74AHC1G04GW-G - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1999 Jan 27

File under Integrated Circuits, IC06

2001 Jan 31

INTEGRATED CIRCUITS

74AHC1G04; 74AHCT1G04

Inverter

2001 Jan 31 2

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

FEATURES

•Symmetrical output impedance

•High noise immunity

•ESD protection:

– HBM EIA/JESD22-A114-A exceeds 2000 V

– MM EIA/JESD22-A115-A exceeds 200 V.

•Low power dissipation

•Balanced propagation delays

•Very small 5-pin package

•Output capability: standard.

DESCRIPTION

The74AHC1G/AHCT1G04isahigh-speedSi-gateCMOS

device.

The 74AHC1G/AHCT1G04 provides the inverting buffer.

QUICK REFERENCE DATA

GND = 0 V; Tamb =25°C; tr=t

f≤3.0 ns.

Notes

1. CPD is used to determine the dynamic power dissipation PD(µW).

PD=C

PD ×VCC2×fi+(C

L×V

CC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in Volts.

2. The condition is VI= GND to VCC.

FUNCTION TABLE

See note 1.

Note

1. H = HIGH voltage level;

L = LOW voltage level.

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

AHC1G AHCT1G

tPHL/tPLH propagation delay A to Y CL= 15 pF; VCC = 5 V 3.1 3.4 ns

CIinput capacitance 1.5 1.5 pF

CPD power dissipation capacitance notes 1 and 2; CL=50pF;

f = 1 MHz 15 16 pF

INPUT OUTPUT

2001 Jan 31 3

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

ORDERING AND PACKAGE INFORMATION

PINNING

TYPE NUMBER PACKAGES

TEMPERATURE

RANGE PINS PACKAGE MATERIAL CODE MARKING

74AHC1G04GW −40 to +85 °C 5 SC-88A plastic SOT353 AC

74AHCT1G04GW −40 to +85 °C 5 SC-88A plastic SOT353 CC

PIN SYMBOL DESCRIPTION

1 n.c. not connected

2 A data input A

3 GND ground (0 V)

4 Y data output Y

CC supply voltage

Fig.1 Pin configuration.

handbook, halfpage

MNA107

VCC

GND

n.c.

Fig.2 Logic symbol.

handbook, halfpage

MNA108

Fig.3 IEC logic symbol.

handbook, halfpage

MNA109

Fig.4 Logic diagram.

handbook, halfpage

MNA110

2001 Jan 31 4

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

RECOMMENDED OPERATING CONDITIONS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. Above 55 °C the value of PD derates linearly with 2.5 mW/K.

SYMBOL PARAMETER CONDITIONS 74AHC1G 74AHCT1G UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V

VIinput voltage 0 −5.5 0 −5.5 V

VOoutput voltage 0 −VCC 0−VCC V

Tamb operating ambient

temperature see DC and AC

characteristics per

device

−40 +25 +85 −40 +25 +85 °C

tr,tf (∆t/∆f) input rise and fall times VCC = 3.3 ±0.3 V −−100 −−−ns/V

VCC =5±0.5 V −−20 −−20 ns/V

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage −0.5 +7.0 V

VIinput voltage −0.5 +7.0 V

IIK input diode current VI<−0.5 V −−20 mA

IOK output diode current VO<−0.5 or VO>V

CC + 0.5 V; note 1 −±20 mA

IOoutput source or sink current −0.5V<V

O<V

CC + 0.5 V −±25 mA

ICC VCC or GND current −±75 mA

Tstg storage temperature −65 +150 °C

PDpower dissipation per package for temperature range from −40 to +85 °C;

note 2 −200 mW

2001 Jan 31 5

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

DC CHARACTERISTICS

Family 74AHC1G

At recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85

MIN. TYP. MAX. MIN. MAX.

VIH HIGH-level

input voltage 2.0 1.5 −−1.5 −V

3.0 2.1 −−2.1 −V

5.5 3.85 −−3.85 −V

VIL LOW-level

input voltage 2.0 −−0.5 −0.5 V

3.0 −−0.9 −0.9 V

5.5 −−1.65 −1.65 V

VOH HIGH-level

output voltage VI=V

IH or VIL; IO=−50 µA 2.0 1.9 2.0 −1.9 −V

VI=V

IH or VIL; IO=−50 µA 3.0 2.9 3.0 −2.9 −V

VI=V

IH or VIL; IO=−50 µA 4.5 4.4 4.5 −4.4 −V

VI=V

IH or VIL; IO=−4.0 mA 3.0 2.58 −−2.48 −V

VI=V

IH or VIL; IO=−8.0 mA 4.5 3.94 −−3.8 −V

VOL LOW-level

output voltage VI=V

IH or VIL; IO=50µA 2.0 −0 0.1 −0.1 V

VI=V

IH or VIL; IO=50µA 3.0 −0 0.1 −0.1 V

VI=V

IH or VIL; IO=50µA 4.5 −0 0.1 −0.1 V

VI=V

IH or VIL; IO= 4.0 mA 3.0 −−0.36 −0.44 V

VI=V

IH or VIL; IO= 8.0 mA 4.5 −−0.36 −0.44 V

ILI input leakage

current VI=V

CC or GND 5.5 −−0.1 −1.0 µA

ICC quiescent

supply current VI=V

CC or GND; IO= 0 5.5 −−1.0 −10 µA

CIinput

capacitance −1.5 10 −10 pF

2001 Jan 31 6

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

Family 74AHCT1G

At recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85

MIN. TYP. MAX. MIN. MAX.

VIH HIGH-level input voltage 4.5 to 5.5 2.0 −− 2.0 −V

VIL LOW-level input voltage 4.5 to 5.5 −−0.8 −0.8 V

VOH HIGH-level output voltage VI=V

IH or VIL;

IO=−50 µA4.5 4.4 4.5 −4.4 −V

VI=V

IH or VIL;

IO=−8.0 mA 4.5 3.94 −− 3.8 −V

VOL LOW-level output voltage VI=V

IH or VIL;

IO=50µA4.5 −0 0.1 −0.1 V

VI=V

IH or VIL;

IO= 8.0 mA 4.5 −−0.36 −0.44 V

ILI input leakage current VI=V

IH or VIL 5.5 −−0.1 −1.0 µA

ICC quiescent supply current VI=V

CC or GND;

IO=0 5.5 −−1.0 −10 µA

∆ICC additional quiescent

supply current per input

VI= 3.4 V; other

inputs at

VCC or GND; IO=0

5.5 −−1.35 −1.5 mA

CIinput capacitance −1.5 10 −10 pF

2001 Jan 31 7

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

AC CHARACTERISTICS

Type 74AHC1G04

GND = 0 V; tr=t

f≤3.0 ns.

Notes

1. Typical values are measured at VCC = 3.3 V.

2. Typical values are measured at VCC =5V.

Type 74AHCT1G04

GND = 0 V; tr=t

f≤3.0 ns.

Note

1. Typical values are measured at VCC =5V.

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CLVCC (V) 25 −40 to +85

MIN. TYP. MAX. MIN. MAX.

tPHL/tPLH propagation

delay A to Y see Figs 5 and 6 15 pF 3.0 to 3.6 −4.3(1) 8.9 1.0 10.5 ns

50 pF 3.0 to 3.6 −6.1(1) 11.4 1.0 13 ns

15 pF 4.5 to 5.5 −3.1(2) 5.5 1.0 6.5 ns

50 pF 4.5 to 5.5 −4.5(2) 7.5 1.0 8.5 ns

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CLVCC (V) 25 −40 to +85

MIN. TYP. MAX. MIN. MAX.

tPHL/tPLH propagation

delay A to Y see Figs 5 and 6 15 pF 4.5 to 5.5 −3.4(1) 6.7 1.0 7.5 ns

50 pF 4.5 to 5.5 −4.9(1) 7.7 1.0 8.5 ns

2001 Jan 31 8

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

AC WAVEFORMS

Fig.5 The input (A) to output (Y) propagation

delays.

andbook, halfpage

MNA111

A input

Y output

tPHL tPLH

FAMILY VI INPUT

REQUIREMENTS VM

INPUT VM

OUTPUT

AHC1G GND to VCC 50% VCC 50% VCC

AHCT1G GND to 3.0 V 1.5 V 50% VCC

Fig.6 Load circuitry for switching times.

Definitions for test circuit:

CL= load capacitance including jig and probe capacitance

(see Chapter “AC characteristics”).

RT= termination resistance should be equal to the output

impedance Z0 of the pulse generator.

handbook, halfpage

VCC

VIVO

MNA101

D.U.T.

PULSE

GENERATOR

2001 Jan 31 9

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

SOT353

wBM

detail X

vMA

0 1 2 mm

scale

132

Plastic surface mounted package; 5 leads SOT353

UNIT A1

max bpcD

E (2) e1HELpQywv

mm 0.1 0.30

0.20 2.2

1.8

0.25

0.10 1.35

1.15 0.65

1.3 2.2

2.0 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15 0.25

0.15

1.1

0.8

97-02-28SC-88A

2001 Jan 31 10

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

SOLDERING

Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurfacemountICs,butitisnotsuitableforfine pitch

SMDs. In these situations reflow soldering is

recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuit board by screenprinting, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended

forsurface mount devices (SMDs)orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages with leads onfoursides,thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2001 Jan 31 11

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

2001 Jan 31 12

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS PRODUCT

STATUS DEFINITIONS (1)

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for

product development. Speciﬁcation may change in any manner without

notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be

published at a later date. Philips Semiconductors reserves the right to

make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

reserves the right to make changes at any time without notice in order to

improve design and supply the best possible product.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseoratanyotherconditionsabovethosegiveninthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentation orwarrantythatsuch applicationswillbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuse of any oftheseproducts,conveysnolicenceor title

under any patent, copyright, or mask work right to these

products,andmakesnorepresentations or warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

2001 Jan 31 13

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

NOTES

2001 Jan 31 14

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

NOTES

2001 Jan 31 15

Philips Semiconductors Product speciﬁcation

Inverter 74AHC1G04; 74AHCT1G04

NOTES

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

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Internet: http://www.semiconductors.philips.com

2001 71

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Printed in The Netherlands 613508/03/pp16 Date of release: 2001 Jan 31 Document order number: 9397 750 07948