TPD2E001 www.ti.com SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 Low-Capacitance 2-Channel 15-kV ESD-Protection Array For High-Speed Data Interfaces Check for Samples: TPD2E001 FEATURES DESCRIPTION * The TPD2E001 is a low-capacitance 15-kV ESDprotection diode array designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND. The TPD2E001 protects against ESD pulses up to 15-kV HumanBody Model (HBM), 8-kV Contact Discharge, and 15-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a 1.5-pF capacitance per channel, making it ideal for use in high-speed data IO interfaces. 1 2 * * * * * * * ESD Protection Exceeds - 15-kV Human-Body Model (HBM) - 8-kV IEC 61000-4-2 Contact Discharge - 15-kV IEC 61000-4-2 Air-Gap Discharge Low 1.5-pF Input Capacitance Low 1-nA (Max) Leakage Current Low 1-nA Supply Current 0.9-V to 5.5-V Supply-Voltage Range Two-Channel Device Space-Saving DRL, DRY, and QFN Package Options Alternate 3-, 4-, 6-Channel Options Available: TPD3E001, TPD4E001, and TPD6E001 The TPD2E001 is a two-channel device intended for USB and USB 2.0 applications. The TPD2E001 is available in DRL, DRY, and thin QFN packages and is specified for -40C to 85C operation. APPLICATIONS * * * * * * * * The 3 x 3 mm DRS package is also available as a non-magnetic package for medical imaging application. See also TPD2E2U06DRLR which is p2p compatible to TPD2E001DRLR and offers higher IEC protection, lower clamping voltage, and eliminates the input capacitor requirement. USB 2.0 Ethernet FireWireTM Video Cell Phones SVGA Video Connections Glucose Meters Medical Imaging DRL PACKAGE (TOP VIEW) DRY PACKAGE (TOP VIEW) VCC 1 VCC 1 6 IO2 N.C. 2 5 N.C. N.C. 2 IO1 3 4 GND IO1 3 5 4 DZD PACKAGE (TOP VIEW) DRS PACKAGE (TOP VIEW) GND IO2 VCC 1 N.C. 2 GND 6 IO2 5 N.C. 4 GND IO1 GND IO1 3 1 4 2 3 VCC IO2 N.C. - Not internally connected 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FireWire is a trademark of Apple Computer, Inc. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated TPD2E001 SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 www.ti.com Logic Block Diagram VCC IO2 IO1 GND Pin Description DRS NO. DRL NO. DRY NO. 3, 6 3, 5 3, 6 IOx 4 4 4 GND Ground 1 1 1 VCC Power-supply input. Bypass VCC to GND with a 0.1-F ceramic capacitor. 2, 5 2 2, 5 N.C. No connection. Not internally connected. EP NAME EP FUNCTION ESD-protected channel Exposed pad. Connect to GND. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC -0.3 7 VIO -0.3 VCC + 0.3 V -65 150 C 150 C Tstg Storage temperature range TJ Junction temperature Bump temperature (soldering) Infrared (15 s) 220 Vapor phase (60 s) 215 Lead temperature (soldering, 10 s) (1) 2 300 V C C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute-maximum-rating conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: TPD2E001 TPD2E001 www.ti.com SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 Electrical Characteristics VCC = 5 V 10%, TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VCC Supply voltage ICC Supply current VF Diode forward voltage IF = 10 mA 0.65 VBR Breakdown Voltage IBR = 10mA 11 Channel clamp voltage (2) VC MAX 5.5 V 1 100 nA 0.95 V 0.9 TA = 25C, 15-kV HBM, IF = 10 A Positive transients TA = 25C, 8-kV Contact Discharge (IEC 61000-4-2), IF = 24 A Positive transients TA = 25C, 15-kV Air-Gap Discharge (IEC 61000-4-2), IF = 45 A Positive transients Ii/o Channel leakage current Vi/o = GND to VCC Ci/o Channel input capacitance VCC = 5 V, Bias of VCC/2 (1) (2) TYP (1) UNIT V VCC + 25 Negative transients -25 VCC + 60 Negative transients -60 V VCC + 100 Negative transients -100 1 1.5 nA pF Typical values are at VCC = 5 V and TA = 25C Channel clamp voltage is not production tested. ESD Protection PARAMETER TYP UNIT 15 kV IEC 61000-4-2 Contact Discharge 8 kV IEC 61000-4-2 Air-Gap Discharge 15 kV HBM Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: TPD2E001 3 TPD2E001 SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 www.ti.com Typical Operating Characteristics IO CAPACITANCE vs IO VOLTAGE (VCC = 5.0 V) 2.20 IO Capacitance (pF) 2.00 1.80 1.60 1.40 1.20 1.00 0.00 IO Leakage Current (pA) 1000 1.00 2.00 2.50 3.00 4.00 5.00 IO Voltage (V) IO LEAKAGE CURRENT vs TEMPERATURE (VCC = 5.5 V) 100 10 1 -40 25 45 65 85 Temperature (C) 4 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: TPD2E001 TPD2E001 www.ti.com SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 APPLICATION INFORMATION VCC 0.1 F VBUS RT IO1 D+ USB Controller RT D1 D- IO2 GND GND Detailed Description When placed near the connector, the TPD2E001 ESD solution offers little or no signal distortion during normal operation due to low IO capacitance and ultra-low leakage current specifications. The TPD2E001 ensures that the core circuitry is protected and the system is functioning properly in the event of an ESD strike. For proper operation, the following layout/ design guidelines should be followed: 1. Place the TPD2E001 solution close to the connector. This allows the TPD2E001 to take away the energy associated with ESD strike before it reaches the internal circuitry of the system board. 2. Place a 0.1-F capacitor very close to the VCC pin. This limits any momentary voltage surge at the IO pin during the ESD strike event. 3. Make sure that there is enough metallization for the VCC and GND loop. During normal operation, the TPD2E001 consumes nA leakage current. But during the ESD event, VCC and GND may see 15 A to 30 A of current, depending on the ESD level. Sufficient current path enables safe discharge of all the energy associated with the ESD strike. 4. Leave the unused IO pins floating. 5. The VCC pin can be connected in two different ways: (a) If the VCC pin is connected to the system power supply, the TPD2E001 works as a transient suppressor for any signal swing above VCC + VF. A 0.1-F capacitor on the device VCC pin is recommended for ESD bypass. (b) If the VCC pin is not connected to the system power supply, the TPD2E001 can tolerate higher signal swing in the range up to 10 V. Please note that a 0.1-F capacitor is still recommended at the VCC pin for ESD bypass. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: TPD2E001 5 TPD2E001 SLLS684G - JULY 2006 - REVISED NOVEMBER 2013 www.ti.com REVISION HISTORY Changes from Revision E (June 2008) to Revision F Page * Added Medical Imaging to Applications. ............................................................................................................................... 1 * Added "The 3x3 mm DRS package is also available as a non-magnetic package for medical imaging application." to the description. ...................................................................................................................................................................... 1 * Added 3 x 3 SON - DRS (Non-Magnetic) package to Ordering Information table. ............................................................. 1 Changes from Revision F (Feburary 2012) to Revision G Page * Updated document formatting. ............................................................................................................................................. 1 * Updated Description. ............................................................................................................................................................ 1 * Removed Ordering Information table. ................................................................................................................................... 1 6 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: TPD2E001 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TPD2E001DRLR ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (2AR ~ 2AZ) TPD2E001DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 (2AR ~ 2AZ) TPD2E001DRSR ACTIVE SON DRS 6 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 ZWK TPD2E001DRST-NM ACTIVE SON DRS 6 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 ZWKNM TPD2E001DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2A TPD2E001DRYRG4 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2A TPD2E001DZDR ACTIVE SOP DZD 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFGO (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPD2E001 : * Automotive: TPD2E001-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Nov-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPD2E001DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 TPD2E001DRSR SON DRS 6 1000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPD2E001DRST-NM SON DRS 6 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPD2E001DRYR SON DRY 6 5000 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1 TPD2E001DZDR SOP DZD 4 3000 179.0 8.4 3.15 2.6 1.2 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Nov-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD2E001DRLR SOT DRL 5 4000 202.0 201.0 28.0 TPD2E001DRSR SON DRS 6 1000 367.0 367.0 35.0 TPD2E001DRST-NM SON DRS 6 250 210.0 185.0 35.0 TPD2E001DRYR SON DRY 6 5000 203.0 203.0 35.0 TPD2E001DZDR SOP DZD 4 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated