PMBD7000,235 - NXP - Pdf.Support

1. Product profile

1.1 General description

The PMBD7000 consists of two high-speed switching diodes connected in series,

fabricated in planar technology, and encapsulated in a small SOT23 (TO-236AB)

Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

1.3 Applications

High-speed switching

General-purpose switching

1.4 Quick reference data

[1] When switched from IF= 10 mA to IR=10mA; R

L= 100 Ω; measured at IR=1mA.

PMBD7000

Double high-speed switching diode

Rev. 4 — 16 September 2010 Product data sheet

High switching speed: trr ≤4ns Reverse voltage: VR≤100 V

Repetitive peak forward current:

IFRM ≤450 mA

Repetitive peak rever s e voltage:

VRRM ≤100 V

Small SMD plastic package AEC-Q101 qualified

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IRreverse current VR= 100 V - - 0.5 μA

VRreverse voltage - - 100 V

trr reverse recovery time [1] --4ns

Product data sheet Rev. 4 — 16 September 2010 2 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

2. Pinning information

3. Ordering information

4. Marking

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 anode (diode 1)

2 cathode (diode 2)

3 cathode (diode 1),

anode (diode 2) 12

006aaa76

Table 3. Ordering i nformation

Type number Package

Name Description Version

PMBD7000 - plastic surface-mounted package; 3 leads SOT23

Table 4. Marking codes

Type number Marking code[1]

PMBD7000 *5C

Product data sheet Rev. 4 — 16 September 2010 3 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

5. Limiting values

[1] Single diode loaded.

[2] Double diode loaded.

[3] Tj=25°C prior to surge.

[4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6. Thermal characteristics

[1] Single diode loaded.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRRM repetitive peak reverse

voltage -100V

VRreverse voltage - 100 V

IFforward current [1] -215mA

[2] -125mA

IFRM repetitive peak forward

current -450mA

IFSM non-repetitive peak

forward current square wave [3]

tp=1μs-4A

tp=1ms - 1 A

tp=1s - 0.5 A

Ptot total power dissipation Tamb ≤25 °C[1][4] -250mW

Per device

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1][2] - - 500 K/W

Rth(j-t) thermal resistance from

junction to tie-point - - 360 K/W

Product data sheet Rev. 4 — 16 September 2010 4 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

7. Characteristics

[1] When switched from IF= 10 mA to IR=10mA; R

L= 100 Ω; measured at IR=1mA.

[2] When switched from IF=10mA; t

r=20ns.

Table 7. Characteristics

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VFforward voltage IF= 1 mA - 550 700 mV

IF= 10 mA - 670 820 mV

IF=50mA --1V

IF= 100 mA - 0.75 1.1 V

IF=150mA --1.25V

IRreverse current VR= 50 V - - 300 nA

VR= 100 V - - 500 nA

VR=50V; T

j=150°C - - 100 μA

Cddiode capacitance f = 1 MHz; VR=0V --1.5pF

trr reverse recovery time [1] --4ns

VFR forward recovery voltage [2] --1.75V

FR4 PCB, standard footprint (1) Tj= 150 °C; typical values

(2) Tj=25°C; typical values

(3) Tj=25°C; maximum values

Fig 1. Forward current as a function of ambient

temperature; derating curve Fig 2. Forward current as a function of forward

voltage

mbd033

0 200

300

100

200

100

(mA)

amb

(°C)

single diode loaded

double diode loaded

300

(mA)

100

200

mbg382

1VF (V)

(1) (2) (3)

Product data sheet Rev. 4 — 16 September 2010 5 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

Based on square wave currents.

Tj=25°C; prior to surge (1) VR= 50 V; maximum values

(2) VR= 30 V; typical values

(3) VR= 50 V; typical values

Fig 3. Non-repe titive peak forward current as a

function of pulse duration; maximum values Fig 4. Reverse cu rrent as a function of junction

temperature

f=1MHz; T

amb =25°C

Fig 5. Diode capacitance as a function of reverse voltage; typical values

mbg704

102

IFSM

(A)

10−1

tp (μs)

110

103

10 102

mbg378

105

104

10 200

0100

(nA)

103

102

(1)

Tj (°C)

(2) (3)

0816124

0.8

0.6

0.4

0.2

mbg446

(V)

(pF)

Product data sheet Rev. 4 — 16 September 2010 6 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

(1) IR=1mA

Fig 6. Reverse recovery time test circuit and waveforms

Fig 7. Forward recove ry voltage test circuit and waveforms

trr

(1)

+ I

output signal

10 %

90 %

input signal

V = V

= 50 ΩI

D.U.T.

= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

10 %

90 %

input signal

= 50 Ω

OSCILLOSCOPE

1 kΩ450 Ω

D.U.T.

mga88

VFR

output signal

Product data sheet Rev. 4 — 16 September 2010 7 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 8. Package outline PMBD7000 (SOT23/TO-236AB)

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packin g quantity

3000 10000

PMBD7000 SOT23 4 mm pi tch, 8 mm tape and reel -215 -235

Product data sheet Rev. 4 — 16 September 2010 8 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

11. Soldering

Fig 9. Reflow soldering footprint PMBD7000 (SOT23/TO-236AB)

Fig 10. Wave soldering footprint PMBD7000 (SOT23/TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Product data sheet Rev. 4 — 16 September 2010 9 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMBD7000 v.4 20100916 Product data sheet - PMBD7000_3

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate .

•Table 4 “Marking codes”: updated

•Table 7 “Characteristics”: corrected VF unit for condition IF=150mA

•Figure 2: updated

•Section 8 “Test in formation”: fi gure title of Figure 6 amended

•Section 8.1 “Quality information”: added

•Section 13 “Legal information”: updated

PMBD7000_3 19990511 Product specification - PMBD7000_2

PMBD7000_2 19960918 Product specification - PMBD7000_1

PMBD7000_1 19960419 Product specification - -

Product data sheet Rev. 4 — 16 September 2010 10 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objecti ve specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 16 September 2010 11 of 12

NXP Semiconductors PMBD7000

Double high-speed switching diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PMBD7000

Double high-speed switching diode

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 16 September 2010

Document identifier: PMBD7 000

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 7

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12