EHP-A07/SUG01H-P01/TR High Power LED - 1W Data Sheet Features Applications Feature of the device: Small package with high efficiency Typical wavelength: 527 nm Typical view angle: 120 Typical light flux output: 57 lm @ 350mA. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. Optical efficiency: 45 lm/W. Moisture Sensitivity Level: 3 Thermal resistance (Junction to Heat sink): 17 C/W The product itself will remain within RoHS compliant version. Interior automotive lighting (e.g. dashboard backlighting) Decorative and entertainment lighting (incl. fiber optic illumination) Reading light (aircraft, car, bus) Signal and symbol luminaries Marker lights (e.g. steps, exit ways, etc.) Materials Items Description Housing black body Heat resistant polymer Encapsulating Resin Silicone resin Electrodes Ag plating copper alloy Die attach Silver paste Chip InGaN 1 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Dimensions Notes. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.25mm. 2 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Maximum Ratings (TSoldering =25C) Parameter Symbol Rating Unit DC Operating Current IF 400 mA Pulsed Forward Current(1) IPF 500 mA ESD 2000 V Tj 125 C Operating Temperature Top. -40 ~ +85 C Storage Temperature Tstge. -40 ~ +100 C Power Dissipation Pd 1 W Junction To Heat-Sink Thermal Resistance Rth 17 C/W ESD Sensitivity Junction Temperature Electro-Optical Characteristics(TSoldering =25C) Parameter Symbol Min Typ. Max Unit Brightness(2) v ---- 57 ---- lm Forward Voltage(3) VF ---- 3.55 ---- V Wavelength(4) d ---- 527 ---- nm Condition IF=350mA Note. 1. tp 100s, Duty cycle = 0.25 2. Luminous Flux measurement tolerance: 10%. 3. Forward Voltage measurement tolerance: 0.1V. 4. Wavelength measurement tolerance: 1nm 3 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Brightness Bin Table Group E F J Bin Min Typ. Max 1 1.5 ---- 2 3 3 Group Bin Min Typ. Max 3 1 52 ---- 60 ---- 4 2 60 ---- 70 4 ---- 5 3 70 ---- 85 4 5 ---- 6 4 85 ---- 100 5 6 ---- 8 5 100 ---- 130 1 8 ---- 10 1 130 ---- 160 2 10 ---- 13 2 160 ---- 200 3 13 ---- 17 3 200 ---- 250 4 17 ---- 20 4 250 ---- 300 5 20 ---- 23 5 300 ---- 400 1 23 ---- 27 1 400 ---- 500 2 27 ---- 33 2 500 ---- 600 3 33 ---- 39 3 600 ---- 750 4 39 ---- 45 4 750 ---- 1000 5 45 ---- 52 5 1000 ---- 1300 K N R 4 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Forward Voltage Bin Table Group U1 U2 U3 U4 Bin Min Typ. Max 1 1.75 ---- 1.85 2 1.85 ---- 1.95 3 1.95 ---- 1 2.05 2 Group Bin Min Typ. Max 1 2.95 ---- 3.05 2 3.05 ---- 3.15 2.05 3 3.15 ---- 3.25 ---- 2.15 1 3.25 ---- 3.35 2.15 ---- 2.25 2 3.35 ---- 3.45 3 2.25 ---- 2.35 3 3.45 ---- 3.55 1 2.35 ---- 2.45 1 3.55 ---- 3.65 2 2.45 ---- 2.55 2 3.65 ---- 3.75 3 2.55 ---- 2.65 3 3.75 ---- 3.85 1 2.65 ---- 2.75 1 3.85 ---- 3.95 2 2.75 ---- 2.85 2 3.95 ---- 4.05 3 2.85 ---- 2.95 3 4.05 ---- 4.15 1 4.15 ---- 4.25 2 4.25 ---- 4.35 3 4.35 ---- 4.45 V1 V2 V3 V4 V5 Group O R Bin Min Typ. Max 1 4.5 ---- 5.0 2 5.0 ---- 5.5 3 5.5 ---- 6.0 4 6.0 ---- 6.5 5 6.5 ---- 7.0 6 7.0 ---- 7.5 7 7.5 ---- 8.0 1 8.0 ---- 9.0 2 9.0 ---- 10.0 3 10.0 ---- 11.0 4 11.0 ---- 12.0 5 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Wavelength Bin Table Group B C G Bin Min Typ. Max 3 440 ---- 4 445 5 450 Group Bin Min Typ. Max 445 1 580 ---- 582.5 ---- 450 2 582.5 ---- 585 ---- 455 3 585 ---- 587.5 4 587.5 ---- 590 A 6 455 ---- 460 7 460 ---- 465 5 590 ---- 592.5 8 465 ---- 490 6 592.5 ---- 610 1 490 ---- 495 3 610 ---- 615 2 495 ---- 500 4 615 ---- 620 3 500 ---- 505 5 620 ---- 625 6 625 ---- 630 R 4 505 ---- 510 5 510 ---- 515 7 630 ---- 635 6 515 ---- 520 8 635 ---- 640 1 520 ---- 525 2 525 ---- 530 3 530 ---- 535 4 535 ---- 540 5 540 ---- 545 6 545 ---- 550 6 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Typical Electro-Optical Characteristics Curves Forward Voltage vs Forward Current, T Soldering =25C Relative Spectral Distribution, IF=350mA, T Soldering =25C 4.0 3.8 0.8 Forward Voltage (V) Relative Luminous Intenstiy 1.0 0.6 0.4 0.2 3.6 3.4 3.2 3.0 2.8 0.0 400 500 600 700 800 0 100 Wavelength(nm) 400 500 Forward Current Derating Curve, Derating based on TjMAX=125C 1.4 400 Forward Current (mA) 1.2 Luminous Intensity 300 Forward Current (mA) Relative Luminous Intensity vs Forward Current, T Soldering =25C 1.0 0.8 0.6 0.4 0.2 0.0 200 350 300 250 200 150 100 0 100 200 300 Forward Current (mA) 400 500 0 20 40 60 80 o Soldering Temperature ( C) 100 7 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Typical Representative Spatial Radiation Pattern 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2) Note. 1. 21/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is 10. 8 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Label explanation CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank REF: Rank of Forward Voltage LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.1mm. 9 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Carrier Tape Dimensions: Loaded quantity 240 PCS per reel Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label 10 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Reliability Data Stress Test Stress Condition Stress Duration Solderability Tsol=230, 5sec 1 times Reflow Tsol=260, 10sec, 6min 3 times Thermal Shock H110 20min. ' 20sec. 'L 40 20min. 200 Cycles Temperature Cycle H100 30min. ' 5min. 'L 40 30min. 200 Cycles High Temperature/Humidity Reverse Bias Ta=85 , RH=85% 1000hours Ta=55, IF=350mA 1000hours Ta=85, IF=225mA 1000hours Low Temperature Operation Life Ta=-40, IF=350mA 1000hours Power Temperature Cycle H85 15min. ' 5min. 'L 40 15min. IF=225mA,2min on/off 200cycles High Temperature Operation Life #2 High Temperature Operation Life #3 *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)50% *VF: FORWARD VOLTAGE DIFFERENCE20% 11 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Precautions For Use 1. Over-current-proof Although the EHP-A07 series has a conductive ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 2. Storage i. Do not open the moisture proof bag before the devices are ready to use. ii. Before the package is opened, LEDs should be stored at temperatures less than 30 and humidity less than 90%. iii. LEDs should be used within a year. iv. After the package is opened, LEDs should be stored at temperatures less than 30and humidity less than 60%. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 605 for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A07 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximately 1W of thermal energy at 350mA operation. ii. Heat dissipation or thermal conduction design is strongly recommended on PCB or MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2. iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of die may exceed over the limit at high current driving conditions and the LEDs' lifetime may be decrease dramatically. iv. For further thermal management suggestions, please consult the Everlight Design Guide or local representatives for assistance. v. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. vi. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 12 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W 4. Proper Handling To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below. Bare Hand When handling the product, do not apply direct pressure on the resin. Pick and Place Nozzle for Surface Mount Assembly. Avoid directly contacting with nozzle. Tweezers Do not touch the resin to avoid scratching or other damage. During Module Assembly Do not stack the modules together, it could damage the resin or scratch the lens. 13 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W 5. Soldering Iron i. For Reflow Process a. EHP-A07 series are suitable for SMT process. b. Curing of glue in oven according to standard operation flow processes. c. Reflow soldering should not be done more than twice. d. In soldering process, stress on the LEDs during heating should be avoided. e. After soldering, do not warp the circuit board. ii. For Manual Soldering Process a. For prototype builds or small series production runs it is possible to place and solder the LED by hand. b. Dispense thermal conductive glue or grease on the substrates and follow its curing specifications. Gently press LED housing to closely connect LED and substrate. c. It is recommended to hand solder the leads with a solder tip temperature of 280C for less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of two seconds or more. d. Take caution and be aware that damaged products are often a result of improper hand soldering technique. 14 of 15 EHP-A07/SUG01H-P01/TR High Power LED - 1W Revision History Page 1-15 3,6 Subjects(major change in previous version) Changes the datasheet edition form Date of change 19-May-2009 1. Revision DC Operating Current 16-Jul-2009 2. T Ambient revision is T TSoldering Prepared date: 16-Jul-2009 Device No.: DHE-0000336 Created by: Amy Ma Rev.: 3 For product information and a complete list of distributors, please go to our web site www.everlight.com Everlight Electronics Co., Ltd. and the logo are trademarks of Everlight Electronics Co., Ltd. in the Taiwan and other countries. Data subject to change. Copyright (c) 2005-2009 Everlight Electronics Co., Ltd.. All rights reserved. 15 of 15