CPC1150N
Single-Pole, Normally Closed
4-Pin SOP OptoMOS® Relay
www.clare.com
DS-CPC1150N-R07 1
RoHS
2002/95/EC e3
Pb
Part # Description
CPC1150N 4-Pin SOP (100/tube)
CPC1150NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 350 VP
Load Current 120 mA
Max On-resistance 50 Ω
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
The CPC1150N is a miniature single-pole, normally
open (1-Form-B) solid state relay that uses optically
coupled MOSFET technology to provide 1500Vrms
of input to output isolation. The efficient MOSFET
switches and photovoltaic die use Clare’s patented
OptoMOS architecture while the optically coupled
output is controlled by a highly efficient GaAIAs
infrared LED.
Clare’s state of the art double-molded vertical
construction packaging enables the CPC1150N to be
one of the world’s smallest 4-pin solid state relays.
It offers board space savings over the competitor’s
larger 4-pin SOP relay.
Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
1
23
4
+ Control
– Control
Load
Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
10%
90%
ILOAD
t
on
t
off
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2R07
CPC1150N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 120 mA
Peak t =10ms ILPK - - 350
On-Resistance IL=120mA RON --50
Ω
Off-State Leakage Current IF=2mA , VL=350VPILEAK --5µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --1
ms
Turn-Off toff --2
Output Capacitance IF=2mA, VL=50V, f=1MHz COUT -25 -pF
Input Characteristics
Input Control Current 2IL=120mA IF- 0.6 2 mA
Input Dropout Current - IF0.3 0.55 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output - CI/O -1 -pF
1 Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC.
2 For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended.
Electrical Characteristics @ 25ºC
CPC1150N
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R07
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
0.21 0.23 0.25 0.270.22 0.24 0.26
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IL=90mA, IF=5mA, TA=25ºC)
0.50 0.70 0.90 1.101.000.800.60
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=90mA, TA=25ºC)
35
30
25
20
15
10
5
0
38.5 39.5 40.5 41.539 40 41
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=90mA, TA=25ºC)
On-Resistance (Ω)
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=90mA, TA=25ºC)
25
20
15
10
5
0
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=90mA, TA=25ºC)
35
30
25
20
15
10
5
0
377.5 399.5 421.5 443.5388.5 410.5 432.5
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-On
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off
vs. LED Forward Current
(IL=100mA)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Temperature (ºC)
Typical Turn-On vs. Temperature
(IL=50mA)
Turn-On (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
Temperature (ºC)
IF=5mA
IF=10mA
Turn-Off (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-Off vs. Temperature
(IL=50mA)
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4R07
CPC1150N
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
Temperature (ºC) Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-6 -4 -2 0 2 4 6
Typical Load Current vs. Load Voltage
(IF=0mA, TA=25ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
Typical Load Current vs. Temperature
(IF=0mA)
Blocking Voltage (VP)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (µA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=350V)
Temperature (ºC)
Time
Load Current (A)
10μs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100μs 100ms 1s
10ms 10s 100s
Energy Rating Curve
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (Ω)
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=Max Rated)
CPC1150N
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R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1150N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1150N 260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
should not be used.
RoHS
2002/95/EC e3
Pb
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1150N-R07
©Copyright 2010, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
10/18/2010
For additional information please visit our website at: www.clare.com
6
CPC1150N
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1150N
CPC1150N Tape & Reel
