WORLD PRODUCTS INC.
ELECTRONIC COMPONENT SOLUTIONS
19654 Eighth Street East, Sonoma, CA 95476-0517 USA • Phone (707) 996-5201 • Fax (707) 996-3380 • www.worldproducts.com
FERRITE BEAD ARRAYS
Revised 10/20/04
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
1
CHIP FERRITE BEAD ARRAYS
Features
1. Available in a wide range of impedance values.
2. Providing excellent EMI suppression characteristics for various types of noise.
3. 4 lines achieved with a single chip, very useful in high density circuit design.
4. Heat generation and crosstalk between adjacent circuits are at minimum.
5. Excellent solderability.
Applications
1. Waveform correction in personal computers, electric equipment, communication equipment, OA equipment.
2. Provides radiated noise countermeasures in interfaces and harness connecting parts.
3. Prevents noise intrusion in video, LCD module, etc.
4. Parallel signal line.
Ordering Information
WPB - 4 M - 3216 - 121 T
(1) (2) (3) (4) (5) (6) (7)
(1) Series
WPB: For signal line
(2) Type
4: Array
(3) Material and Design
H: For general purpose
S: For high speed
M: For high impedance type
T, V: For Low speed
(4) Dimensions*
First two digits: length(mm)
Last two digits: width(mm)
(5) Thickness
A: 0.9mm max
B: 0.7mm max
C: 1.2mm max
(6) Impedence (at 100MHz)
First two digits are impedance values.
Last digit is the number of zeros following.
(7) Packaging
B: Bulk Package
T: Tape & Reel (Φ 178mm [ 7 inch ])
L: Tape & Reel (Φ 254mm [10 inch ])
*2012(mm) is equivalent to 0805 (inches).
3216(mm) is equivalent to 1206 (inches).
Shape & Dimensions
Type L W T C1 C2 D M
2.00±0.15 1.00±0.15 0.60±0.1 0.25±0.15 0.3 max 0.50±0.10 0.2 max
WPB-42010 B [.079±.006] [.063±.008] [.031±.004] [.020±.006] [.012 max] [.020±.004] [.008 max]
3.20±0.2 1.60±0.2 0.80±0.1 0.40±0.15 0.30±0.10 0.80±0.1 0.20±0.1
A [.126±.008] [.063±.008] [.031±.004] [.016±.006] [.012±.004] [.031±.004] [.008±.004]
3.20±0.2 1.60±0.2 0.60±0.1 0.40±0.15 0.30±0.10 0.80±0.10 0.20±0.1
B [.126±.008] [.063±.008] [.024±.004] [.016±.006] [.012±.004] [.031±.004] [.008±.004]
3.2±0.2 1.60±0.2 1.10±0.1 0.40±0.15 0.30±0.10 0.80±0.10 0.20±0.1
WPB-43216
C
[.126±.008] [.063±.008] [.043±.004] [.016±.006] [.012±.004] [.031±.004] [.008±.004]
C2
T
C1
D
L
W
M
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
2
CHIP FERRITE BEAD ARRAYS
Specifications
IZI at 100 MHz(Ω)
Part No. typ min
DCR
(Ω) max
Rated
current
(mA) max
WPB-4M2010-100 10 7.5 0.10 200
WPB-4M2010-400 40 30 0.15 200
WPB-4M2010-600 60 45 0.30 200
WPB-4M2010-800 80 60 0.30 200
WPB-4M2010-121 120 90 0.40 150
WPB-4M2010-201 200 150 0.60 100
WPB-4M2010-301 300 225 0.80 50
WPB-4T2010-100 10 7.5 0.10 200
WPB-4T2010-400 40 30 0.15 200
WPB-4T2010-600 60 45 0.30 200
WPB-4T2010-800 80 60 0.30 200
WPB-4T2010-121 120 90 0.40 150
WPB-4T2010-201 200 150 0.60 100
WPB-4T2010-301 300 225 0.80 50
WPB-4S2010-100 10 7.5 0.20 200
WPB-4S2010-300 30 23 0.30 200
WPB-4S2010-600 60 45 0.40 150
WPB-4S2010-101 100 75 0.50 150
WPB-4H3216-300 30 22 0.10 200
WPB-4M3216-600 60 45 0.12 200
WPB-4M32160-800 80 60 0.15 150
WPB-4M32160-121 120 90 0.20 100
WPB-4M3216-201 200 150 0.30 100
WPB-4M3216-241 240 180 0.40 100
WPB-4M3216-301 300 225 0.45 100
WPB-4M3216-471 470 353 0.45 100
WPB-4M3216-601 600 450 0.50 100
WPB-4M3216-102 1000 750 0.80 100
WPB-4T3216-600 600 450 0.12 200
WPB-4T3216-121 120 90 0.20 200
WPB-4T3216-201 200 150 0.30 150
WPB-4T3216-241 240 180 0.40 150
WPB-4T3216-301 300 225 0.45 150
WPB-4T3216-601 600 450 0.50 100
WPB-4T3216-102 1000 750 0.80 50
WPB-4S2316-500 50 37 0.20 200
WPB-4S3216-800 80 60 0.25 200
WPB-4S3216-121 120 90 0.25 200
WPB-4S3216-201 200 150 0.30 200
WPB-4S3216-241 240 180 0.35 200
WPB-4S3216-301 300 225 0.40 200
WPB-4V3216-400 40 30 0.15 200
WPB-4V3216-600 60 45 0.20 200
WPB-4V3216-800 80 60 0.20 200
WPB-4V3216-121 120 90 0.30 150
WPB-4V3216-201 200 150 0.40 100
WPB-4V3216-301 300 225 0.50 100
* Parts with other electrical characteristics can be provided upon request. * Test equipment : HP4291A + HP161692A
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
3
CHIP FERRITE BEAD ARRAYS
Electrical Characteristics
4 Array 3216 Series
WPB-4H3216A-300 WPB-4M3216A-600 WPB-4M3216A-800
1M 10M 100M 1G
0
20
40
60
80
100
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
50
100
150
200
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
50
100
150
200
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4M3216A-121 WPB-4M3216A-201 WPB-4M3216A-241
1M 10M 100M 1G
0
50
100
150
200
250
300
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4M3216A-301 WPB-4M3216A-471 WPB-4M3216A-601
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
4
CHIP FERRITE BEAD ARRAYS
WPB-4M3216A-102 WPB-4T3216A-121 WPB-4T3216A-201
1M 10M 100M 1G
0
500
1000
1500
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
50
100
150
200
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
50
100
150
200
250
300
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4T3216A-301 WPB-4T3216A-601 WPB-4T3216A-102
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
500
1000
1500
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4S3216A-800 WPB-4S3216A-121 WPB-4S3216A-201
1M 10M 100M 1G
0
50
100
150
200
250
300
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4S3216A-301
1M 10M 100M 1G
0
300
600
900
1200
1500
X
R
Z
Impedance [Ω]
Frequency [Hz]
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
5
CHIP FERRITE BEAD ARRAYS
4 Array 2012 Series
WPB-4M2010B-400 WPB-4M2010B-600 WPB-4M2010B-121
1M 10M 100M 1G
0
50
100
150
200
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
50
100
150
200
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
WPB-4M2010B-201 WPB-4M2010B-301
1M 10M 100M 1G
0
100
200
300
400
500
X
R
Z
Impedance [Ω]
Frequency [Hz]
1M 10M 100M 1G
0
200
400
600
800
1000
X
R
Z
Impedance [Ω]
Frequency [Hz]
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
6
CHIP FERRITE BEAD ARRAYS
Reliability and Test Conditions
REQUIREMENTS
ITEM
3216 2012
TEST CONDITION
Operating temp.range -55°C~+125°C -
Storage temp. & humidity range 40°C max. , 70% RH max. at packing condition
Resistance to solder heat 1. No damage such as cracks should be caused in chip
element.
2. More than 75% of the terminal electrode shall be
covered with new solder.
3. Impedance change: ±30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 260 ± 10°C
Dipping time: 10 ± 0.5sec.
Solderability 1. More than 90% of the terminal electrode shall be
covered with new solder.
2. Inductance change : ± within 5%
3. Impedance change: ±30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 230 ± 10°C
Dipping time: 3 ± 1sec.
Reflow soldering 1. More than 50% of the terminal electrode shall be
covered with new solder.
ST
S T * 0.5
Preheat temperature: 150°C
Preheat time: 1min
Solder temperature: 230 ± 10°C
Dipping time: 3 ± 1sec.
1. No mechanical damage. Tensile strength
(Terminal strength)
Unit : Kgf(W)
W 1.2(1.0) 0.6 ”T”max. 0.7mm
W
W (kgf) min.
1. No mechanical damage Adhension of Terminal electrode
(Flexure strength)
Unit : mm (a,b,c), Kgf(W)
a 0.8 0.5 -
b 0.8 0.5 -
c 3.0 2.0 -
d 0.4 0.25 -
W 5.0 2.0 -
Land pattern
R 0.5
W
ad
c
b
1. The body shall not be damaged by forces applied (see
illustration.)
Body strength (Bending strength)
Unit : mm (d), Kgf(W)
d 2.0 1.3 -
W 3.0 2.0 -
R 0.5
W
d
T
1.0mm
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
7
CHIP FERRITE BEAD ARRAYS
Reliability and Test Conditions
REQUIREMENTS
ITEM
3216 2012
TEST CONDITION
Drop 1. No mechanical damage
2. Impedance change: ±within 30%
Drop 10 times on a concrete
Floor from a height of 91cm
Vibration 1. No mechanical damage
2. Impedance change: ±within 30%
Frequency: 10~55~10Hz
Amplitude: 1.52mm
Direction and time: X,Y,Z
directions for 2 hours
Thermal shock (Temperature cycle) 1. No mechanical damage
2. Impedance change: ± within 30%
Step1. -40 ± 3°C 30 ± 3min.
Step2. 85 ± 3°C 30 ± 3min.
Number of cycle: 100 times
Heat load resistance
1. No mechanical damage
2. Impedance change: ± within 30%
Temperature: 85 ± 2°C
Applied current: rated current
Time: 1,000 hours
Measured at ambient temperature
after placing for 24 hours
Low temp. resistance 1. No mechanical damage
2. Impedance change: ± within 30%
Temperature: -40 ± 5°C
Time: 1,000 hours
Measured at ambient temperature
after placing for 24 hours
Humidity resistance 1. No mechanical damage
2. Impedance change: ± within 30%
Temperature: 40 ± 2°C
Humidity: 90~95% RH
Applied current: rated current
Time: 500 hours
Measured at ambient temperature
after placing for 24 hours
Humidity load resistance 1. No mechanical damage
2. Impedance change: ± within 30%
Temperature: 40 ±2°C
Humidity: 90~95% RH
Applied current: rated current
Time: 500 hours
Measured at ambient temperature
after placing for 24 hours
Cross 1. Cross talk: Max –30dB
2. Cross talk= 20 log (Vx/Vin)
Drop voltage: 5V
Pulse Width: 100ns
Pulse duration: 16.6 ms
Test diagram: Fig. 1
Pulse generator
Digital Storage
OSC
ba
1
2
3
4
Fig. 1 Cross talk test diagram
Drop voltage (a~b): Vin (5Vrms)
Output voltage(1,2,3,~4): Vx
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
8
CHIP FERRITE BEAD ARRAYS
Land Pattern Design
ad
bc
Labeling
Label
1) Part name.
2) Lot No.
3) Quantity.
Standard quantity for packing
Tape & reel Bulk
Packing Type(EIA) Reel Inner box Carton box Vinyl or Cassette
3,000 30,000 120,000
3216 7,000 70,000 280,000
As requested
*Packing method can be changed upon request.
Tape Dimensions
Embossing 8mm
unit: mm
Type A ± 0.1 B ± 0.1 P ± 0.1 K0 ± 0.1 T (max.)
1.90 3.60 4.0 1.00 0.3
3216 1.90 3.60 4.0 1.35 0.3
T
8. 0 ± 0.3
P
A
B
2.0 ± 0.05
4.0 ± 0.1
CHIP CAVITY
SPROCKET HOLE
Φ1.5 + 0.1, - 0 1.75 ± 0.1
3.5 ± 0.05
unit : mm
Ko
unit: mm
Size a b c d
3216 0.8 0.8 3.0 0.5
2012 0.5 0.5 1.5 0.4
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
9
CHIP FERRITE BEAD ARRAYS
Leader and Blank Portion
The pitch holes shift within ±0.3mm for cumulative 10 pitches.
Reel Dimensions
Type W (mm)
3216 Array 9.0 ± 0.3
Top Cover Tape Strength
The force for tearing off top cover tape is 20 to 70 grams in the arrow direction.
10 to 20 pitches 20 to 40 pitches 210 to 250mm
Leader
Drawing direction
Chips
Blank Blank
less than 1.5
R1.0
2.0 ± 0.8
Φ178 ± 2.0
Φ254 ± 2.0
Φ21.0 ± 0.8
unit : mm
Φ13.0 ± 0.5
More than 50
W
Top cover tape
165° to 180°
Embossing tape
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380 www.worldproducts.com 102004 Rev. 9.0
10
CHIP FERRITE BEAD ARRAYS
Soldering Profile
REFLOW SOLDERING(Peak 230°C) REFLOW SOLDERING (Peak 250°C)
FLOW SOLDERING MANUAL SOLDERING
Precaution for Storage
Electrical characteristics of product will not change when stored under typical environmental conditions. However, it is possible that the
solderability of terminal electrodes and the characteristics of the tape packaging can change during storage. For this reason, the following
storage guidelines should be followed.
1. Storage Environment: The tape packaging material is designed to withstand long-term storage but they will degrade more rapidly in
the presence of high temperature or high humidity. Therefore, product shall be stored in an ambient temperature of less than 40°C
with a relative humidity of less than 70%. The products should be used within 6 months of receipt. To achieve best solderability,
product should be used as soon as possible after unpacking. Leftover product must be stored in dry condition with desiccant.
2. Corrosive gases: Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the product
in an environment free of such gases.
3. Temperature fluctuations: Dew condensation may occur when the product is taken out of storage due to variation of temperature. It is
important to maintain a temperature-controlled environment.
300
200°C
230°C
150°C
0 50 100 150 200 250
60 sec. min.
20 sec. max.
Soldering
10 sec. max.
Cooling
60 sec. min. 250°C
220°C
190°C
150°C
0 50 100 150 200 250 300
350
100 sec. min.
60 sec. max.
Soldering
10 sec. max.
175°C
250°C
150°C
0 50 100 150 200
60 sec. min.
Dipping
10 sec. max.
Cooling
60 sec. min.
Preheating
100 sec. max.
∆T≤200°C/ .5 sec
300°C
Tc°C
soldering
2 sec max.
solder iron
30w max.
Diameter of
solder iron
1.2mm max.
∆
T
180°C
