LM2940S-5.0/NOPB - NATIONAL SEMICONDUCTOR

VIN

Unregulated Input VOUT

Regulated Output

C1*

0.47 µF COUT**

22 µF

LM2940

IN OUT

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LM2940x 1-A Low Dropout Regulator

1 Features 3 Description

The LM2940-N and LM2940C positive voltage

1• Input Voltage Range = 6 V to 26 V regulators feature the ability to source 1 A of output

• Dropout Voltage Typically 0.5 V at IOUT =1A current with a dropout voltage of typically 0.5 V and a

• Output Current in Excess of 1 A maximum of 1 V over the entire temperature range.

Furthermore, a quiescent current reduction circuit has

• Output Voltage Trimmed Before Assembly been included which reduces the ground current

• Reverse Battery Protection when the differential between the input voltage and

• Internal Short Circuit Current Limit the output voltage exceeds approximately 3 V. The

quiescent current with 1 A of output current and an

• Mirror Image Insertion Protection input-output differential of 5 V is therefore only 30

• P+Product Enhancement Tested mA. Higher quiescent currents only exist when the

regulator is in the dropout mode (VIN −VOUT ≤3 V).

2 Applications Designed also for vehicular applications, the LM2940-

• Post Regulator for Switching Supplies N and LM2940C and all regulated circuitry are

• Logic Power Supplies protected from reverse battery installations or 2-

• Industrial Instrumentation battery jumps. During line transients, such as load

dump when the input voltage can momentarily

space exceed the specified maximum operating voltage, the

space regulator will automatically shut down to protect both

space the internal circuits and the load. The LM2940-N and

LM2940C cannot be harmed by temporary mirror-

image insertion. Familiar regulator features such as

short circuit and thermal overload protection are also

provided.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

SOT-223 (4) 6.50 mm x 3.50 mm

WSON (8) 4.00 mm x 4.00 mm

LM2940-N TO-263 (3) 10.18 mm x 8.41 mm

TO-220 (3) 14.986 mm x 10.16 mm

TO-263 (3) 10.18 mm x 8.41 mm

LM2940C TO-220 (3) 14.986 mm x 10.16 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

Simplified Schematic

*Required if regulator is located far from power supply filter.

**COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during

transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating

temperature range as the regulator and the ESR is critical; see curve.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM2940-N

LM2940C

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Table of Contents

7.3 Feature Description................................................. 13

1 Features.................................................................. 17.4 Device Functional Modes........................................ 14

2 Applications ........................................................... 18 Application and Implementation ........................ 15

3 Description............................................................. 18.1 Application Information............................................ 15

4 Revision History..................................................... 28.2 Typical Application.................................................. 15

5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 17

6 Specifications......................................................... 410 Layout................................................................... 17

6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 17

6.2 ESD Ratings.............................................................. 410.2 Layout Examples................................................... 17

6.3 Recommended Operating Conditions....................... 410.3 Heatsinking ........................................................... 18

6.4 Thermal Information.................................................. 511 Device and Documentation Support................. 20

6.5 Electrical Characteristics (5 V and 8 V).................... 511.1 Documentation Support ........................................ 20

6.6 Electrical Characteristics (9 V and 10 V).................. 611.2 Related Links ........................................................ 20

6.7 Electrical Characteristics (12 V and 15 V)................ 711.3 Trademarks........................................................... 20

6.8 Typical Characteristics.............................................. 811.4 Electrostatic Discharge Caution............................ 20

7 Detailed Description............................................ 13 11.5 Glossary................................................................ 20

7.1 Overview................................................................. 13 12 Mechanical, Packaging, and Orderable

7.2 Functional Block Diagram....................................... 13 Information ........................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (April 2013) to Revision J Page

• Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional

Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

• Deleted information re: obsolete CDIP and CLGA package options ; Change pin names from Vin, Vout to IN, OUT;

delete Heatsinking sections re: packages apart from TO-220 ............................................................................................... 1

• Changed symbols for Thermal Information ......................................................................................................................... 19

Changes from Revision H (April 2013) to Revision I Page

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N/C

GND

N/C

OUT

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5 Pin Configuration and Functions

DDPAK/TO-263 (KTT) Package DDPAK/TO-263 ( KTT) Package

3 Pins Side View

Top View

WSON (NGN) Package

8 Pins

Top View

TO-220 (NDE) Package

4 Pins

Front View

SOT-223 (DCY) Package

3 Pins

Front View Pin 2 and pin 7 are fused to center DAP

Pin 5 and 6 need to be tied together on

PCB board

Pin Functions

PIN I/O DESCRIPTION

NAME NDE KTT DCY NGN

IN 1 1 1 3 I Unregulated input voltage.

GND 2 2 2 2 — Ground

Regulated output voltage. This pin requires an output capacitor to

OUT 3 3 3 5, 6 O maintain stability. See Detailed Design Procedure for output

capacitor details.

GND 4 4 4 7 — Ground

N/C — — — 1, 4, 8 — No connection

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6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT

LM2940-N KTT, NDE, DCY ≤100 ms 60 V

LM2940C KTT, NDE ≤1 ms 45

Internally

Internal power dissipation(3) Limited

Maximum junction temperature 150

TO-220 (NDE), Wave (10 s) 260

Soldering DDPAK/TO-263 (KTT) (30 s) 235

temperature(4) °C

SOT-223 (DCY) (30 s) 260

WSON-8 (NGN) (30 s) 235

Storage temperature, Tstg −65 150

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions

see the Electrical Characteristics (5 V and 8 V).

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal

resistance, RθJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown. The value of R θJA (for devices in still air with no heatsink) is 23.3°C/W for

the TO-220 package, 40.9°C/W for the DDPAK/TO-263 package, and 59.3°C/W for the SOT-223 package. The effective value of RθJA

can be reduced by using a heatsink (see Heatsinking for specific information on heatsinking). The value of RθJA for the WSON package

is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance

and power dissipation for the WSON package, refer to Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401). It is

recommended that 6 vias be placed under the center pad to improve thermal performance.

(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the

temperature and time are for Sn-Pb (STD) only.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Input voltage 6 26 V

LM2940-N NDE, LM2940-N KTT −40 125

LM2940C NDE, LM2940C KTT 0 125

Temperature °C

LM2940-N DCY −40 85

LM2940-N NGN −40 125

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6.4 Thermal Information LM2940-N, LM2940C LM2940-N

TO-220 DDPAK/TO-263 SOT-223 WSON

THERMAL METRIC(1) UNIT

(NDE) (KTT) (DCY) (NGN)

3 PINS 3 PINS 4 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance(2) 23.3 40.9 59.3 40.5

RθJC(top) Junction-to-case (top) thermal resistance 16.1 43.5 38.9 26.2

RθJB Junction-to-board thermal resistance 4.8 23.5 8.1 17.0 °C/W

ψJT Junction-to-top characterization parameter 2.7 10.3 1.7 0.2

ψJB Junction-to-board characterization parameter 4.8 22.5 8.0 17.2

RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 0.8 n/a 3.2

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) Thermal information for the TO-220 package is for a package vertically mounted with a heat sink in the middle of a PCB which is

compliant to the JEDEC HIGH-K 2s2p (JESD51-7). The heatsink-to-ambient thermal resistance, RƟSA, is 21.7°C/W. See Heatsinking

TO-220 Package Parts for more information.

6.5 Electrical Characteristics (5 V and 8 V)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

5 V 8 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Input voltage 5 mA ≤IOUT ≤1 A 6.25 26 9.4 26

5 mA ≤IOUT ≤1A 4.75 5 5.25 7.6 8 8.4 V

Output voltage 5 mA ≤IOUT ≤1A, TJ= 25°C 4.85 5 5.15 7.76 8 8.24

VOUT + 2 V ≤VIN ≤26 V, IOUT = 5 mA

Line regulation 20 50 20 80 mV

TJ= 25°C

50 mA ≤IOUT ≤1 A LM2940-N 35 80 55 130

Load regulation LM2940-N 35 50 55 80 mV

50 mA ≤IOUT ≤1 A

TJ= 25°C LM2940C 35 50 55 80

Output 100 mADC, 20 mArms, ƒOUT = 120 Hz 35 55 mΩ

impedance VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 20 10 20

IOUT = 5 mA

VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 15 10 15

IOUT = 5 mA

Quiescent current LM2940C 10 15 mA

TJ= 25°C

VIN = VOUT + 5 V, IOUT = 1 A 30 60 30 60

VIN = VOUT + 5 V, IOUT = 1 A 30 45 30 45

TJ= 25°C

Output noise 10 Hz to 100 kHz, IOUT = 5 mA 150 240 µVrms

voltage ƒOUT = 120 Hz, 1 Vrms, IOUT = LM2940-N 54 72 48 66

100 mA

Ripple rejection dB

ƒOUT = 120 Hz, 1 Vrms, IOUT = LM2940-N 60 72 54 66

100 mA LM2940C 60 72 54 66

TJ= 25°C

Long-term mV/1000

20 32

stability Hr

IOUT = 1A 0.5 1 0.5 1 V

IOUT = 1A, TJ= 25°C 0.5 0.8 0.5 0.8

Dropout voltage IOUT = 100 mA 110 200 110 200 mV

IOUT = 100 mA, TJ= 25°C 110 150 110 150

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Electrical Characteristics (5 V and 8 V) (continued)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

5 V 8 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Short-circuit See(1), TJ= 25°C 1.6 1.9 1.6 1.9 A

current ROUT = 100Ω, T ≤100 ms LM2940-N 60 75 60 75

Maximum line V

ROUT = 100Ω, T ≤1 ms

transient LM2940C 45 55 45 555

TJ= 25°C

ROUT = 100 ΩLM2940-N –15 –30 –15 –30

Reverse polarity V

ROUT = 100 Ω

DC input voltage LM2940C –15 –30 –15 –30

TJ= 25°C

Reverse polarity ROUT = 100 Ω, T ≤100 ms LM2940-N –50 –75 –50 –75

Transient Input V

ROUT = 100 Ω, T ≤1 ms LM2940C –45 –55

Voltage

(1) Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.

6.6 Electrical Characteristics (9 V and 10 V)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

9 V 10 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Input voltage 5 mA ≤IOUT ≤1 A 10.5 26 11.5 26

5 mA ≤IOUT ≤1A 8.55 9 9.45 9.5 10 10.5 V

Output voltage 5 mA ≤IOUT ≤1A, TJ= 25°C 8.73 9 9.27 9.7 10 10.3

VOUT + 2 V ≤VIN ≤26 V, IOUT = 5 mA

Line regulation 20 90 20 100 mV

TJ= 25°C

50 mA ≤IOUT ≤1 A LM2940-N 60 150 65 165

Load regulation 50 mA ≤IOUT ≤1 A LM2940-N 60 90 65 100 mV

TJ= 25°C LM2940C 60 90

Output 100 mADC, 20 mArms, ƒOUT = 120 Hz 60 65 mΩ

impedance VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 20 10 20

IOUT = 5 mA

VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 15 15

IOUT = 5 mA

Quiescent current LM2940C 10 15 mA

TJ= 25°C

VIN = VOUT + 5 V, IOUT = 1 A 30 60 30 60

VIN = VOUT + 5 V, IOUT = 1 A 30 45 30 45

TJ= 25°C

Output noise 10 Hz to 100 kHz, IOUT = 5 mA 270 300 µVrms

voltage ƒOUT = 120 Hz, 1 Vrms LM2940-N 46 64 45 63

IOUT = 100 mA

Ripple rejection dB

ƒOUT = 120 Hz, 1 Vrms LM2940-N 52 64 51 63

IOUT = 100 mA LM2940C 52 64

TJ= 25°C

Long-term mV/1000

34 36

stability Hr

IOUT = 1A 0.5 1 0.5 1 V

IOUT = 1A, TJ= 25°C 0.5 0.8 0.5 0.8

Dropout voltage IOUT = 100 mA 110 200 110 200 mV

IOUT = 100 mA, TJ= 25°C 110 150 110 150

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Electrical Characteristics (9 V and 10 V) (continued)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

9 V 10 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Short-circuit See(1), TJ= 25°C 1.6 1.9 1.6 1.9 A

current ROUT = 100Ω, T ≤100 ms LM2940-N 60 75 60 75

Maximum line V

ROUT = 100Ω, T ≤100 ms

transient LM2940C 45 55

TJ= 25°C

ROUT = 100 ΩLM2940-N –15 –30 –15 –30

Reverse polarity V

ROUT = 100 Ω–15 –30

DC input voltage LM2940C

TJ= 25°C

Reverse polarity LM2940-N –50 –75 –50 –75

Transient Input ROUT = 100 Ω, T ≤100 ms V

LM2940C –45 –55

Voltage

(1) Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.

6.7 Electrical Characteristics (12 V and 15 V)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

12 V 15 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Input voltage 5 mA ≤IOUT ≤1 A 13.6 26 16.75 26

5 mA ≤IOUT ≤1A 11.40 12 12.6 14.25 15 15.75 V

Output voltage 5 mA ≤IOUT ≤1A, TJ= 25°C 11.64 12 12.36 14.55 15 15.45

VOUT + 2 V ≤VIN ≤26 V, IOUT = 5 mA

Line regulation 20 120 20 150 mV

TJ= 25°C

50 mA ≤IOUT ≤1 A LM2940-N 55 200

Load regulation 50 mA ≤IOUT ≤1 A LM2940-N 55 120 mV

TJ= 25°C LM2940C 55 120 70 150

Output 100 mADC, 20 mArms, ƒOUT = 120 Hz 80 100 mΩ

impedance VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 20

IOUT = 5 mA

VOUT + 2 V ≤VIN ≤26 V, LM2940-N 10 15

IOUT = 5 mA

Quiescent current LM2940C 10 15 10 15 mA

TJ= 25°C

VIN = VOUT + 5 V, IOUT = 1 A 30 60 30 60

VIN = VOUT + 5 V, IOUT = 1 A 30 45 30 45

TJ= 25°C

Output noise 10 Hz to 100 kHz, IOUT = 5 mA 360 450 µVrms

voltage ƒOUT = 120 Hz, 1 Vrms, IOUT = LM2940-N 48 66

100 mA

Ripple rejection dB

ƒOUT = 120 Hz, 1 Vrms, IOUT = LM2940-N 54 66

100 mA LM2940C 54 66 52 64

TJ= 25°C

Long-term mV/1000

48 60

stability Hr

IOUT = 1A 0.5 1 0.5 1 V

IOUT = 1A, TJ= 25°C 0.5 0.8 0.5 0.8

Dropout voltage IOUT = 100 mA 110 200 110 200 mV

IOUT = 100 mA, TJ= 25°C 110 150 110 150

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Electrical Characteristics (12 V and 15 V) (continued)

Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply

over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA= TJ= 25°C.

12 V 15 V

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

Short-circuit See(1), TJ= 25°C 1.6 1.9 1.6 1.9 A

current ROUT = 100Ω, T ≤100 ms LM2940-N 60 75

Maximum line V

ROUT = 100Ω, T ≤100 ms

transient LM2940C 45 55 45 55

TJ= 25°C

ROUT = 100 ΩLM2940-N –15 –30

Reverse polarity V

ROUT = 100 Ω

DC input voltage LM2940C –15 –30 –15 –30

TJ= 25°C

Reverse polarity ROUT = 100 Ω, T ≤100 ms LM2940-N –50 –75

transient input V

–45 –55 –45 –55

ROUT = 100 Ω, T ≤1 ms LM2940C

voltage

(1) Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.

6.8 Typical Characteristics

Figure 2. Dropout Voltage vs. Temperature

Figure 1. Dropout Voltage

Figure 3. Output Voltage vs. Temperature Figure 4. Quiescent Current vs. Temperature

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Typical Characteristics (continued)

Figure 5. Quiescent Current Figure 6. Quiescent Current

Figure 8. Load Transient Response

Figure 7. Line Transient Response

Figure 10. Low Voltage Behavior

Figure 9. Ripple Rejection

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Typical Characteristics (continued)

Figure 11. Low Voltage Behavior Figure 12. Low Voltage Behavior

Figure 14. Low Voltage Behavior

Figure 13. Low Voltage Behavior

Figure 16. Output at Voltage Extremes

Figure 15. Output at Voltage Extremes

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Typical Characteristics (continued)

Figure 17. Output at Voltage Extremes Figure 18. Output at Voltage Extremes

Figure 19. Output at Voltage Extremes Figure 20. Output Capacitor ESR

Figure 21. Peak Output Current Figure 22. Output Impedance

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Typical Characteristics (continued)

Figure 24. Maximum Power Dissipation (SOT-223)

Figure 23. Maximum Power Dissipation (TO-220)

Figure 25. Maximum Power Dissipation (DDPAK/TO-263)

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Shutdown

IN OUT

GND

Bandgap

Reference

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(§30 V)

PNP

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7 Detailed Description

7.1 Overview

The LM2940 positive voltage regulator features the ability to source 1 A of output current with a dropout voltage

of typically 0.5 V and a maximum of 1 V over the entire temperature range. Furthermore, a quiescent current

reduction circuit has been included which reduces the ground current when the differential between the input

voltage and the output voltage exceeds approximately 3 V. The quiescent current with 1 A of output current and

an input-output differential of 5 V is therefore only 30 mA. Higher quiescent currents only exist when the regulator

is in the dropout mode (VIN – VOUT ≤3 V).

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Short-Circuit Current Limit

The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The

LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources

constant current. Therefore, the output voltage falls when load impedance decreases. Note, also, that if a current

limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting

a thermal shutdown of the output.

7.3.2 Overvoltage Shutdown (OVSD)

Input voltage greater than typically 30 V will cause the LM2940 output to be disabled. When operating with the

input voltage greater than the maximum recommended input voltage of 26 V, the device performance is not

ensured. Continuous operation with the input voltage greater than the maximum recommended input voltage is

discouraged.

7.3.3 Thermal Shutdown (TSD)

The LM2940 contains the thermal shutdown circuitry to turn off the output when excessive heat is dissipated in

the LDO. The internal protection circuitry of the LM2940 is designed to protect against thermal overload

conditions. The TSD circuitry is not intended to replace proper heat sinking. Continuously running the device into

thermal shutdown degrades its reliability as the junction temperature will be exceeding the absolute maximum

junction temperature rating.

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7.4 Device Functional Modes

7.4.1 Operation with Enable Control

The LM2940 design does not include any undervoltage lockout (UVLO), or enable functions. Generally, the

output voltage will track the input voltage until the input voltage is greater than VOUT + 1V. When the input

voltage is greater than VOUT + 1 V, the LM2940 will be in linear operation, and the output voltage will be

regulated. However, the device will be sensitive to any small perturbation of the input voltage. Device dynamic

performance is improved when the input voltage is at least 2 V greater than the output voltage.

Product Folder Links: LM2940-N LM2940C

VIN

Unregulated Input VOUT

Regulated Output

C1*

0.47 µF COUT**

22 µF

LM2940

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM2940-N and LM2940C positive voltage regulators feature the ability to source 1 A of output current with a

dropout voltage of typically 0.5 V and a maximum of 1 V over the entire temperature range. The output capacitor,

COUT, must have a capacitance value of at least 22 µF with an ESR of at least 100 mΩ, but no more than 1 Ω.

The minimum capacitance value and the ESR requirements apply across the entire expected operating ambient

temperature range.

8.2 Typical Application

*Required if regulator is located far from power supply filter.

**COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during

transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating

temperature range as the regulator and the ESR is critical; see curve.

Figure 26. Typical Application

8.2.1 Design Requirements

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE

Input voltage range 6 V to 26 V

Output voltage range 8 V

Output current range 5 mA to 1 A

Input capacitor value 0.47 µF

Output capacitor value 22 µF minimum

Output capacitor ESR range 100 mΩto 1 Ω

8.2.2 Detailed Design Procedure

8.2.2.1 External Capacitors

The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both

equivalent series resistance (ESR) and minimum amount of capacitance.

8.2.2.1.1 Minimum Capacitance

The minimum output capacitance required to maintain stability is 22 μF (this value may be increased without

limit). Larger values of output capacitance will give improved transient response.

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8.2.2.1.2 ESR Limits

The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of

ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet these

requirements, or oscillations can result.

Figure 27. Output Capacitor ESR Limits

It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer

must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the

design.

For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to

−40°C. This type of capacitor is not well-suited for low temperature operation.

Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum

electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid

tantalum, with the total capacitance split about 75/25% with the aluminum being the larger value.

If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The flatter ESR of

the tantalum will keep the effective ESR from rising as quickly at low temperatures.

8.2.3 Application Curves

Figure 29. Output at Voltage Extremes

Figure 28. Low Voltage Behavior

Product Folder Links: LM2940-N LM2940C

VIN

Ground

VOUT

CIN COUT

1 2 3

Ground

CIN COUT

VOUT

VIN

COUT

VIN

VOUT

CIN

Ground

GND

LM2940-N

LM2940C

www.ti.com

SNVS769J –MARCH 2000–REVISED DECEMBER 2014

9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between VOUT + 1 V up to a maximum of

26 V. This input supply must be well regulated and free of spurious noise. To ensure that the LM2940 output

voltage is well regulated, the input supply should be at least VOUT + 2 V.

10 Layout

10.1 Layout Guidelines

The dynamic performance of the LM2940 is dependent on the layout of the PCB. PCB layout practices that are

adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2940. Best

performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2940, and as close as

is practical to the package. The ground connections for CIN and COUT should be back to the LM2940 ground pin

using as wide and short of a copper trace as is practical.

10.2 Layout Examples

Figure 30. LM2940 WSON Layout

Figure 31. LM2940 SOT-223 Layout

Figure 32. TO-263 Layout

Product Folder Links: LM2940-N LM2940C

LM2940-N

LM2940C

SNVS769J –MARCH 2000–REVISED DECEMBER 2014

www.ti.com

10.3 Heatsinking

A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of

the application. Under all possible operating conditions, the junction temperature must be within the range

specified under Absolute Maximum Ratings(1)(2).

To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.

Figure 33 shows the voltages and currents which are present in the circuit, as well as the formula for calculating

the power dissipated in the regulator:

IIN = IL+ IG

PD= (VIN −VOUT) IL+ (VIN) IG

Figure 33. Power Dissipation Diagram

The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is

calculated by using the formula:

TR(MAX) = TJ(MAX) −TA(MAX)

where

• TJ(MAX) is the maximum allowable junction temperature, which is 125°C for commercial grade parts.

• TA(MAX)is the maximum ambient temperature which will be encountered in the application. (1)

Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal

resistance, RθJA, can now be found:

RθJA = TR(MAX) / PD(2)

NOTE

If the maximum allowable value for RθJA is found to be ≥23.3°C/W for the TO-220

package (with a heatsink of 21.7°C/W RθSA), ≥40.9°C/W for the DDPAK/TO-263 package,

or ≥59.3°C/W for the SOT-223 package, no heatsink is needed since the package alone

will dissipate enough heat to satisfy these requirements.

If the calculated value for RθJA falls below these limits, a heatsink is required.

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions

see the Electrical Characteristics (5 V and 8 V).

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

Product Folder Links: LM2940-N LM2940C

LM2940-N

LM2940C

www.ti.com

SNVS769J –MARCH 2000–REVISED DECEMBER 2014

Heatsinking (continued)

10.3.1 Heatsinking TO-220 Package Parts

The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board.

If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, RθSA, must first

be calculated:

RθSA = RθJA −RθCS −RθJC

where

• RθJC is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be

assumed for RθJC for this calculation.

• RθCS is defined as the thermal resistance between the case and the surface of the heatsink. The value of RθCS

will vary from about 0.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If the

exact value is unknown, 2°C/W should be assumed for RθCS. (3)

When a value for RθSA is found using Equation 3,a heatsink must be selected that has a value that is less than

or equal to this number.

RθSA is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots

temperature rise vs power dissipation for the heatsink.

Product Folder Links: LM2940-N LM2940C

LM2940-N

LM2940C

SNVS769J –MARCH 2000–REVISED DECEMBER 2014

www.ti.com

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

• Application Note AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036).

• Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM2940-N Click here Click here Click here Click here Click here

LM2940C Click here Click here Click here Click here Click here

11.3 Trademarks

All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM2940-N LM2940C

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2940CS-12 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CS

-12 P+

LM2940CS-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-12 P+

LM2940CS-15 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CS

-15 P+

LM2940CS-15/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-15 P+

LM2940CS-5.0 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CS

-5.0 P+

LM2940CS-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-5.0 P+

LM2940CS-9.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-9.0 P+

LM2940CSX-12 NRND DDPAK/

TO-263 KTT 3 500 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CS

-12 P+

LM2940CSX-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-12 P+

LM2940CSX-15/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-15 P+

LM2940CSX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-5.0 P+

LM2940CSX-9.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM2940CS

-9.0 P+

LM2940CT-12 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CT

-12 P+

LM2940CT-12/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM2940CT

-12 P+

LM2940CT-15 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CT

-15 P+

LM2940CT-15/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM2940CT

-15 P+

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2021

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2940CT-5.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI 0 to 125 LM2940CT

-5.0 P+

LM2940CT-5.0/LF01 ACTIVE TO-220 NDG 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR LM2940CT

-5.0 P+

LM2940CT-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM2940CT

-5.0 P+

LM2940CT-9.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM2940CT

-9.0 P+

LM2940IMP-10/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L55B

LM2940IMP-12/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L56B

LM2940IMP-15 NRND SOT-223 DCY 4 1000 Non-RoHS

& Green Call TI Call TI -40 to 85 L70B

LM2940IMP-15/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L70B

LM2940IMP-5.0 NRND SOT-223 DCY 4 1000 Non-RoHS

& Green Call TI Call TI -40 to 85 L53B

LM2940IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L53B

LM2940IMP-9.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L0EB

LM2940IMPX-10/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L55B

LM2940IMPX-12/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L56B

LM2940IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L53B

LM2940IMPX-8.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L54B

LM2940LD-12 NRND WSON NGN 8 1000 Non-RoHS

& Green Call TI Call TI -40 to 125 L00018B

LM2940LD-12/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L00018B

LM2940LD-5.0/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L00014B

LM2940S-10 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-10 P+

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2021

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2940S-10/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-10 P+

LM2940S-12 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-12 P+

LM2940S-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-12 P+

LM2940S-5.0 NRND DDPAK/

TO-263 KTT 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-5.0 P+

LM2940S-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-5.0 P+

LM2940S-8.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-8.0 P+

LM2940S-9.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-9.0 P+

LM2940SX-10 NRND DDPAK/

TO-263 KTT 3 500 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-10 P+

LM2940SX-10/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-10 P+

LM2940SX-12 NRND DDPAK/

TO-263 KTT 3 500 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-12 P+

LM2940SX-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-12 P+

LM2940SX-5.0 NRND DDPAK/

TO-263 KTT 3 500 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940S

-5.0 P+

LM2940SX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-5.0 P+

LM2940SX-8.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-8.0 P+

LM2940SX-9.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM2940S

-9.0 P+

LM2940T-10.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940T

10.0 P+

LM2940T-10.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2940T

10.0 P+

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2021

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2940T-12.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940T

12.0 P+

LM2940T-12.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2940T

12.0 P+

LM2940T-5.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940T

-5.0 P+

LM2940T-5.0/LF08 ACTIVE TO-220 NEB 3 45 RoHS & Green SN Level-3-245C-168 HR LM2940T

-5.0 P+

LM2940T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2940T

-5.0 P+

LM2940T-8.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940T

-8.0 P+

LM2940T-8.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2940T

-8.0 P+

LM2940T-9.0 NRND TO-220 NDE 3 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM2940T

-9.0 P+

LM2940T-9.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2940T

-9.0 P+

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2021

Addendum-Page 5

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2940CSX-12 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940CSX-12/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940CSX-15/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940CSX-5.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940CSX-9.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940IMP-10/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-12/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-15 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-15/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMP-9.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMPX-10/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMPX-12/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2940IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940IMPX-8.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2940LD-12 WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM2940LD-12/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM2940LD-5.0/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM2940SX-10 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-10/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-12 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-12/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-5.0 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-5.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-8.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2940SX-9.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2940CSX-12 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940CSX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940CSX-15/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940CSX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940CSX-9.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940IMP-10/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-12/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-15 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-15/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMP-9.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2940IMPX-10/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2940IMPX-12/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2940IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2940IMPX-8.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2940LD-12 WSON NGN 8 1000 210.0 185.0 35.0

LM2940LD-12/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM2940LD-5.0/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM2940SX-10 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-10/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-12 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-8.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2940SX-9.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 3

MECHANICAL DATA

NDE0003B

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MECHANICAL DATA

KTT0003B

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BOTTOM SIDE OF PACKAGE

TS3B (Rev F)

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

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PACKAGE OUTLINE

8X 0.35

0.25

2.4

0.8 MAX

(0.25)

(0.25) (0.2)

(0.15)

0.05

0.00

8X 0.6

0.4

3 0.05

2.2 0.05

6X 0.8

A4.1

3.9 B

4.1

3.9

(0.2) TYP

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

PIN 1 ID 0.1 C A B

0.05 C

THERMAL PAD

EXPOSED SYMM

SYMM

DETAIL A

SEE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

PIN 1 ID DETAIL A

PIN 1 ID

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.3)

(3)

(3.3)

6X (0.8)

(2.2)

( 0.2) VIA

TYP (0.85)

(1.25)

8X (0.5)

(R0.05) TYP

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

SYMM 9

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

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EXAMPLE STENCIL DESIGN

(R0.05) TYP

0.59

4X (1.31)

8X (0.3)

8X (0.5)

4X (0.98)

(3.3)

(0.755)

6X (0.8)

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 9:

78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

SYMM

METAL

TYP

SYMM 9

MECHANICAL DATA

NDG0003F

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T03F (Rev B)

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