LP38693
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
VEN EN
LP38691
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
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LP3869x/-Q1 500-mA Low-Dropout CMOS Linear Regulators
Stable With Ceramic Output Capacitors
1 Features 3 Description
The LP3869x low-dropout CMOS linear regulators
1• Wide Input Voltage Range (2.7 V to 10 V) provide tight output tolerance (2% typical), extremely
• All WSON Options are Available as AEC-Q100 low dropout voltage (250 mV at 500-mA load current,
Grade 1 VOUT = 5 V), and excellent AC performance using
• 2% Output Accuracy (25°C) ultralow equivalent series resistance (ESR) ceramic
output capacitors.
• Low Dropout Voltage: 250 mV at 500 mA (Typical,
5 V Out) The low thermal resistance of the WSON, SOT-223,
and TO-252 packages allow use of the full operating
• Precision (Trimmed) Bandgap Reference current even in high ambient temperature
• Ensured Specifications for –40°C to 125°C environments.
• 1-µA Off-State Quiescent Current The use of a PMOS power transistor means that no
• Thermal Overload Protection DC base-drive current is required to bias it, thus
• Foldback Current Limiting allowing ground pin current to remain below 100 µA
• Ground Pin Current: 55 µA (typical) at full load regardless of load current, input voltage, or operating
temperature.
• Enable Pin (LP38693)
Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
• Hard Disk Drives TO-252 (3) 6.58 mm × 6.10 mm
LP38691
• Notebook Computers WSON (6) 3.00 mm × 3.00 mm
• Battery-Powered Devices SOT-223 (5) 6.50 mm × 3.56 mm
LP38693
• Portable Instrumentation WSON (6) 3.00 mm × 3.00 mm
LP38691-Q1 WSON (6) 3.00 mm × 3.00 mm
LP38693-Q1
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Typical Application Circuits
* Minimum value required for stability * Minimum value required for stability
** WSON package devices only ** WSON package devices only
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
8.4 Device Functional Modes........................................ 13
1 Features.................................................................. 19 Application and Implementation ........................ 14
2 Applications ........................................................... 19.1 Application Information............................................ 14
3 Description............................................................. 19.2 Typical Application ................................................. 14
4 Typical Application Circuits ................................. 110 Power Supply Recommendations ..................... 19
5 Revision History..................................................... 211 Layout................................................................... 19
6 Pin Configuration and Functions......................... 311.1 Layout Guidelines ................................................. 19
7 Specifications......................................................... 411.2 Layout Example .................................................... 19
7.1 Absolute Maximum Ratings ...................................... 411.3 WSON Mounting................................................... 20
7.2 ESD Ratings: LP38691 and LP38693....................... 412 Device and Documentation Support................. 21
7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1........... 412.1 Documentation Support ........................................ 21
7.4 Recommended Operating Conditions....................... 412.2 Related Links ........................................................ 21
7.5 Thermal Information.................................................. 512.3 Community Resources.......................................... 21
7.6 Electrical Characteristics........................................... 512.4 Trademarks........................................................... 21
7.7 Typical Characteristics.............................................. 712.5 Electrostatic Discharge Caution............................ 21
8 Detailed Description............................................ 11 12.6 Glossary................................................................ 21
8.1 Overview................................................................. 11 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagrams ..................................... 11 Information........................................................... 21
8.3 Feature Description................................................. 13
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (March 2015) to Revision O Page
• Added top navigator icon for TI Designs ............................................................................................................................... 1
• Added Caution note to Foldback Current Limiting subsection ............................................................................................ 13
Changes from Revision M (February 2015) to Revision N Page
• Added "Cout = xx pF" to "Cout = µF" for Figures 4 through 6 in Typical Characteristics...................................................... 1
Changes from Revision L (December 2014) to Revision M Page
• Changed wording of Description and added one item to Features; update Vin, Vout and Ven pin names to IN, OUT,
and EN in text and graphics .................................................................................................................................................. 1
• Added top navigator icon for TI Designs ............................................................................................................................... 1
• Changed "PFM" to 'TO-252" .................................................................................................................................................. 4
• Changed Handling Ratings to ESD Ratings format ............................................................................................................... 4
Changes from Revision K (April 2013) to Revision L Page
• Added Handling Rating table, Feature Description section, Device Functional Modes,Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section; update thermal values.......................... 1
Changes from Revision J (April 2013) to Revision K Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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IN
2
34
5
6
1
GND
EN OUT
SNS
IN
Exposed Pad
on Bottom
(DAP)
IN
2
34
5
6
1
GND
N/C OUT
SNS
IN
Exposed Pad
on Bottom
(DAP)
N/C
OUT
GND
EN
IN
1
2
4
3
5
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6 Pin Configuration and Functions
NDP Package
3-Pin TO-252
Top View
NDC Package
5-Pin SOT-223
Top View
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38691SD Top View
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38693SD Top View
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Pin Functions
PIN I/O DESCRIPTION
TO- SOT-
NAME WSON
252 223
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when
DAP — √ √ — — soldered to a copper plane. See WSON Mounting section for more information.
The EN pin allows the part to be turned ON and OFF by pulling this pin high or
EN — — 3 1 I low.
Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is
GND TAB 2 2 5 — thermally connected to the die and functions as a heat sink when the soldered
down to a large copper plane.
This is the input supply voltage to the regulator. For WSON devices, both IN
IN 3 1, 6 1, 6 4 I pins must be tied together for full current operation (250 mA maximum per pin).
OUT 1 4 4 3 O Regulated output voltage
WSON Only - Output SNS pin allows remote sensing at the load which eliminate
SNS — 5 5 — I the error in output voltage due to voltage drops caused by the resistance in the
traces between the regulator and the load. This pin must be tied to OUT.
7 Specifications
7.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
Lead temp. (Soldering, 5 seconds) 260 °C
Power dissipation(3) Internally Limited V
V(max) All pins (with respect to GND) –0.3 12 V
IOUT(4) Internally Limited V
Junction temperature –40 150 °C
Storage temperature, Tstg −65 150
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). When using the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP),SNOA401, and the WSON
Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device goes into
thermal shutdown.
(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
7.2 ESD Ratings: LP38691 and LP38693 VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1 VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.4 Recommended Operating Conditions MIN NOM MAX UNIT
VIN supply voltage 2.7 10 V
Operating junction temperature −40 125 °C
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7.5 Thermal Information LP38691 LP38693 LP3869x
THERMAL METRIC(1) TO-252 WSON SOT-223 UNIT
3 PINS 6 PINS 5 PINS
RθJA(2) Junction-to-ambient thermal resistance 50.5 50.6 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.6 44.4 52.2 °C/W
RθJB Junction-to-board thermal resistance 29.7 24.9 13.0 °C/W
ψJT Junction-to-top characterization parameter 4.8 0.4 5.5 °C/W
ψJB Junction-to-board characterization parameter 29.3 25.1 12.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 5.4 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Junction-to-ambient thermal resistance, High-K.
7.6 Electrical Characteristics
Unless otherwise specified, limits apply for TJ= 25°C, VIN = VOUT + 1 V, CIN = COUT = 10 µF, ILOAD = 10 mA. Minimum and
maximum limits are specified through testing, statistical correlation, or design.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
–2 2
100 µA < IL< 0.5 A
VOOutput voltage tolerance %VOUT
VO+ 1 V ≤VIN ≤10 V –4 4
Full operating temperature range
VO+ 0.5 V ≤VIN ≤10 V 0.03
IL= 25 mA
Output voltage line
ΔVO/ΔVIN %/V
VO+ 0.5 V ≤VIN ≤10 V
regulation(2) IL= 25 mA 0.1
Full operating temperature range
1 mA < IL< 0.5 A 1.8
VIN = VO+ 1 V
Output voltage load
ΔVO/ΔIL%/A
1 mA < IL< 0.5 A
regulation(3) VIN = VO+ 1 V 5
Full operating temperature range
IL= 0.1 A 80
(VO= 2.5 V) IL= 0.5 A 430
(VO= 2.5 V) IL= 0.1 A 145
Full operating temperature IL= 0.5 A 725
range IL= 0.1 A 65
(VO= 3.3 V) IL= 0.5 A 330
VIN – VOUT Dropout voltage(4) mV
(VO= 3.3 V) IL= 0.1 A 110
Full operating temperature IL= 0.5 A 550
range IL= 0.1 A 45
(VO= 5 V) IL= 0.5 A 250
(VO= 5 V) IL= 0.1 A 100
Full operating temperature IL= 0.5 A 450
range
(1) Typical numbers represent the most likely parametric norm for 25°C operation.
(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to
full load.
(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.
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Electrical Characteristics (continued)
Unless otherwise specified, limits apply for TJ= 25°C, VIN = VOUT + 1 V, CIN = COUT = 10 µF, ILOAD = 10 mA. Minimum and
maximum limits are specified through testing, statistical correlation, or design.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIN ≤10 V, IL=100 µA - 0.5 A 55
VIN ≤10 V, IL=100 µA - 0.5 A
IQQuiescent current 100
Full operating temperature range µA
VEN ≤0.4 V, (LP38693 Only) 0.001 1
VIN – VO≤4 V
IL(MIN) Minimum load current 100
Full operating temperature range
VIN – VO> 5 V 350
IFB Foldback current limit mA
VIN – VO< 4 V 850
PSRR Ripple rejection VIN = VO+ 2 V(DC), with 1 V(p-p) / 120-Hz Ripple 55 dB
Thermal shutdown activation
TSD 160
(junction temp) °C
TSD Thermal shutdown hysteresis 10
(HYST) (junction temp) BW = 10 Hz to 10 kHz
enOutput noise 0.7 µV/√Hz
VO= 3.3 V
VO(LEAK) Output leakage current VO= VO(NOM) + 1 V at 10 VIN 0.5 12 µA
Output = OFF 0.4
Full operating temperature range
Output = ON, VIN = 4 V 1.8
Full operating temperature range
Enable voltage (LP38693
VEN V
Only) Output = ON, VIN = 6 V 3
Full operating temperature range
Output = ON, VIN = 10 V 4
Full operating temperature range
Enable pin leakage VEN = 0 V or 10 V, VIN = 10 V
IEN –1 0.001 1 µA
(lLP38693 only)
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