Rev.3.00, Jul.22.2005, page 1 of 7
HD74LS74A
Dual D-type Positive Edge-triggered Flip-Flops
(with Preset and Clear) REJ03D0415–0300
Rev.3.00
Jul.22.2005
Features
Ordering Information
Part Name Package Type Package Code
(Previous Code) Package
Abbreviation Taping Abbreviation
(Quantity)
HD74LS74AP DILP-14 pin PRDP0014AB-B
(DP-14AV) P —
HD74LS74AFPEL SOP-14 pin (JEITA) PRSP0014DF-B
(FP-14DAV) FP EL (2,000 pcs/reel)
HD74LS74ARPEL SOP-14 pin (JEDEC) PRSP0014DE-A
(FP-14DNV) RP EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
(Top view)
V
CC
2CLR
2D
2CK
2Q
2PR
1CLR
GND
1D
1CK
1PR
1Q
1Q
2Q
1
2
3
4
5
6
7
14
8
9
10
11
12
13
PR
CK
D
CLR
Q
Q
D
CK
PR
QQ
CLR
HD74LS74A
Rev.3.00, Jul.22.2005, page 2 of 7
Function Table
Input Output
Preset Clear Clock D Q Q
L H X X H L
H L X X L H
L L X X H* H*
H H H H L
H H L L H
H H L X Q0 Q0
H; high level, L; low level, X; irrelevant, ; transition from low to high level,
Q0; level of Q before the indicated steady-state input conditions were established.
Q0; complement of Q0 or level of Q before the indicated steady-state input conditions were established.
*;This configuration is nonstable, that is, it will not persist when preset and clear inputs return to their inactive (high) level.
Absolute Maximum Ratings
Item Symbol Ratings Unit
Supply voltage VCC 7 V
Input voltage VIN 7 V
Power dissipation PT 400 mW
Storage temperature Tstg –65 to +150 °C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item Symbol Min Typ Max Unit
Supply voltage VCC 4.75 5.00 5.25 V
IOH–400 µA
Output current IOL 8 mA
Operating temperature Topr –20 25 75 °C
Clock frequency fclock 0 25 MHz
Clock High tw 25
Pulse width Clear Preset tw 25 ns
“H” Data tsu 20
Setup time “L” Data tsu 20 ns
Hold time th 5ns
Note: ; The arrow indicates the rising edge.
HD74LS74A
Rev.3.00, Jul.22.2005, page 3 of 7
Electrical Characteristics
(Ta = –20 to +75 °C)
Item Symbol min. typ.* max. Unit Condition
VIH 2.0 V
Input voltage VIL0.8 V
VOH 2.7 V
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V,
IOH = –400 µA
— — 0.5 IOL = 8 mA
Output voltage VOL — — 0.4 V IOL = 4 mA VCC = 4.75 V, VIL = 0.8 V,
VIH = 2 V
D — 20
Clear — 40
Preset — 40
Clock
IIH
— — 20
µA VCC = 5.25 V, VI = 2.7 V
D — –0.4
Clear — –0.8
Preset — –0.8
Clock
IIL
— — –0.4
mA VCC = 5.25 V, VI = 0.4 V
D — 0.1
Clear — 0.2
Preset — 0.2
Input
current
Clock
II
— — 0.1
mA VCC = 5.25 V, VI = 7 V
Short-circuit output
current IOS –20 –100 mA VCC = 5.25 V
Supply current ICC** — 4 8 mA VCC = 5.25 V
Input clamp voltag e VIR–1.5 V VCC = 4.75 V, IIN = –18 mA
Notes: * VCC = 5 V, Ta = 25°C
** With all output open, ICC is measured with the Q and Q outputs high in turn. At the time of measurement, the
clock input is grounded.
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item Symbol Inputs Outputs min. typ. max. Unit Condition
Maximum clock frequency fmax 25 33 MHz
tPLH13 25 ns
Propagation delay time tPHL Clear, Clock
or Preset Q, Q — 25 40 ns
CL = 15 pF,
RL = 2 k
Timing Definition
Data
Clock 0 V
3 V
0 V
3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V
"H" Data "L" Data
t
w
t
su
t
h
t
su
t
h
HD74LS74A
Rev.3.00, Jul.22.2005, page 4 of 7
Testing Method
Test Circuit
1. ƒmax, tPLH, tPHL (ClockQ, Q)
PR
4.5V VCC Output Q
Output Q
Input
D
CK Q
Q
CLR
P.G.
Zout = 50
Same as Load Circuit 1.
RLLoad circuit 1
CL
Input
P.G.
Zout = 50
Notes: 1. Test is put into the each flip-flop.
2. CL includes probe and jig capacitance.
3. All diodes are 1S2074(H).
2. tPHL, tPLH (Clear or Preset Q, Q)
PR
VCC Output Q
Output Q
Q
Q
CLR Same as Load Circuit 1.
RLLoad circuit 1
CL
D
Input
P.G.
Zout = 50
Input
P.G.
Zout = 50
CK
Notes: 1. Test is put into the each flip-flop.
2. CL includes probe and jig capacitance.
3. All diodes are 1S2074(H).
HD74LS74A
Rev.3.00, Jul.22.2005, page 5 of 7
Waveforms 1
t
w
(H)
tPHL
VOH
VOL
0 V
3 V
0 V
3 V
VOH
VOL
t
w
(L)
tPHL
tPLH
tPLH
10%
90%
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
10%
90%
Clock
D
Q
Q
tTLH tTHL
Note: Clock input pulse; tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle = 50% and for fmax,
tTLH = tTHL 2.5 ns
Waveforms 2
Clear
Preset
Q
Q
V
OH
V
OH
V
OL
V
OL
0V
0V
3V
3V
1.3V 1.3V
1.3V 1.3V
1.3V
1.3V
t
THL
t
TLH
t
w (clear)
25ns
t
w (preset)
25ns
t
TLH
t
THL
t
PHL
t
PLH
10%10%
10% 10%
90% 90%
90% 90%
1.3V
1.3V
t
PLH
t
PHL
Note: Crear and presel input pulse; tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz,
HD74LS74A
Rev.3.00, Jul.22.2005, page 6 of 7
Package Dimensions
( Ni/Pd/Au plating )
7.62
DP-14AV
RENESAS CodeJEITA Package Code Previous Code
MaxNomMin
Dimension in Millimeters
Symbol
Reference
19.2
6.3
5.06
MASS[Typ.]
A
Z
b
D
E
A
b
c
θ
e
L
1
1
p
3
e
0.51
0.56
1.30
0.19 0.25 0.31
2.29 2.54 2.79
0
°
15
°
PRDP0014AB-BP-DIP14-6.3x19.2-2.54
20.32
7.4
0.40 0.48
2.39
2.54
0.97g
814
7
1
p
3
1
1
b
D
E
e
Z
b
LA
A
c
e
θ
1.42
0.15
1.27
7.50 8.00
0.400.34
p
A
1
10.5
FP-14DAV
RENESAS CodeJEITA Package Code Previous Code
MaxNomMin
Dimension in Millimeters
Symbol
Reference
2.20
0.900.700.50
5.50
0.200.100.00
0.46
0.250.200.15
7.80
8
°
0
°
0.12
1.15
10.06
0.23g
MASS[Typ.]
1
E
1
1
2
L
Z
H
y
x
θ
c
b
A
E
D
b
c
e
L
A
P-SOP14-5.5x10.06-1.27 PRSP0014DF-B
Index mark
E
1
*2
*1
7
14 8
F
*3
p
Mx
y
D
E
H
Zb
A
p
Terminal cross section
( Ni/Pd/Au plating )
b
c
Detail F
1
1
L
L
A
θ
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
e
HD74LS74A
Rev.3.00, Jul.22.2005, page 7 of 7
14 8
7
F
*1
*2
*3
p
Mx
y
1
E
Index mark
b
A
Z
H
E
D
Terminal cross section
( Ni/Pd/Au plating )
p
b
c
1
1
Detail F
L
L
A
θ
PRSP0014DE-AP-SOP14-3.95x8.65-1.27
A
L
e
e
c
b
D
E
A
b
c
θ
x
y
H
Z
L
2
1
1
E
1
MASS[Typ.]
0.13g
8.65
1.08
0.25
0
°
8
°
6.10
0.15 0.20 0.25
0.46
0.10 0.14 0.25
3.95
0.40 0.60 1.27
1.75
Reference
Symbol
Dimension in Millimeters
Min Nom Max
Previous CodeJEITA Package Code RENESAS Code
FP-14DNV
9.05
1
A
p
0.34 0.40
6.205.80
1.27
0.15
0.635
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0