DPG 60 C 300 HB
ns
HiPerFRED²
Symbol Definition
R a t i n g s
Features / Advantages:
typ. max.
I
FSM
I
R
A
V
360
IA
V
F
1.34
R0.95 K/W
V
R
=
1 2 3
min.
30
t = 10 ms
Applications:
V
RRM
V300
1T
VJ
V°C=
T
VJ
°C=mA0.1
Package:
Part number
V
R
=
T
VJ
=°C
I
F
=A
V
T
C
=135°C
d =
P
tot
160 WT
C
°C=
T
VJ
175 °C-55
V
I
RRM
=
=300
30
30
T
VJ
=45°C
DPG 60 C 300 HB
V
A
300
V300
25
25
25
max. repetitive reverse voltage
reverse current
forward voltage
virtual junction temperature
total power dissipation
max. forward surge current
Conditions Unit
1.63
T
VJ
°C=25
C
J
j
unction capacitance V = V; T
150
V
F0
V0.70T
VJ
=175°C
r
F
10.5
f = 1 MHz = °C25
mΩ
V1.06T
VJ
=°C
I
F
=A
V
30
1.39
I
F
=A60
I
F
=A60
2x
threshold voltage
slope resistance for power loss calculation only
Backside: cathode
3A
T
VJ
=°C
reverse recovery time
A7
35
55
ns
(50 Hz), sine
t
rr
=35 ns
● Housing:
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Common Cathode
TO-247
●rIndustry standard outline
●rEpoxy meets UL 94V-0
●rRoHS compliant
RVJ
I
RM
max. reverse recovery current
I
F
=A;30
25
T=125°C
VJ
-di
F
=A/µs200/dtt
rr
V
R
=V200
T
VJ
=°C25
T=125°C
VJ
µA
50150 pF
thermal resistance junction to case
thJC
rectangular 0.5
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
FAV
average forward current
FAV
150
IXYS reserves the right to change limits, conditions and dimensions.
©
20100125b
Data according to IEC 60747and per diode unless otherwise specified
2010 IXYS all rights reserved
http://store.iiic.cc/
DPG 60 C 300 HB
I
RMS
A
per pin 50
R
thCH
K/W0.25
M
D
Nm1.2
mounting torque 0.8
T
stg
°C150
storage temperature -55
Weight g6
Symbol Definition Ratings
typ. max.min.Conditions
RMS current
thermal resistance case to heatsink
Unit
I is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
F
C
N120
mounting force with clip 20
Ordering Delivering Mode Base Qty Code Key
Standard
Part Name
DPG 60 C 300 HB 502163Tube 30
XXXXXX
YYWW
Logo
Marking on product
DateCode
Assembly Code
abcdef
Product Marking
D
P
G
60
C
300
HB
Part number
Diode
HiPerFRED
extreme fast
Common Cathode
TO-247AD (3)
=
=
=
DPG60C300QB
DPG60C300HJ
DPG60C300PC
DPF60C300HB
TO-3P (3)
ISOPLUS247 (3)
TO-263AB (D2Pak)
TO-247AD (3)
Similar Part Package
1)
1
)
Marking on Product
DPG60C300HB
300
300
300
300
Voltage Class
Current Rating [A]
Reverse Voltage [V]
=
=
=
=
RMS
DPG80C300HB TO-247AD (3) 300
IXYS reserves the right to change limits, conditions and dimensions.
©
20100125b
Data according to IEC 60747and per diode unless otherwise specified
2010 IXYS all rights reserved
http://store.iiic.cc/
DPG 60 C 300 HB
Sym. Inches Millimeter
min. max. min. max.
A 0.185 0.209 4.70 5.30
A1 0.087 0.102 2.21 2.59
A2 0.059 0.098 1.50 2.49
D 0.819 0.845 20.79 21.45
E 0.610 0.640 15.48 16.24
E2 0.170 0.216 4.31 5.48
e 0.215 BSC 5.46 BSC
L 0.780 0.800 19.80 20.30
L1 - 0.177 - 4.49
Ø P 0.140 0.144 3.55 3.65
Q 0.212 0.244 5.38 6.19
S 0.242 BSC 6.14 BSC
b 0.039 0.055 0.99 1.40
b2 0.065 0.094 1.65 2.39
b4 0.102 0.135 2.59 3.43
c 0.015 0.035 0.38 0.89
D1 0.515 - 13.07 -
D2 0.020 0.053 0.51 1.35
E1 0.530 - 13.45 -
Ø P1 - 0.29 - 7.39
Outlines TO-247
IXYS reserves the right to change limits, conditions and dimensions.
©
20100125b
Data according to IEC 60747and per diode unless otherwise specified
2010 IXYS all rights reserved
http://store.iiic.cc/
DPG 60 C 300 HB
0.0 0.4 0.8 1.2 1.6 2.0
10
20
30
40
50
60
70
80
0 200 400 600
20
30
40
50
60
70
1 10 100 1000 10000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
04080120160
0.2
0.4
0.6
0.8
1.0
1.2
1.4
K
f
T
VJ
[°C] -di
F
/dt [A/µs]
t[ms]
0 200 400 600
0
100
200
300
400
500
600
0
2
4
6
8
10
12
0 200 400 600
2
4
6
8
10
12
14
16
0 200 400 600
0.1
0.2
0.3
0.4
Q
rr
[µC]
V
F
[V] -di
F
/dt [A/µs]
Z
thJC
[K/W]
I
F
= 60 A
30 A
15 A
I
RM
Q
rr
V
FR
t
fr
T
VJ
= 150°C
Fig. 1 Forward current I
F
versus
forward voltage V
F
Fig. 2 Typ. reverse recovery charge
Q
rr
versus -di
F
/dt
Fig. 3 Typ. reverse recovery current
I
RM
versus -di
F
/dt
Fig. 4 Dynamic parameters
Q
rr
,I
RM
versus T
VJ
Fig. 5 Typ. reverse recovery time
t
rr
versus -di
F
/dt
Fig. 6 Typ. forward recovery voltage V
FR
& forward recovery time t
fr
vs. di
F
/dt
Fig. 8 Transient thermal impedance junction to case
25°C
I
F
[A]
-di
F
/dt [A/µs]
I
RM
[A]
t
rr
[ns]
-di
F
/dt [A/µs]
t
fr
[ns]
V
FR
[V]
0 200 400 600
2
4
6
8
10
12
14
16
E
rec
[µJ]
-di
F
/dt [A/µs]
Fig. 7 Typ. recovery energy
E
rec
versus -di
F
/dt
R
thi
[K/W]
0.1311
0.1377
0.3468
0.2394
0.095
t
i
[s]
0.0018
0.002
0.012
0.07
0.345
I
F
= 15 A
30 A
60 A
T
VJ
= 125°C
V
R
= 200 V
T
VJ
= 125°C
V
R
= 200 V
T
VJ
= 125°C
V
R
=200 V
T
VJ
= 125°C
V
R
=200 V
I
F
= 30 A
T
VJ
= 125°C
V
R
= 200 V
I
F
= 60 A
30 A
15 A
I
F
= 60 A
30 A
15 A
IXYS reserves the right to change limits, conditions and dimensions.
©
20100125b
Data according to IEC 60747and per diode unless otherwise specified
2010 IXYS all rights reserved
http://store.iiic.cc/
