PRELIMINARY AMD-K6TM-2E Embedded Processor Standard- and Low-Power Processor Featuring Super7TM and Socket 7 Platform Compatibility, Superscalar MMXTM Unit, and 3DNow!TM Technology DISTINCTIVE CHARACTERISTICS Advanced 6-Issue RISC86(R) Superscalar Microarchitecture - Ten parallel specialized execution units - Multiple sophisticated x86-to-RISC86 instruction decoders - Advanced two-level branch prediction - Speculative execution - Out-of-order execution - Register renaming and data forwarding - Up to six RISC86 instructions per clock Large On-Chip Split 64-Kbyte Level-One (L1) Cache - 32-Kbyte instruction cache with additional 20 Kbytes of predecode cache - 32-Kbyte writeback dual-ported data cache - Two-way set associative - MESI protocol support 3DNow!TM Technology - Additional instructions to improve 3D graphics and multimedia performance - Separate multiplier and ALU for superscalar instruction execution 321-Pin Ceramic Pin Grid Array (CPGA) Socket 7 Platform Compatible, 66-MHz Frontside Bus Super7TM Platform Compatible, 100-MHz Frontside Bus Supported on the 300-MHz and 350-MHz Versions of the AMD-K6-2E Processor High-Performance Industry-Standard MMXTM Instructions - Dual integer ALU for superscalar execution High-Performance IEEE 754-Compatible and 854-Compatible Floating-Point Unit Industry-Standard System Management Mode (SMM) IEEE 1149.1 Boundary Scan x86 Binary Software Compatibility Low-Power 0.25-micron Process Technology - Split-plane power with support for full 3.3 V I/O - Available with a low-power 1.9-V core voltage and extended temperature rating or with a standard-power 2.2-V core voltage and standard temperature rating Operating Frequencies - Standard-power devices: 233, 266, 300, 333, and 350 MHz - Low-power devices: 233, 266, 300, and 333 MHz Package GENERAL DESCRIPTION The AMD-K6-2E processor with 3DNow!TM technology is a functionally compatible embedded version of the sixth generation, Microsoft(R) Windows(R) compatible AMD-K6-2 processor. The AMD-K6-2E embedded processor delivers the same high performance and incorporates the same leading-edge features, including the innovative and efficient RISC86(R) microarchitecture, a large 64-Kbyte level-one cache (32-Kbyte dual-ported data cache, 32-Kbyte instruction cache with predecode data), and a powerful IEEE 754-compatible and 854-compatible floating-point execution unit. The AMD-K6-2E embedded processor also supports the new features incorporated into the AMD-K6-2 processor. These features include superscalar MMXTM instruction execution support, support for the Super7TM (c) Copyright 1999 Advanced Micro Devices, Inc. All rights reserved. 100-MHz frontside bus, and AMD's innovative 3DNow!TM technology for high-performance multimedia and 3D graphics operation based on high-performance single instruction multiple data (SIMD) execution resources. The AMD-K6-2E embedded processor includes several key features that are very beneficial to the embedded market. The AMD-K6-2E processor offers leading-edge performance for embedded systems requiring compatibility with the extensive installed base of x86 software. The AMD-K6-2E processor's Socket 7 and Super7 platform-compatible, 321-pin ceramic pin grid array (CPGA) package allows the product designer to reduce time-to-market by leveraging today's cost-effective industry-standard infrastructure to deliver a superior-performing embedded solution. Publication# n/a Rev: n/a Issue Date: December 1999 AMD-K6TM-2E PROCESSOR FEATURES The AMD-K6-2E embedded processor is available in two versions. generation solutions. AMD is now bringing this advanced capability to embedded systems. The low-power version has a 1.9-V core voltage AMD has taken a leadership role in developing these new instructions that enable exciting new levels of performance and realism. 3DNow! technology was defined and implemented in collaboration with Microsoft, application developers, and graphics vendors, and has received an enthusiastic reception. It is compatible with today's existing x86 software, is supported by industry-standard APIs, and requires no operating system support, thereby enabling a broad class of applications to benefit from 3DNow! technology. and extended temperature rating. The standard-power version has a 2.2-V core voltage and is the embedded equivalent of the industry-standard desktop version of the AMD-K6-2 processor. System Management Mode and Power Management The AMD-K6-2E processor includes the complete industry-standard system management mode (SMM), which is critical to system resource and power management. The AMD-K6-2E processor also features industrystandard Stop-Clock (STPCLK#) control circuitry and the Halt instruction, both required for implementing the ACPI power management specification. Microarchitecture The AMD-K6-2E processor's RISC86 microarchitecture is a decoupled decode/execution superscalar design that implements state-of-the-art techniques to achieve leading-edge performance. Advanced design techniques implemented in the AMD-K6-2E processor include multiple x86 instruction decode, single-clock internal RISC operations, ten execution units that support superscalar operation, out-of-order execution, data forwarding, speculative execution, and register renaming. In addition, the processor supports advanced branch prediction logic by implementing an 8192-entry branch history table, a branch target cache, and a return address stack, which combine to deliver better than a 95% prediction rate. These design techniques enable the AMD-K6-2E to issue, execute, and retire multiple x86 instructions per clock, resulting in excellent scalable performance. 3DNow!TM Technology AMD's 3DNow! technology is an instruction-set extension to x86, which includes 21 new instructions to accelerate 3D graphics and other single-precision floating-point compute intensive operations. Improvements include fast frame rates on high-resolution graphics applications, superior modeling of realworld environments and physics, life-like images, graphics, and audio. AMD has already shipped millions of processors with 3DNow! technology for desktop and notebook PCs, revolutionizing the 3D experience with up to four times the peak floating-point performance of previous sixth 2 Industry-Standard x86 Architecture The AMD-K6-2E processor is x86 binary code compatible. AMD's extensive experience with six generations of x86 processors has been carefully integrated into the processor to enable compatibility with Windows(R)based operating systems, including Windows 95, Windows 98, Windows CE, Windows NT(R), and Windows NTE. The AMD-K6-2E processor is also compatible with DOS, OS/2, UNIX, and other leading operating systems, including real-time operating systems (RTOS) commonly used in embedded applications such as pSOS, QNX, RTXC, and VxWorks. The AMD-K6-2E processor is compatible with more than 60,000 software applications, including the latest software optimized for 3DNow! and MMX technologies. AMD has shipped more than 120 million x86 microprocessors, including more than 60 million Windowscompatible processors. The AMD-K6-2E processor is among a long line of Microsoft Windows compatible processors from AMD. The combination of state-of-the-art features, leadingedge performance, high-performance multimedia engine, x86 compatibility, and low-cost infrastructure enable decreased development costs and improved time-to-market, making the AMD-K6-2E processor the superior choice for embedded systems. Process Technology The AMD-K6-2E processor is implemented using an advanced CMOS 0.25-micron process technology that utilizes a split core and I/O voltage supply, which allows the core of the processor to operate at a low voltage while the I/O portion operates at the industry-standard 3.3 V. This technology enables high performance while reducing power consumption by operating the core at a low voltage and limiting power requirements to the acceptable levels for today's embedded systems. AMD-K6TM-2E Processor Press Data Sheet Provides an easy upgrade path for future embed- Super7TM Platform Initiative ded applications, as well as a bridge to legacy applications All AMD-K6-2E processors remain pin compatible with existing Socket 7 solutions; however, for maximum system performance, the 300-MHz and 350-MHz versions of the processor work optimally in Super7 designs that incorporate advanced features such as support for the 100-MHz frontside bus and AGP graphics. By taking advantage of the low-cost, mature Socket 7 infrastructure, the Super7 platform will continue to provide superior value and leading-edge performance for embedded systems. Block Diagram The Super7 platform has the following advantages: As shown in Figure 1, the high-performance, out-of-order execution engine of the AMD-K6-2E processor is mated to a split level-one 64-Kbyte writeback cache with 32 Kbytes of instruction cache and 32 Kbytes of data cache. The instruction cache feeds the decoders and, in turn, the decoders feed the scheduler. The Instruction Control Unit (ICU) issues and retires RISC86 operations contained in the scheduler. The system bus interface is an industry-standard 64-bit Super7 and Socket 7 demultiplexed bus. Delivers performance and features competitive with alternate platforms at the same clock speed, and at a significantly lower cost Takes advantage of existing system designs for superior value Enables OEMs and resellers to take advantage of mature, high-volume infrastructure supported by multiple BIOS, chipset, graphics, and motherboard suppliers The AMD-K6-2E processor combines the latest in processor microarchitecture to provide the highest x86 performance for today's computational systems. The AMD-K6-2E offers true sixth-generation performance and x86 binary software compatibility Reduces inventory and design costs with one motherboard for a wide range of products Builds on a huge installed base of more than 100 million motherboards . 32-KByte Level-One Instruction Cache Predecode Logic 64-Entry ITLB 20-KByte Predecode Cache 16-Byte Fetch Level-One Cache Controller Branch Logic (8192-Entry BHT) (16-Entry BTC) (16-Entry RAS) Multiple Instruction Decoders x86 to RISC86 100 MHz Super7 Bus Interface Four RISC86 Decode Out-of-Order Execution Engine Scheduler Buffer (R) Six RISC86 Operation Issue Load Unit Store Unit Instruction Control Unit (24 RISC86) Register X Functional Units Integer/ Multimedia/3DNow! E Register Y Functional Units Integer/ Multimedia /3DNow! FPU Branch Unit Store Queue 32-KByte Level-One Dual-Port Data Cache 128-Entry DTLB Figure 1. AMD-K6TM-2E Processor Block Diagram AMD-K6TM-2E Processor Press Data Sheet 3 ORDERING INFORMATION AMD standard- and low-power products are available in several operating ranges. The ordering part number (OPN) is formed by a combination of the elements below. See Table 1 for valid ordering part number combinations. AMD-K6-2E/ 350 A F R Case Temperature R =0C-70C Z =0C-85C Operating Voltage F =2.1 V-2.3 V (Core) / 3.135 V-3.6 V (I/O) M =1.8 V-2.0 V (Core) / 3.135 V-3.6 V (I/O) Package Type A =321-pin Ceramic Pin Grid Array (CPGA) Performance Rating /350 = 350 MHz /333 = 333 MHz /300 = 300 MHz /266 = 266 MHz /233 = 233 MHz Family/Core AMD-K6-2E Embedded Processor Table 1. Device Type Low Power Standard Power Valid Ordering Part Number Combinations1 Case Temperature Maximum CPU/Bus Frequency 1.8V-2.0V (Core) 3.135V-3.6V (I/O) 0C-85C 333 MHz/95 MHz2 321-pin CPGA 1.8V-2.0V (Core) 3.135V-3.6V (I/O) 0C-85C 300 MHz/100 MHz2 AMD-K6-2E/266AMZ 321-pin CPGA 1.8V-2.0V (Core) 3.135V-3.6V (I/O) 0C-85C 266 MHz/66 MHz AMD-K6-2E/233AMZ 321-pin CPGA 1.8V-2.0V (Core) 3.135V-3.6V (I/O) 0C-85C 233 MHz/66 MHz AMD-K6-2E/350AFR 321-pin CPGA 2.1V-2.3V (Core) 3.135V-3.6V (I/O) 0C-70C 350 MHz/100 MHz AMD-K6-2E/333AFRl 321-pin CPGA 2.1V-2.3V (Core) 3.135V-3.6V (I/O) 0C-70C 333 MHz/95 MHz2 AMD-K6-2E/300AFR 321-pin CPGA 2.1V-2.3V (Core) 3.135V-3.6V (I/O) 0C-70C 300 MHz/100 MHz2 AMD-K6-2E/266AFR 321-pin CPGA 2.1V-2.3V (Core) 3.135V-3.6V (I/O) 0C-70C 266 MHz/66 MHz AMD-K6-2E/233AFR 321-pin CPGA 2.1V-2.3V (Core) 3.135V-3.6V (I/O) 0C-70C 233 MHz/66 MHz OPN Package Type Operating Voltage AMD-K6-2E/333AMZ 321-pin CPGA AMD-K6-2E/300AMZ Notes: 1. This table lists configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly-released combinations. 2. Also supports 66-MHz bus operation. 4 AMD-K6TM-2E Processor Press Data Sheet OPERATING RANGES The AMD-K6-2E processor is designed to provide functional operation if the voltage and temperature parameters are within the limits defined in Table 2. Table 2. Operating Ranges Parameter VCC21 VCC31 TCASE Parameter Description Minimum Typical Maximum Core Supply Voltage--Low Power 1.8 V 1.9 V 2.0 V Core Supply Voltage--Standard Power3 2.1 V 2.2 V 2.3 V 3.135 V 3.3 V 3.6 V 0C - 85C 0C - 70C 2 I/O Supply Voltage--Standard and Low Power 4 Case Temperature--Low Power Case Temperature--Standard Power5 Notes: 1. VCC2 and VCC3 are referenced from VSS. 2. VCC2 specification for 1.9-V component. 3. VCC2 specification for 2.2-V component. 4. Case temperature range required for AMD-K6-2E/xxxAMZ valid ordering part number combinations, where xxx represents the processor core frequency. 5. Case temperature range required for AMD-K6-2E/xxxAFR valid ordering part number combinations, where xxx represents the processor core frequency. ABSOLUTE RATINGS The AMD-K6-2E processor is not designed to be operated beyond the operating ranges listed in Table 2. Exposure to conditions outside these operating ranges for extended periods of time can affect long-term reliability. Permanent damage can occur if the absolute ratings listed in Table 3 are exceeded. Table 3. Note: If the AMD-K6-2E processor shows a "7" after the date code, refer to the numbers in the last (rightmost) column of Table 3. The AMD-K6(R)-2 Revision Guide (order #21641) available on AMD's web site contains package marking details, including the location of the date code Absolute Ratings Parameter Minimum Maximum for OPN Suffixes: 233AFR, 233AMZ, 266AFR, 266AMZ, 300AFR1 Maximum for All OPNs2 VCC2 -0.5 V 2.6 V 2.4 V VCC3 -0.5 V 3.6 V 3.6 V VPIN3 -0.5 V VCC3 + 0.5 V and < 4.0 V VCC3 + 0.5 V and < 4.0 V TCASE (under bias) -65C +110C +110C TSTORAGE -65C +150C +150C Notes: 1. The data in this column applies to OPN suffixes 233AFR, 233AMZ, 266AFR, 266AMZ, and 300AFR, provided that the processor is not marked with "7" following the date code (i.e., is blank). 2. The data in this column applies to all OPNs listed in Table 1, "Valid Ordering Part Number Combinations," on page 4 (including 233AFR, 233AMZ, 266AFR, 266AMZ, and 300AFR when the processor is marked with a "7" following the date code). 3. VPIN (the voltage on any I/O pin) must not be greater than 0.5 V above the voltage being applied to VCC3. In addition, the VPIN voltage must never exceed 4.0 V. AMD-K6TM-2E Processor Press Data Sheet 5 DC CHARACTERISTICS The DC characteristics of the AMD-K6-2E processor are shown in Table 4. Table 4. DC Characteristics Symbol Parameter Description Min Max VIL Input Low Voltage -0.3 V +0.8 V VIH1 Input High Voltage 2.0 V VCC3 +0.3 V VOL Output Low Voltage VOH Output High Voltage 0.4 V 2.4 V 2 1.9 V Power Supply Current ICC2 Low Power 2.2 V Power Supply Current6 ICC2 Standard Power 3.3 V Power Supply Current7 ICC3 Standard and Low Power ILI8 4.75 A 233 MHz2,3 5.35 A 266 MHz2,3 5.50 A 300 MHz2,3,5 5.65 A 333 MHz2,3,4 6.50 A 233 MHz3,6 7.35 A 266 MHz3,6 8.45 A 300 MHz3,5,6 9.40 A 333 MHz3,4,6 9.85 A 350 MHz5,6 0.52 A 233 MHz3,7 0.54 A 266 MHz3,7 0.56 A 300 MHz3,5,7 0.58 A 333 MHz3,4,7 0.60 A 350 MHz5,7 Input Leakage Current 15 mA Output Leakage Current 15 mA 9 Input Leakage Current Bias with Pullup -400 mA IIH10 Input Leakage Current Bias with Pulldown 200 mA CIN Input Capacitance 10 pF COUT Output Capacitance 15 pF COUT I/O Capacitance 20 pF CCLK CLK Capacitance 10 pF CTIN Test Input Capacitance (TDI, TMS, TRST#) 10 pF CTOUT Test Output Capacitance (TDO) 15 pF CTCK TCK Capacitance 10 pF IIL IOL = 4.0-mA load IOH = 3.0-mA load 8 ILO Comments Notes: 1. VCC3 refers to the voltage being applied to VCC3 during functional operation. 2. VCC2=2.0 V --The maximum power supply current must be taken into account when designing a power supply. 3. This specification applies to components using a CLK frequency of 66 MHz. 4. This specification applies to components using a CLK frequency of 95 MHz. 5. This specification applies to components using a CLK frequency of 100 MHz. 6. VCC2=2.3 V --The maximum power supply current must be taken into account when designing a power supply. 7. VCC3=3.6 V --The maximum power supply current must be taken into account when designing a power supply. 8. Refers to inputs and I/O without an internal pullup resistor and 0 VIN VCC3. 9. Refers to inputs with an internal pullup and VIL=0.4 V. 10.Refers to inputs with an internal pulldown and VIH=2.4 V. 6 AMD-K6TM-2E Processor Press Data Sheet POWER DISSIPATION Table 5 and Table 6 list the typical and maximum power dissipation of the AMD-K6-2E processor during normal and reduced power states. . Table 5. Typical and Maximum Power Dissipation for OPN Suffix AMZ (Low-Power Devices) Clock Control State 233 MHz1 266 MHz1 300 MHz1,3 333 MHz1,2 Thermal Power (Maximum)4,5 9.00 W 10.00 W 10.00 W 10.00 W Thermal Power (Typical)6 6.30 W 7.00 W 7.00 W 7.00 W Stop Grant/Halt (Maximum)7 1.20 W 1.20 W 1.20 W 1.20 W Stop Clock (Maximum)8 1.00 W 1.00 W 1.00 W 1.00 W Notes: 1. 2. 3. 4. 5. 6. 7. 8. This specification applies to components using a CLK frequency of 66 MHz. This specification applies to components using a CLK frequency of 95 MHz. This specification applies to components using a CLK frequency of 100 MHz. The maximum power dissipated in the normal clock control state must be taken into account when designing a solution for thermal dissipation for the AMD-K6-2E processor. Maximum power is determined for the worst-case instruction sequence or function for the listed clock control states with VCC2 = 1.9 V, and VCC3 = 3.3 V. Typical power is determined for the typical instruction sequences or functions associated with normal system operation with VCC2 = 1.9 V, and VCC3 = 3.3 V. The CLK signal and the internal PLL are still running but most internal clocking has stopped. The CLK signal, the internal PLL, and all internal clocking has stopped. Table 6. Typical and Maximum Power Dissipation for OPN Suffix AFR (Standard-Power Devices) Clock Control State 233 MHz1 266 MHz1 300 MHz1,3 333 MHz1,2 350 MHz3 Thermal Power (Maximum)4,5 13.50 W 14.70 W 17.20 W 19.00 W 19.95 W Thermal Power (Typical)6 8.10 8.85 W 10.35 W 11.40 W 11.98 W Stop Grant/Halt (Maximum)7 2.46 W 2.48 W 2.50 W 3.94 W 3.96 W Stop Clock (Maximum)8 2.25 W 2.25 2.25 W 3.50 W 3.50 W Notes: 1. This specification applies to components using a CLK frequency of 66 MHz. 2. This specification applies to components using a CLK frequency of 95 MHz. 3. This specification applies to components using a CLK frequency of 100 MHz. 4. The maximum power dissipated in the normal clock control state must be taken into account when designing a solution for thermal dissipation for the AMD-K6-2E processor. 5. Maximum power is determined for the worst-case instruction sequence or function for the listed clock control states with VCC2 = 2.2 V, and VCC3 = 3.3 V. 6. Typical power is determined for the typical instruction sequences or functions associated with normal system operation with VCC2 = 2.2 V, and VCC3 = 3.3 V. 7. The CLK signal and the internal PLL are still running but most internal clocking has stopped. 8. The CLK signal, the internal PLL, and all internal clocking has stopped. AMD-K6TM-2E Processor Press Data Sheet 7 PIN DESIGNATION DIAGRAMS Figure 2. 8 AMD-K6TM-2E Processor Connection Diagram (Top-Side View CPGA) AMD-K6TM-2E Processor Press Data Sheet Figure 3. AMD-K6TM-2E Processor Connection Diagram (Bottom-Side View CPGA) AMD-K6TM-2E Processor Press Data Sheet 9 PIN DESIGNATIONS BY FUNCTIONAL GROUPING Pin Name Pin Number Control A20M# ADS# ADSC# AHOLD APCHK# BE0# BE1# BE2# BE3# BE4# BE5# BE6# BE7# BF0 BF1 BF2 BOFF# BRDY# BRDYC# BREQ CACHE# CLK D/C# EADS# EWBE# FERR# FLUSH# HIT# HITM# HLDA HOLD IGNNE# INIT INTR INV KEN# LOCK# M/IO# NA# NMI PCD PCHK# PWT RESET SCYC SMI# SMIACT# STPCLK# VCC2DET VCC2H/L# W/R# WB/WT# 10 AK-08 AJ-05 AM-02 V-04 AE-05 AL-09 AK-10 AL-11 AK-12 AL-13 AK-14 AL-15 AK-16 Y-33 X-34 W-35 Z-04 X-04 Y-03 AJ-01 U-03 AK-18 AK-04 AM-04 W-03 Q-05 AN-07 AK-06 AL-05 AJ-03 AB-04 AA-35 AA-33 AD-34 U-05 W-05 AH-04 T-04 Y-05 AC-33 AG-05 AF-04 AL-03 AK-20 AL-17 AB-34 AG-03 V-34 AL-01 AN-05 AM-06 AA-05 Pin Name Pin Number Address A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 AL-35 AM-34 AK-32 AN-33 AL-33 AM-32 AK-30 AN-31 AL-31 AL-29 AK-28 AL-27 AK-26 AL-25 AK-24 AL-23 AK-22 AL-21 AF-34 AH-36 AE-33 AG-35 AJ-35 AH-34 AG-33 AK-36 AK-34 AM-36 AJ-33 Pin Name D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 D37 D38 D39 D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 Pin Number Data K-34 G-35 J-35 G-33 F-36 F-34 E-35 E-33 D-34 C-37 C-35 B-36 D-32 B-34 C-33 A-35 B-32 C-31 A-33 D-28 B-30 C-29 A-31 D-26 C-27 C-23 D-24 C-21 D-22 C-19 D-20 C-17 C-15 D-16 C-13 D-14 C-11 D-12 C-09 D-10 D-08 A-05 E-09 B-04 D-06 C-05 E-07 C-03 D-04 E-05 D-02 F-04 AMD-K6TM-2E Processor Press Data Sheet Pin Name D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 Pin Number Data E-03 G-05 E-01 G-03 H-04 J-03 J-05 K-04 L-05 L-03 M-04 N-03 Test TCK TDI TDO TMS TRST# M-34 N-35 N-33 P-34 Q-33 Parity AP DP0 DP1 DP2 DP3 DP4 DP5 DP6 DP7 AK-02 D-36 D-30 C-25 D-18 C-07 F-06 F-02 N-05 No Connect (NC) VCC2 A-37 E-17 E-25 R-34 S-33 S-35 W-33 AJ-15 AJ-23 AL-19 AN-35 A-07 A-09 A-11 A-13 A-15 A-17 B-02 E-15 G-01 J-01 L-01 N-01 Q-01 S-01 U-01 W-01 Y-01 AA-01 AC-01 AE-01 AG-01 AJ-11 AN-09 AN-11 AN-13 AN-15 AN-17 AN-19 Internal No Connect (INC) C-01 H-34 Y-35 Z-34 AC-35 AL-07 AN-01 AN-03 Reserved (RSVD) J-33 L-35 P-04 Q-03 Q-35 R-04 S-03 S-05 AA-03 AC-03 AC-05 AD-04 AE-03 AE-35 Key AH-32 Pin Numbers VCC3 A-19 A-21 A-23 A-25 A-27 A-29 E-21 E-27 E-37 G-37 J-37 L-33 L-37 N-37 Q-37 S-37 T-34 U-33 U-37 W-37 Y-37 AA-37 AC-37 AE-37 AG-37 AJ-19 AJ-29 AN-21 AN-23 AN-25 AN-27 AN-29 VSS VSS A-03 B-06 B-08 B-10 B-12 B-14 B-16 B-18 B-20 B-22 B-24 B-26 B-28 E-11 E-13 E-19 E-23 E-29 E-31 H-02 H-36 K-02 K-36 M-02 M-36 P-02 P-36 R-02 R-36 T-02 T-36 U-35 V-02 V-36 X-02 X-36 Z-02 Z-36 AB-02 AB-36 AD-02 AD-36 AF-02 AF-36 AH-02 AJ-07 AJ-09 AJ-13 AJ-17 AJ-21 AJ-25 AJ-27 AJ-31 AJ-37 AL-37 AM-08 AM-10 AM-12 AM-14 AM-16 AM-18 AM-20 AM-22 AM-24 AM-26 AM-28 AM-30 AN-37 AMD-K6TM-2E Processor Press Data Sheet 11 (c) 1999 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. 12 AMD-K6TM-2E Processor Press Data Sheet