INTEGRATED CIRCUITS DATA SHEET 74AHC1G04; 74AHCT1G04 Inverter Product specification Supersedes data of 1999 Jan 27 File under Integrated Circuits, IC06 2001 Jan 31 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 FEATURES DESCRIPTION * Symmetrical output impedance * High noise immunity The 74AHC1G/AHCT1G04 is a high-speed Si-gate CMOS device. * ESD protection: The 74AHC1G/AHCT1G04 provides the inverting buffer. - HBM EIA/JESD22-A114-A exceeds 2000 V - MM EIA/JESD22-A115-A exceeds 200 V. * Low power dissipation * Balanced propagation delays * Very small 5-pin package * Output capability: standard. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT AHC1G tPHL/tPLH propagation delay A to Y CI input capacitance CPD power dissipation capacitance CL = 15 pF; VCC = 5 V notes 1 and 2; CL = 50 pF; f = 1 MHz 3.1 3.4 ns 1.5 1.5 pF 15 16 pF Notes 1. CPD is used to determine the dynamic power dissipation PD (W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUT OUTPUT A Y L H H L Note 1. H = HIGH voltage level; L = LOW voltage level. 2001 Jan 31 2 AHCT1G Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 ORDERING AND PACKAGE INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE MARKING 74AHC1G04GW -40 to +85 C 5 SC-88A plastic SOT353 AC 74AHCT1G04GW -40 to +85 C 5 SC-88A plastic SOT353 CC PINNING PIN SYMBOL DESCRIPTION 1 n.c. not connected 2 A data input A 3 GND ground (0 V) 4 Y data output Y 5 VCC supply voltage handbook, halfpage n.c. 1 A 2 GND 5 VCC handbook, halfpage 2 04 3 4 A Y 4 Y MNA108 MNA107 Fig.1 Pin configuration. handbook, halfpage 2 1 Fig.2 Logic symbol. 4 handbook, halfpage Y A MNA110 MNA109 Fig.3 IEC logic symbol. 2001 Jan 31 Fig.4 Logic diagram. 3 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 RECOMMENDED OPERATING CONDITIONS 74AHC1G SYMBOL PARAMETER 74AHCT1G CONDITIONS UNIT MIN. TYP. MAX. VCC supply voltage 2.0 5.0 5.5 MIN. 4.5 TYP. MAX. 5.0 5.5 V VI input voltage 0 - 5.5 0 - 5.5 V VO output voltage 0 - VCC 0 - VCC V Tamb operating ambient temperature -40 +25 +85 -40 +25 +85 C tr,tf (t/f) input rise and fall times see DC and AC characteristics per device VCC = 3.3 0.3 V - - 100 - - - ns/V VCC = 5 0.5 V - - 20 - - 20 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage -0.5 +7.0 V VI input voltage -0.5 +7.0 V IIK input diode current VI < -0.5 V - -20 mA IOK output diode current VO < -0.5 or VO > VCC + 0.5 V; note 1 - 20 mA IO output source or sink current -0.5 V < VO < VCC + 0.5 V - 25 mA ICC VCC or GND current - 75 mA Tstg storage temperature PD power dissipation per package -65 for temperature range from -40 to +85 C; - note 2 +150 C 200 mW Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 C the value of PD derates linearly with 2.5 mW/K. 2001 Jan 31 4 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 DC CHARACTERISTICS Family 74AHC1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (C) TEST CONDITIONS SYMBOL VCC (V) OTHER VIH VIL VOH VOL TYP. MAX. MIN. MAX. 1.5 - - 1.5 - V 3.0 2.1 - - 2.1 - V 5.5 3.85 - - 3.85 - V 2.0 - - 0.5 - 0.5 V 3.0 - - 0.9 - 0.9 V 5.5 - - 1.65 - 1.65 V VI = VIH or VIL; IO = -50 A 2.0 1.9 2.0 - 1.9 - V VI = VIH or VIL; IO = -50 A 3.0 2.9 3.0 - 2.9 - V VI = VIH or VIL; IO = -50 A 4.5 4.4 4.5 - 4.4 - V VI = VIH or VIL; IO = -4.0 mA 3.0 2.58 - - 2.48 - V LOW-level input voltage LOW-level output voltage MIN. UNIT 2.0 HIGH-level input voltage HIGH-level output voltage -40 to +85 25 PARAMETER VI = VIH or VIL; IO = -8.0 mA 4.5 3.94 - - 3.8 - V VI = VIH or VIL; IO = 50 A 2.0 - 0 0.1 - 0.1 V VI = VIH or VIL; IO = 50 A 3.0 - 0 0.1 - 0.1 V VI = VIH or VIL; IO = 50 A 4.5 - 0 0.1 - 0.1 V VI = VIH or VIL; IO = 4.0 mA 3.0 - - 0.36 - 0.44 V VI = VIH or VIL; IO = 8.0 mA 4.5 - - 0.36 - 0.44 V ILI input leakage current VI = VCC or GND 5.5 - - 0.1 - 1.0 A ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 - - 1.0 - 10 A CI input capacitance - 1.5 10 - 10 pF 2001 Jan 31 5 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 Family 74AHCT1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (C) PARAMETER -40 to +85 25 VCC (V) OTHER MIN. TYP. MAX. MIN. MAX. UNIT VIH HIGH-level input voltage 4.5 to 5.5 2.0 - - 2.0 - V VIL LOW-level input voltage 4.5 to 5.5 - - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; IO = -50 A 4.5 4.4 4.5 - 4.4 - V VI = VIH or VIL; IO = -8.0 mA 4.5 3.94 - - 3.8 - V VI = VIH or VIL; IO = 50 A 4.5 - 0 0.1 - 0.1 V VI = VIH or VIL; IO = 8.0 mA 4.5 - - 0.36 - 0.44 V VOL LOW-level output voltage ILI input leakage current VI = VIH or VIL 5.5 - - 0.1 - 1.0 A ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 - - 1.0 - 10 A ICC additional quiescent supply current per input pin VI = 3.4 V; other inputs at VCC or GND; IO = 0 5.5 - - 1.35 - 1.5 mA CI input capacitance - 1.5 10 - 10 pF 2001 Jan 31 6 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 AC CHARACTERISTICS Type 74AHC1G04 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER propagation delay A to Y -40 to +85 25 WAVEFORMS tPHL/tPLH Tamb (C) see Figs 5 and 6 VCC (V) CL MIN. TYP. MAX. MIN. UNIT MAX. 3.0 to 3.6 - 4.3(1) 8.9 1.0 10.5 ns 50 pF 3.0 to 3.6 - 6.1(1) 11.4 1.0 13 ns 15 pF 4.5 to 5.5 - 3.1(2) 5.5 1.0 6.5 ns 4.5 to 5.5 - 4.5(2) 7.5 1.0 8.5 ns 15 pF 50 pF Notes 1. Typical values are measured at VCC = 3.3 V. 2. Typical values are measured at VCC = 5 V. Type 74AHCT1G04 GND = 0 V; tr = tf 3.0 ns. Tamb (C) TEST CONDITIONS SYMBOL WAVEFORMS tPHL/tPLH propagation delay A to Y see Figs 5 and 6 CL VCC (V) MIN. TYP. 15 pF 4.5 to 5.5 - 3.4(1) 50 pF 4.5 to 5.5 - 4.9(1) Note 1. Typical values are measured at VCC = 5 V. 2001 Jan 31 -40 to +85 25 PARAMETER 7 MAX. MIN. UNIT MAX. 6.7 1.0 7.5 ns 7.7 1.0 8.5 ns Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 AC WAVEFORMS handbook, halfpage A input VM VCC handbook, halfpage tPHL PULSE GENERATOR tPLH VI VO D.U.T. RT Y output CL VM MNA101 MNA111 FAMILY VI INPUT REQUIREMENTS VM INPUT VM OUTPUT AHC1G GND to VCC 50% VCC 50% VCC AHCT1G GND to 3.0 V 1.5 V Fig.5 Definitions for test circuit: CL = load capacitance including jig and probe capacitance (see Chapter "AC characteristics"). RT = termination resistance should be equal to the output impedance Z0 of the pulse generator. 50% VCC The input (A) to output (Y) propagation delays. 2001 Jan 31 Fig.6 Load circuitry for switching times. 8 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 2001 Jan 31 REFERENCES IEC JEDEC EIAJ SC-88A 9 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 2001 Jan 31 10 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Jan 31 11 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Jan 31 12 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 NOTES 2001 Jan 31 13 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 NOTES 2001 Jan 31 14 Philips Semiconductors Product specification Inverter 74AHC1G04; 74AHCT1G04 NOTES 2001 Jan 31 15 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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