5
LM2593HV
www.ti.com
SNVS082E –DECEMBER 2001–REVISED MAY 2016
Product Folder Links: LM2593HV
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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the
leads soldered to a printed-circuit board with (1 oz) copper area of approximately 1 in2.
(3) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single-sided printed-circuit board with 0.5 in2of (1 oz)
copper area.
(4) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single-sided printed-circuit board with 2.5 in2of (1 oz)
copper area.
(5) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double-sided printed-circuit board with 3 in2of (1 oz)
copper area on the LM2593HVS side of the board, and approximately 16 in2of copper on the other side of the printed-circuit board.
6.4 Thermal Information
THERMAL METRIC(1) LM2593HV
UNITNDZ (TO-220) KTW (TO-263)
7 PINS 7 PINS
RθJA Junction-to-ambient thermal resistance 50(2) 50(3)
°C/W30(4)
20(5)
RθJC(top) Junction-to-case (top) thermal resistance 2 2 °C/W
RθJB Junction-to-board thermal resistance — — °C/W
ψJT Junction-to-top characterization parameter — — °C/W
ψJB Junction-to-board characterization parameter — — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W
(1) All limits specified at room temperature unless otherwise noted. All room temperature limits are 100% production tested. All limits at
temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) The switching frequency is reduced when the second stage current limit is activated. The amount of reduction is determined by the
severity of current overload.
(4) No diode, inductor or capacitor connected to output pin.
(5) Feedback pin removed from output and connected to 0 V to force the output transistor switch ON.
6.5 Electrical Characteristics
TJ= 25°C, VIN = 12 V for the 3.3-V, 5-V, and adjustable versions, and ILOAD = 500 mA (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Ib Feedback bias current Adjustable version only, VFB = 1.3 V 50 10 100 nA
fOOscillator frequency(3) TJ= 25°C 127 150 173 kHz
TJ= –40°C to 125°C 110 173
VSAT Saturation voltage
IOUT = 2 A; no diode, inductor
or capacitor connected to
output pin(4); Feedback pin
removed from output and
connected to 0 V to force the
output transistor switch ON(5)
TJ= 25°C 1.1 1.3
V
TJ= –40°C to 125°C 1.4
DC
Max duty cycle (ON) Feedback pin removed from output and connected to 0
V to force the output transistor switch ON 100%
Min duty cycle (OFF) Feedback pin removed from output and connected to
12 V for the 3.3-V, 5-V, and the adjustable versions to
force the output transistor switch OFF 0%
ICLIM Switch current limit
Peak current; no diode,
inductor or capacitor connected
to output pin; Feedback pin
removed from output and
connected to 0 V to force the
output transistor switch ON
TJ= 25°C 2.4 3 3.7
A
TJ= –40°C to 125°C 2.3 4
ILOutput leakage current
Feedback pin removed from output and connected to
12 V for the 3.3-V, 5-V, and the adjustable version to
force the output transistor switch OFF; VIN = 60 V,
output = 0 V,
output = −1 V
50 5 30 mA
IQOperating quiescent current
SD and SS pin open, Feedback pin removed from
output and connected to 12 V for the 3.3-V, 5-V, and
the adjustable version to force the output transistor
switch OFF
5 10 mA