DCT OR DCU PACKAGE
(TOP VIEW)
1SCL_B
8
27VCCB
3 6 OE
45
SDA_B
GND
VCCA
SDA_A SCL_A
YZP PACKAGE
(BOTTOM VIEW)
SDA_A 5
4SCL_A
3 6 OE
VCCA
27VCCB
GND
8SCL_B
1
SDA_B A1
B1
C1
D1
A2
B2
C2
D2
TCA9406
www.ti.com
SCPS221 JULY 2010
2-BIT BIDIRECTIONAL 1MHz, I
2
C BUS AND SMBUS VOLTAGE-LEVEL TRANSLATOR WITH
8kV HBM ESD
Check for Samples: TCA9406
1FEATURES TYPICAL LEVEL-SHIFTER
APPLICATIONS
2 2-Bit Bidirectional Translator for SDA and SCL I2C/SMBus
Lines in Mixed-Mode I2C Applications UART
Lock-Up Free for Bus Isolation when OE GPIO
Control Pin referring to VCCA with 5-V Input
Tolerant
Level Translation Range
1.8 V to 2.5 V/3.3 V/5 V
2.5 V to 2.5 V/3.3 V/5 V
3.3 V to 3.3 V/5 V
Internal10-kΩPullup Resistor on Each Port
and Option to Add External Pullup Resistor if
Required
Provides Bidirectional Voltage Translation
With No Direction Pin
Ioff Support Partial Power Down (VCC= 0 V)
With 2 mA
High-Impedance Output SCL1, SDA1, SCL2,
and SDA2 Pins When OE = Low or VCC=0V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
A Port
2500-V Human-Body Model (A114-B)
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
B Port
8-kV Human-Body Model (A114-B)
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The TCA9406 is a dual bidirectional I2C-Bus and SMBus Voltage-Level translator with enable (OE) Input. It is
operational from 1.65 V to 3.6 V on A-Port and 2.3 V to 5.5 V on B-port. Enable (OE) input is referenced to
VCCA with a maximum input voltage tolerance of 4.6 V.
The TCA9406 can operate up to 24Mbps in push pull mode and 2Mbps with open drain mod. Its compatible
with a standard I2C bus 100 kHz, 400 kHz and 1 MHz at both sides of A-Port and B-Port.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoStar is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TCA9406
SCPS221 JULY 2010
www.ti.com
With the standard I2C bus system, it needs pull-up resistors to provide logic HIGH levels on the translator
bus. The TCA9406 is an open-drain bus level configuration of the I2C-bus. The value of pullup resistors
depends on the system, but each side of the translator must have pull-up resistors and TCA9406 already has
10 kΩpullup resistors on each side and it allows to add additional external pull-up resistors. It can work with
standard-mode, fast-mode and fast mode plus I2C-bus devices in additional to SMBus.
The TCA9406 is not a bus buffer like the PCA9515A and PCA9517. It provides both level translation and
physically isolates the capacitance to either side of the bus when both sides are connected. The Ioff feature
can be utilized to isolate the bus into high impedance when using the power supply to off the either VCCA or
VCCB.
The Enable (OE) should be tied to GND through a pulldown resistor to ensure the high-impedance state
during power up or power down. The minimum value of the resistor is determined by the current-sourcing
capability of the driver.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
NanoStar™ WCSP (DSBGA) Reel of 3000 TCA9406YZPR
0.23-mm Large Bump YZP Reel of 3000 TCA9406DCTR
–40°C to 85°C SSOP DCT Tube of 250 TCA9406DCTT
VSSOP DCU Reel of 3000 TCA9406DCUR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCT: The actual top-side marking has three additional characters that designate the year, month, and wafer fab/assembly site.
DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
PIN DESCRIPTION
NO. NAME TYPE FUNCTION
DCT, YZP
DCU
1 A1 SDA_B I/O Input/output B. Referenced to VCCB. Allow I2C_SDA configured to 2.5V/3.3V/5V
2 B1 GND GND Ground
A-port supply voltage. 1.65 V VCCA 3.6 V and VCCA VCCB. Configuration for
3 C1 VCCA PWR SDA_A, SCL_A, and OE
4 D1 SDA_A I/O Input/output A. Referenced to VCCA. Allows I2C_SDA configured to 1.8V, 2.5V, 3.3V
5 D2 SCL_A I/O Input/output A. Referenced to VCCA. Allows I2C_SCL configured to 1.8V, 2.5V, 3.3V
Output enable (active High). Pull OE low to place all outputs in 3-state mode.
6 C2 OE Input Referenced to VCCA. Pull OE to LOW to place all outputs in 3-state mode with 3.6V
input tolerance.
7 B2 VCCB PWR B-port supply voltage. 2.3 V VCCB 5.5 V for SDA_B, SCL_B
8 A2 SCL_B I/O Input/output B. Referenced to VCCB. Allow I2C_SCL configured to 2.5V/3.3V/5V
2Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
Master
I2C
Bus
I2C
Bus
Devices
1.8V 0.1!F3.3V
VCCA VCCB
SDA_A SDA_B
SCL_A SCL_B
OE
Optional Resistors
Design Notes:
OE can be directly tie to 1.8V (VccA), if the chip wants all the ways ENABLE Mode.
Master
I2C
Bus
I2C
Bus
Devices
1.8V 0.1!F3.3V
VCCA VCCB
SDA_A SDA_B
SCL_A SCL_B
OE
Optional Resistors
Design Notes:
OE can be directly tie to 1.8V (VccA), if the chip wants all the ways ENABLE Mode.
TCA9406
www.ti.com
SCPS221 JULY 2010
TYPICAL OPERATING CIRCUIT
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TCA9406
TCA9406
SCPS221 JULY 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
over recommended operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCCA Supply voltage range –0.5 4.6 V
VCCB Supply voltage range –0.5 6.5 V
A port –0.5 4.6
VIInput voltage range(2) V
B port –0.5 6.5
A port –0.5 4.6
Voltage range applied to any output
VOV
in the high-impedance or power-off state(2) B port –0.5 6.5
A port –0.5 VCCA + 0.5
VOVoltage range applied to any output in the high or low state(2) (3) V
B port –0.5 VCCB + 0.5
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCCA, VCCB, or GND ±100 mA
DCT package 220
qJA Package thermal impedance(4) DCU package 227 °C/W
YZP package 102
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1) (2)
VCCA VCCB MIN MAX UNIT
VCCA Supply voltage(3) 1.65 3.6 V
VCCB Supply voltage 2.3 5.5 V
1.65 V to 1.95 V VCCI 0.2 VCCI
A-port I/Os 2.3 V to 5.5 V
2.3 V to 3.6 V VCCI 0.4 VCCI
High-level
VIH V
input voltage B-port I/Os VCCI 0.4 VCCI
1.65 V to 3.6 V 2.3 V to 5.5 V
OE input VCCA × 0.65 5.5
A-port I/Os 0 0.15
Low-level
VIL (4) B-port I/Os 1.65 V to 3.6 V 2.3 V to 5.5 V 0 0.15 V
input voltage OE input 0 VCCA × 0.35
A-port I/Os, push-pull driving 10
Input transition
Δt/Δv B-port I/Os, push-pull driving 1.65 V to 3.6 V 2.3 V to 5.5 V 10 ns/V
rise or fall rate Control input 10
TAOperating free-air temperature –40 85 °C
(1) VCCI is the supply voltage associated with the input port.
(2) VCCO is the supply voltage associated with the output port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
(4) The maximum VIL value is provided to ensure that a valid VOL is maintained. The VOL value is VIL plus the voltage drop across the
pass-gate transistor.
4Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
TCA9406
www.ti.com
SCPS221 JULY 2010
ELECTRICAL CHARACTERISTICS(1) (2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
TA= 25°C –40°C to 85°C
TEST
PARAMETER VCCA VCCB UNIT
CONDITIONS MIN TYP MAX MIN MAX
IOH = –20 mA,
VOHA 1.65 V to 3.6 V 2.3 V to 5.5 V VCCA × 0.67 V
VIB VCCB 0.4 V
IOL = 1 mA,
VOLA 1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 V
VIB 0.15 V
IOH = –20 mA,
VOHB 1.65 V to 3.6 V 2.3 V to 5.5 V VCCB × 0.67 V
VIA VCCA 0.2 V
IOL = 1 mA,
VOLB 1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 V
VIA 0.15 V
IIOE 1.65 V to 3.6 V 2.3 V to 5.5 V ±1 ±2 mA
A port 0 V 0 to 5.5 V ±1 ±2 mA
Ioff B port 0 to 3.6 V 0 V ±1 ±2 mA
IOZ A or B port 1.65 V to 3.6 V 2.3 V to 5.5 V ±1 ±2 mA
1.65 V to VCCB 2.3 V to 5.5 V 2.4
VI= VO= open,
ICCA 3.6 V 0 V 2.2 mA
IO= 0 0 V 5.5 V –1
1.65 V to VCCB 2.3 V to 5.5 V 12
VI= VO= open,
ICCB 3.6 V 0 V –1 mA
IO= 0 0 V 5.5 V 1
VI= VCCI or GND,
ICCA + ICCB 1.65 V to VCCB 2.3 V to 5.5 V 14.4 mA
IO= 0
CIOE 3.3 V 3.3 V 2.5 3.5 pF
A or B port 3.3 V 3.3 V 10
Cio A port 5 6 pF
B port 6 7.5
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TCA9406
TCA9406
SCPS221 JULY 2010
www.ti.com
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V VCC = 3.3 V VCC = 5 V
± 0.2 V ± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX MIN MAX
Push-pull driving 21 22 24
Data rate Mbps
Open-drain driving 2 2 2
Push-pull driving 47 45 41
Pulse
twData inputs ns
duration Open-drain driving 500 500 500
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V VCC = 3.3 V VCC = 5 V
± 0.2 V ± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX MIN MAX
Push-pull driving 20 22 24
Data rate Mbps
Open-drain driving 2 2 2
Push-pull driving 50 45 41
Pulse
twData inputs ns
duration Open-drain driving 500 500 500
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCC = 3.3 V VCC = 5 V
± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX
Push-pull driving 23 24
Data rate Mbps
Open-drain driving 2 2
Push-pull driving 43 41
twPulse duration Data inputs ns
Open-drain driving 500 500
6Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
TCA9406
www.ti.com
SCPS221 JULY 2010
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER TEST CONDITIONS UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX
Push-pull driving 5.3 5.4 6.8
tPHL Open-drain driving 2.3 8.8 2.4 9.6 2.6 10
A B ns
Push-pull driving 6.8 7.1 7.5
tPLH Open-drain driving 45 260 36 208 27 198
Push-pull driving 4.4 4.5 4.7
tPHL Open-drain driving 1.9 5.3 1.1 4.4 1.2 4
B A ns
Push-pull driving 5.3 4.5 0.5
tPLH Open-drain driving 45 175 36 140 27 102
ten OE A or B 200 200 200 ns
tdis OE A or B 50 40 35 ns
Push-pull driving 3.2 9.5 2.3 9.3 2 7.6
trA A-port rise time ns
Open-drain driving 38 165 30 132 22 95
Push-pull driving 4 10.8 2.7 9.1 2.7 7.6
trB B-port rise time ns
Open-drain driving 34 145 23 106 10 58
Push-pull driving 2 5.9 1.9 6 1.7 13.3
tfA A-port fall time Open-drain driving 4.4 6.9 4.3 6.4 4.2 6.1 ns
Push-pull driving 2.9 13.8 2.8 16.2 2.8 16.2
tfB B-port fall time Open-drain driving 6.9 13.8 7.5 16.2 7 16.2
tSK(O) Channel-to-channel skew 0.7 0.7 0.7 ns
Push-pull driving 21 22 24
Max data rate Mbps
Open-drain driving 2 2 2
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TCA9406
TCA9406
SCPS221 JULY 2010
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER TEST CONDITIONS UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX
Push-pull driving 3.2 3.7 3.8
tPHL Open-drain driving 1.7 6.3 2 6 2.1 5.8
A B ns
Push-pull driving 3.5 4.1 4.4
tPLH Open-drain driving 43 250 36 206 27 190
Push-pull driving 3 3.6 4.3
tPHL Open-drain driving 1.8 4.7 2.6 4.2 1.2 4
B A ns
Push-pull driving 2.5 1.6 1
tPLH Open-drain driving 44 170 37 140 27 103
ten OE A or B 200 200 200 ns
tdis OE A or B 50 40 35 ns
Push-pull driving 2.8 7.4 2.6 6.6 1.8 5.6
trA A-port rise time ns
Open-drain driving 34 149 28 121 24 89
Push-pull driving 3.2 8.3 2.9 7.2 2.4 6.1
trB B-port rise time ns
Open-drain driving 35 151 24 112 12 64
Push-pull driving 1.9 5.7 1.9 5.5 1.8 5.3
tfA A-port fall time ns
Open-drain driving 4.4 6.9 4.3 6.2 4.2 5.8
Push-pull driving 2.2 7.8 2.4 6.7 2.6 6.6
tfB B-port fall time ns
Open-drain driving 5.1 8.8 5.4 9.4 5.4 10.4
tSK(O) Channel-to-channel skew 0.7 0.7 0.7 ns
Push-pull driving 20 22 24
Max data rate Mbps
Open-drain driving 2 2 2
8Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
TCA9406
www.ti.com
SCPS221 JULY 2010
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.3 V ± 0.5 V
PARAMETER TEST CONDITIONS UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX
Push-pull driving 2.4 3.1
tPHL Open-drain driving 1.3 4.2 1.4 4.6
A B ns
Push-pull driving 4.2 4.4
tPLH Open-drain driving 36 204 28 165
Push-pull driving 2.5 3.3
tPHL Open-drain driving 1 124 1 97
B A ns
Push-pull driving 2.5 2.6
tPLH Open-drain driving 3 139 3 105
ten OE A or B 200 200 ns
tdis OE A or B 40 35 ns
Push-pull driving 2.3 5.6 1.9 4.8
trA A-port rise time ns
Open-drain driving 25 116 19 85
Push-pull driving 2.5 6.4 2.1 7.4
trB B-port rise time ns
Open-drain driving 26 116 14 72
Push-pull driving 2 5.4 1.9 5
tfA A-port fall time ns
Open-drain driving 4.3 6.1 4.2 5.7
Push-pull driving 2.3 7.4 2.4 7.6
tfB B-port fall time ns
Open-drain driving 5 7.6 4.8 8.3
tSK(O) Channel-to-channel skew 0.7 0.7 ns
Push-pull driving 23 24
Max data rate Mbps
Open-drain driving 2 2
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TCA9406
TCA9406
SCPS221 JULY 2010
www.ti.com
PRINCIPLES OF OPERATION
Application Notes
The TCA9406 A-Port I/O has open-drain outputs with an internal 10-kΩpullup resistor to VCCA, and B-Port I/O
has an internal 10-kΩpullup resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor
must be added from the I/O to VCCA or VCCB (in parallel with the internal 10-kΩresistors). Adding lower value
pullup resistors changes VOL levels. When the OE pin is set low, the internal pullups of the TCA9406 are
disabled for power saving caused by pullup resistors.
Figure 1. Typical Design Example
The TCA6406 has a VCC isolation feature known as Ioff partial power down and backdrive protection. If a cable is
connected, and the connected external system is still powered own, the system can be put into standby mode by
shutting down the power rail. In this state, the TCA6406 has a leakage current of approximately 2 µA caused by
current flow from powered-on system.
Power Up, Power Down
One advantage of the TCA9406 translator is that either power supply can be ramped up first. Another advantage
is that either power supply can be set to 0 V, and the outputs are in high-impedance state.
The recommended power up sequence is:
1. Apply power to the first VCC and apply the second VCC
2. Drive the OE input high to enable the device
The recommended power down sequence is:
1. Drive OE input low to disable the device
2. Switch Off the power from either VCC and remove power from other VCC.
Enable/Disable
The TCA9406 han an OE input that is used to disable the device by setting OE low, which place all I/Os in the
high-impedance state. The control OE is referenced to the VCCA supply. A pulldown resistor tying OE to ground
should be used to ensure that bus contention, excessive currents, or oscillations do not occur during power up
and power down. The value of resistor is based upon the current sinking capability of the device.
10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
TCA9406
www.ti.com
SCPS221 JULY 2010
Integrated Pullup Resistors on the I/Os (A-Ports/B-Ports)
Each A-port I/O has an internal 10-kΩpullup resistor to VCCA, and each B-port I/O has an internal 10-kΩpullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩresistors). Adding lower value pull-up resistors may effect VOL
levels, however. The internal pullups of the PCA9406 are disabled when the OE pin is low.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TCA9406
VOH
VOL
From Output
Under Test
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 kW
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCCA/2VCCA/2
VCCI
0 V
VCCO/2VOH
VOL
0 V
0.1 y VCCO
VCCO/2
0.9 y VCCO VCCO/2 0 V
VCCI
0 V
VCCI/2 VCCI/2
tw
Input
VCCA
VCCO
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
Input
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
50 kW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURA TION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
VCCO
VCCI
DUT
IN OUT
1 MW
15 pF
DATA RATE, PULSE DURA TION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
VCCO
VCCI
DUT
IN OUT
VCCI/2 VCCI/2
0.9 y VCCO
VCCO/2
tr
0.1 y VCCO tf
TCA9406
SCPS221 JULY 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 2. Load Circuit and Voltage Waveforms
12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406
PACKAGE OPTION ADDENDUM
www.ti.com 6-Oct-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TCA9406DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TCA9406DCUR ACTIVE US8 DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TCA9406YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TCA9406DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
TCA9406DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
TCA9406YZPR DSBGA YZP 8 3000 180.0 8.4 1.11 2.1 0.56 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-May-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TCA9406DCTR SM8 DCT 8 3000 182.0 182.0 20.0
TCA9406DCUR US8 DCU 8 3000 202.0 201.0 28.0
TCA9406YZPR DSBGA YZP 8 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 4-May-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
D: Max =
E: Max =
1.918 mm, Min =
0.918 mm, Min =
1.858 mm
0.858 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated