STPS5H100 High voltage power Schottky rectifier Main product characteristics K IF(AV) 5A VRRM 100 V Tj (max) 175 C VF(max) 0.61 V K A A K NC Features and benefits DPAK STPS5H100B Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Avalanche specification NC IPAK STPS5H100H Order codes Description Part number Marking This high voltage Schottky barrier rectifier is packaged in DPAK and IPAK, and designed for high frequency miniature switched mode power supplies such as adaptators and on board DC to DC converters. STPS5H100B S5H100 STPS5H100B-TR S5H100 STPS5H100H S5H100H Table 1. Absolute ratings (limiting values) Symbol Parameter Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) RMS forward voltage 10 A IF(AV) Average forward current Tc = 165 C = 0.5 5 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 s F = 1 KHz 1 A IRSM Non repetitive peak reverse current tp = 100 s square 2 A PARM Repetitive peak avalanche power tp = 1 s Tj = 25 C Storage temperature range Tstg Maximum operating junction temperature(1) Tj dV/dt 1. Value dPtot --------------dTj < Critical rate of rise of reverse voltage 1 -------------------------Rth ( j - a ) March 2007 7200 W -65 to + 175 C 175 C 10000 V/s condition to avoid thermal runaway for a diode on its own heatsink Rev 9 1/8 www.st.com 8 Characteristics 1 STPS5H100 Characteristics Table 2. Thermal resistance Symbol Rth(j-c) Table 3. Symbol IR(1) Parameter Junction to case Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM 2.5 C/W Min. Typ. 1.3 Max. Unit 3.5 A 4.5 mA 0.73 IF = 5 A 0.57 0.61 V 0.85 IF = 10 A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.51 x IF(AV) + 0.02IF2(RMS) 2/8 Unit Static electrical characteristics Tj = 25 C VF(2) Value 0.66 0.71 STPS5H100 Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current IF(av)(A) PF(av)(W) 4.0 = 0.1 3.5 6 = 0.2 = 0.5 Rth(j-a)=Rth(j-c) 5 = 0.05 3.0 Average forward current versus ambient temperature ( = 0.5) 2.5 4 =1 Rth(j-a)=80C/W 3 2.0 1.5 2 T T 1.0 0.5 tp =tp/T IF(av) (A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Figure 3. Normalized avalanche power derating versus pulse duration 1 0 =tp/T tp 20 40 0 Figure 4. PARM(tp) PARM(1s) 1 1.2 Tamb(C) 60 80 100 120 140 160 180 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Figure 5. IM(A) 120 110 100 90 80 70 60 50 40 30 IM 20 10 0 1E-3 Tj(C) tp(s) 0.1 1 0 10 100 0 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 25 Figure 6. 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=50C 0.6 Tc=75C 0.4 = 0.5 = 0.2 = 0.1 Tc=125C t 0.2 T Single pulse t(s) =0.5 1E-2 tp(s) 1E-1 1E+0 0.0 1E-3 1E-2 =tp/T 1E-1 tp 1E+0 3/8 Characteristics Figure 7. STPS5H100 Reverse leakage current versus reverse voltage applied Figure 8. IR(A) Junction capacitance versus reverse voltage applied (typical values) C(pF) 5E+3 1000 1E+3 F=1MHz Tj=25C Tj=125C 1E+2 1E+1 100 1E+0 Tj=25C 1E-1 1E-2 VR(V) VR(V) 0 10 Figure 9. 20 30 40 50 60 70 80 90 100 Forward voltage drop versus forward current (maximum values) 10 1 Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0 Tj=125C 10.0 Tj=25C 1.0 4/8 VFM(V) 0.2 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 m) IFM(A) 50.0 0.1 0.0 10 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu) (cm) 0 2 4 6 8 10 12 14 16 18 20 STPS5H100 2 Package information Package information Cooling method: by conduction (C) Epoxy meets UL94, V0 Figure 11. DPAK dimensions Dimensions Ref E A B2 C2 L2 D R H L4 A1 B R G Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 C A2 0.60 MIN. L2 0.80 typ. 0.031 typ. V2 L4 0.60 1.00 0.023 0.039 V2 0 8 0 8 Figure 12. Footprint dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 5/8 Package information STPS5H100 Table 4. IPAK Dimensions Dimensions Ref. Millimeters Min. A E C2 B2 L Min. Typ. Max. 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.027 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 0.95 0.037 B5 D Max. A B3 L2 H Typ. Inches 0.30 0.035 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.019 0.023 D 6 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 B3 L1 B A1 V1 e B5 e G 2.28 0.090 C A3 G 4.40 H 4.60 0.173 16.10 0.181 0.634 L 9 9.40 0.354 0.370 L1 0.8 1.20 0.031 0.047 L2 0.80 V1 10 1 0.031 0.039 10 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS5H100 3 4 Ordering information Ordering information Ordering type Marking STPS5H100B S5H100 STPS5H100B-TR S5H100 STPS5H100H S5H100H Package Weight DPAK 0.30 g IPAK Base qty Delivery mode 75 Tube 2500 Tape and reel 75 Tube 0.40 g Revision history Date Revision Description of changes Jul-2003 6B 03-Nov-2005 7 DPAK footprint dimensions updated. 15-Feb-2006 8 ECOPACK statement added. 05-Mar-2007 9 IPAK package added. Last issue. 7/8 STPS5H100 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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