1Rectifier Device Data
Designer's
Data Sheet
Power Rectifiers
. . . employing the Schottky Barrier principle in a large area metal–to–silicon
power diode. State–of–the–art geometry features chrome barrier metal,
epitaxial construction with oxide passivation and metal overlap contact. Ideally
suited for use as rectifiers in low–voltage, high–frequency inverters, free–
wheeling diodes, and polarity–protection diodes.
Extremely Low vF
Low Power Loss/High Efficiency
Low Stored Charge, Majority Carrier Conduction
High Surge Capacity
Mechanical Characteristics:
Case: Welded steel, hermetically sealed
Weight: 45.6 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal Lead is
Readily Solderable
Solder Heat: The excellent heat transfer property of the heavy duty copper
anode terminal which transmits heat away from the die requires that cau-
tion be used when attaching wires. Motorola suggests a heat sink be
clamped between the eyelet and the body during any soldering operation.
Stud Torque: 15 lb–in max
Shipped 25 units per rail
Marking: 1N5826, 1N5827, 1N5828
MAXIMUM RATINGS
Rating Symbol 1N5826 1N5827 1N5828 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20 30 40 Volts
Non–Repetitive Peak Reverse Voltage VRSM 24 36 48 Volts
Average Rectified Forward Current
VR(equiv)
v
0.2 VR(dc), TC = 85°CIO15 Amp
Ambient Temperature
Rated VR(dc), PF(AV) = 0,
RθJA = 5.0°C/W
TA95 90 85 °C
Non–Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM 500 (for one cycle) Amp
Operating and Storage Junction Temperature Range
(Reverse Voltage applied) TJ, Tstg
*
65 to +125 °C
Peak Operating Junction Temperature (Forward Current applied) TJ(pk) 150 °C
*THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case RθJC 2.5 °C/W
*Indicates JEDEC Registered Data
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%.
Designer’s Data for “W orst Case” Conditions The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves representing boundaries on device characteristics are given to facilitate “worst case” design.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola, Inc. 1996
Order this document
by 1N5826/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1N5826
1N5827
1N5828
SCHOTTKY BARRIER
RECTIFIERS
15 AMPERES
20, 30, 40 VOLTS
CASE 56–03
DO–203AA
METAL
1N5826 and 1N5828 are
Motorola Preferred Devices
Rev 1
1N5826 1N5827 1N5828
2Rectifier Device Data
*ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol 1N5826 1N5827 1N5828 Unit
Maximum Instantaneous Forward Voltage (1)
(iF = 8.0 Amps)
(iF = 15 Amps)
(iF = 47.1 Amps)
vF0.380
0.440
0.670
0.400
0.470
0.770
0.420
0.500
0.870
Volts
Maximum Instantaneous Reverse
Current @ Rated dc Voltage (1)
TC = 100°C
iR10
75 10
75 10
75
mA
*Indicates JEDEC Registered Data
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%.
NOTE 1 — DETERMINING MAXIMUM RATINGS
Reverse power dissipation and the possibility of thermal runaway
must be considered when operating this rectifier at reverse voltages
above 0.2 VRWM. Proper derating may be accomplished by use of
equation (1):
TA(max) = TJ(max)
*
RθJA PF(AV)
*
RθJA PR(AV) (1)
where TA(max) = Maximum allowable ambient temperature
TJ(max) = Maximum allowable junction temperature
(125°C or the temperature at which thermal
runaway occurs, whichever is lowest)
PF(AV) = Average forward power dissipation
PR(AV) = A verage reverse power dissipation
RθJA = Junction–to–ambient thermal resistance
Figures 1, 2, and 3 permit easier use of equation (1) by taking
reverse power dissipation and thermal runaway into consideration.
The figures solve for a reference temperature as determined by
equation (2): TR = TJ(max)
*
RθJA PR(AV) (2)
Substituting equation (2) into equation (1) yields:
TA(max) = TR
*
RθJA PF(AV) (3)
Inspection of equations (2) and (3) reveals that TR is the ambient
temperature at which thermal runaway occurs or where TJ = 125°C,
when forward power is zero. The transition from one boundary condi-
tion to the other is evident on the curves of Figures 1, 2, and 3 as a
difference in the rate of change of the slope in the vicinity of 115°C.
The data of Figures 1, 2, and 3 is based upon dc conditions. For use
in common rectifier circuits, Table 1 indicates suggested factors for
an equivalent dc voltage to use for conservative design, i.e.:
VR(equiv) = Vin(PK)
F (4)
The Factor F is derived by considering the properties of the various
rectifier circuits and the reverse characteristics of Schottky diodes.
EXAMPLE: Find T A(max) for 1N5828 operated in a 12–volt dc sup-
ply using a bridge circuit with capacitive filter such that IDC = 10 A
(IF(AV) = 5 A), I(PK)/I(AV) = 20, Input Voltage = 10 V(rms), RθJA =
5°C/W.
Step 1. Find VR(equiv). Read F = 0.65 from Table 1,
N
VR(equiv) = (1.41) (10) (0.65) = 9.18 V.
Step 2. Find TR from Figure 3. Read TR = 121°C
@ VR = 9.18 V and RθJA = 5°C/W.
Step 3. Find PF(AV) from Figure 4. **Read PF(AV) = 10 W
@I(PK)
I(AV)
+
20and IF(AV)
+
5A
Step 4. Find TA(max) from equation (3).
TA(max) = 121
@
(5) (10) = 71°C.
**Values given are for the 1N5828. Power is slightly lower for the
other units because of their lower forward voltage.
Table 1. Values for Factor F
Circuit Half W ave Full W ave, Bridge Full W ave,
Center Tapped*†
Load Resistive Capacitive* Resistive Capacitive Resistive Capacitive
Sine W ave 0.5 1.3 0.5 0.65 1.0 1.3
Square W ave 0.75 1.5 0.75 0.75 1.5 1.5
*Note that VR(PK)
[
2.0 Vin(PK). *†Use line to center tap voltage for Vin.
1N5826 1N5827 1N5828
3Rectifier Device Data
Figure 1. Maximum Reference Temperature – 1N5826
VR REVERSE VOLT AGE (VOLTS)
2.0 4.03.0 7.05.0 201510
75
85
95
105
115
125
10
R
q
JA (°C/W) = 50*
30 20
15
7.0
5.0
3.5
2.5
T , REVERSE TEMPERATURE ( C)
R
_
7.0
5.0
3.5
2.5
Figure 2. Maximum Reference Temperature – 1N5827
VR REVERSE VOLT AGE (VOLTS)
T , REVERSE TEMPERATURE ( C)
R
_
304.03.0 7.05.0 201510
75
85
95
105
115
125
R
q
JA (°C/W) = 50*
304.0 407.05.0 201510
75
85
95
105
115
125
T , REVERSE TEMPERATURE ( C)
R
_
Figure 3. Maximum Reference Temperature – 1N5828 Figure 4. Forward Power Dissipation
VR REVERSE VOLT AGE (VOLTS)
P , A VERAGE POWER DISSIPATION (WATTS)
F(AV)
0 2.0 4.0 6.0 8.0 10 12 14 16
IF(AV), AVERAGE FOR W ARD CURRENT (AMP)
0
2.0
4.0
6.0
8.0
10
14
16
dc
TJ
[
125°C
SQUARE
WAVE
SINEWAVE
π
CAPACITIVE
LOADS
10
30 20 15
10
R
q
JA (°C/W) = 50*
30 20
15
7.0
5.0
3.5
2.5
12
= 20
I(PK)
I(AV) 5.010
SINE WAVE
RESISTIVE LOAD
* NO EXTERNAL HEAT SINK
1N5826 1N5827 1N5828
4Rectifier Device Data
Figure 5. Typical Forward Voltage
vF, INSTANT ANEOUS FORWARD VOLT AGE (VOLTS)
0.2 0.80.6 1.0
30
200
0.3
0.2
2.0
1.0
100
20
7.0
3.0
0.5
5.0
50
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
0.7
10
70
1.20 1.4
100°C
TJ = 25°C
i
0.4
Figure 6. Maximum Surge Capability
Figure 7. Current Derating
Figure 8. Thermal Response
1000
100
200
10 100
NUMBER OF CYCLES
300
500
700
1.0 2.0 5.0 20 50
Prior to surge, the rectifier is operated such
that TJ = 100°C; VRRM may be applied be-
tween each cycle of surge.
f = 60 Hz
IFSM, PEAK HALF–WAVE CURRENT (AMP)
0.01
0.02
0.05
0.1
0.2
0.5
1.0
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
t, TIME (ms)
ZθJC(t) = RθJC
@
r(t)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
200 500 1.0 k 2.0 k 5.0 k
0.03
0.07
0.3
0.7
P(pk)
tp
t1
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk, is peak of an
equivalent square power pulse.
D
TJC = the increase in junction temperature above the case temperature
r(t) = normalized value of transient thermal resistance at time, t, from Figure 8, i.e.:
r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
D
TJC = P(pk)
@
RθJC [D = (1–D)
@
r(t1 + tp) + r(tp) – r(t1)] where
TC, CASE TEMPERATURE (°C)
75 85
0
4.0
2.0
6.0
10
8.0
14
12
I
12595 105
16
, A VERAGE FORWARD CURRENT (AMPS)
F(AV)
115
p
5.0
10
SineWave = 20
I(PK)
I(AV)
Capacitive Loads
Curves apply when reverse power is negligible
Square
Wave Sine Wave
Resistive Load
DC Continuous
Max IDC = 23.4 A
1N5826 1N5827 1N5828
5Rectifier Device Data
VR, REVERSE VOLT AGE (VOLTS)
0128.0 20 24
200
10
5
2
50
20
100 TJ = 125°C
IR
4.0 16 40
Figure 9. Normalized Reverse Current
32 3628
1
0.5
0.2
, REVERSE CURRENT (mA)
100°C
25°C
Figure 10. Typical Reverse Current
2500
250
500
700
VR, REVERSE VOLT AGE (VOLTS)
Figure 11. Capacitance
C, CAPACIT ANCE (pF)
1000
1500
2000 TJ = 25°C
5.0
0.05
0.2
85 125
0.7
1.0
3.0
25 45 65 105
VR = VRWM
75°C
1N5826 – 20 V
1N5827 – 30 V
1N5828 – 40 V
300
400
1N5826
1N5827
1N5828
0.1 2.00.6 1.0 4.00.04 400.40.06 0.2 6.0 10 20
IR, REVERSE CURRENT (NORMALIZED)
TC, CASE TEMPERATURE (°C)
2.0
0.3
0.5
0.1
0.07
NOTE 2 — HIGH FREQUENCY OPERATION
Since current flow in a Schottky rectifier is the result of majority
carrier conduction, it is not subject to junction diode forward and
reverse recovery transients due to minority carrier injection and
stored charge. Satisfactory circuit analysis work may be performed
by using a model consisting of an ideal diode in parallel with a
variable capacitance. (See Figure 11.)
Rectification efficiency measurements show that operation will
be satisfactory up to several megahertz. For example, relative
waveform rectification efficiency is approximately 70 per cent at
2.0 MHz, e.g., the ratio of dc power to RMS power in the load is
0.28 at this frequency, whereas perfect rectification would yield
0.406 for sine wave inputs. However, in contrast to ordinary
junction diodes, the loss in waveform efficiency is not indicative of
power loss; it is simply a result of reverse current flow through the
diode capacitance, which lowers the dc output voltage.
1N5826 1N5827 1N5828
6Rectifier Device Data
PACKAGE DIMENSIONS
CASE 56–03
ISSUE G
B
A
D
RP
E
F
10 32UNF–2A 2
1
SEATING
CK
J
Q
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A––– 0.505 ––– 12.82
B0.424 0.437 10.77 11.09
C––– 0.405 ––– 10.28
D––– 0.250 ––– 6.35
E0.060 ––– 1.53 –––
F0.075 0.175 1.91 4.44
J0.422 0.453 10.72 11.50
K0.600 0.800 15.24 20.32
P0.163 0.189 4.14 4.80
Q0.060 0.095 1.53 2.41
R0.265 0.424 6.74 10.76
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