MAX11102ATB+T - MAXIM INTEGRATED PRODUCTS

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

EVALUATION KIT AVAILABLE

General Description

The MAX11102/MAX11103/MAX11105/MAX11106/

MAX11110/MAX11111/MAX11115/MAX11116/

MAX11117 are 12-/10-/8-bit, compact, high-speed, low-

power, successive approximation analog-to-digital con-

verters (ADCs). These high-performance ADCs include a

high-dynamic range sample-and-hold and a high-speed

serial interface. These ADCs accept a full-scale input

from 0V to the power supply or to the reference voltage.

The MAX11102/MAX11103/MAX11106/MAX11111 fea-

ture dual, single-ended analog inputs connected to the

ADC core using a 2:1 MUX. The devices also include a

separate supply input for data interface and a dedicated

input for reference voltage. In contrast, the single-chan-

nel devices generate the reference voltage internally

from the power supply.

These ADCs operate from a 2.2V to 3.6V supply and

consume only 5.2mW at 3Msps and 3.7mW at 2Msps.

The devices include full power-down mode and fast

wake-up for optimal power management and a high-

speed 3-wire serial interface. The 3-wire serial interface

directly connects to SPI, QSPIK, and MICROWIRE®

devices without external logic.

Excellent dynamic performance, low voltage, low power,

ease of use, and small package size make these con-

verters ideal for portable battery-powered data-acquisi-

tion applications, and for other applications that demand

low-power consumption and minimal space.

These ADCs are available in a 10-pin TDFN package,

10-pin FMAX® package, and a 6-pin SOT23 package.

These devices operate over the -40NC to +125NC tem-

perature range.

Features

S 2Msps/3Msps Conversion Rate, No Pipeline Delay

S 12-/10-/8-Bit Resolution

S 1-/2-Channel, Single-Ended Analog Inputs

S Low-Noise 73dB SNR

S Variable I/O: 1.5V to 3.6V (Dual-Channel Only)

Allows the Serial Interface to Connect Directly

to 1.5V, 1.8V, 2.5V, or 3V Digital Systems

S 2.2V to 3.6V Supply Voltage

S Low Power

3.7mW at 2Msps

5.2mW at 3Msps

Very Low Power Consumption at 2.5µA/ksps

S External Reference Input (Dual-Channel Devices Only)

S 1.3µA Power-Down Current

S SPI-/QSPI-/MICROWIRE-Compatible Serial

Interface

S 10-Pin, 3mm x 3mm TDFN Package

S 10-Pin, 3mm x 5mm µMAX Package

S 6-Pin, 2.8mm x 2.9mm SOT23 Package

S Wide -40NC to +125NC Operation

Applications

Data Acquisition

Portable Data Logging

Medical Instrumentation

Battery-Operated Systems

Communication Systems

Automotive Systems

19-5245; Rev 8; 7/13

Note: All devices are specified over the -40°C to +125°C operating temperature range.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed pad.

Ordering Information continued at end of data sheet.

Ordering Information

QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National Semiconductor Corp.

µMAX is a registered trademark of Maxim Integrated Products, Inc.

PART PIN-PACKAGE BITS SPEED (Msps) NO. OF CHANNELS TOP MARK

MAX11102AUB+ 10 FMAX-EP* 12 2 2 +ABBA

MAX11102AUB/V+ 10 FMAX-EP* 12 2 2 +ABBR

MAX11102ATB+ 10 TDFN-EP* 12 2 2 +AWI

MAX11103AUB+ 10 FMAX-EP* 12 3 2 +AAAU

MAX11103ATB+ 10 TDFN-EP* 12 3 2 +AWV

For pricing, delivery, and ordering information, please contact Maxim Direct

at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.

2 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

VDD to GND ............................................................-0.3V to +4V

REF, OVDD, AIN1, AIN2, AIN to GND ........-0.3V to the lower of

(VDD + 0.3V) and +4V

CS, SCLK, CHSEL, DOUT TO GND ............-0.3V to the lower of

(VOVDD + 0.3V) and +4V

AGND to GND ......................................................-0.3V to +0.3V

Input/Output Current (all pins) ...........................................50mA

Continuous Power Dissipation (TA = +70NC)

6-Pin SOT23 (derate 8.7mW/NC above +70NC) ...........696mW

10-Pin TDFN (derate 24.4mW/NC above +70NC) .......1951mW

10-Pin FMAX (derate 8.8mW/NC above +70NC)........707.3mW

Operating Temperature Range ....................... .-40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range ............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. MAX11102: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11103: fSCLK = 48MHz,

50% duty cycle, 3Msps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 12 Bits

Integral Nonlinearity INL Q1 LSB

Differential Nonlinearity DNL No missing codes Q1 LSB

Offset Error OE Q0.3 Q3 LSB

Gain Error GE Excluding offset and reference errors Q1Q3 LSB

Total Unadjusted Error TUE Q1.5 LSB

Channel-to-Channel Offset

Matching Q0.4 LSB

Channel-to-Channel Gain

Matching Q0.05 LSB

DYNAMIC PERFORMANCE (MAX11103: fAIN_ = 1MHz, MAX11102: fAIN_ = 0.5MHz)

Signal-to-Noise and Distortion SINAD MAX11103 70 72 dB

MAX11102 70 72.5

Signal-to-Noise Ratio SNR MAX11103 70.5 72 dB

MAX11102 70.5 73

Total Harmonic Distortion THD MAX11103 -85 -75 dB

MAX11102 -85 -76

Spurious-Free Dynamic Range SFDR MAX11103 76 85 dB

MAX11102 77 85

Intermodulation Distortion IMD MAX11103: f1 = 1.0003MHz, f2 = 0.99955MHz

MAX11102: f1 = 500.15kHz, f2 = 499.56kHz -84 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 68dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

Crosstalk -90 dB

3Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103) (continued)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. MAX11102: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11103: fSCLK = 48MHz,

50% duty cycle, 3Msps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

CONVERSION RATE

Throughput MAX11103 0.03 3 Msps

MAX11102 0.02 2

Conversion Time MAX11103 260 ns

MAX11102 391

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial-Clock Frequency fCLK MAX11103 0.48 48 MHz

MAX11102 0.32 32

ANALOG INPUT (AIN1, AIN2)

Input Voltage Range VAIN_ 0 VREF V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN_ Track 20 pF

Hold 4

EXTERNAL REFERENCE INPUT (REF)

Reference Input-Voltage Range VREF 1VDD +

0.05 V

Reference Input Leakage

Current IILR Conversion stopped 0.005 Q1FA

Reference Input Capacitance CREF 5 pF

DIGITAL INPUTS (SCLK, CS, CHSEL)

Digital Input High Voltage VIH 0.75 x

VOVDD V

Digital Input Low Voltage VIL 0.25 x

VOVDD V

Digital Input Hysteresis VHYST 0.15 x

VOVDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

DIGITAL OUTPUT (DOUT)

Output High Voltage VOH ISOURCE = 200FA0.85 x

VOVDD V

Output Low Voltage VOL ISINK = 200FA0.15 x

VOVDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

4 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103) (continued)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. MAX11102: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11103: fSCLK = 48MHz,

50% duty cycle, 3Msps. CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

ELECTRICAL CHARACTERISTICS (MAX11105)

(VDD = 2.2V to 3.6V, fSCLK = 32MHz, 50% duty cycle, 2Msps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Digital I/O Supply Voltage VOVDD 1.5 VDD V

Positive Supply Current

(Full-Power Mode)

IVDD MAX11103, VAIN_ = VGND 3.3

MAX11102, VAIN_ = VGND 2.6

IOVDD MAX11103, VAIN_ = VGND 0.33

MAX11102, VAIN_ = VGND 0.22

Positive Supply Current (Full-

Power Mode), No Clock IVDD MAX11103 1.98 mA

MAX11102 1.48

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V, VREF = 2.2V 0.7 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge t4Figure 2, VOVDD = 2.2V - 3.6V 15 ns

Figure 2, VOVDD = 1.5V - 2.2V 16.5

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 12 Bits

Integral Nonlinearity INL Q1 LSB

Differential Nonlinearity DNL No missing codes Q1 LSB

Offset Error OE Q0.3 Q3 LSB

Gain Error GE Excluding offset and reference errors Q1Q3 LSB

Total Unadjusted Error TUE Q1.5 LSB

DYNAMIC PERFORMANCE

Signal-to-Noise and Distortion SINAD fAIN = 500kHz 70 72.5 dB

Signal-to-Noise Ratio SNR fAIN = 500kHz 70.5 73 dB

5Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11105) (continued)

(VDD = 2.2V to 3.6V, fSCLK = 32MHz, 50% duty cycle, 2Msps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Total Harmonic Distortion THD fAIN = 500kHz -85 -76 dB

Spurious-Free Dynamic Range SFDR fAIN = 500kHz 77 85 dB

Intermodulation Distortion IMD f1 = 500.15 kHz, f2 = 499.56 kHz -84 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 68dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

CONVERSION RATE

Throughput 0.02 2 Msps

Conversion Time 391 ns

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial Clock Frequency fCLK 0.32 32 MHz

ANALOG INPUT

Input Voltage Range VAIN 0 VDD V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN Track 20 pF

Hold 4

DIGITAL INPUTS (SCLK, CS, CHSEL)

Digital Input High Voltage VIH 0.75 x

VVDD V

Digital Input Low Voltage VIL 0.25 x

VVDD V

Digital Input Hysteresis VHYST 0.15 x

VVDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

DIGITAL OUTPUT (DOUT)

Output High Voltage VOH ISOURCE = 200FA0.85 x

VVDD V

Output Low Voltage VOL ISINK = 200FA0.15 x

VVDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Positive Supply Current

(Full-Power Mode) IVDD VAIN = VGND 2.6 mA

6 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11105) (continued)

(VDD = 2.2V to 3.6V, fSCLK = 32MHz, 50% duty cycle, 2Msps, CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.)

ELECTRICAL CHARACTERISTICS (MAX11106)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 48MHz, 50% duty cycle, 3Msps; CDOUT = 10pF, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Positive Supply Current (Full-

Power Mode), No Clock IVDD 1.48 mA

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V 0.7 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge t4Figure 2, VDD = +2.2V to +3.6V 15 ns

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 10 Bits

Integral Nonlinearity INL Q0.4 LSB

Differential Nonlinearity DNL No missing codes Q0.4 LSB

Offset Error OE Q0.5 Q1 LSB

Gain Error GE Excluding offset and reference errors 0Q1 LSB

Total Unadjusted Error TUE Q0.5 LSB

Channel-to-Channel Offset

Matching Q0.05 LSB

Channel-to-Channel Gain

Matching Q0.05 LSB

DYNAMIC PERFORMANCE

Signal-to-Noise and Distortion SINAD fAIN_ = 1MHz 61 61.8 dB

Signal-to-Noise Ratio SNR fAIN_ = 1MHz 61 61.8 dB

Total Harmonic Distortion THD fAIN_ = 1MHz -83 -74 dB

Spurious-Free Dynamic Range SFDR fAIN_ = 1MHz 75 dB

7Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11106) (continued)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 48MHz, 50% duty cycle, 3Msps; CDOUT = 10pF, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Intermodulation Distortion IMD f1 = 1.0003MHz, f2 = 0.99955MHz -82 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 60dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

Crosstalk -90 dB

CONVERSION RATE

Throughput 0.03 3 Msps

Conversion Time 260 ns

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial-Clock Frequency fCLK 0.48 48 MHz

ANALOG INPUT (AIN1, AIN2)

Input Voltage Range VAIN_ 0 VREF V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN-_Track 20 pF

Hold 4

EXTERNAL REFERENCE INPUT (REF)

Reference Input-Voltage Range VREF 1VDD +

0.05 V

Reference Input Leakage

Current IILR Conversion stopped 0.005 Q1FA

Reference Input Capacitance CREF 5 pF

DIGITAL INPUTS (SCLK, CS, CHSEL)

Digital Input-High Voltage VIH 0.75 x

VOVDD V

Digital Input-Low Voltage VIL 0.25 x

VOVDD V

Digital Input Hysteresis VHYST 0.15 x

VOVDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

DIGITAL OUTPUT (DOUT)

Output-High Voltage VOH ISOURCE = 200µA 0.85 x

VOVDD V

Output-Low Voltage VOL ISINK = 200µA 0.15 x

VOVDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

8 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11106) (continued)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 48MHz, 50% duty cycle, 3Msps; CDOUT = 10pF, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.)

ELECTRICAL CHARACTERISTICS (MAX11110/MAX11117)

(VDD = 2.2V to 3.6V. MAX11110: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11117: fSCLK = 48MHz, 50% duty cycle, 3Msps.

CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Digital I/O Supply Voltage VOVDD 1.5 VDD V

Positive Supply Current (Full-

Power Mode)

IVDD VAIN_ = VGND 3.3 mA

IOVDD VAIN_ = VGND 0.33

Positive Supply Current (Full-

Power Mode), No Clock IVDD 1.98 mA

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V, VREF = 2.2V 0.17 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge (Figure 2) t4VOVDD = 2.2V - 3.6V 15 ns

VOVDD = 1.5V - 2.2V 16.5

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 10 Bits

Integral Nonlinearity INL Q1 LSB

Differential Nonlinearity DNL No missing codes Q1 LSB

Offset Error OE MAX11117 Q0.5 Q1.65 LSB

MAX11110 Q0.3 Q1.2

Gain Error GE

Excluding offset and reference errors,

MAX11117 Q0.7 Q1.4

LSB

Excluding offset and reference errors,

MAX11110 Q0.15 Q1

Total Unadjusted Error TUE Q1 LSB

9Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11110/MAX11117) (continued)

(VDD = 2.2V to 3.6V. MAX11110: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11117: fSCLK = 48MHz, 50% duty cycle, 3Msps.

CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DYNAMIC PERFORMANCE (MAX11117: fAIN = 1MHz, MAX11110: fAIN = 0.5MHz)

Signal-to-Noise and Distortion SINAD MAX11117 59 61.5 dB

MAX11110 60.5 61.5

Signal-to-Noise Ratio SNR MAX11117 59 61.5 dB

MAX11110 60.5 61.5

Total Harmonic Distortion THD MAX11117 -85 -74 dB

MAX11110 -85 -73

Spurious-Free Dynamic Range SFDR MAX11117 75 dB

MAX11110 75

Intermodulation Distortion IMD MAXX11117: f1 = 1.0003MHz, f2 = 0.99955MHz

MAX11110: f1 = 500.15kHz, f2 = 499.56kHz -82 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 60dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

CONVERSION RATE

Throughput MAX11117 0.03 3 Msps

MAX11110 0.02 2

Conversion Time MAX11117 260 ns

MAX11110 391

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial Clock Frequency fCLK MAX11117 0.48 48 MHz

MAX11110 0.32 32

ANALOG INPUT (AIN)

Input Voltage Range VAIN 0 VDD V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN Track 20 pF

Hold 4

DIGITAL INPUTS (SCLK, CS, CHSEL)

Digital Input-High Voltage VIH 0.75 x

VDD V

Digital Input-Low Voltage VIL 0.25 x

VDD V

Digital Input Hysteresis VHYST 0.15 x

VDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

10 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11110/MAX11117) (continued)

(VDD = 2.2V to 3.6V. MAX11110: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11117: fSCLK = 48MHz, 50% duty cycle, 3Msps.

CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DIGITAL OUTPUT (DOUT)

Output-High Voltage VOH ISOURCE = 200µA 0.85 x

VDD V

Output-Low Voltage VOL ISINK = 200µA 0.15 x

VDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Positive Supply Current

(Full-Power Mode) IVDD MAX11117, VAIN = VGND 3.55 mA

MAX11110, VAIN = VGND 2.6

Positive Supply Current

(Full-Power Mode), No Clock IVDD MAX11117 1.98 mA

MAX11110 1.48

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V 0.17 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge t4Figure 2, VDD = +2.2V to +3.6V 15 ns

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

11Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11111)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 48MHz, 50% duty cycle, 3Msps, CDOUT = 10pF, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 8 Bits

Integral Nonlinearity INL Q0.15 LSB

Differential Nonlinearity DNL No missing codes Q0.15 LSB

Offset Error OE 0.45 Q0.7 LSB

Gain Error GE Excluding offset and reference errors 0Q0.2 LSB

Total Unadjusted Error TUE 0.5 LSB

Channel-to-Channel Offset

Matching 0.01 LSB

Channel-to-Channel Gain

Matching 0.01 LSB

DYNAMIC PERFORMANCE

Signal-to-Noise and Distortion SINAD fAIN_ = 1MHz 49 49.8 dB

Signal-to-Noise Ratio SNR fAIN_ = 1MHz 49 49.8 dB

Total Harmonic Distortion THD fAIN_ = 1MHz -75 -67 dB

Spurious-Free Dynamic Range SFDR fAIN_ = 1MHz 63 67 dB

Intermodulation Distortion IMD f1 = 1.0003MHz, f2 = 0.99955MHz -65 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 49dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

Crosstalk -90 dB

CONVERSION RATE

Throughput 0.03 3 Msps

Conversion Time 260 ns

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial-Clock Frequency fCLK 0.48 48 MHz

ANALOG INPUT (AIN1, AIN2)

Input Voltage Range VAIN_ 0 VREF V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN_ Track 20 pF

Hold 4

EXTERNAL REFERENCE INPUT (REF)

Reference Input Voltage Range VREF 1VDD +

0.05 V

Reference Input Leakage Current IILR Conversion stopped 0.005 Q1FA

Reference Input Capacitance CREF 5 pF

12 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11111) (continued)

(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD, fSCLK = 48MHz, 50% duty cycle, 3Msps, CDOUT = 10pF, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DIGITAL INPUTS (SCLK, CS)

Digital Input High Voltage VIH 0.75 x

VOVDD V

Digital Input Low Voltage VIL 0.25 x

VOVDD V

Digital Input Hysteresis VHYST 0.15 x

VOVDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

DIGITAL OUTPUT (DOUT)

Output High Voltage VOH ISOURCE = 200µA (Note 2) 0.85 x

VOVDD V

Output Low Voltage VOL ISINK = 200µA (Note 2) 0.15 x

VOVDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Digital I/O Supply Voltage VOVDD 1.5 VDD V

Positive Supply Current

(Full-Power Mode)

IVDD VAIN_ = VGND 3.3 mA

IOVDD VAIN_ = VGND 0.33

Positive Supply Current

(Full-Power Mode), No Clock IVDD 1.98 mA

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V, VREF = 2.2V 0.17 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge (Figure 2) t4VOVDD = 2.2V - 3.6V 15 ns

VOVDD = 1.5V - 2.2V 16.5

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

13Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11115/MAX11116)

(VDD = 2.2V to 3.6V. MAX11115: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11116: fSCLK = 48MHz, 50% duty cycle, 3Msps.

CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DC ACCURACY

Resolution 8 Bits

Integral Nonlinearity INL Q0.25 LSB

Differential Nonlinearity DNL No missing codes Q0.25 LSB

Offset Error OE Q0.45 Q0.75 LSB

Gain Error GE Excluding offset and reference errors Q0.04 Q0.5 LSB

Total Unadjusted Error TUE Q0.75 LSB

DYNAMIC PERFORMANCE (MAX11116: fAIN = 1MHz MAX11115: fAIN = 500kHz)

Signal-to-Noise and Distortion SINAD MAX11116 49 49.5 dB

MAX11115 49 49.5

Signal-to-Noise Ratio SNR MAX11116 49 49.5 dB

MAX11115 49 49.5

Total Harmonic Distortion THD MAX11116 -70 -66 dB

MAX11115 -75 -67

Spurious-Free Dynamic Range SFDR MAX11116 63 66 dB

MAX11115 63 66

Intermodulation Distortion IMD MAX11116: f1 = 1.0003MHz, f2 = 0.99955MHz

MAX11115: f1 = 500.15kHz, f2 = 499.56kHz -65 dB

Full-Power Bandwidth -3dB point 40 MHz

Full-Linear Bandwidth SINAD > 49dB 2.5 MHz

Small-Signal Bandwidth 45 MHz

CONVERSION RATE

Throughput MAX11116 0.03 3 Msps

MAX11115 0.02 2

Conversion Time MAX11116 260 ns

MAX11115 391

Acquisition Time tACQ 52 ns

Aperture Delay From CS falling edge 4 ns

Aperture Jitter 15 ps

Serial-Clock Frequency fCLK MAX11116 0.48 48 MHz

MAX11115 0.32 32

ANALOG INPUT (AIN)

Input Voltage Range VAIN 0 VDD V

Input Leakage Current IILA 0.002 Q1FA

Input Capacitance CAIN Track 20 pF

Hold 4

DIGITAL INPUTS (SCLK, CS)

Digital Input High Voltage VIH 0.75 x

VDD V

14 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

ELECTRICAL CHARACTERISTICS (MAX11115/MAX11116) (continued)

(VDD = 2.2V to 3.6V. MAX11115: fSCLK = 32MHz, 50% duty cycle, 2Msps. MAX11116: fSCLK = 48MHz, 50% duty cycle, 3Msps.

CDOUT = 10pF, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

Note 1: All timing specifications given are with a 10pF capacitor.

Note 2: Guaranteed by design in characterization; not production tested.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Digital Input Low Voltage VIL 0.25 x

VDD V

Digital Input Hysteresis VHYST 0.15

VDD V

Digital Input Leakage Current IIL Inputs at GND or VDD 0.001 Q1FA

Digital Input Capacitance CIN 2 pF

DIGITAL OUTPUT (DOUT)

Output High Voltage VOH ISOURCE = 200µA 0.85 x

VDD V

Output Low Voltage VOL ISINK = 200µA 0.15 x

VDD V

High-Impedance Leakage

Current IOL Q1.0 FA

High-Impedance Output

Capacitance COUT 4 pF

POWER SUPPLY

Positive Supply Voltage VDD 2.2 3.6 V

Positive Supply Current (Full-

Power Mode) IVDD MAX11116, VAIN = VGND 3.55 mA

MAX11115, VAIN = VGND 2.6

Positive Supply Current (Full-

Power Mode), No Clock IVDD MAX11116 1.98 mA

MAX11115 1.48

Power-Down Current IPD Leakage only 1.3 10 FA

Line Rejection VDD = +2.2V to +3.6V 0.17 LSB/V

TIMING CHARACTERISTICS (Note 1)

Quiet Time tQ(Note 2) 4 ns

CS Pulse Width t1(Note 2) 10 ns

CS Fall to SCLK Setup t2(Note 2) 5 ns

CS Falling Until DOUT High-

Impedance Disabled t3(Note 2) 1 ns

Data Access Time After SCLK

Falling Edge t4Figure 2, VDD = +2.2V to +3.6V 15 ns

SCLK Pulse Width Low t5Percentage of clock period (Note 2) 40 60 %

SCLK Pulse Width High t6Percentage of clock period (Note 2) 40 60 %

Data Hold Time From SCLK

Falling Edge t7Figure 3 5 ns

SCLK Falling Until DOUT High-

Impedance t8Figure 4 (Note 2) 2.5 14 ns

Power-Up Time Conversion cycle (Note 2) 1 Cycle

15Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Figure 1. Interface Signals for Maximum Throughput, 12-Bit Devices

Figure 2. Setup Time After SCLK Falling Edge Figure 3. Hold Time After SCLK Falling Edge

Figure 4. SCLK Falling Edge DOUT Three-State

12345678910 11 12 13 14 15 16

16 1

D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

DOUT

SCLK

HIGH

IMPEDANCE

SAMPLE SAMPLE

(MSB)

t3t4t7t8tQUIET

tCONVERT

1/fSAMPLE

tACQ

HIGH

IMPEDANCE

VIH

VIL

NEW DATAOLD DATADOUT

SCLK

VIH

VIL

OLD DATA NEW DATA

DOUT

SCLK

HIGH IMPEDANCE

DOUT

SCLK

16 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

µMAX Typical Operating Characteristics

(MAX11103AUB+, TA = +25°C, unless otherwise noted.)

THD vs. ANALOG INPUT FREQUENCY

MAX11102 toc07

fIN (kHz)

THD (dB)

-110

-100

-90

-80

-70

-60

-120

12009006003000 1500

fS = 3Msps

SNR AND SINAD

vs. ANALOG INPUT FREQUENCY

MAX11102 toc06

fIN (kHz)

SINAD

SNR

SNR AND SINAD (dB)

1200900600300

0 1500

fS = 3Msps

HISTOGRAM FOR 30,000 CONVERSIONS

MAX11102 toc05

DIGITAL CODE OUTPUT

CODE COUNT

204920482047

5000

10,000

15,000

20,000

25,000

30,000

35,000

2046 2050

GAIN ERROR vs. TEMPERATURE

MAX11102 toc04

TEMPERATURE (˚C)

GAIN ERROR (LSB)

1109580655035205-10-25

-2

-1

-3

-40 125

OFFSET ERROR vs. TEMPERATURE

MAX11102 toc03

TEMPERATURE (˚C)

OFFSET ERROR (LSB)

1109580655035205-10-25

-2

-1

-3

-40 125

DIFFERENTIAL NONLINEARITY

vs. DIGITAL OUTPUT CODE

MAX11102 toc02

DIGITAL OUTPUT CODE

DNL (LSB)

300020001000

-0.5

0.5

1.0

-1.0

0 4000

fS = 3.0Msps

INTEGRAL NONLINEARITY

vs. DIGITAL OUTPUT CODE

MAX11102 toc01

DIGITAL OUTPUT CODE

INL (LSB)

300020001000

-0.5

0.5

1.0

-1.0

0 4000

fS = 3.0Msps

17Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

µMAX Typical Operating Characteristics (continued)

(MAX11103AUB+, TA = +25°C, unless otherwise noted.)

SNR vs. REFERENCE VOLTAGE

MAX11102 toc13

VREF (V)

SNR (dB)

3.43.23.02.82.62.4

71.5

72.0

72.5

73.0

73.5

71.0

2.2 3.6

fS = 3Msps

fIN = 1.0183MHz

ANALOG SUPPLY CURRENT

vs. TEMPERATURE

MAX11102 toc12

TEMPERATURE (˚C)

IVDD (mA)

1109580655035205-10-25

2.3

2.6

2.9

3.2

3.5

2.0

-40 125

VDD = 2.2V

VDD = 3.6V

VDD = 3.0V

REFERENCE CURRENT

vs. SAMPLING RATE

MAX11102 toc11

fS (ksps)

IREF (µA)

2500200015001000500

100

150

200

0 3000

1MHz SINE-WAVE INPUT

(16,834-POINT FFT PLOT)

MAX11102 toc10

FREQUENCY (kHz)

AHD3 = -91.2dB

AMPLITUDE (dB)

-100

-80

-60

-40

-20

-120

1000 12507505002500 1500

fS = 3.0Msps

fIN = 1.0183MHz

AHD2 = -110.3dB

THD vs. INPUT RESISTANCE

MAX11102 toc09

RIN (I)

THD (dB)

-95

-90

-85

-80

-75

-70

-100

806040200 100

fS = 3.0Msps

fIN = 1.0183MHz

SFDR vs. ANALOG INPUT FREQUENCY

MAX11102 toc08

fIN (kHz)

SFDR (dB)

100

110

120

130

12009006003000 1500

fS = 3Msps

18 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

SOT Typical Operating Characteristics

(MAX11105AUB+, TA = +25°C, unless otherwise noted.)

SNR AND SINAD

vs. ANALOG INPUT FREQUENCY

MAX11102 toc19

fIN (kHz)

SNR

SINAD

SNR AND SINAD (dB)

800600400200

72.0

72.5

73.0

73.5

71.5

0 1000

fS = 2.0Msps

HISTOGRAM FOR 30,000 CONVERSIONS

MAX11102 toc18

DIGITAL CODE OUTPUT

CODE COUNT

204920482047

5000

10,000

15,000

20,000

25,000

30,000

35,000

2046 2050

GAIN ERROR vs. TEMPERATURE

MAX11102 toc17

TEMPERATURE (˚C)

GAIN ERROR (LSB)

1109580655035205-10-25

-3

-2

-1

-4

-40 125

OFFSET ERROR vs. TEMPERATURE

MAX11102 toc16

TEMPERATURE (˚C)

OFFSET ERROR (LSB)

1109580655035205-10-25

-2

-1

-3

-40 125

DIFFERENTIAL NONLINEARITY

vs. DIGITAL OUTPUT CODE

MAX11102 toc15

DIGITAL OUTPUT CODE

DNL (LSB)

300020001000

-0.5

0.5

1.0

-1.0

0 4000

fS = 2.0Msps

INTEGRAL NONLINEARITY

vs. DIGITAL OUTPUT CODE

MAX11102 toc14

DIGITAL OUTPUT CODE

INL (LSB)

300020001000

-0.5

0.5

1.0

-1.0

0 4000

fS = 2.0Msps

19Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

SOT Typical Operating Characteristics (continued)

(MAX11105AUB+, TA = +25°C, unless otherwise noted.)

SNR vs. REFERENCE VOLTAGE (VDD)

MAX11102 toc25

VDD (V)

SNR (dB)

3.43.23.02.82.62.4

2.2 3.6

fS = 2.0Msps

fIN = 500.122kHz

ANALOG SUPPLY CURRENT

vs. TEMPERATURE

MAX11102 toc24

TEMPERATURE (˚C)

IVDD (mA)

1109580655035205-10-25

1.8

2.0

2.2

2.4

2.6

1.6

-40 125

VDD = 2.2V

VDD = 3.6V

VDD = 3.0V

500kHz SINE-WAVE INPUT

(16,834-POINT FFT PLOT)

MAX11102 toc23

FREQUENCY (kHz)

AHD3 = -96.5dB

AMPLITUDE (dB)

-100

-80

-60

-40

-20

-120

7505002500 1000

fS = 2.0Msps

fIN = 500.122kHz

AHD2 = -92.0dB

THD vs. INPUT RESISTANCE

MAX11102 toc22

RIN (I)

THD (dB)

-95

-90

-85

-80

-75

-100

806040200 100

fS = 2.0Msps

fIN = 500.122kHz

SFDR vs. ANALOG INPUT FREQUENCY

MAX11102 toc21

fIN (kHz)

SFDR (dB)

100

105

110

8006004002000 1000

fS = 2.0Msps

THD vs. ANALOG INPUT FREQUENCY

MAX11102 toc20

fIN (kHz)

THD (dB)

-105

-100

-95

-90

-85

-80

-110

8006004002000 1000

fS = 2.0Msps

20 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Pin Description

Pin Configurations

SCLK

OVDD

CHSEL

*CONNECT EXPOSED PAD TO GROUND PLANE. DEVICES DO NOT OPERATE WHEN EP IS NOT CONNECTED TO GROUND!

AGND

REF

MAX11102

MAX11103

MAX11106

MAX11111

DOUTAIN2

AIN1

CSVDD

TDFN

TOP VIEW

EP*

TOP VIEW

GND

SCLKAIN

5 DOUT

VDD

MAX11105

MAX11110

MAX11115

MAX11116

MAX11117

SOT23

µMAX

29DOUTAIN2

110 SCLKAIN1

OVDDAGND 38

CHSELREF 7

CSVDD 6

MAX11102

MAX11103

PIN NAME FUNCTION

TDFN µMAX SOT23

1 1 — AIN1 Analog Input Channel 1. Single-ended analog input with respect to AGND with range

of 0V to VREF.

2 2 — AIN2 Analog Input Channel 2. Single-ended analog input with respect to AGND with range

of 0V to VREF.

— — 3 AIN Analog Input Channel. Single-ended analog input with respect to GND with range of

0V to VDD.

— — 2 GND Ground. Connect GND to the GND ground plane.

3 3 — AGND Analog Ground. Connect AGND directly the GND ground plane.

4 4 — REF

External Reference Input. REF defines the signal range of the input signal AIN1/AIN2:

0V to VREF. The range of VREF is 1V to VDD. Bypass REF to AGND with 10FF || 0.1FF

capacitor.

5 5 1 VDD

Positive Supply Voltage. Bypass VDD with a 10FF || 0.1FF capacitor to GND. VDD

range is 2.2V to 3.6V. For the SOT23 package, VDD also defines the signal range of

the input signal AIN: 0V to VDD.

6 6 6 CS Active-Low Chip-Select Input. The falling edge of CS samples the analog input signal,

starts a conversion, and frames the serial data transfer.

7 7 — CHSEL Channel Select. Set CHSEL high to select AIN2 for conversion. Set CHSEL low to

select AIN1 for conversion.

8 8 — OVDD Digital Interface Supply for SCLK, CS, DOUT, and CHSEL. The OVDD range is 1.5V

to VDD. Bypass OVDD with a 10FF || 0.1FF capacitor to GND.

9 9 5 DOUT Three-State Serial Data Output. ADC conversion results are clocked out on the falling

edge of SCLK, MSB first. See Figure 1.

10 10 4 SCLK Serial Clock Input. SCLK drives the conversion process. DOUT is updated on the fall-

ing edge of SCLK. See Figures 2 and 3.

— — EP GND Exposed Pad (TDFN and FMAX only). Connect EP directly to a solid ground plane.

Devices do not operate unless EP is connected to ground!

21Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Functional Diagrams

Typical Operating Circuit

CDACMUX

REF

AIN2

AIN1

CHSEL

CONTROL

LOGIC

SAR OUTPUT

BUFFER

SCLK

VDD OVDD

DOUT

MAX11102/MAX11103/

MAX11106/MAX11111

CDAC

AIN

CONTROL

LOGIC

SAR OUTPUT

BUFFER

SCLK

DOUT

VDD

GND

VREF = VDD

MAX11105/MAX11110/

MAX11115/MAX11116/

MAX11117

GND (EP)AGND

MAX11102

MAX11103

MAX11106

MAX11111

VDD OVDD

SCLK

CPU

DOUT

CHSEL

AIN1

SCK

MISO

AIN2

AGND

REF

+3V VOVDD

ANALOG

INPUTS

+2.5V

MAX11105

MAX11110

MAX11115

MAX11116

MAX11117

VDD

CPU

AIN

GND

+3V

ANALOG

INPUT

DOUT MISO

SCLK SCK

CS SS

GND (EP)

22 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Detailed Description

The MAX11102/MAX11103/MAX11105/MAX11106/MAX11110/

MAX11111/MAX11115/MAX11116/MAX11117 are fast,

12-/10-/8-bit, low-power, single-supply ADCs. The

devices operate from a 2.2V to 3.6V supply and con-

sume only 8.3mW (VDD = 3V)/5.2mW (VDD = 2.2V) at

3Msps and 6.2mW (VDD = 3V)/3.7mW (VDD = 2.2V) at

2Msps. The 3Msps devices are capable of sampling

at full rate when driven by a 48MHz clock and the

2Msps devices can sample at full rate when driven by

a 32MHz clock. The dual-channel devices provide a

separate digital supply input (OVDD) to power the digi-

tal interface enabling communication with 1.5V, 1.8V,

2.5V, or 3V digital systems.

The conversion result appears at DOUT, MSB first, with a

leading zero followed by the 12-bit, 10-bit, or 8-bit result.

A 12-bit result is followed by two trailing zeros, a 10-bit

result is followed by four trailing zeros, and an 8-bit result

is followed by six trailing zeros. See Figures 1 and 5.

The dual-channel devices feature a dedicated refer-

ence input (REF). The input signal range for AIN1/AIN2

is defined as 0V to VREF with respect to AGND. The

single-channel devices use VDD as the reference. The

input signal range of AIN is defined as 0V to VDD with

respect to GND.

These ADCs include a power-down feature allowing

minimized power consumption at 2.5FA/ksps for lower

throughput rates. The wake-up and power-down feature

is controlled by using the SPI interface as described in

the Operating Modes section.

Serial Interface

The devices feature a 3-wire serial interface that directly

connects to SPI, QSPI, and MICROWIRE devices without

external logic. Figures 1 and 5 show the interface sig-

nals for a single conversion frame to achieve maximum

throughput.

The falling edge of CS defines the sampling instant.

Once CS transitions low, the external clock signal

(SCLK) controls the conversion.

The SAR core successively extracts binary-weighted bits

in every clock cycle. The MSB appears on the data bus

during the 2nd clock cycle with a delay outlined in the

timing specifications. All extracted data bits appear suc-

cessively on the data bus with the LSB appearing during

the 13th/11th/9th clock cycle for 12-/10-/8-bit operation.

The serial data stream of conversion bits is preceded by

a leading “zero” and succeeded by trailing “zeros.” The

data output (DOUT) goes into high-impedance state dur-

ing the 16th clock cycle.

Figure 5. 10-/8-Bit Timing Diagrams

SCLK 12345678910 11 12 13 14 15 16

16 1

SAMPLE SAMPLE

DOUT

HIGH

IMPEDANCE

HIGH

IMPEDANCE

HIGH

IMPEDANCE

HIGH

IMPEDANCE

000D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 00

SAMPLE SAMPLE

SCLK

12345678910 11 12 13 14 15 16

16 1

DOUT 000D7 D6 D5 D4 D3 D2 D1 D0 0000

23Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

To sustain the maximum sample rate, all devices have to

be resampled immediately after the 16th clock cycle. For

lower sample rates, the CS falling edge can be delayed

leaving DOUT in a high-impedance condition. Pull CS

high after the 10th SCLK falling edge (see the Operating

Modes section).

Analog Input

The devices produce a digital output that corresponds to

the analog input voltage within the specified operating

range of 0 to VREF for the dual-channel devices and 0 to

VDD for the single-channel devices.

Figure 6 shows an equivalent circuit for the analog input

AIN (for single-channel devices) and AIN1/AIN2 (for

dual-channel devices). Internal protection diodes D1/D2

confine the analog input voltage within the power rails

(VDD, GND). The analog input voltage can swing from

GND - 0.3V to VDD + 0.3V without damaging the device.

The electric load presented to the external stage driv-

ing the analog input varies depending on which mode

the ADC is in: track mode vs. conversion mode. In track

mode, the internal sampling capacitor CS (16pF) has to

be charged through the resistor R (R = 50I) to the input

voltage. For faithful sampling of the input, the capacitor

voltage on CS has to settle to the required accuracy dur-

ing the track time.

The source impedance of the external driving stage in

conjunction with the sampling switch resistance affects

the settling performance. The THD vs. Input Resistance

graph in the Typical Operating Characteristics shows

THD sensitivity as a function of the signal source imped-

ance. Keep the source impedance at a minimum for

high-dynamic performance applications. Use a high-

performance op amp such as the MAX4430 to drive the

analog input, thereby decoupling the signal source and

the ADC.

While the ADC is in conversion mode, the sampling

switch is open presenting a pin capacitance, CP (CP

= 5pF), to the driving stage. See the Applications

Information section for information on choosing an

appropriate buffer for the ADC.

ADC Transfer Function

The output format is straight binary. The code transi-

tions midway between successive integer LSB values

such as 0.5 LSB, 1.5 LSB, etc. The LSB size for single-

channel devices is VDD/2n and for dual-channel devices

is VREF/2n, where n is the resolution. The ideal transfer

characteristic is shown in Figure 10.

Operating Modes

The ICs offer two modes of operation: normal mode and

power-down mode. The logic state of the CS signal

during a conversion activates these modes. The power-

down mode can be used to optimize power dissipation

with respect to sample rate.

Normal Mode

In normal mode, the devices are powered up at all times,

thereby achieving their maximum throughput rates.

Figure 7 shows the timing diagram of these devices in

normal mode. The falling edge of CS samples the analog

input signal, starts a conversion, and frames the serial

data transfer.

Figure 6. Analog Input Circuit

Figure 7. Normal Mode

AIN1/AIN2

VDD

AIN

RCS

SWITCH CLOSED IN TRACK MODE

SWITCH OPEN IN CONVERSION MODE

12345678910111213141516SCLK

PULL CS HIGH AFTER THE 10TH SCLK FALLING EDGEKEEP CS LOW UNTIL AFTER THE 10TH SCLK FALLING EDGE

DOUT VALID DATA HIGH

IMPEDANCE

HIGH

IMPEDANCE

24 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

To remain in normal mode, keep CS low until the falling

edge of the 10th SCLK cycle. Pulling CS high after the

10th SCLK falling edge keeps the part in normal mode.

However, pulling CS high before the 10th SCLK falling

edge terminates the conversion, DOUT goes into high-

impedance mode, and the device enters power-down

mode. See Figure 8.

Power-Down Mode

In power-down mode, all bias circuitry is shut down

drawing typically only 1.3FA of leakage current. To save

power, put the device in power-down mode between

conversions. Using the power-down mode between

conversions is ideal for saving power when sampling the

analog input infrequently.

Entering Power-Down Mode

To enter power-down mode, drive CS high between the

2nd and 10th falling edges of SCLK (see Figure 8). By

pulling CS high, the current conversion terminates and

DOUT enters high impedance.

Exiting Power-Down Mode

To exit power-down mode, implement one dummy con-

version by driving CS low for at least 10 clock cycles

(see Figure 9). The data on DOUT is invalid during this

dummy conversion. The first conversion following the

dummy cycle contains a valid conversion result.

The power-up time equals the duration of the dummy

cycle, and is dependent on the clock frequency. The

power-up time for 3Msps operation (48MHz SCLK) is

333ns. The power-up time for 2Msps operation (32MHz

SCLK) is 500ns.

Figure 8. Entering Power-Down Mode

Figure 9. Exiting Power-Down Mode

Figure 10. ADC Transfer Function

12345678910111213141

HIGH

IMPEDANCE INVALID

DATA

SCLK

DOUT

INVALID DATA OR HIGH IMPEDANCE HIGH IMPEDANCE

PULL CS HIGH AFTER THE 2ND AND BEFORE THE 10TH SCLK FALLING EDGE

12345678910111213141516N12345678910111213141516

HIGH

IMPEDANCE

HIGH

IMPEDANCE

HIGH

IMPEDANCE

SCLK

DOUT INVALID DATA (DUMMY CONVERSION) VALID DATA

FS - 1.5 x LSB

OUTPUT CODE

ANALOG

INPUT (LSB)

111...111

111...110

111...101

0123 2n-2 2n-1 2n

000...000

000...001

000...010

FULL SCALE (FS):

AIN1/AIN2 = REF (TDFN, µMax)

AIN = VDD (SOT)

n = RESOLUTION

25Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Supply Current vs. Sampling Rate

For applications requiring lower throughput rates, the

user can reduce the clock frequency (fSCLK) to lower the

sample rate. Figure 11 shows the typical supply current

(IVDD) as a function of sample rate (fS) for the 3Msps

devices. The part operates in normal mode and is never

powered down. Figure 13 pertains to the 2Msps devices.

The user can also power down the ADC between con-

versions by using the power-down mode. Figure 12

shows for the 3Msps device that as the sample rate is

reduced, the device remains in the power-down state

longer and the average supply current (IVDD) drops

accordingly. Figure 14 pertains to the 2Msps devices.

Figure 11. Supply Current vs. Sample Rate (Normal Operating

Mode, 3Msps Devices)

Figure 13. Supply Current vs. Sample Rate (Normal Operating

Mode, 2Msps Devices)

Figure 12. Supply Current vs. Sample Rate (Device Powered

Down Between Conversions, 3Msps Devices)

Figure 14. Supply Current vs. Sample Rate (Device Powered

Down Between Conversions, 2Msps Devices)

MAX11102 fig11

fS (ksps)

IVDD (mA)

2500200015001000500

0 3000

VDD = 3V

fSCLK = VARIABLE

16 CYCLES/CONVERSION

fS (ksps)

IVDD (mA)

800600400200

0.5

1.0

1.5

2.0

2.5

3.0

0 1000

VDD = 3V

fSCLK = 48MHz

15001000500

0 2000

VDD = 3V

fSCLK = VARIABLE

16 CYCLES/CONVERSION

fS (ksps)

IVDD (mA)

fS (ksps)

IVDD (mA)

400300200100

0.5

1.0

1.5

2.0

0 500

VDD = 3V

fSCLK = 32MHz

26 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Figure 15. Channel Select Timing Diagram

Dual-Channel Operation

The MAX11102/MAX11103/MAX11106/MAX11111 fea-

ture dual-input channels. These devices use a channel-

select (CHSEL) input to select between analog input AIN1

(CHSEL = 0) or AIN2 (CHSEL = 1). As shown in Figure

15, the CHSEL signal is required to change between the

2nd and 12th clock cycle within a regular conversion to

guarantee proper switching between channels.

14-Cycle Conversion Mode

The ICs can operate with 14 cycles per conversion.

Figure 16 shows the corresponding timing diagram.

Observe that DOUT does not go into high-impedance

mode. Also, observe that tACQ needs to be sufficiently

long to guarantee proper settling of the analog input

voltage. See the Electrical Characteristics table for tACQ

requirements and the Analog Input section for a descrip-

tion of the analog inputs.

Applications Information

Layout, Grounding, and Bypassing

For best performance, use PCBs with a solid ground

plane. Ensure that digital and analog signal lines are

separated from each other. Do not run analog and digital

(especially clock) lines parallel to one another or digital

lines underneath the ADC package. Noise in the VDD

power supply, OVDD, and REF affects the ADC’s perfor-

mance. Bypass the VDD, OVDD, and REF to ground with

0.1FF and 10FF bypass capacitors. Minimize capacitor

lead and trace lengths for best supply-noise rejection.

Choosing an Input Amplifier

It is important to match the settling time of the input

amplifier to the acquisition time of the ADC. The conver-

sion results are accurate when the ADC samples the

input signal for an interval longer than the input signal’s

worst-case settling time. By definition, settling time is

the interval between the application of an input voltage

step and the point at which the output signal reaches

Figure 16. 14-Clock Cycle Operation

DATA CHANNEL AIN1 DATA CHANNEL AIN2

SCLK

CHSEL

DOUT

234567891011121314151612345678910111213141516

DOUT

SCLK

(MSB)

SAMPLE SAMPLE

1/fSAMPLE

tACQ

tCONVERT

234

D10D11

5678910111213141

D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 000

27Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

and stays within a given error band centered on the

resulting steady-state amplifier output level. The ADC

input sampling capacitor charges during the sampling

cycle, referred to as the acquisition period. During this

acquisition period, the settling time is affected by the

input resistance and the input sampling capacitance.

This error can be estimated by looking at the settling of

an RC time constant using the input capacitance and

the source impedance over the acquisition time period.

Figure 17 shows a typical application circuit. The

MAX4430, offering a settling time of 37ns at 16 bits, is

an excellent choice for this application. See the THD

vs. Input Resistance graph in the Typical Operating

Characteristics.

Choosing a Reference

For devices using an external reference, the choice of

the reference determines the output accuracy of the

ADC. An ideal voltage reference provides a perfect initial

accuracy and maintains the reference voltage indepen-

dent of changes in load current, temperature, and time.

Considerations in selecting a reference include initial

voltage accuracy, temperature drift, current source,

sink capability, quiescent current, and noise. Figure 17

shows a typical application circuit using the MAX6126

to provide the reference voltage. The MAX6033 and

MAX6043 are also excellent choices.

Figure 17. Typical Application Circuit

MAX11102

MAX11103

MAX11106

MAX11111

MAX6126

OVDD

VOVDD

SCLK

CPU

DOUT

CHSEL

SCK

MISO

CS SS

0.1µF

1µF

10µF

0.1µF

AGND

AIN1

VDC

AIN2

VDD

10µF

0.1µF

+5V

-5V 470pF

COG CAPACITOR

10I

500I

470pF

COG CAPACITOR

10µF

+5V

10µF

0.1µF

0.1µF 10µF

REF

OUTF IN

OUTS

GNDS

GND

MAX4430

AIN2

VDC

0.1µF

+5V

-5V

10I

10µF

0.1µF 10µF

MAX4430

500I

100pF COG

28 Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Definitions

Integral Nonlinearity

Integral nonlinearity (INL) is the deviation of the values

on an actual transfer function from a straight line. For

these devices, the straight line is a line drawn between

the end points of the transfer function after offset and

gain errors are nulled.

Differential Nonlinearity

Differential nonlinearity (DNL) is the difference between

an actual step width and the ideal value of 1 LSB. A DNL

error specification of ±1 LSB or less guarantees no mis-

sing codes and a monotonic transfer function.

Offset Error

The deviation of the first code transition (00 . . . 000) to

(00 . . . 001) from the ideal, that is, AGND + 0.5 LSB.

Gain Error

The deviation of the last code transition (111 . . . 110) to

(111 . . . 111) from the ideal after adjusting for the offset

error, that is, VREF - 1.5 LSB.

Aperture Jitter

Aperture jitter (tAJ) is the sample-to-sample variation in

the time between the samples.

Aperture Delay

Aperture delay (tAD) is the time between the falling edge

of sampling clock and the instant when an actual sample

is taken.

Signal-to-Noise Ratio (SNR)

SNR is a dynamic figure of merit that indicates the con-

verter’s noise performance. For a waveform perfectly

reconstructed from digital samples, the theoretical maxi-

mum SNR is the ratio of the full-scale analog input (RMS

value) to the RMS quantization error (residual error).

The ideal, theoretical minimum analog-to-digital noise

is caused by quantization error only and results directly

from the ADC’s resolution (N bits):

SNR (dB) (MAX) = (6.02 x N + 1.76) (dB)

In reality, there are other noise sources such as thermal

noise, reference noise, and clock jitter that also degrade

SNR. SNR is computed by taking the ratio of the RMS

signal to the RMS noise. RMS noise includes all spectral

components to the Nyquist frequency excluding the

fundamental, the first five harmonics, and the DC offset.

Signal-to-Noise Ratio and Distortion

(SINAD)

SINAD is a dynamic figure of merit that indicates the

converter’s noise and distortion performance. SINAD

is computed by taking the ratio of the RMS signal to

the RMS noise plus distortion. RMS noise plus distor-

tion includes all spectral components to the Nyquist

frequency excluding the fundamental and the DC offset:

( )

RMS

SIGNAL

SINAD(dB) 20 log NOISE DISTORTION



= ×





Total Harmonic Distortion

Total harmonic distortion (THD) is the ratio of the RMS

sum of the first five harmonics of the input signal to the

fundamental itself. This is expressed as:

2222

2345

VVVV

THD 20 log



+++



= ×





where V1 is the fundamental amplitude and V2–V5 are

the amplitudes of the 2nd- through 5th-order harmonics.

Spurious-Free Dynamic Range (SFDR)

SFDR is a dynamic figure of merit that indicates the low-

est usable input signal amplitude. SFDR is the ratio of

the RMS amplitude of the fundamental (maximum signal

component) to the RMS value of the next largest spuri-

ous component, excluding DC offset. SFDR is specified

in decibels with respect to the carrier (dBc).

Full-Power Bandwidth

Full-power bandwidth is the frequency at which the input

signal amplitude attenuates by 3dB for a full-scale input.

Full-Linear Bandwidth

Full-linear bandwidth is the frequency at which the

signal-to-noise ratio and distortion (SINAD) is equal to a

specified value.

Intermodulation Distortion

Any device with nonlinearities creates distortion prod-

ucts when two sine waves at two different frequencies

(f1 and f2) are applied into the device. Intermodulation

distortion (IMD) is the total power of the IM2 to IM5 inter-

modulation products to the Nyquist frequency relative to

the total input power of the two input tones, f1 and f2. The

individual input tone levels are at -6dBFS.

29Maxim Integrated

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Note: All devices are specified over the -40°C to +125°C operating temperature range.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed pad.

Ordering Information (continued)

Chip Information

PROCESS: CMOS

Package Information

For the latest package outline information and land patterns

(footprints), go to www.maximintegrated.com/packages. Note

that a “+”, “#”, or “-” in the package code indicates RoHS status

only. Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PART PIN-PACKAGE BITS SPEED (Msps) NO. OF CHANNELS TOP MARK

MAX11105AUT+ 6 SOT23 12 2 1 +ACON

MAX11106ATB+ 10 TDFN-EP* 10 3 2 +AWJ

MAX11110AUT+ 6 SOT23 10 2 1 +ACOO

MAX11111ATB+ 10 TDFN-EP* 8 3 2 +AWL

MAX11115AUT+ 6 SOT23 8 2 1 +ACOP

MAX11116AUT+ 6 SOT23 8 3 1 +ACOX

MAX11117AUT+ 6 SOT23 10 3 1 +ACOY

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

10 TDFN-EP T1033+2 21-0137 90-0061

10 µMAX-EP U10E+3 21-0109 90-0148

6 SOT23 U6+1 21-0058 90-0175

Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent

licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and

max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

30 Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000

2Msps/3Msps, Low-Power,

Serial 12-/10-/8-Bit ADCs

MAX11102/03/05/06/10/11/15/16/17

Revision History

REVISION

NUMBER

REVISION

DATE DESCRIPTION PAGES

CHANGED

0 4/10 Initial release of the MAX11102/MAX11103/MAX11105/MAX11110/MAX11115/

MAX11116/MAX11117 —

1 7/10 Initial release of the MAX11106/MAX11111. 1 –30

2 9/10 Corrected the package code of the µMAX package in the Package Information

section. 29

3 10/10 Changed the typical power consumption to 2.2V in the General Description,

Features, and Detailed Description sections. 1, 22

4 2/11 Update style, change voltage in Figure 17. 4, 5, 8, 9, 10,

12, 13, 14, 27

5 8/11 Updated the Ordering Information and Electrical Characteristics sections. 1, 4, 6, 8, 10,

12, 14, 29

6 10/11 Updated Figures 15 and 16. 26, 27

7 9/12 Corrected top mark information in Ordering Information section. 1, 29

8 7/13 Added automotive package for MAX11102 to Ordering Information. 1