Serializer
Deserializer
DS30BA101 DS30EA101
150 Mbps
to
3.125 Gbps
100: Differential Cable or
75: Coaxial Cable
Max Cable Loss ~ 50 dB @ 1.5 GHz
DS30BA101
www.ti.com
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
DS30BA101 3.125 Gbps Differential Buffer
Check for Samples: DS30BA101
1FEATURES DESCRIPTION
The DS30BA101 is a high-speed differential buffer for
2• Data Rates from DC to 3.125 Gbps cable driving, signal buffering, and signal repeating
• Supports SD and HD Video Resolutions applications. Its fully differential signal path ensures
• Power Consumption: 165 mW Typical exceptional signal integrity and noise immunity. The
DS30BA101 drives both differential and single-ended
• Industrial Temperature Range: -40°C to +85°C transmission lines at data rates up to 3.125 Gbps.
APPLICATIONS The output voltage amplitude is adjustable via a
single external resistor for cable driving applications
• Cable Extension into 75Ωsingle-ended and 100Ωdifferential mode
• Signal Buffering and Repeating impedances.
• Security and Surveillance The DS30BA101 is powered from a single 3.3V
supply and consumes 165 mW (typical). It operates
over the full industrial temperature range of -40°C to
+85°C and is available in a 4 x 4 mm 16-pin WQFN
package.
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1
4
3
2DS30BA101
(top view)
12
9
10
11
85 6 7
1316 15 14
IN+
IN-
OUT+
OUT-
VCC
NC
VCC
DAP = VEE
RVO
VEE
NC
NC
NC
NC
NC
NC
VEE
DS30BA101
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
Connection Diagram
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 1. 16-Pin WQFN Package
See Package Number RUM0016A
PIN DESCRIPTIONS
Pin Name I/O, Type Description
1 IN+ I, CML Non-inverting input.
2 IN- I, CML Inverting input.
3 VEE Ground Negative power supply (ground).
4 RVO I, Analog Output voltage level control. Connect a resistor between this pin and VCC to set the output
voltage.
5 NC N/A No connect. Not bonded internally.
6 VCC Power Positive power supply (+3.3V).
7 NC N/A No connect. Not bonded internally.
8 NC N/A No connect. Not bonded internally.
9 VCC Power Positive power supply (+3.3V).
10 VEE Ground Negative power supply (ground).
11 OUT- O, Data Inverting output.
12 OUT+ O, Data Non-inverting output.
13 NC N/A No connect. Not bonded internally.
14 NC N/A No connect. Not bonded internally.
15 NC N/A No connect. Not bonded internally.
16 NC N/A No connect. Not bonded internally.
DAP VEE Ground Connect exposed DAP to negative power supply (ground).
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: DS30BA101
DS30BA101
www.ti.com
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
Absolute Maximum Ratings(1)
Supply Voltage: 3.6V
Input Voltage (all inputs) −0.3V to VCC+0.3V
Output Current 28 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature +125°C
Package Thermal Resistance
θJA 16-pin WQFN +58°C/W
θJC 16-pin WQFN +21°C/W
ESD Rating (HBM) ≥±4.5 kV
ESD Rating (MM) ≥±250V
ESD Rating (CDM) ≥±2 kV
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device my occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
Recommended Operating Conditions
Supply Voltage (VCC): 3.3V ±5%
Operating Free Air Temperature (TA) -40°C to +85°C
DC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified. (1) (2)
Parameter Test Conditions Reference Min Typ Max Units
VICM Input Common Mode Voltage IN+, IN- 1.1 + VCC – V
VID/2 VID/2
VID Input Voltage Swing Differential 100 2200 mVP−P
VOCM Output Common Mode Voltage OUT+, OUT- VCC – V
VOUT
VOUT Output Voltage Single-ended, 75Ωload, 800 mVP-P
RVO = 750Ω
Single-ended, 50Ωload, 400 mVP-P
RVO = 953Ω
ICC Supply Current 50 59 mA
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Typical values represent most likely parametric norms at VCC = +3.3V, TA= +25°C, and at the Recommended Operating Conditions at
the time of product characterization and are not ensured.
AC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified. (1) (2)
Parameter Test Conditions Reference Min Typ Max Units
DRIN Input Data Rate IN+, IN- 3125 Mbps
tTLH Transition Time Low to High 20% - 80% (3) OUT+, 90 130 ps
OUT-
tTHL Transition Time High to Low 90 130 ps
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Typical values represent most likely parametric norms at VCC = +3.3V, TA= +25°C, and at the Recommended Operating Conditions at
the time of product characterization and are not ensured.
(3) Specification is ensured by characterization and is not tested in production.
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS30BA101
DS30BA101
OUT-
IN+
IN-
OUT+
0.1 PF
50:
50:
953:
100:
1 PF
1 PF
1 PF
1 PFDS30EA101
IN+
IN-
100:
OUT+
OUT-
VCC
100: Differential TP Cable
RVO
DS30BA101
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
DEVICE OPERATION
INPUT INTERFACING
The DS30BA101 accepts either differential or single-ended input. DC-coupled inputs must be kept within the
specified common-mode range.
OUTPUT INTERFACING
The DS30BA101 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75ΩAC-coupled
coaxial cable with an RVO resistor of 750Ω, or 400 mVP-P (800 mVP-P differential) into 100Ωdifferential cable with
an RVO resistor of 953Ω. The output voltage level is controlled by the value of the RVO resistor connected
between the RVO pin and VCC.
The RVO resistor should be placed as close as possible to the RVO pin. In addition, the copper in the plane layers
below the RVO network should be removed to minimize parasitic capacitance.
Figure 2 and Figure 3 show the typical configurations for differential output and single-ended output, respectively.
For single-ended output, the unused output must be properly terminated as shown.
APPLICATION INFORMATION
CABLE EXTENDER APPLICATION
The DS30BA101 together with the DS30EA101 form a cable extender chipset optimized for extending serial data
streams from serializer/deseralizer (SerDes) pairs and FPGAs over 100Ωdifferential cables and 75Ωcoaxial
cables. Setting the correct DS30BA101 output amplitude and proper cable termination are essential for optimal
operation. Figure 2 shows the recommended chipset configuration for 100Ωdifferential cable and Figure 3 shows
the recommended chipset configuration for 75Ωcoaxial cable.
Figure 2. Cable Extender Chipset Application Circuit for 100ΩDifferential Cable
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Product Folder Links: DS30BA101
DS30BA101
OUT-
IN+
IN-
OUT+
0.1 PF
75:
75:
750:
100:
1 PF1 PF
1 PFDS30EA101
IN+
IN-
75:
OUT+
OUT-
VCC
37.4:
RVO 75: Coaxial Cable
1 PF
75:
DS30BA101
www.ti.com
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
Figure 3. Cable Extender Chipset Application Circuit for 75ΩCoaxial Cable
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS30BA101
DS30BA101
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Original (April 2013) to Revision A Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
DS30BA101SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30BA101
DS30BA101SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30BA101
DS30BA101SQX/NOPB ACTIVE WQFN RUM 16 4500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30BA101
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS30BA101SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
DS30BA101SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
DS30BA101SQX/NOPB WQFN RUM 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS30BA101SQ/NOPB WQFN RUM 16 1000 213.0 191.0 55.0
DS30BA101SQE/NOPB WQFN RUM 16 250 213.0 191.0 55.0
DS30BA101SQX/NOPB WQFN RUM 16 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
www.ti.com
SQB16A (Rev A)
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