level output voltage V
IL
= 0.8 V, I
OH
= 12 mA 0.8 1.05 V|V
OD
| Differential output voltage
(2)
0.95 1.5 VV
OC
Common-mode output voltage 1.3 1.55 1.8 VR
L
= 100 ΩChange in magnitude of∆|V
OC
|±0.2 Vcommon-mode output voltage
(2)
I
O
Output current with power off V
O
= –0.25 V or 6 V, V
CC
= 0 ±100 µAOff-state (high-impedance state)I
OZ
V
O
= –0.25 V or 6 V, G = 0.8 V or G = 2 V ±100 µAoutput currentI
H
High-level input current V
CC
= 0 or 3 V, V
I
= 5.5 V 10 µAI
L
Low-level input current V
CC
= 3.6 V, V
I
= 0 –10 µAI
OS
Short-circuit output current V
CC
= 3.6 V, V
O
= 0 –200 mAI
CC
Supply current (all drivers) V
I
= V
CC
or GND, No load 100 µAPower-dissipation capacitanceC
pd
No load 160 pF(all drivers)
(3)
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25°C.(2) ∆|V
OD
| and ∆|V
OC
| are the changes in magnitude of V
OD
and V
OC
, respectively, that occur when the input is changed from a high level toa low level.(3) C
pd
determines the no-load dynamic current consumption. I
S
= C
pd
×V
CC
×f + I
CC
3
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SR 90%VOH VOL10%VOH VOL
tr, the differential slew rate of VOD is 2 SR.
Switching Characteristics
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
V
CC
= 3.3 V, T
A
= 25 °C
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
t
PLH
Propagation delay time, low- to high-level output See Figure 2 4 8 12 nst
PHL
Propagation delay time, high- to low-level output 4 8 12 nst
t
Transition time (t
r
or t
f
) 3 nsSR Slew rate, single-ended output voltage See Note
(2)
and Figure 2 0.3 1 V/nst
PZH
Output-enable time to high level See Figure 3 10 20 nst
PZL
Output-enable time to low level See Figure 4 10 20 nst
PHZ
Output-disable time from high level See Figure 3 10 20 nst
PLZ
Output-disable time from low level See Figure 4 10 20 nst
sk(p)
Pulse skew f = 32 MHz, See Note
(3)
0.5 1.5 nst
sk(o)
Skew limit f = 32 MHz 1.5 nst
sk(lim)
Skew limit (device to device) f = 32 MHz, See Note
(4)
3 ns
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25°C.(2) Slew rate is defined by:
(3) Pulse skew is defined as the |t
PLH
- t
PHL
| of each channel of the same device.(4) Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices.
4
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PARAMETER MEASUREMENT INFORMATION
RL/2
VOC
RL/2
VOD2
G
G
A
Y
Z
TEST CIRCUIT
Generator
(see Note B) 50 Ω
VCC
RL = 100 ΩCL = 15 pF
(see Note A) VOD
G
G
AY
ZVO
VO
Z
Output, VO
Input
tPLH tPHL
VCC
0 V
50% 50%
PROPAGATION DELAY TIMES
Y
A
Output, VO
trtf
VOH
90% 90%
RISE AND FALL TIMES
10%10% VOL
NOTES: A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: PRR = 32 MHz, ZO ≈ 50 Ω, 50% duty cycle,
tr and tf ≤ 2 ns.
10% 10%
90% 90%
Y
Ztftr
VOL
VOH
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
Figure 1. Differential and Common-Mode Output Voltages
Figure 2. Test Circuit and Voltage Waveforms, t
PHL
and t
PLH
5
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PARAMETER MEASUREMENT INFORMATION
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
Figure 3. Test Circuit and Voltage Waveforms, t
PZH
and t
PHZ
6
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PARAMETER MEASUREMENT INFORMATION
AM26LV31C, AM26LV31ILOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
SLLS201G – MAY 1995 – REVISED MAY 2005
Figure 4. Test Circuit and Voltage Waveforms, t
PZL
and t
PLZ
7
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
AM26LV31CD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CNSLE OBSOLETE SO NS 16 TBD Call TI Call TI
AM26LV31CNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31ID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31IDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31IDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31IDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31INSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31INSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LV31INSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
AM26LV31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LV31CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
AM26LV31IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LV31INSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26LV31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26LV31CNSR SO NS 16 2000 367.0 367.0 38.0
AM26LV31IDR SOIC D 16 2500 333.2 345.9 28.6
AM26LV31INSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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