* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
THRU
BZT52C39S
200 mW
Zener Diode
2.4 to 39 Volts
Features
x Planar Die Construction
x 200mW Power Dissipation on Ceramic PCB
x General Purpose Medium Current
x Ideally Suited for Automated Assembly Processes
Absolute Maximum Ratings
Symbol Parameter Rating Unit
PD Power dissipation 200 mW
TJ Junction Temperature -65 to +150 к
TSTG Storage Temperature Range -65 to +150 к
Absolute Maximum Ratings
Symbol Parameter Rating Unit
RthJA
Thermal Resistance Junction to
Ambient* 625 к/W
Electrical Characteristics
Symbol Parameter Rating Unit
VF
Maximum Forward Voltage
(IF=10mAdc) 0.9 V
BZT52C2V4S
www.mccsemi.com
MCC omponents
20736 Marilla Street Chatsworth
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TM
Micro Commercial Components
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• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Revision: A 2011/01/01
DIMENSIONS
INCHES MMDIM
MIN MAX MIN MAX
NOTE
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
A
B
E
C
J
D
H
G
SOD-323
0.022”
0.074"
0.027”
SUGGESTED SOLDER
PAD LAYOUT
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
ELECTRICAL CHARACTERISTICS @25qC
(1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2
(2) f=1KHz
ZENER VOLTAGE
VZ
(1)
VOLTS
Maximum Zener
Impedance (2)
ZZT(OHMS)
Maximum Zener
Impedance (2)
ZZK (OHMS)
REVERSE
CURRENT
IR(Max) @ VR
Typical
Temperature
Coefficent
@ IZTC
Type
Min. Nom Max. IZT(mA) Max. IZK(mA) Max. uA V mV/ć
Marking
BZT52C2V4S 2.28 2.4 2.56 5 100 1.0 600 50 1.0 -3.5 0 WX
BZT52C2V7S 2.5 2.7 2.9 5 100 1.0 600 20 1.0 -3.5 0 W1
BZT52C3V0S 2.8 3.0 3.2 5 95 1.0 600 10 1.0 -3.5 0 W2
BZT52C3V3S 3.1 3.3 3.5 5 95 1.0 600 5 1.0 -3.5 0 W3
BZT52C3V6S 3.4 3.6 3.8 5 90 1.0 600 5 1.0 -3.5 0 W4
BZT52C3V9S 3.7 3.9 4.1 5 90 1.0 600 3 1.0 -3.5 0 W5
BZT52C4V3S 4.0 4.3 4.6 5 90 1.0 600 3 1.0 -3.5 0 W6
BZT52C4V7S 4.4 4.7 5.0 5 80 1.0 500 3 2.0 -3.5 0.2 W7
BZT52C5V1S 4.8 5.1 5.4 5 60 1.0 480 2 2.0 -2.7 1.2 W8
BZT52C5V6S 5.2 5.6 6.0 5 40 1.0 400 1 2.0 -2.0 2.5 W9
BZT52C6V2S 5.8 6.2 6.6 5 10 1.0 150 3 4.0 0.4 3.7 WA
BZT52C6V8S 6.4 6.8 7.2 5 15 1.0 80 2 4.0 1.2 4.5 WB
BZT52C7V5S 7.0 7.5 7.9 5 15 1.0 80 1 5.0 2.5 5.3 WC
BZT52C8V2S 7.7 8.2 8.7 5 15 1.0 80 0.7 5.0 3.2 6.2 WD
BZT52C9V1S 8.5 9.1 9.6 5 15 1.0 100 0.5 6.0 3.8 7.0 WE
BZT52C10S 9.4 10 10.6 5 20 1.0 150 0.2 7.0 4.5 8.0 WF
BZT52C11S 10.4 11 11.6 5 20 1.0 150 0.1 8.0 5.4 9.0 WG
BZT52C12S 11.4 12 12.7 5 25 1.0 150 0.1 8.0 6.0 10.0 WH
BZT52C13S 12.4 13 14.1 5 30 1.0 170 0.1 8.0 7.0 11.0 WI
BZT52C15S 13.8 15 15.6 5 30 1.0 200 0.1 10.5 9.2 13.0 WJ
BZT52C16S 15.3 16 17.1 5 40 1.0 200 0.1 11.2 10.4 14.0 WK
BZT52C18S 16.8 18 19.1 5 45 1.0 225 0.1 12.6 12.4 16.0 WL
BZT52C20S 18.8 20 21.2 5 55 1.0 225 0.1 14.0 14.4 18.0 WM
BZT52C22S 20.8 22 23.3 5 55 1.0 250 0.1 15.4 16.4 20.0 WN
BZT52C24S 22.8 24 25.6 5 70 1.0 250 0.1 16.8 18.4 22.0 WO
BZT52C27S 25.1 27 28.9 2 80 0.5 300 0.1 18.9 21.4 25.3 WP
BZT52C30S 28 30 32 2 80 0.5 300 0.1 21.0 24.4 29.4 WQ
BZT52C33S 31 33 35 2 80 0.5 325 0.1 23.1 27.4 33.4 WR
BZT52C36S 34 36 38 2 90 0.5 350 0.1 25.2 30.4 37.4 WS
BZT52C39S 37 39 41 2 130 0.5 350 0.1 27.3 33.4 41.2 WT
www.mccsemi.com
BZT52C2V4S THRU BZT52C39SMCC TM
Micro Commercial Components
2 of 3
Revision: A 2011/01/01
www.mccsemi.com
2 of 3
Revision: A 2011/01/01
0
10
20
30
0
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Z
Fi
g
. 3. Zener Breakdown Characteristics
10 20 30 40
T = 25°C
j
Test current IZ
5mA
C10
C12
C18
C22
C27
C33 C36
C15
C39
0
10
20
30
40
50
01 2 3 4 5 6 78910
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Z
Fi
g
. 2 Zener Breakdown Characteristics
T = 25°C
jC2V7
C3V3
C3V9
C4V7
C5V6
C6V8
C8V2
Test Current IZ
5.0mA
T , AMBIENT TEMPERATURE, °C
A
Fi
g
. 1. Power Deratin
g
Curve
P , POWER DISSIPATION (mW)
D
200
100
0
300
0100 200
C , TOTAL CAPACITANCE (pF)
T
10
100
1000
10 100
1
V , NOMINAL ZENER VOLTAGE (V)
Z
Fig. 4 Total Capacitance vs Nominal Zener Voltage
T=25°C
j
V=1V
R
V=2V
R
V=1V
R
V=2V
R
BZT52C2V4S-BZT52C39S
Typical characteristics
MCC TM
Micro Commercial Components
Test current IZ
2mA
MCC TM
Micro Commercial Components
www.mccsemi.com
3 of 3
Revision: A 2011/01/01
3
Device Packing
Part Number-TP Tape&Reel: 3Kpcs/Reel
Ordering Information :
***IMPORTANT NOTICE***
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
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problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
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