HLMP-3519-IJ002 - Avago Technologies

Selection Guide Luminous Intensity Iv (mcd) @ 10 mA

Color Part Number Min. Max.

HLMP-3315 13.8 -

Red HLMP-3317 22.00 -

HLMP-3316-I00xx 22.0 -

HLMP-3316-IJ0xx 22.0 70.4

HLMP-3415 9.2 -

Yellow HLMP-3416 14.7 -

HLMP-3416-G00xx 14.7 -

HLMP-3416-IJ0xx 37.6 120.2

HLMP-3517 6.7 -

Green HLMP-3519 10.6 -

HLMP-3519-F00xx 10.6 -

HLMP-3519-IJ0xx 43.6 139.6

Description

This family of T-13/4 nondiffused

LED lamps is specially designed

for applications requiring higher

on-axis intensity than is achievable

with a standard lamp. The light

generated is focused to a narrow

beam to achieve this effect.

HLMP-331x Series, HLMP-341x Series, HLMP-351x Series

Agilent T-13/4 (5 mm) High Intensity

LED Lamps

Data Sheet

Features

• High intensity

• Choice of 3 bright colors

High Efficiency Red

Yellow

High Performance Green

• Popular T-13/4 diameter package

• Selected minimum intensities

• Narrow viewing angle

• General purpose leads

• Reliable and rugged

• Available on tape and reel

Package Dimensions

Part Numbering System

HLMP - 3 x 1 x - x x x xx

Mechanical Options

00: Bulk

01: Tape & Reel, Crimped Leads

02: Tape & Reel, Straight Leads

B1: Right Angle Housing, Uneven Leads

B2: Right Angle Housing, Even Leads

Color Bin Options

0: Full Color Bin Distribution

Maximum Iv Bin Options

0: Open (no max. limit)

Others: Please refer to the Iv Bin Table

Minimum Iv Bin Options

Please refer to the Iv Bin Table

Brightness Level

5, 7: Less Brightness

6, 9: Higher Brightness

Color Options

3: GaP HER

4: GaP Yellow

5: GaP Green

Electrical Characteristics at TA = 25°CDevice

Symbol Description HLMP- Min. Typ. Max. Units Test Conditions

IVLuminous Intensity 3315 13.8 40.0 mcd IF = 10 mA (Figure 3)

3316 22 60.0

3415 9.2 40.0 mcd IF = 10 mA (Figure 8)

3416 14.7 50.0

3517 6.7 50.0 mcd IF = 10 mA (Figure 13)

3519 10.6 70.0

2q1/2Including Angle Between Half 3315 35 Deg. IF = 10 mA

Luminous Intensity Points 3316 35 See Note 1 (Figure 6)

3415 35 Deg. IF = 10 mA

3416 35 See Note 1 (Figure 11)

3517 24 Deg. IF = 10 mA

3519 24 See Note 1 (Figure 16)

lPEAK Peak Wavelength 331X 635 nm Measurement at Peak

341X 583 (Figure 1)

351X 565

Dl1/2 Spectral Line Halfwidth 331X 40 nm

341X 36

351X 28

ldDominant Wavelength 331X 626 nm See Note 2 (Figure 1)

341X 585

351X 569

tsSpeed of Response 331X 90 ns

341X 90

351X 500

C Capacitance 331X 11 pF VF = 0; f = 1 MHz

341X 15

351X 18

RqJ-PIN Thermal Resistance 331X 260 °C/W Junction to Cathode

341X Lead

351X

VFForward Voltage 331X 1.9 2.4 V IF = 10 mA (Figure 2)

341X 2.0 2.4 IF = 10 mA (Figure 7)

351X 2.1 2.7 IF = 10 mA (Figure 12)

VRReverse Breakdown Volt. All 5.0 V IR = 100 µA

hVLuminous Efficacy 331X 145 lumens See Note 3

341X 500 Watt

351X 595

Notes:

1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the

device.

3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the

luminous efficacy in lumens/watt.

Figure 1. Relative intensity vs. wavelength.

Absolute Maximum Ratings at TA = 25°C

Parameter 331X Series 341X Series 351X Series Units

Peak Forward Current 90 60 90 mA

Average Forward Current[1] 25 20 25 mA

DC Current[2] 30 20 30 mA

Power Dissipation[3] 135 85 135 mW

Reverse Voltage (IR = 100 µA) 5 5 5 V

Transient Forward Current[4] 500 500 500 mA

(10 µsec Pulse)

LED Junction Temperature 110 110 110 °C

Operating Temperature Range -55 to +100 -55 to +100 -20 to +100 °C

Storage Temperature Range -55 to +100

Notes:

1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.

2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.

3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.

4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond.

It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.

High Efficiency Red HLMP-331X Series

Figure 3. Relative luminous intensity vs. DC

forward current.

Figure 2. Forward current vs. forward voltage

characteristics. Figure 4. Relative efficiency (luminous

intensity per unit current) vs. peak LED

current.

Figure 5. Maximum tolerable peak current vs.

pulse duration (IDC MAX as per MAX

ratings).

Figure 6. Relative luminous intensity vs. angular displacement.

Yellow HLMP-341X Series

Figure 8. Relative luminous intensity vs. DC

forward current.

Figure 7. Forward current vs. forward voltage

characteristics. Figure 9. Relative efficiency (luminous

intensity per unit current) vs. peak current.

Figure 10. Maximum tolerable peak current

vs. pulse duration (IDC MAX as per MAX

ratings).

Figure 11. Relative luminous intensity vs. angular displacement.

Green HLMP-351X Series

Figure 13. Relative luminous intensity vs. DC

forward current.

Figure 12. Forward current vs. forward

voltage characteristics. Figure 14. Relative efficiency (luminous

intensity per unit current) vs. peak LED

current.

Figure 15. Maximum tolerable peak current

vs. pulse duration (IDC MAX as per MAX

ratings).

Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp.

Table 2. Intensity Bin Limit

Intensity Range

(mcd)

Color Bin Min. Max.

H 15.5 24.8

I 24.8 39.6

J 39.6 63.4

K 63.4 101.5

L 101.5 162.4

M 162.4 234.6

N 234.6 340.0

O 340.0 540.0

Red P 540.0 850.0

Q 850.0 1200.0

R 1200.0 1700.0

S 1700.0 2400.0

T 2400.0 3400.0

U 3400.0 4900.0

V 4900.0 7100.0

W 7100.0 10200.0

X 10200.0 14800.0

Y 14800.0 21400.0

Z 21400.0 30900.0

Table 2. (Cont'd) Table 2. (Cont'd)

Maximum tolerance for each bin limit is ±18%.

Intensity Range

(mcd)

Color Bin Min. Max.

G 16.6 26.5

H 26.5 42.3

I 42.3 67.7

J 67.7 108.2

K 108.2 173.2

L 173.2 250.0

M 250.0 360.0

Yellow N 360.0 510.0

O 510.0 800.0

P 800.0 1250.0

Q 1250.0 1800.0

R 1800.0 2900.0

S 2900.0 4700.0

T 4700.0 7200.0

U 7200.0 11700.0

V 11700.0 18000.0

W 18000.0 27000.0

Intensity Range

(mcd)

Color Bin Min. Max.

E 7.6 12.0

F 12.0 19.1

G 19.1 30.7

H 30.7 49.1

I 49.1 78.5

J 78.5 125.7

K 125.7 201.1

L 201.1 289.0

Green M 289.0 417.0

N 417.0 680.0

O 680.0 1100.0

P 1100.0 1800.0

Q 1800.0 2700.0

R 2700.0 4300.0

S 4300.0 6800.0

T 6800.0 10800.0

U 10800.0 16000.0

V 16000.0 25000.0

W 25000.0 40000.0

Color Categories Lambda (nm)

Color Cat # Min. Max.

6 561.5 564.5

5 564.5 567.5

Green 4 567.5 570.5

3 570.5 573.5

2 573.5 576.5

1 582.0 584.5

3 584.5 587.0

Yellow 2 587.0 589.5

4 589.5 592.0

5 592.0 593.0

Mechanical Option Matrix

Mechanical Option Code Definition

00 Bulk Packaging, minimum increment 500 pcs/bag

01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag

02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag

B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag

B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag

Note:

All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent

representative for further clarification/information.

Precautions

Lead Forming

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering into PC board.

• If lead forming is required before soldering, care must

be taken to avoid any excessive mechanical stress

induced to LED package. Otherwise, cut the leads of

LED to length after soldering process at room

temperature. The solder joint formed will absorb the

mechanical stress of the lead cutting from traveling to

the LED chip die attach and wirebond.

• It is recommended that tooling made to precisely

form and cut the leads to length rather than rely upon

hand operation.

Soldering Conditions

• Care must be taken during PCB assembly and

soldering process to prevent damage to LED

component.

• The closest LED is allowed to solder on board is 1.59

mm below the body (encapsulant epoxy) for those

parts without standoff.

• Recommended soldering conditions:

• Wave soldering parameter must be set and

maintained according to recommended temperature

and dwell time in the solder wave. Customer is

advised to periodically check on the soldering profile

to ensure the soldering profile used is always

conforming to recommended soldering condition.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

soldering process.

• Proper handling is imperative to avoid excessive

thermal stresses to LED components when heated.

Therefore, the soldered PCB must be allowed to cool

to room temperature, 25°C, before handling.

• Special attention must be given to board fabrication,

solder masking, surface plating and lead holes size

and component orientation to assure solderability.

• Recommended PC board plated through hole sizes for

LED component leads:

Manual Solder

W ave Soldering Dipping

Pre-heat Temperature 105 °C Max. –

Pre-heat Time 30 sec Max. –

Peak Temperature 250 °C Max. 260 °C Max.

Dwell Time 3 sec Max. 5 sec Max.

LED Component Plated Through

Lead Size Diagonal Hole Diameter

0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm

(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)

0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm

(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)

Note: Refer to application note AN1027 for more

information on soldering LED components.

Figure 17. Recommended wave soldering profile.

LAMINAR W A VE BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT W A VE

FLUXING

PREHEAT

01020

100

150

200

250

30 40 50

TIME – SECONDS

TEMPERATURE – °C

60 70 80 90 100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150°C (100°C PCB)

SOLDER WAVE TEMPERATURE = 245°C

AIR KNIFE AIR TEMPERATURE = 390°C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40°

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE

SUFFICIENTLY COOLED BEFORE EXERTING

MECHANICAL FORCE.

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

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Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152(Domestic/Interna-

tional), or 0120-61-1280(Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

Obsoletes 5988-2146EN

November 16, 2005

5989-4259EN