MGC3140T-E/MV - MICROCHIP TECHNOLOGY

MGC3140

MGC3140 3D Tracking and Gesture Controller Data Sheet

Introduction

Microchip’s MGC3140 is a 3D gesture and motion tracking controller based on Microchip’s patented

GestIC® technology – suitable for consumer, industrial and automotive applications. It enables robust user

interfaces with natural hand and finger movements utilizing the principles of electrical near-field sensing.

Implemented as a low-power mixed-signal configurable controller, the MGC3140 provides a compelling

set of smart functional features such as gesture recognition while using adaptive working frequencies for

robust performance in noisy environments. Microchip’s on-chip Colibri gesture suite removes the need for

host post-processing and reduces system power consumption, resulting in low software development

efforts for short time-to-market success.

The MGC3140 represents a unique and high-performance single-chip gesture solution focusing on

automotive applications. MGC3140 provides proximity, gesture detection and driver recognition, thus

enabling modern and compelling user interfaces to be created.

MGC3140 Applications

• Automotive Applications

• IoT

• Audio Products

• Notebooks/Keyboards/PC Peripherals

• Home Automation

• White Goods

• Switches

• Medical Products

• Game Controllers

Power Operation Modes

Several Power Operation Modes Including:

• Processing Mode: 29 mA, typical

• Deep Sleep: 85 μA, typical

Key Features

• Automotive Qualification AEC Q100 Grade 1

• Recognition of 3D Hand Gestures and x, y, z Positional Data

• Proximity and Touch Sensing

• Built-in Colibri Gesture Suite (running on-chip)

• Advanced 3D Signal Processing Unit

• Detection Range: 0 to 10 cm, typical

• Receiver Sensitivity: <1 fF

• Position Rate: 200 positions/sec.

• Spatial Resolution: up to 150 dpi

• Carrier Frequency: 42, 43, 44, 45, 100 kHz

• Channels Supported:

– Five receive (Rx) channels

– One transmit (Tx) channel

• On-chip Auto-Calibration

• Low-Noise Radiation due to Low-Transmit Voltage and Slew Rate Control

• Noise Susceptibility Reduction:

– On-chip analog filtering

– On-chip digital filtering

– Automatic frequency hopping

• Enables the use of Low-Cost Electrode Material including:

– Printed circuit board

– Conductive paint

– Conductive foil

– Laser Direct Structuring (LDS)

– Touch panel ITO structures

• Field Upgrade Capability

• Operating Voltage: VDD = 3.3V ± 5%

• Operating Temperature Range: -40°C to +125°C

Peripheral Features

• I2C for Configuration and Sensor Output Streaming I2C, speed up to 400 kHz

Packages

Part Number Available Package Pins Contact/Lead Pitch Dimensions

MGC3030 SSOP 28 0.65 7.8x10.2x1.9

MGC3130 QFN 28 0.5 5x5x0.9

MGC3140 UQFN 48 0.4 6x6x0.5

Note: All dimensions are in millimeters (mm), unless specified.

MGC3140

Part Number

Gesture Recognition

Position Tracking

Raw Data Streaming

Wake-Up-On-Approach

Deep Sleep

Gesture Port Pins

Rx Receive Electrodes

I2C Ports

AEC-Q100 Qualified (PPAP)

MGC3030 Yes No Yes Yes Yes 5 5 1 No

MGC3130 Yes Yes Yes Yes Yes 5 5 1 No

MGC3140 Yes Yes Yes Yes Yes 5 5 1 Yes

Note:

1. MGC3030 recommended for new Industrial designs.

2. MGC3130 recommended for new Industrial designs.

3. MGC3140 recommended for Automotive designs.

MGC3140

Table of Contents

Introduction......................................................................................................................1

MGC3140 Applications....................................................................................................1

Power Operation Modes..................................................................................................1

Key Features................................................................................................................... 1

Peripheral Features.........................................................................................................2

Packages.........................................................................................................................2

1. Pin Diagram...............................................................................................................6

2. 48-Pin Allocation and Pinout Description Table.........................................................7

3. Theory of Operation: Electrical Near-Field (E-Field) Sensing................................... 9

4. Feature Description..................................................................................................11

5. System Architecture................................................................................................ 17

6. Functional Description............................................................................................. 21

7. Interface Description................................................................................................29

8. Application Architecture...........................................................................................34

9. Development Support..............................................................................................36

10. Electrical Specifications...........................................................................................37

11. Packaging Information.............................................................................................41

The Microchip Web Site................................................................................................ 45

Customer Change Notification Service..........................................................................45

Customer Support......................................................................................................... 45

Product Identification System........................................................................................46

Microchip Devices Code Protection Feature................................................................. 47

Legal Notice...................................................................................................................47

Trademarks................................................................................................................... 47

MGC3140

Quality Management System Certified by DNV.............................................................48

Worldwide Sales and Service........................................................................................49

MGC3140

1. Pin Diagram

Figure 1-1. MGC3140 48L Diagram UQFN

Gesture Port 4

Gesture Port 3

Gesture Port 2

Gesture Port 1

Vcorecap

DNC

RX0

DNC

PGC

PGD

Gesture Port 5 1 36 DNC

SYNC 2 35 DNC

DNC 3 34 VSS

RX1 4 33 TS

DNC 5 32 MODE

DNC 6 31 VDD

7MGC3140-E/MV 30 SCL

VSS

8 29 SDA

VDD 9 28 TX4

IS1 10 27 TX3

IS2 11 26 TX2

RX2 12 25 TX1

DNC

AVDD

VSS

VANA

DNC

RX3

DNC

RX4

DNC

TX0

MCLR

Related Links

2. 48-Pin Allocation and Pinout Description Table

MGC3140

Pin Diagram

2. 48-Pin Allocation and Pinout Description Table

Pin Name Pin Number Pin Type Buffer Type Description

GP5 1 O — Gesture Port 5.

SYNC 2 O — Gesture device synchronization pulse (every 1 ms).

DNC 3 — — not connected

RX1 4 I Analog Analog GestIC® input channel 1:

Receive electrode connection.

DNC 5 — — not connected

DNC 6 — — not connected

MCLR 7 I — Master Clear (Reset) input.

This pin is an active-low Reset to the device.

VSS 8 P — Ground reference for logic and I/O pins.

This pin must be connected at all times.

VDD 9 P — Positive supply for peripheral logic and I/O pins.

IS1 10 I ST Interface Selection Pin 1

IS2 11 I ST Interface Selection Pin 2

RX2 12 I Analog Analog GestIC® input channel 2:

Receive electrode connection.

DNC 13 — — not connected

DNC 14 — — not connected

AVDD 15 P — Positive supply for analog modules.

This pin must be connected at all times.

VSS 16 P — Ground reference for analog modules.

VANA 17 P — Positive supply for analog front end.

DNC 18 — — not connected

RX3 19 I Analog Analog GestIC® input channel 3:

Receive electrode connection.

DNC 20 — — not connected

DNC 21 — — not connected

RX4 22 I Analog Analog GestIC® input channel 4:

Receive electrode connection.

DNC 23 — — not connected

TX0 24 O — GestIC® Transmit electrode connection 0.

TX1 25 O — GestIC® Transmit electrode connection 1.

TX2 26 O — GestIC® Transmit electrode connection 2.

TX3 27 O — GestIC® Transmit electrode connection 3.

TX4 28 O — GestIC® Transmit electrode connection 4.

SDA 29 I/O ST Synchronous serial data input/output for I2C.

SCL 30 I/O ST Synchronous serial clock input/output for I2C.

MGC3140

48-Pin Allocation and Pinout Description Table

Pin Name Pin Number Pin Type Buffer Type Description

VDD 31 P — Positive supply for peripheral logic and I/O pins.

MODE 32 I ST

Gesture Devices Scan mode:

High: 2D touch device measuring;

Low: gesture device measuring

TS 33 O — Transfer Status. GestIC® message ready interrupt.

VSS 34 P — Ground reference for analog modules.

This pin must be connected at all times.

DNC 35 — — not connected

DNC 36 — — not connected

PGD 37 I/O ST Programming Data line, connect to test pin in application.

PGC 38 I/O ST Programming Clock line, connect to test pin in application.

DNC 39 — — not connected

DNC 40 — — not connected

RX0 41 I Analog Analog GestIC® input channel 0:

Receive electrode connection.

DNC 42 — — not connected

DNC 43 — — not connected

VCORECAP 44 P — Capacitor for Internal Voltage Regulator.

GP1 45 O — Gesture Port 1.

GP2 46 O — Gesture Port 2.

GP3 47 O — Gesture Port 3.

GP4 48 O — Gesture Port 4.

Legend:

Analog = Analog input

P = Power

ST = Schmitt Trigger input with CMOS levels

I = Input

O = Output

I/O = Input/Output

— = N/A

Important: Exposed pad must be connected to VSS.

Related Links

1. Pin Diagram

MGC3140

48-Pin Allocation and Pinout Description Table

3. Theory of Operation: Electrical Near-Field (E-Field) Sensing

Microchip’s GestIC technology is a 3D sensor technology which utilizes an electric field (E-field) for

advanced proximity sensing. It allows realization of new user interface applications by detection, tracking

and classification of a user’s hand gestures in free space.

E-fields are generated by electrical charges and propagate three-dimensionally around the surface,

carrying the electrical charge.

Applying direct voltages (DC) to an electrode results in a constant electric field. Applying alternating

voltages (AC) makes the charges vary over time and, thus, the field. When the charge varies sinusoidally

with frequency ‘f’, the resulting electromagnetic wave is characterized by wavelength λ = c/f, where ‘c’ is

the wave propagation velocity — in vacuum, the speed of light. In cases where the wavelength is much

larger than the electrode geometry, the magnetic component is practically zero and no wave propagation

takes place. The result is quasi-static electrical near field that can be used for sensing conductive objects

such as the human body.

Microchip’s GestIC technology uses five transmit (Tx) frequencies, 42, 43, 44, 45 and 100 kHz, with

wavelengths of at least three kilometers. This wavelength is much larger than the typical range of

electrode dimensions between 5 mm and 20 mm. GestIC systems work without wave propagation.

In case a person’s hand or finger intrudes the electrical field, the field becomes distorted. The field lines

are drawn to the hand due to the conductivity of the human body itself and shunted to ground. The 3D

electric field decreases locally. Microchip’s GestIC technology uses a minimum number of four receiver

(Rx) electrodes to detect the E-field variations at different positions to measure the origin of the electric

field distortion from the varying signals received. The information is used to calculate the position, track

movements and classify movement patterns (gestures).

The two following figures show the influence of an earth-grounded body to the electric field. The proximity

of the body causes a compression of the equipotential lines and shifts the Rx electrode signal levels to a

lower potential which is measured.

Figure 3-1. Equipotential Lines of an Undistorted E-Field

MGC3140

Theory of Operation: Electrical Near-Field (E-Fiel...

Figure 3-2. Equipotential Lines of a Distorted E-Field

3.1 GestIC Technology Benefits

• GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have

a negative impact to the majority of other 3D technologies.

• GestIC technology allows gesture/position tracking processing on-chip – no host processing

needed. Algorithms are included in the Colibri Gesture Suite which runs on-chip and is provided by

Microchip.

• The GestIC technology has a high immunity to noise, provides high update rates and resolution,

low latency and is also not affected by clothing, surface texture or reflectivity.

• Five carrier frequencies of 42, 43, 44, 45 and 100 kHz are utilized by the GestIC with minimal

impact on the regulated radio frequency range.

• Usage of thin low-cost materials as electrodes allow low system cost at slim Industrial designs.

• The further use of existing capacitive sensor structures, such as a touch panel’s ITO coating, allows

additional cost savings and ease the integration of the technology.

• Electrodes are invisible to the user’s eye since they are implemented underneath the housing

surface or integrated into a touch panel’s ITO structure.

• GestIC works centrically over the full sensing space. Thus, it provides full surface coverage without

any detection blind spots.

• Only one GestIC transmitter electrode is used for E-field generations. The benefit is an overall low

power consumption and low radiated EMC noise.

• Since GestIC is basically processing raw electrode signals and computes them in real time into

preprocessed gestures and x, y, z positional data, it provides a highly-flexible user interface

technology for any kind of electronic devices.

MGC3140

Theory of Operation: Electrical Near-Field (E-Fiel...

4. Feature Description

4.1 Gesture Definition

A hand gesture is the movement of the hand to express an idea or meaning. The GestIC technology

accurately allows sensing of a user’s free space hand motion for contact free position tracking, as well as

3D gesture recognition based on classified movement patterns.

4.2 GestIC Library

MGC3140 is being provided with a GestIC Library loader (bootloader) which is stored on the chip’s Flash

memory. Using this loader, a GestIC Library can be flashed on the MGC3140 via I2C using, for example,

an embedded host controller or Microchip's Aurea GUI. The GestIC Library includes:

• Colibri Suite: Digital Signal Processing (DSP) algorithms and feature implementations.

• System Control: MGC3140 hardware control.

Related Links

9.1 Aurea Software Package

4.2.1 Colibri Suite

The Colibri Suite combines data acquisition, digital signal processing and interpretation.

The Colibri Suite functional features are illustrated below and described in the following sections.

Figure 4-1. Colibri Suite Core Elements

Digital Signal Processing

Colibri Suite

Position

Tracking

Gesture

Recognition

Approach

Detection

4.2.1.1 Position Tracking

The Colibri Suite’s Position Tracking feature provides 3D hand position over time and area. The absolute

position data is provided according to the defined origin of the Cartesian coordinate system (x, y, z).

Position Tracking data is continuously acquired in parallel to Gesture Recognition. With a position rate of

up to 200 positions/sec., a maximum spatial resolution of 150 dpi is achieved.

4.2.1.2 Gesture Recognition

The Colibri Suite’s gesture recognition model detects and classifies hand movement patterns performed

inside the sensing area.

Using advanced random classification based on Hidden Markov Model (HMM), industry best gesture

recognition rate is being achieved.

MGC3140

Feature Description

The Colibri Suite includes a set of predefined hand gestures which contains Flick, Circular and Symbol

gestures as the ones outlined below:

Flick Gestures

Figure 4-2. Flick Gestures

A Flick gesture is a unidirectional gesture in a quick flicking motion. An example may be a hand

movement from West to East within the sensing area, from South to North, etc.

Circular Gestures

Figure 4-3. Circle Gestures

A circular gesture is a round-shaped hand movement defined by direction (clockwise/counterclockwise)

without any specific start position of the user’s hand. Two types of circular gestures are distinguished by

GestIC technology:

1. AirWheel

– An AirWheel is the recognition of continuously-performed rotations inside the sensing area

and provides information about the rotational movement in real time. It provides continuously

counter information which increments/decrements according to the movement’s direction

(clockwise/counterclockwise). The AirWheel can be adjusted for convenient usage in various

applications (e.g., volume control, sensitivity adjustment or light dimming).

2. Discrete Circles

– Discrete Circles are recognized after performing a hand movement inside the sensing area.

The recognition result (direction: clockwise/counterclockwise) is provided after the hand

movement stops or the hand exits the detection area. The Discrete Circles are typically used

as dedicated application control commands.

Hold and Presence Gestures

Hold/Presence gestures are recognized through the detection of a hand within a configurable detection

area. After the hand is detected as being present in this area, a timer will be started. If the hand stays

MGC3140

Feature Description

within the detection area until a certain timer value is reached, the Presence gesture is detected. The

timer value is configurable. The Presence gesture is typically used for lighting up back-lights as if the

hand is in the detection area and does not move; a second timer is started.

Presence and Hold gestures are triggered upon a time-out in a defined Status flag. If a Status flag is

active during a certain amount of time, after its last rising edge, the corresponding gesture is triggered.

The Status flags that can trigger one of these gestures are:

•Hand Presence flag is active while the user's hand is in the sensing space.

•Hand Inside flag is active while the user's hand is in the sensing space approximately centered

above the sensor.

•Hand Hold flag is active while the hand is not moving and one of the above Status flags is active,

the selection depends on ActiveOutside.

The behavior of the Status flags and corresponding gestures can be adjusted to suit a specific

application. The Gesture and Presence/Hold state visualization windows offer immediate feedback upon

adjustment.

The adjustable parameters are:

1. ActiveOutside

– Chooses if Hand Hold flag and Presence gesture can be active when the user is outside the

sensor, but still in sensing space.

• ActiveOutside checked (default) means that Hand Presence is required to set Hand

Hold and that Presence Duration starts counting on the rising edge of Hand Presence

Status flag;

• ActiveOutside unchecked means that Hand Inside is required to set Hand Hold and that

Presence Duration starts counting on the rising edge of Hand Inside Status flag.

2. Presence Duration

– This is the time during which the selected Status flag must be active to trigger a Presence

gesture. This time starts counting on the last rising edge of the selected Status flag. The

gesture is only triggered once for each rising edge of the flag.

3. Hold Duration

– This is the time during which the Holding Hand flag must be active to trigger a Hold gesture.

This time starts counting on the last rising edge of the Holding Hand flag. The gesture is only

triggered once for each rising edge of the flag.

4. Hold Tremble Threshold

– This value specifies how much the hand can move and still be considered as holding. For

high values, the hand can move while the Hand Hold flag is still high. For low values, only a

slight movement is necessary to clear the Hand Hold flag.

MGC3140

Feature Description

Sensor Touch Gestures

Figure 4-4. Sensor Touch

A Sensor Touch is a multi-zone gesture that reports up to five concurrently-performed touches on the

system’s electrodes.

The Sensor Touch provides information about touch and tapping:

1. The Sensor Touch indicates an event during which a GestIC electrode is touched. This allows

distinction between short and long touches.

2. The Tap and Double Tap signalize short taps and double taps on each system electrode. The tap

length and double tap interval are adjustable.

–Single Tap Delay: A single tap is detected when touching the surface of an electrode first

and after the hand is pulled out of the touch area. The Single Tap is only detected when the

timing between the touch and the release of the touch event is smaller than the adjusted

delay. Increasing the time allows the user more time to perform the tap. The range for the

adjusted delay can range between 0s and 1s.

–Double Tap Delay: The double tap is detected when two taps are performed within the

adjusted delay. The range for the adjusted delay can range between 0s and 1s. The smaller

the selected delay is, the faster the two taps have to be executed.

MGC3140

Feature Description

Figure 4-5. Sensor Touch Diagram

Touch

detected

Tap

detected

Max Tap Duration

0s-1s

Double Tap

detected

Max Double Tap Duration

0s-1s

Max Tap Duration

0s-1s

Tap

detected

4.2.1.3 Approach Detection

Figure 4-6. Approach Detection

Approach Detection is an embedded power-saving feature of Microchip’s Colibri Suite. It sends MGC3140

to Sleep mode and scans periodically the sensing area to detect the presence of a human hand. Utilizing

the built-in Self Wake-up mode, Approach Detection alternates between Sleep and Scan phase. During

the Scan phase, the approach of a human hand can be detected while very low power is consumed.

A detected approach of a user exceeding configured threshold criteria will alternate the MGC3140 from

Self Wake-up to Processing mode or even the application host in the overall system.

Within the Approach Detection sequence, the following scans are performed:

•Approach Scan

MGC3140

Feature Description

– An Approach scan is performed during the scan phase of the device’s Self Wake-up mode.

Typically, one Rx channel is active but more channels can be activated via the GestIC Library.

The time interval (scan interval) between two consecutive Approach scans is configurable.

For typical applications, the scan cycle is in a range of 20 ms to 150 ms. During the Approach

scan, the activated Rx channels are monitored for signal changes which are caused by, for

example, an approaching human hand and exceeding the defined threshold. This allows an

autonomous wake-up of the MGC3140 and host applications at very low-power consumption.

•AFA Scan

– During Wake-up-on-Approach, periodic Automatic Frequency Adaptation (AFA) scans are

performed. During this scan, the environmental noise is measured and a new Tx frequency

will be selected from the five preset frequencies available, if necessary. The AFA scan is

usually performed in configurable intervals from 120s to 600s (120s typical). The timing

sequence of the Approach Detection feature is illustrated below:

Figure 4-7. Approach Detection Sequence

C u r re n t

tim e

Perio d ic A p p roach Scan s A FA S c an Perio d ic A p p roach Scan s AFA S c a n P erio d ic A ppro ach Scan s A FA S can Perio d ic A p p roach Scan s

20 m s-150 m s 2s -1 0 s

IS LE E P = 6 2 µA

I5 CH S C A N = 29 m A

I5 CH S C A N: Scan P ha s e w it h 5 a c t ive RX c ha nnels: Cali bration Scan

IS LE E P: Sle e p Phase

120 s- 600 s

N on -user ac tivi ty tim eout

2s - 255 s

Related Links

6.4.3 Wake-up-on-Approach Mode

MGC3140

Feature Description

5. System Architecture

MGC3140 is a mixed-signal configurable controller. The entire system solution is composed of the

following main building blocks (see diagram below):

• MGC3140 Controller

• GestIC Library

• External Electrodes

Figure 5-1. MGC3140 Controller System Architecture

MGC3140

To Application

Host

Communications

Interface

Signal Processing

Unit GestIC®

Library

Analog Front End

External

Electrodes

5 Rx

5 Tx

5.1 MGC3140 Controller

The MGC3140 features the following main building blocks:

• Low-Noise Analog Front End (AFE)

• Digital Signal Processing Unit (SPU)

• Communication Interfaces

The MGC3140 provides a transmit signal to generate the E-field, conditions the analog signals from the

receiving electrodes and processes these data digitally on the SPU. Data exchange between the

MGC3140 and a host is conducted via the controller’s I2C interface.

Related Links

6. Functional Description

5.2 GestIC® Library

The embedded GestIC Library is optimized to ensure continuous and Real-Time Free-Space gesture

recognition and motion tracking concurrently. It is fully-configurable and allows required parametrization

for individual application and external electrodes.

MGC3140

System Architecture

5.3 External Rx Electrodes

Rx electrodes are connected to the MGC3140. An electrode needs to be individually designed following

the guide lines from the "GestIC Design Guide” (DS40001716), for optimal E-field distribution and

detection of E-field variations inflicted by a user.

5.3.1 Electrode Equivalent Circuit

The hand position tracking and gesture recognition capabilities of a GestIC system depend on the

electrode design and their material characteristics.

A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in the following

figure:

Figure 5-2. Electrodes Capacitive Equivalent Circuitry Earth Grounded

CRXTX

CTXGCRXG

System ground

Transmitter signal

Electrode signal

Earth ground

E-field

VTX

System Ground

eRx

eTx

External Electrodes

VRXBUF

VTx Tx electrode voltage

VRxBuf MGC3140 Rx input voltage

CHCapacitance between receive electrode and hand (earth ground). The user’s hand can always

be considered as earth-grounded due to the comparable large size of the human body.

CRxTx Capacitance between receive and transmit electrodes

CRxG Capacitance of the receive (Rx) electrode to system ground + input capacitance of the

MGC3140 receiver circuit

CTxG Capacitance of the transmit (Tx) electrode to system ground

eRx Rx electrode

eTx Tx electrode

The Rx and Tx electrodes in a GestIC electrode system build a capacitance voltage divider with the

capacitances CRxTx and CRxG which are determined by the electrode design. CTxG represents the Tx

electrode capacitance to system ground driven by the Tx signal. The Rx electrode measures the potential

of the generated E-field. If a conductive object (e.g., a hand) approaches the Rx electrode, CH changes

its capacitance. Femtofarad changes are detected by the MGC3140 receiver. The equivalent circuit

formula for the earth-grounded circuitry is described in the following equation:

MGC3140

System Architecture

Equation 5-1. Electrodes Equivalent Circuit

 = ×

 + +

A common example of an earth-grounded device is a notebook, even with no ground connection via

power supply or Ethernet connection. Due to its larger form factor, it presents a high earth-ground

capacitance in the range of 50 pF and, thus, it can be assumed as an earth-grounded GestIC system. For

further information on sensor designs with earth-grounded as well as nonearth-grounded devices, see

"GestIC Design Guide” (DS40001716).

A brief overview of the typical values of the electrode capacitances is summarized in the table below:

Table 5-1. Electrode Capacitances Typical Values

Capacity Typical value

CRxTx 10...30 pF

CTxG 10...1000 pF

CRxG 10...30 pF

CH<1 pF

Important: Ideal designs have low CRxTx and CRxG to ensure higher sensitivity of the electrode

system. Optimal results are achieved with CRxTx and CRxG values being in the same range.

5.3.2 Standard Electrode Design

The MGC3140 electrode system is typically a double-layer design with a Tx transmit electrode at the

bottom layer to shield against device ground and, thus, ensure high-receive sensitivity. Up to five

comparably smaller Rx electrodes are placed above the Tx layer providing the spatial resolution of the

GestIC system. Tx and Rx are separated by a thin isolating layer. The Rx electrodes are typically

arranged in a frame configuration as shown in the following electrode diagrams.

The frame defines the inside sensing area.

Larger dimensions yield in higher sensitivity of the system.

For more information on sensor design as well as the function of the center electrode, see "GestIC

Design Guide" (DS40001716).

The electrode shapes can be designed solid or structured. In addition to the distance and the material

between the Rx and Tx electrodes, the shape structure density also controls the capacitance CRxTx and

thus, the sensitivity of the system.

MGC3140

System Architecture

Figure 5-3. Frame Shape Electrodes

Centre

SOUTH

EAST

West

NORTH

Transmit Elect rode - Bot tom Layer

Edge Receive Elect rodes - Top Layer

Centre Receive Elect rode - Top Layer

MGC3140

System Architecture

6. Functional Description

Microchip Technology’s GestIC technology utilizes electrical near-field (E-field) sensing. The chip is

connected to electrodes that are sensing the E-field variance. The GestIC device then calculates the

user’s hand motion relatively to the sensing area in x, y, z position data, and classifies the movement

pattern into gestures in real time. In addition, by utilizing the principles of E-field sensing, the GestIC

system is immune to ambient influences such as light or sound, which have a negative impact on the

majority of other 3D technologies. Also, it allows full-surface coverage of the electrode area with no

detection blind spots of a user’s action.

Microchip Technology’s MGC3140 is a configurable controller. Featuring a Signal Processing Unit (SPU),

a wide range of 3D gesture applications are being processed on the MGC3140, which allows short

development cycles. Always-on 3D sensing is enabled, even for battery-driven devices, by the chip’s low-

power design and the variety of programmable power modes. GestIC sensing electrodes are driven by a

low-voltage signal with frequencies of 42, 43, 44, 45, and 100 kHz, allowing their electrical conductive

structure to be made of any low-cost material. Figure 6-1 provides an overview of the main building

blocks of MGC3140.

Figure 6-1. MGC3140 Block Diagram

(

)

Internal System

Tx Signal Generation

5 Tx Electrodes

Clock

Signal Processing

Unit

Power Management

Unit (PMU)

Diagnostics

6.1 Reset

The Reset block combines all Reset sources. It controls the device system’s Reset signal (SYSRST). The

following is a list of device Reset sources:

• MCLR: Master Clear Reset pin

• SWR: Software Reset available through GestIC Library Loader

• Power-on Reset (POR)

• Brown-out Reset (BOR)

• Watchdog Timer Reset (WDTR)

MGC3140

Functional Description

A simplified block diagram of the Reset block is illustrated in the following figure.

A pull-up resistor of 10 kΩ must be connected at all times to the MCLR pin.

Figure 6-2. System Reset Block Diagram

PIC16(L)F18325/18345

DS40000000A-page 74 Preliminary  2017 Microchip Technology Inc.

FIGURE 5-4: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

MCLR

VDD

Brown-out

Reset

Glitch Filter

MCLR

Deep Sleep

WDT Time-out

POR

WDTR

BOR

Power-up

Timer

VDD Rise Detect

Voltage

Regulator

Enabled

Software Reset SWR

SYSRST

Timing Diagrams for POR and BOR are shown below:

Figure 6-3. Power-on Reset Timing

VDD

VPOR

Power-up Sequence

(Note 2)

(TPU)

CPU Starts Fetching Code

(Note 1)

(TSYSDLY)

Note:

1. The power-up period will be extended if the power-up sequence completes before the device exits

from BOR (VDD < VDDMIN).

2. Includes interval voltage regulator stabilization delay.

MGC3140

Functional Description

Figure 6-4. Brown-out Reset Timing

MCLR

BOR

TMCLR

TBOR

Reset Sequence

CPU Starts Fetching Code

(TSYSDLY

BOR voltage

= 2.25V to

2.45V

)

6.2 Power Management Unit (PMU)

6.2.1 Basic Connection Requirements

The device requires a nominal 3.3V supply voltage. The following pins need to be connected:

• All VDD and VSS pins need connection to the supply voltage and decoupling capacitors

•VCORECAP: The devices’ core and digital logic is designed to operate at a nominal 1.8V, which is

provided by an on-chip regulator. The required core logic voltage is derived from VDD and is

outputted on the VCORECAP pin. A low-ESR capacitor (such as tantalum) must be connected to the

VCORECAP pin. This helps to maintain the stability of the regulator.

•AVDD: Analog voltage references for the ADC needs to be connected to the supply voltage and a

decoupling capacitor

•VANA: Analog supply for GestIC analog front end must be connected to the supply voltage

Figure 6-5. Connections for VCORE Regulator

VDD

VCORECAP

VSS

CEFC(2,3 )

3.3V(1)

(10 uF typ)

Note:

MGC3140

Functional Description

1. These are typical operating voltages.

2. It is important that the low-ESR capacitor is placed as close as possible to the VCAP pin.

3. The typical voltage on the VCAP is 1.8V.

6.2.2 Decoupling Capacitors

The use of decoupling capacitors on power supply pins, such as VDD, VSS, and AVDD is required.

Consider the following criteria when using decoupling capacitors:

•Value and type of capacitor: A value of 0.1 μF (100 nF), 10-20V is recommended. The capacitor

should be a low Equivalent Series Resistance (low-ESR) capacitor and have resonance frequency

in the range of 20 MHz and higher. It is further recommended that ceramic capacitors be used.

•Placement on the printed circuit board: The decoupling capacitors should be placed as close to

the pins as possible. It is recommended that the capacitors be placed on the same side of the

board as the device. If space is constricted, the capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace length from the pin to the capacitor is within 6 mm

in length.

•Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens

of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling

capacitor. The value of the second capacitor can be in the range of 0.01 μF to 0.001 μF. Place this

second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as close to the power and ground pins as possible. For

example, 0.1 μF in parallel with 0.001 μF.

•Maximizing performance: On the board layout from the power supply circuit, run the power and

return traces to the decoupling capacitors first, and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain. Equally important is to keep the trace length

between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance.

Related Links

8.5 Reference Schematic

6.3 Clocks

The MGC3140 is embedding two internal oscillators, high speed and low speed. The High-Speed

Oscillator (HSO) is factory-trimmed, achieving high accuracy.

•High-Speed Oscillator (HSO): The MGC3140 is clocked by an internal HSO running at 40 MHz

(+/- 2%). This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the

SPU. During Deep Sleep mode, the HSO clock is switched off.

•Low-Speed Oscillator (LSO): This low-speed and ultra-low-power oscillator is typically 32 kHz (+/-

15%). It is used during power-saving modes.

6.4 Operation Modes

MGC3140 offers three operation modes that allow the user to balance power consumption with device

functionality. In all of the modes described in this section, power saving is configured by GestIC Library

messages. A summary of the operation modes, as well as their respective current consumption values

are given in the table below:

MGC3140

Functional Description

Table 6-1. Operation Modes Summary

Mode Entry Exit Comments

Processing

I2C/Approach/

MCLR/WDTR/SW

Reset

GestIC® Library

Message/ Non-

Activity Time-out/

WDTR

Processing mode with up to five electrodes

continuously running

Full positioning and Gesture Recognition

capabilities

Wake-up on

Approach

Hand not present

Time-out/GestIC®

Library Message

I2C Message/

MCLR/WDTR/

Hand Detected

Scan phase with a configurable number of Rx

active channels, wake-up timer is used to

resume the system

Approach detection capability

Fast wake-up time

Very low-power consumption

Deep Sleep GestIC® Library

Message

I2C Message/

MCLR

SPU halted, Watchdog OFF

No positioning or gesture detection

Extreme low-power consumption: Needs

trigger from application host to switch into

Wake-up on Approach or Processing mode

MGC3140

Functional Description

Figure 6-6. Operation Mode Flow

Processing

mode

Wake-up on

Approach

mode

Deep Sleep

mode

Approach time-

out or GestIC

library enable

Approach mode

message

Hand detected or

I2C message or

MCLR or

WDTR

GestIC library

enable Deep Sleep

mode message

I2C message or

MCLR

MCLR or

WDTR

Power off

Power on

6.4.1 Processing Mode

In this mode, all power domains are enabled and the SPU is running continuously. All peripheral digital

blocks are active. Gesture recognition and position tracking require the Processing Operation mode.

6.4.2 Deep Sleep Mode

The Deep Sleep mode includes the following characteristics:

• The SPU is halted

• The High-Speed Oscillator is shut down

• The Low-Speed Oscillator is running

• The Watchdog is switched off

• Host interface pins are active for wake-up

This leads to the lowest possible power consumption of MGC3140. The device will resume from Deep

Sleep if one of the following events occurs:

MGC3140

Functional Description

• I2C Start bit detection

• On MCLR Reset

The Deep Sleep mode can be enabled by GestIC Library messages.

6.4.3 Wake-up-on-Approach Mode

The Wake-up-on-Approach mode is a low power mode allowing an autonomous wake-up of the

MGC3140 and application host. In this mode, the MGC3140 is automatically and periodically alternating

between Deep Sleep and scan phases.

During the approach scan phase, the sensor will be able to detect an approach of the human hand and

change to Processing mode accordingly.

The MGC3140’s fast wake-up, typically below 1 ms, allows the performance of scans in very efficient

periods and to maximize the Sleep phase.

Additionally, the sensor will perform periodic AFA scans in which the sensor will scan through all available

Tx frequencies and select an optimal frequency depending on the signals’ noise level.

The periodic wake-up sequence is triggered by a programmable wake-up timer running at the low-speed

Oscillator 32 kHz frequency. The repetition rate of the scan can be adjusted via the host, affecting the

sensitivity and current consumption during Wake-up-on-Approach.

The MGC3140 enters the Self Wake-up mode by a GestIC Library message or by a non-activity time-out.

Non-activity means no user detection within the sensing area.

The MGC3140 will resume from Self Wake-up on one of the following events:

• Detection of a human hand approaching the sensor

• I2C Start bit detection

• On MCLR or WDTR

6.4.4 Transmit Signal Generation

The Tx signal generation block provides five bandwidth limited square wave signals for the transmit

electrode. The five Tx signals are combined through a resistive network to provide a single Tx signal to

the Tx electrode. This provides slew control to the rising and falling Tx signal edges in order to reduce

radiated emissions. Frequency hopping automatically adjusts the Tx carrier frequency choosing one of

the five transmit frequencies, depending on the environmental noise conditions. GestIC Library

automatically selects the lowest noise working frequency in case the sensor signal is compromised.

Frequencies can be enabled/disabled via the GestIC Library.

6.4.5 Receive (Rx) Channels

There are five identical Rx channels that can be used for five respective receive electrodes. Four receive

electrodes are required for Position Tracking and Gesture Recognition. A fifth electrode can be used for

touch detection and for approach detection in Wake-up on Approach mode. Every Rx input pin is

connected to its own dedicated ADC. The Rx input signal is sampled at a sampling rate equal to double

the Tx frequency, providing a high and low ADC sample.

The electrodes can be connected in any order to the external electrodes. The channel assignment is then

done in a parameterization step in Aurea GUI or alliteratively using I2C commands.

MGC3140

Functional Description

Important: It is recommended to assign Rx channels 1 to 4 in most application designs, only

using RX0 if a fifth Rx electrode is required.

6.4.6 Analog-to-Digital Converter (ADC)

As outlined in the previous section, each Rx channel features a dedicated ADC with a trigger derived

from the internal clock. ADC samples are synchronous with twice the Tx transmit frequency.

6.4.7 Signal Processing Unit (SPU)

The MGC3140 features a Signal Processing Unit (SPU) to control the hardware blocks and process the

advanced DSP algorithms included in the GestIC Library. It provides filtered sensor data, continuous

position information and recognized gestures to the application host. The host combines the information

and controls its application.

6.4.8 Parameters Storage

The MGC3140 provides an embedded 128 kB Flash memory which is dedicated for the GestIC Library

and storage of the individual configuration parameters. These parameters have to be set according to the

individual electrode design and application. The GestIC Library and parameters are loaded into

MGC3140 with the provided software tools or, alternatively, via GestIC Library messages by the

application host.

Related Links

9. Development Support

MGC3140

Functional Description

7. Interface Description

The MGC3140 supports an I2C interface in Slave mode. For further information on the I2C interface as

well as a list of the I2C commands, see ”MGC3140 - GestIC Library Interface Description User’s Guide”

(DS40001875).

7.1 Interface Address Selection

The MGC3140 interface selection pins IS1 and IS2 are used to select the MGC3140 interface.

Table 7-1. Interface Pins

IS2 IS1 Mode (Address)

0 0 I2C Slave Mode (Address 0x42)

1 0 Reserved

7.2 I2C Slave Mode

7.2.1 I2C Hardware Interface

A summary of the hardware interface pins is shown below:

Table 7-2. Interface Pins

Pin Function

SCL Serial Clock to Master I2C

SDA Serial Data to Master I2C

TS Transfer Status Line

The MGC3140 requires a dedicated Transfer Status line (TS). The MGC3140 (I2C Slave) uses this line to

inform the host controller (I2C Master) that there is data available which can be transferred. The TS line is

electrically open-drain and requires a pull-up resistor of typically 10 kΩ from the TS line to VDD. The TS

Idle state is high.

The MGC3140 uses an internal I2C message buffer. If after a read operation there are remaining

messages in the buffer, the TS will only go high for a short time period and then be driven low again.

Table 7-3. Usage of TS Line

Device TS Line Status

Released (H) High No new pending message from the device

Asserted (L) Low New message from device available; Host can start reading I2C message

MGC3140

Interface Description

Figure 7-1. Example for TS Line Indication and Following Read Operation

SCL

SDA

Note: The TS line handling of the MGC3140 is different to MGC3x30 devices. With the MGC3140 there

is no need for the host to assert the TS line.

7.2.2 I2C Message Buffer

The MGC3140 has an internal FIFO I2C message buffer for a total of five messages. After a I2C message

read process is started by the host, the message will be deleted from the buffer. Also if the I2C transfer of

a message is read by the host and the transfer is interrupted, the message will be deleted. For further

information, refer to “MGC3140 - GestIC Library Interface Description User’s Guide”(DS40001875).

7.2.3 I2C Addressing

The MGC3140 Device ID 7-bit address is: 0x42 (0b1000010) depending on the interface selection pin

configuration. Refer to the table below:

Table 7-4. I2C Device ID Address

Device ID Address, 7-bit

Address

offset A7 A6 A5 A4 A3 A2 A1

0x42 1000010

0x43 1000011

7.2.4 Timing Descriptions

I2C Clock - The I2C clock operates up to 400 kHz.

MGC3140

Interface Description

I2C Master Read Bit Timing

Master read is to receive position data, gesture reports and command responses from the MGC3140.

The timing diagram is shown below:

Figure 7-2. I2C Master Read Bit Timing Diagram

31 2 4 5 6 7 8 9 31 2 4 5 6 7 8 9 31 2 4 5 6 7 8 9

A7 A6 A5 A4 A3 A2 A1 1D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Address R/W ACK ACK ACKData Data

Address Bits Latched in Data Bits Valid Out Data Bits Valid Out

SCL may be stretched SCL may be stretched

Start Bit Stop Bit

SDA

SCL

• Address bits are latched into the MGC3140 on the rising edges of SCL.

• Data bits are latched out of the MGC3140 on the rising edges of SCL.

• ACK bit:

– MGC3140 presents the ACK bit on the ninth clock for address acknowledgment

– I2C master presents the ACK bit on the ninth clock for data acknowledgment

• The I2C master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3140

may be holding off the I2C master by stretching the clock.

I2C Communication Steps

1. SCL and SDA lines are Idle high.

2. I2C master presents Start bit to the MGC3140 by taking SDA high-to-low, followed by taking SCL

high-to-low.

3. I2C master presents 7-bit address, followed by a R/W = 1 (Read mode) bit to the MGC3140 on

SDA, at the rising edge of eight master clock (SCL) cycles.

4. MGC3140 compares the received address to its Device ID. If they match, the MGC3140

acknowledges (ACK) the master sent address by presenting a low on SDA, followed by a low-high-

low on SCL.

5. I2C master monitors SCL, as the MGC3140 may be clock-stretching, holding SCL low to indicate

that the I2C master should wait.

6. I2C master receives eight data bits (MSB first) presented on SDA by the MGC3140, at eight

sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it

is valid during the subsequent SCL high time.

7. If data transfer is not complete, then:

– I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA,

followed by a low-high-low on SCL.

– Go to Step 5.

8. If data transfer is complete, then:

– I2C master acknowledges (ACK) reception of the eight data bits and a completed data

transfer by presenting a high on SDA, followed by a low-high-low on SCL.

I2C Master Write Bit Timing

I2C master write is to send supported commands to the MGC3140. The timing diagram is shown below:

MGC3140

Interface Description

Figure 7-3. I2C Master Write Bit Timing Diagram

31 2 4 5 6 7 8 9 31 2 4 5 6 7 8 9 31 2 4 5 6 7 8 9

A7 A6 A5 A4 A3 A2 A1 0D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Address R/W ACK ACK ACKData Data

Address Bits Latched in Data Bits Valid Out Data Bits Valid Out

SCL may be stretched SCL may be stretched

Start Bit Stop Bit

SDA

SCL

• Address bits are latched into the MGC3140 on the rising edges of SCL.

• Data bits are latched into the MGC3140 on the rising edges of SCL.

• ACK bit:

– MGC3140 presents the ACK bit on the ninth clock for address acknowledgment

– I2C master presents the ACK bit on the ninth clock for data acknowledgment

• The master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3140 may

be holding off the master by stretching the clock.

I2C Communication Steps

1. SCL and SDA lines are Idle high.

2. I2C master presents Start bit to the MGC3140 by taking SDA high-to-low, followed by taking SCL

high-to-low.

3. I2C master presents 7-bit address, followed by a R/W = 0 (Write mode) bit to the MGC3140 on

SDA, at the rising edge of eight master clock (SCL) cycles.

4. MGC3140 compares the received address to its Device ID. If they match, the MGC3140

acknowledges (ACK) the I2C master sent address by presenting a low on SDA, followed by a low-

high-low on SCL.

5. I2C master monitors SCL, as the MGC3140 may be clock stretching, holding SCL low to indicate

the I2C master should wait.

6. I2C master presents eight data bits (MSB first) to the MGC3140 on SDA, at the rising edge of eight

master clock (SCL) cycles.

7. MGC3140 acknowledges (ACK) receipt of the eight data bits by presenting a low on SDA, followed

by a low-high-low on SCL.

8. If data transfer is not complete, then go to Step 5.

9. Master presents a Stop bit to the MGC3140 by taking SCL low-high, followed by taking SDA low-to-

high.

Important: The Stop condition after an I2C data transmission is generated by the host

controller (I2C master) after the data transfer is completed. Thus, it is recommended to verify the

number of bytes to be read in the message header (Size field).

7.3 Gesture Port

The MGC3140 provides five output pins which can be used to indicate gesture events. These pins are

controlled by GestIC Library to signal that an event occurred. The host does not need to monitor the I2C

bus to get GestIC Library events, but only has to monitor the Gesture Port pins. This feature can be used

in parallel to I2C communication.

MGC3140

Interface Description

Up to 20 event outputs can be mapped to any Gesture port (1, 2, 3, 4 or 5). To activate this feature

contact Microchip support. It is also possible to map more than one event output to one Gesture port.

MGC3140

Interface Description

8. Application Architecture

The standard MGC3140 application architecture consists of a MGC3140 controller connected to external

electrodes and an application host. For further information on the electrode design, refer to “GestIC

Design Guide” (DS40001716). Details on the I2C interface can be found in “MGC3140 - GestIC Library

Interface Description User’s Guide” (DS40001875).

8.1 ESD Considerations

The MGC3140 provides Electrostatic Discharge (ESD) voltage protection up to 4 kV (HBM) and Charge

Device Model (CDM) 750V on corner pins; 500V on all other pins. Additional ESD countermeasures may

be implemented individually to meet application-specific requirements.

8.2 Power Noise Considerations

MGC3140 filtering capacitors are included in the reference design schematic.

8.3 High-Frequency Noise Immunity

In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to

the electrodes via serial 10 kΩ resistors, as close as possible to MGC3140. The 10 kΩ resistor and the

MGC3140 input capacitance are building a low-pass filter with a corner frequency of 3 MHz. An additional

ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600Ω at 100

MHz).

8.4 RF Emission

The Tx pins are used to shape the Tx signal and reduce emission in relevant frequency bands. The slope

of the Tx signal is randomized using dithering techniques while the sampling point is kept constant for

further reduction of emission. In addition, a RC network on the Tx output will reduce the emission even

further. For further support on reduction of RF emission, contact your local Microchip representative.

MGC3140

Application Architecture

8.5 Reference Schematic

North Electrode

South Electrode

East Electrode

WestElectrode

Center Electrode

10 KΩ

VDD

10 KΩ

10 kΩ

IS1

IS2

VDD VDD

n.p: not populated

Interface Selection

IS1

IS2

SDA

SCL

GPIO/IRQ

HOST

RESET

CONTROL

MCLR

10 KΩ

1.8 KΩ

VDD VDD

VDD

0.1 μF

Decoupling Caps

IS2 IS1 Mode (Address)

I2C Slave Address 1 (0x42)

Reserved

0.1 μF

TX Electrode

n.p.

VDD

10 μF

C1 1)

TX0

TX4

R0 = 1K 1)

R1 = 4.7K 1)

R2 = 4.7K 1)

R3 = 1K 1)

R4 = 4.7K 1)

TX1

TX0

TX2

TX3

TX4

Gesture Port 5

SYNC

DNC

RX1

DNC

MCLR

VSS

VDD

IS1

IS2

RX2

DNC

VSS

MODE

VDD

SCL

SDA

TX4

TX3

TX2

TX1

DNC

AVDD

VSS

VANA

DNC

RX3

DNC

RX4

DNC

TX0

Gesture Port 4

Gesture Port 3

Gesture Port 2

Gesture Port 1

VCORECAP

DNC

RX0

DNC

PGC

PGD

10 KΩ

1) Specific values should be reviewed with your Microchip representative.

10 μF

C1 = 470pF 1)

MGC3140-E/MV

Test Point

TX3

TX2

TX1

MODE

GP5

GP4

GP3

GP2

GP1

SYNC

1.8 KΩ

VDD

8.6 Layout Recommendation

This section provides a brief description of layout hints for a proper system design.

The PCB layout requirements for MGC3140 follow the general rules for a mixed signal design. In

addition, there are certain requirements to be considered for the sensor signals and electrode feeding

lines.

The chip should be placed as close as possible to the electrodes to keep their feeding lines as short as

possible. Furthermore, it is recommended to keep MGC3140 away from electrical and thermal sources

within the system.

A two layer PCB layout is sufficient to enable analog and digital signals to be separated from each other

to minimize crosstalk.

The individual electrode feeding lines should be kept as far as possible apart from each other. VDD lines

should be routed as wide as possible.

MGC3140 requires a proper ground connection on all VSS pins which can be connected together.

MGC3140

Application Architecture

9. Development Support

Microchip provides software and hardware development tools for the MGC3140:

• Software:

– Aurea Software Package

– MGC3140 Linux Driver

• Schematics:

– GestIC Hardware References

9.1 Aurea Software Package

The Aurea evaluation software demonstrates Microchip’s GestIC technology and its features and

applications. Aurea provides visualization of the MGC3140 generated data and access to GestIC Library

controls and configuration parameters.

That contains the following:

• Visualization of hand position and user gestures

• Visualization of sensor data

• Real-time control of sensor features

• MGC3140 GestIC Library update

• Analog front-end parameterization

• Advanced sensor parameterization

• Logging of sensor values and storage in a log file

9.2 MGC3140 Linux Driver

Microchip provides a reference Linux driver which is available on: https://github.com/MicrochipTech/

linux_at91_GestIC.

9.3 GestIC Hardware References

The GestIC Hardware References package contains the PCB Layouts (Gerber files) for the MGC

development kits (Emerald, Hillstar and Woodstar) and a collection of electrode reference designs fitting

all kits. In addition, the package includes designs, parameter files and host code of various demonstrators

which represent complete systems for embedded or PC-based applications. The GestIC Hardware

Reference package can be downloaded from Microchip’s website via www.microchip.com/

GestICResources.

9.4 Evaluation Kits

For the complete list of demonstration, development and evaluation kits, refer to the Microchip website:

www.microchip.com/wwwproducts/en/mgc3140.

MGC3140

Development Support

10. Electrical Specifications

10.1 Absolute Maximum Ratings(†)

Parameter Rating

Ambient temperature -40°C to +125°C

Storage temperature -65°C to +150°C

Voltage on VDD with respect to VSS 4V

Voltage on non I2C pins with respect to VSS -0.3V to +3.6V

Voltage on I2C pins relative to VSS -0.3V to +5.5V

Notice: (†) Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional operation of the

device at those or any other conditions above those indicated in the operation listings of this

specification is not implied. Exposure above maximum rating conditions for extended periods

may affect device reliability.

Notice: (†) This device is sensitive to ESD damage and must be handled appropriately. Failure

to properly handle and protect the device in an application may cause partial to complete failure

of the device.

10.2 Recommended Operating Conditions

Parameter Rating

Operating temperature -40°C to +125°C

Storage temperature -65°C to +150°C

VDD 3.3V ± 5%

VANA 3.3V ± 5%

AVDD 3.3V ± 5%

10.3 I/O Characteristics

DC Input Characteristics Operating temperature: -40°C ≤ TA ≤ 125°C

Characteristic Symbol Pin Function Min Max Units Conditions

Input low

voltage VIL

Rx pins VSS 0.2 VDD V

SDA, SCL VSS 0.3 VDD V

Input high

voltage VIH

Rx pins 0.65 VDD VDD V

SDA, SCL 0.65 VDD 5.5 V

MGC3140

Electrical Specifications

DC Input Characteristics Operating temperature: -40°C ≤ TA ≤ 125°C

Characteristic Symbol Pin Function Min Max Units Conditions

Input leakage

current IIL

Rx pins ±1 uA VSS ≤ Vpin ≤ VDD

MCLR ±1 uA VSS ≤ Vpin ≤ VDD

Note: Parameters are characterized, but not tested.

DC Output Characteristics Operating temperature: -40°C ≤ TA ≤ 125°C

Characteristic Symbol Pin Function Min Max Units Conditions

Output low

voltage VIL

Tx, SDA, SCL,

SYNC 0.4 V IOL ≤ 10 mA VDD = 3.3V

Output high

voltage VIH

Tx, SDA, SCL,

SYNC

1.5(1) V IOH ≥ -14 mA VDD = 3.3V

2.0(1) V IOH ≥ -12 mA VDD = 3.3V

2.4(1) uA IOH ≥ -10 mA VDD = 3.3V

3.0(1) uA IOH ≥ -7 mA VDD = 3.3V

Note:

1. Parameters are characterized, but not tested.

10.4 Current Consumption

Operating mode

Current Consumption mA

Typical

Processing mode 29

Approach mode 0.23-2.4(1)

Deep Sleep mode 0.085

Note:

1. Approach mode current consumption is dependent on the Approach mode scan time. Figure 10-1

below shows the variation of current consumption with scan period.

MGC3140

Electrical Specifications

10.4.1 Approach scan current consumption

Figure 10-1. MGC3140 Power Consumption Vs Approach Scan Period

10.5 Timing Characteristics

10.5.1 Power-on and Reset Timing

Table 10-1. Power-on and Reset Parameters

Operating temperature: -40°C ≤ TA ≤ 125°C

Characteristic(1) Parameter Symbol Min Typical(2) Max Units

Power-up period:

Internal voltage regulator enabled TPU

- 400 600 us

System delay period:

Time required to reload device

configuration fuses plus clock delay

before first instruction is fetched TSYSDLY

- 1.2 - us

MCLRminimum pulse width TMCLR 2 - - us

BOR pulse width TBOR - 1 - us

Note:

1. These parameters are characterized, but not tested in manufacture.

2. Data in Typical column is at 3.3V, 25°C, unless otherwise stated.

MGC3140

Electrical Specifications

Figure 10-2. Power-On Timings

SDA/SCL

VDD

4.9 ms

TS line low for

duration of transfer

“SensorDataOutput” messages every 5 ms

1.1 ms

MGC3140 will respond to I2C messages

after the Firmware Version message has been transmitted to the host

Power on to “Firmware

Version" message

TS goes high

“Firmware Version” message

470 ms

600 ms

2 ms

Figure 10-3. Reset Timings

SDA/SCL

MCLR

TSline low for duration of message

“SensorDataOutput” messages every 5 ms

500 ms

0.44 ms

22 ms

1.1 ms

“Firmware Version”

message

MGC3140 will respond to I2C messages after the Firmware

Version message has been transmitted to the host

4.9 ms

MGC3140

Electrical Specifications

11. Packaging Information

Package Marking Information

Legend: XX...X Customer-specific information or Microchip part number

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

P b- free JEDEC ®designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Rev. 30-009000A

5/17/2017

48-Lead UQFN (6x6x0.5 mm) Example

XXXXXXXX

YYWWNNN

PIN 1 PIN 1

Rev. 30-009048A

9/04/2017

11.1 Package Details

The following sections give the technical details of the packages.

MGC3140

Packaging Information

2009 Microchip Technology Inc. DS00049BC-page 95

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MGC3140

Packaging Information

DS00049BC-page 94 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MGC3140

Packaging Information

MGC3140

Packaging Information

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as

a means to make files and information easily available to customers. Accessible by using your favorite

Internet browser, the web site contains the following information:

•Product Support – Data sheets and errata, application notes and sample programs, design

resources, user’s guides and hardware support documents, latest software releases and archived

software

•General Technical Support – Frequently Asked Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant program member listing

•Business of Microchip – Product selector and ordering guides, latest Microchip press releases,

listing of seminars and events, listings of Microchip sales offices, distributors and factory

representatives

Customer Change Notification Service

Microchip’s customer notification service helps keep customers current on Microchip products.

Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata

related to a specified product family or development tool of interest.

To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on

“Customer Change Notification” and follow the registration instructions.

Customer Support

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.

Local sales offices are also available to help customers. A listing of sales offices and locations is included

in the back of this document.

Technical support is available through the web site at: http://www.microchip.com/support

MGC3140

Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. –X /XX

Package

[X](1)

Tape

and Reel

Device Temperature

Range

Device: MGC3140

Tape & Reel Option:

Blank = Tube

T = Tape & Reel

Temperature Range:

I = -40°C to +85°C (Industrial)

E = -40°C to +125°C (Extended)

Package MV = 48-lead UQFN 6x6x0.5mm

Pattern QTP, SQTP, Code or Special Requirements (blank otherwise)

Orderable Part Number Firmware

Revision

Industrial/

Automotive

Description

MGC3140-E/MV (supplied

in tubes)

3.0.04

Industrial 48-pin UQFN48 6x6x0.5

RoHS compliant

Industrial grade, PPAP requests are not

supported

MGC3140-I/MV (supplied

in tubes)

Industrial

MGC3140T-E/MV

(supplied in tape and reel)

Industrial

MGC3140T-I/MV

(supplied in tape and reel)

Industrial

MGC3140-E/MVVAO

(supplied in tubes)

Automotive 48-pin UQFN48 6x6x0.5

RoHS compliant

Automotive grade; suitable for automotive

characterization, PPAP requests are

supported

MGC3140-I/MVVAO

(supplied in tubes)

Automotive

MGC3140T-E/MVVAO

(supplied in tape and reel)

Automotive

MGC3140T-I/MVVAO

(supplied in tape and reel)

Automotive

Examples:

• MGC3140-E/MV: Extended temperature, UQFN package.

• MGC3140-I/MV: Industrial temperature, UQFN package

Note:

MGC3140

1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used

for ordering purposes and is not printed on the device package. Check with your Microchip Sales

Office for package availability with the Tape and Reel option.

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the

market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of

these methods, to our knowledge, require using the Microchip products in a manner outside the

operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is

engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the

code protection features of our products. Attempts to break Microchip’s code protection feature may be a

violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software

or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice

Information contained in this publication regarding device applications and the like is provided only for

your convenience and may be superseded by updates. It is your responsibility to ensure that your

application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY

OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS

CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life

support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,

indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting

from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual

property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings,

BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,

Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA,

SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight

Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

MGC3140

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,

chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController,

dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi,

motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient

Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL

ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are

trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

ISBN: 978-1-5224-2982-1

Quality Management System Certified by DNV

ISO/TS 16949

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer

fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC®

DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design and manufacture of development

systems is ISO 9001:2000 certified.

MGC3140

AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Austin, TX

Tel: 512-257-3370

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Novi, MI

Tel: 248-848-4000

Houston, TX

Tel: 281-894-5983

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Tel: 317-536-2380

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Tel: 951-273-7800

Raleigh, NC

Tel: 919-844-7510

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Tel: 408-436-4270

Canada - Toronto

Tel: 905-695-1980

Fax: 905-695-2078

Australia - Sydney

Tel: 61-2-9868-6733

China - Beijing

Tel: 86-10-8569-7000

China - Chengdu

Tel: 86-28-8665-5511

China - Chongqing

Tel: 86-23-8980-9588

China - Dongguan

Tel: 86-769-8702-9880

China - Guangzhou

Tel: 86-20-8755-8029

China - Hangzhou

Tel: 86-571-8792-8115

China - Hong Kong SAR

Tel: 852-2943-5100

China - Nanjing

Tel: 86-25-8473-2460

China - Qingdao

Tel: 86-532-8502-7355

China - Shanghai

Tel: 86-21-3326-8000

China - Shenyang

Tel: 86-24-2334-2829

China - Shenzhen

Tel: 86-755-8864-2200

China - Suzhou

Tel: 86-186-6233-1526

China - Wuhan

Tel: 86-27-5980-5300

China - Xian

Tel: 86-29-8833-7252

China - Xiamen

Tel: 86-592-2388138

China - Zhuhai

Tel: 86-756-3210040

India - Bangalore

Tel: 91-80-3090-4444

India - New Delhi

Tel: 91-11-4160-8631

India - Pune

Tel: 91-20-4121-0141

Japan - Osaka

Tel: 81-6-6152-7160

Japan - Tokyo

Tel: 81-3-6880- 3770

Korea - Daegu

Tel: 82-53-744-4301

Korea - Seoul

Tel: 82-2-554-7200

Malaysia - Kuala Lumpur

Tel: 60-3-7651-7906

Malaysia - Penang

Tel: 60-4-227-8870

Philippines - Manila

Tel: 63-2-634-9065

Singapore

Tel: 65-6334-8870

Taiwan - Hsin Chu

Tel: 886-3-577-8366

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600

Thailand - Bangkok

Tel: 66-2-694-1351

Vietnam - Ho Chi Minh

Tel: 84-28-5448-2100

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

Finland - Espoo

Tel: 358-9-4520-820

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Garching

Tel: 49-8931-9700

Germany - Haan

Tel: 49-2129-3766400

Germany - Heilbronn

Tel: 49-7131-67-3636

Germany - Karlsruhe

Tel: 49-721-625370

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Rosenheim

Tel: 49-8031-354-560

Israel - Ra’anana

Tel: 972-9-744-7705

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Padova

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Norway - Trondheim

Tel: 47-7289-7561

Poland - Warsaw

Tel: 48-22-3325737

Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Gothenberg

Tel: 46-31-704-60-40

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Worldwide Sales and Service