NC7SZ175 TinyLogic UHS D-Type Flip-Flop with Asynchronous Clear Description www.onsemi.com The NC7SZ175 is a single positive edge-triggered D-type CMOS Flip-Flop with Asynchronous Clear from ON Semiconductor's Ultra High Speed Series of TinyLogic in the space saving SC70 6-lead package. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs and output are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage. This single flip-flop will store the state of the D input that meets the setup and hold time requirements on the LOW-to-HIGH Clock (CP) transition. A LOW input to Clear sets the Q output to LOW level. The Clear input is independent of clock. MARKING DIAGRAMS SIP6 1.45x1.0 CASE 127EB Pin 1 SC-88 (SC-70 6 Lead) 1.25x2 CASE 419AD-01 Features * * * * * * * * * * Space Saving SC70 6-Lead Package Ultra Small MicroPakTM Leadless Package Ultra High Speed: tPD 2.6 ns Typ into 50 pF at 5 V VCC High Output Drive: 24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Matches the Performance of LCX when Operated at 3.3 V VCC Power Down High Impedance Inputs / Output Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Implemented These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant C4KK XYZ C4, Z75 KK XY Z T Z75T = Specific Device Code = 2-Digit Lot Run Traceability Code = 2-Digit Date Code Format = Assembly Plant Code = Year Coding Scheme = Plant Code Identifier = Die Run Code = Eight-Week Datacoding Scheme ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. IEEC / IEC C CP D Q Figure 1. Logic Symbol (c) Semiconductor Components Industries, LLC, 2004 June, 2019 - Rev. 3 1 Publication Order Number: NC7SZ175/D NC7SZ175 Connection Diagrams CP 1 GND 2 CP D C 5 VCC CP 1 C D 6 GND 2 Q 3 4 Q 5 VCC D 3 Figure 2. SC70 (Top View) (Top View) 6 C 4 Q Figure 4. MicroPak (Top Through View) AAA Pin One AAA represents Product Code Top Mark - see ordering code. NOTE: Orientation of Top Mark determines Pin One location. Read the Top Product Code Mark left to right, Pin One is the lower left pin (see diagram). Figure 3. Pin 1 Orientation PIN DESCRIPTIONS Pin Name D FUNCTION TABLE Description Inputs Data Input D C Q Clock Pulse Input L H L C Clear Input H H H Q Flip-Flop Output X H Qn X L L CP CP Output X H = HIGH Logic Level L = LOW Logic Level www.onsemi.com 2 Qn = No Change in Data X = Immaterial NC7SZ175 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage -0.5 +6.5 V VIN DC Input Voltage -0.5 +6.5 V DC Output Voltage -0.5 +6.5 V VOUT Parameter IIK DC Input Diode Current VIN < 0 V - -50 mA IOK DC Output Diode Current VOUT < 0 V - -50 mA IOUT DC Output Source / Sink Current - 50 mA DC VCC / GND Current - 50 mA -65 +150 C ICC / IGND TSTG Storage Temperature Range TJ Junction Temperature under Bias - 150 C TL Junction Lead Temperature (Soldering, 10 Seconds) - 260 C PD Power Dissipation @ +85C SC70 - 190 mW MicroPak - 327 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT tr, tf Min Max Unit Supply Voltage Operating Parameter 1.65 5.5 V Supply Voltage Data Retention 1.5 5.5 Input Voltage 0 5.5 V Output Voltage 0 VCC V VCC = 1.8 V, 2.5 V 0.2 V 0 20 ns/V VCC = 3.3 V 0.3 V 0 10 Input Rise and Fall Time Conditions VCC = 5.5 V 0.5 V TA Operating Temperature qJA Thermal Resistance 0 5 -40 +85 C SC70-5 - 659 C/W MicroPak - 382 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7SZ175 DC ELECTICAL CHARACTERISTICS TA = +25C Symbol VIH VIL VOH VOL Parameter VCC (V) Typ Max Min Max Unit V HIGH Level Input Control Voltage 1.65 to 1.95 0.65 VCC - - 0.65 VCC - 2.3 to 5.5 0.7 VCC - - 0.7 VCC - LOW Level Input Control Voltage 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC 2.3 to 5.5 - - 0.3 VCC - 0.3 VCC 1.55 1.65 - 1.55 - 1.7 1.8 - 1.7 - 2.3 2.2 2.3 - 2.2 - 3.0 2.9 3.0 - 2.9 - 4.5 4.4 4.5 - 4.4 - HIGH Level Control Output Voltage LOW Level Control Output Voltage 1.65 1.8 Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current VIN = VIH or VIL IOH = -100 mA 1.65 IOH = -4 mA 1.24 1.52 - 1.29 - 2.3 IOH = -8 mA 1.9 2.15 - 1.9 - 3.0 IOH = -16 mA 2.4 2.8 - 2.4 - 3.0 IOH = -24 mA 2.3 2.68 - 2.3 - 4.5 IOH = -32 mA 3.8 4.2 - 3.8 - IOL = 100 mA - 0.0 0.1 - 0.1 - 0.0 0.1 - 0.1 2.3 - 0.0 0.1 - 0.1 3.0 - 0.0 0.1 - 0.1 4.5 - 0.0 0.1 - 0.1 1.65 1.8 VIN = VIL or VIH 1.65 IOL = 4 mA - 0.08 0.24 - 0.24 2.3 IOL = 8 mA - 0.10 0.3 - 0.3 3.0 IOL = 16 mA - 0.15 0.4 - 0.4 3.0 IOL = 24 mA - 0.22 0.55 - 0.55 IOL = 32 mA 4.5 IIN Conditions TA = -40 to +85C Min 1.65 to 5.5 0.0 1.65 to 5.5 V V V - 0.22 0.55 - 0.55 0 VIN 5.5 V - - 0.1 - 1.0 mA VIN or VOUT = 5.5 V - - 1.0 - 10 mA VIN = 5.5 V, GND - - 1.0 - 10.0 mA www.onsemi.com 4 NC7SZ175 AC ELECTRICAL CHARACTERISTICS TA = +25C Symbol fMAX tPLH, tPHL Parameter Maximum Clock Frequency (Figures 5, 8) Propagation Delay CP to Q (Figures 5, 7) Conditions Min Typ Max Min Max Unit 1.65 CL = 50 pF, RL = 500 W - - - 100 - MHz - - - 100 - 2.5 0.2 - - - 125 - 3.3 0.3 - - - 150 - 5.0 0.5 - - - 175 - - 9.8 15.0 - 16.5 - 6.5 10.0 - 11.0 2.5 0.2 - 3.8 6.5 - 7.0 3.3 0.3 - 2.8 4.5 - 5.0 1.8 CL = 15 pF, RL = 1 MW 1.65 1.8 5.0 0.5 - 2.2 3.5 - 3.8 CL = 50 pF, RL = 500 W - 3.4 5.5 - 6.2 - 2.6 4.0 - 4.7 CL = 15 pF, RL = 1 MW - 9.8 13.5 - 15.0 - 6.5 9.0 - 10.0 2.5 0.2 - 3.8 6.0 - 6.4 3.3 0.3 - 2.8 4.3 - 4.6 5.0 0.5 - 2.2 3.2 - 3.5 CL = 50 pF, RL = 500 W - 3.4 5.3 - 5.8 - 2.7 4.0 - 4.5 CL = 50 pF, RL = 500 W - - - 2.5 - - - - 2.0 - - - 1.5 - CL = 50 pF, RL = 500 W - - - 1.5 - - - - 1.5 - - - - 1.5 - - - - 3.0 - - - - 2.8 - 3.3 0.3 5.0 0.5 tPHL Propagation Delay C to Q (Figures 5, 7) 1.65 1.8 3.3 0.3 5.0 0.5 tS Setup Time, CP to D (Figures 5, 8) 2.5 0.2 3.3 0.3 5.0 0.5 tH Hold Time, CP to D (Figures 5, 8) 2.5 0.2 3.3 0.3 5.0 0.5 tW Pulse Width, CP (Figures 5, 8) 2.5 0.2 3.3 0.3 CL = 50 pF, RL = 500 W 5.0 0.5 Pulse Width, C (Figures 5, 8) 2.5 0.2 3.3 0.3 5.0 0.5 trec Recovery Time, C to CP (Figures 5, 8) TA = -40 to +85C VCC (V) 2.5 0.2 3.3 0.3 - - - 2.5 - Clock HIGH or LOW CL = 50 pF, RL = 500 W - - - 3.0 - - - - 2.8 - - - - 2.5 - CL = 50 pF, RL = 500 W - - - 1.0 - - - - 1.0 - - - - 1.0 - 5.0 0.5 www.onsemi.com 5 ns ns ns ns ns ns ns NC7SZ175 CAPACITANCE (TA = +25C, f = 1 MHz) Symbol Parameter CIN Condition Typ Max Units Input Capacitance VCC = Open, VIN = 0 V or VCC 3 - pF COUT Output Capacitance VCC = 3.3 V, VIN = 0 V or VCC 4 - pF CPD Power Dissipation Capacitance (Note 2) VCC = 3.3 V VCC = 5.0 V 10 12 - - pF 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. (See Figure 6) CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). AC Loading and Waveforms VCC A VCC CP CP Input Q D C C Input OUTPUT CL D Input RL Q Output CP Input = AC Waveform; tr = tf = 1.8 ns; CP Input PRR = 10 MHz; Duty Cycle = 50% D Input PRR = 5 MHz; Duty Cycle = 50%. CL includes load and stray capacitance Input PRR = 1.0 MHz, tW = 500 ns. Figure 5. AC Test Circuit Figure 6. ICCD Test Circuit Figure 7. AC Waveforms Figure 8. AC Waveforms DEVICE ORDERING INFORMATION Top Mark Packages Shipping NC7SZ175P6X Z75 6-Lead SC70, EIAJ SC88, 1.25 mm Wide 3000 / Tape & Reel NC7SZ175L6X C4 6-Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. 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(c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-88 (SC-70 6 Lead), 1.25x2 CASE 419AD-01 ISSUE A SYMBOL D e e E1 E DATE 07 JUL 2010 MIN MAX A 0.80 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 c 0.10 0.18 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L TOP VIEW NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 0 8 1 4 10 q1 A2 A q b q1 L L1 A1 SIDE VIEW c L2 END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. DOCUMENT NUMBER: DESCRIPTION: 98AON34266E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. SC-88 (SC-70 6 LEAD), 1.25X2 PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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