TLE8458GU V33 - Infineon Technologies

TLE8458Gx

LIN Transceiver with integrated Low Drop Voltage

Regulator

LIN-LDO

Data Sheet, Rev. 1.01, April 2009

Automotive Power

Data Sheet 2 Rev. 1.01, 2009-04-28

TLE8458Gx

Table of Contents

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5.1 Operation Mode State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5.2 Description of Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2.1 Stand-By Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2.2 Normal Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2.2.1 Normal Slope Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.2.2.2 Software Flash Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.2.3 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.2.4 Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.2.5 Wake - Up Events in Sleep and Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.2.5.1 Bus Wake - Up event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.2.5.2 Local Wake - Up Event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.2.5.3 Mode Transition via EN pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.2.6 Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

5.2.7 Over-Temperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

5.3 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

5.4 Electrical Characteristics EN and WK Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.5 Power Up, Power Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.1 Description of Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.2 Electrical Characteristics of the Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7 LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.1.1 Under-Voltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.1.2 TxD Time - Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.1.3 LIN Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.2 Electrical Characteristics of the LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

8 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

8.1 ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8.1.1 EMC Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8.2 Pin Compatibility to Stand-Alone LIN transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

9 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

10 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table of Contents

PG-DSO-8-16

Data Sheet 3 Rev. 1.01, 2009-04-28

LIN Transceiver with integrated Low Drop Voltage

Regulator

LIN-LDO

TLE8458Gx

Type Package Marking Note

TLE8458G PG-DSO-8-16 8458G VCC = 5 V; 20 kbit/s

TLE8458GV33 PG-DSO-8-16 8458GV3 VCC = 3.3 V; 20 kbit/s

TLE8458GU PG-DSO-8-16 8458GU VCC = 5 V; 10.4 kbit/s

TLE8458GUV33 PG-DSO-8-16 8458GUV3 VCC = 3.3 V; 10.4 kbit/s

1Overview

Features

• LIN Transceiver compliant to LIN 2.1 (20 kBit / s)

or SAE J2602 (10.4 kbit / s)

• 5 V or 3.3 V Low Drop Voltage Regulator

• 50 mA output current capability

• Normal, Stop, and Sleep modes

• Wake - Up via bus from Sleep Mode

• Wake - Up from Local WK pin

• Very low quiescent current in Stop Mode

• Very low quiescent current in Sleep Mode

• Very high ESD Robustness ±10 kV according IEC61000-4-2

• Bus short to ground and VBat protection

• Software Flash mode

• Over-Temperature protection

• Pin- and function compatible to single LIN Transceivers, like TLE7259-2GE/GU

• Fully compatible to TLE8458E

• Green (RoHS compliant) product

• AEC Qualified

Description

The TLE8458G and its derivatives TLE8458GV33, TLE8458GU and TLE8458GUV33, integrate a low drop voltage

regulator and a LIN transceiver on one monolithic circuit. The device is suitable to supply microcontrollers and

driving a LIN bus at the same time. The TLE8458Gx is pin compatible to stand-alone LIN transceivers like the

TLE7259-2GE. The combination of a voltage regulator and a LIN transceiver on one circuit decreases the

quiescent current for a typical application to a value of 8 µA, while the TLE8458G is still able to wake-up off a LIN

bus signal or a signal change on the local wake-up input WK. Compliant to all LIN standards and with a wide

operational supply range, the TLE8458G can be used in all automotive applications.

Based on the Infineon Smart Power Technology SPT®, the TLE8458Gx provides excellent ESD robustness

together with a very high electro-magnetic immunity (EMI). The TLE8458Gx reaches a very low level of electro-

magnetic emission (EME) within a broad frequency range. The TLE8458Gx family and the Infineon SPT®

technology are AEC qualified and tailored to withstand the harsh conditions in the automotive environment.

TLE8458Gx

Block Diagram

Data Sheet 4 Rev. 1.01, 2009-04-28

2 Block Diagram

Figure 1 Block Diagram

Wake and Bus

Comparator

Driver

Temp.-

Protection

Current

Limit

Output

Stage

Supply

TxD Input

Mode

Control

Receiver

RxD

Filter

LIN

TxD

BUS

Filter

Timeout

GND

TxD

Bandgap

Reference

Overtemperature

Shutdown

Charge

Pump

Vcc

Data Sheet 5 Rev. 1.01, 2009-04-28

TLE8458Gx

Pin Configuration

3 Pin Configuration

3.1 Pin Assignments

Figure 2 Pin Configuration

3.2 Pin Definitions and Functions

Table 1 Pin Definition

Pin Symbol Function

1RxD Receive Data Output;

Low in dominant state, active low after a wake-up event on BUS or WK pin.

2EN Enable Input;

Integrated pull-down resistor, device set to normal operation mode when HIGH.

3WK Wake-up Input;

Active LOW, negative edge triggered, internal pull-up.

4TxD Transmit Data Input;

Integrated pull-down resistor, LOW in dominant state. Active LOW after wake-up via

WK pin.

5GND Ground

6LIN Bus Output / Input;

LIN bus input / Output,

LOW in dominant state,

Internal termination and pull - up current source.

7VSBattery Supply Input

8VCC Output Voltage;

Decouple to GND with a capacitor CVcc ≥ 470 nF, ESR < 6 Ω at 10 kHz,

Active during Normal Mode, disabled in Sleep Mode.

RxD

TxD

LIN

GND

TLE8458Gx

General Product Characteristics

Data Sheet 6 Rev. 1.01, 2009-04-28

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Notes

1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not

designed for continuous repetitive operation.

Table 2 Absolute Maximum Ratings 1)

All voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

1) Not subject to production test; specified by design.

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

Voltages

Supply Voltage on VS pin VS-0.3 – 40 V LIN2.1 Param 11 P_4.1.1

Input Voltage on LIN, WK pin versus

GND

VLIN,G -40 – 40 V – P_4.1.2

Logic Voltages at EN, TxD, RxD pin VL,max -0.3 – 5.5 V – P_4.1.3

Output Voltage at VCC pin VCC -0.3 – 5.5 V Static P_4.1.4

Temperatures

Junction Temperature Tj-40 – 150 °C– P_4.1.5

Storage Temperature Tstg -55 – 150 °C– P_4.1.6

ESD Resistivity

ESD all pins VESD,HBM -2–2kVHBM

2)ESD susceptibility “HBM” according to AEC-Q100-002D.

P_4.1.7

ESD VS, WK, LIN versus GND VESD,HBM -8–8kVHBM

2) P_4.1.8

ESD Resistivity all pins versus GND VESD,CDM -750 – 750 V CDM3)

3)ESD susceptibility “CDM” according to ESDA STM 5.3.1

P_4.1.9

Data Sheet 7 Rev. 1.01, 2009-04-28

TLE8458Gx

General Product Characteristics

4.2 Functional Range

Note: Within the functional range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3 Thermal Characteristics

Table 3 Functional Range

Parameter

Symbol

Values Unit Note / Test Condition Number

Min. Typ. Max.

Extended Supply Range VS(EXT) 5.5 – 40 V Parameter deviations

possible

P_4.2.1

Supply Voltage for Normal

Operation

VS(Nor) 7 – 27 V LIN 2.1 Param. 11 P_4.2.3

Junction Temperature Tj-40 – 150 °C– P_4.2.2

Table 4 Thermal Resistance

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

Thermal Resistance

Junction to Case1)

PG-DSO-8-16

1) Device versions TLE8458G, TLE8458GV33, TLE8458GU, TLE8458GUV33

RthJC,G –55–K/W

2) Not subject to production test. Simulated thermal resistance

P_4.3.1

Junction to Ambient

PG-DSO-8-16

RthJA,G –120–K/W

2)3)

3) The RthJA values are according to Jedec JESD51-2,-7 at natural convection on 2s2p board for 1 W.

Package was simulated on a 76.2 × 114.3 × 1.5 mm³ board with 2 inner copper layers (70 µm thick).

P_4.3.2

Thermal Shutdown Junction Temperature

VCC Shutdown Temperature TSD,Vcc 150 – 200 °C4)

4) Not subject to production test, specified by design.

P_4.3.5

VCC Thermal Shutdown Hysteresis ∆TSD,Vcc –35–K

4) P_4.3.6

LIN Shutdown Temperature TSD,LIN 150 – 200 °C4) P_4.3.7

LIN Thermal Shutdown Hysteresis ∆TSD,LIN –10–K

4) P_4.3.8

TLE8458Gx

Mode Control

Data Sheet 8 Rev. 1.01, 2009-04-28

5Mode Control

5.1 Operation Mode State Diagram

Figure 3 Operation Mode State Diagram

6WDQGE\0RGH

1RUPDO6ORSH0RGH

6OHHS0RGH

6WDUW8S

3RZHU8S

:.SLQRU

:DNH8S%86

9FFRQ

%86RII

7['

6RIWZDUH

)ODVK0RGH

9FFRQ

%86RQ

9FFRII

%86RII

6WRS0RGH

:.SLQRU

9FFRQ

%86RII

7['

*RWR

1RUPDO

WUPRGH

*RWR

6OHHS

WPRGH

*RWR

6OHHS

WPRGH

*RWR

6WRS

WPRGH

7['

:DNH8S%86

7['

5[' 7[' :DNH6RXUFH

 :.SLQ

 /,1%XV

 3RZHUXS

:DNH8S6RXUFHLQGLFDWLRQRQWKH

3LQV5['7['LQ6WDQG%\0RGH

ZHDNSXOOGRZQWRVHHKLJKVLJQDOD

H[WHUQDOSXOOXSUHVLVWRULVUHTXLUHG







1RUPDO2SHUDWLRQ0RGH

9FFRQ

%86RQ

Data Sheet 9 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.2 Description of Mode Control

The TLE8458Gx has 4 major operation modes:

• Normal Operation Mode

• Stand-By Mode

• Sleep Mode

• Stop Mode

The Normal Operation mode contains 2 sub-operation modes, which differentiate by the slew rate control of the

LIN Bus signal (see Figure 3).

Sub-operation modes with different slew rates on the BUS pin:

• Normal Slope Mode, for data transmission rates up to 20 kBaud

• Software Flash mode, for programming of the external microcontroller

The operation mode of the TLE8458Gx is selected by the EN pin and the TxD pin. (see Table 5, see Figure 4).

Table 5 Operation Modes

Mode EN TxD RxD VCC LIN Bus

Termination

Comments

Normal Operation

Mode

HIGH LOW

HIGH1)

1) The TxD pin acts as an input

LOW

HIGH

ON 30 kΩ

(typical)

TxD drives the data to the bus,

RxD indicates the data on the

bus.

Stand-By Mode LOW LOW

HIGH2)

2) The TxD pin acts as an output and indicates the wake-up source.The TxD input needs an external termination to indicate

a HIGH or a LOW signal. The external termination could be a pull-up resistor or an active microcontroller output.

LOW

HIGH

ON 30 kΩ

(typical)

In Stand-By Mode the RxD and

TxD pins indicate the wake-up

source

Sleep Mode LOW HIGH Float OFF High

Impedance

For Sleep Mode TxD needs to

be HIGH for the time tmode1

Stop Mode LOW LOW Float ON High

Impedance

For Stop Mode TxD needs to be

LOW for the time tmode1

TLE8458Gx

Mode Control

Data Sheet 10 Rev. 1.01, 2009-04-28

Figure 4 Mode Transition

(1 W

0RGHB12

7['

WRUHF

6WDQG%\0RGHWR1RUPDO2SHUDWLRQ0RGH

7['

'RQ¶W&DUH

PRGH

7['

6WRS0RGH 6OHHS0RGH



1RUPDO2SHUDWLRQ0RGHFDQEHHLWKHU1RUPDO6ORSH0RGHRU6RIWZDUH)ODVK0RGH

Data Sheet 11 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.2.1 Stand-By Mode

The Stand-By Mode is an idle operation mode, which disables the communication to the LIN bus. The TLE8458Gx

enters automatically the Stand-By Mode after a power-up. By setting the EN pin to HIGH, the operation mode

changes to Normal Operation Mode, regardless of the signal applied to the TxD pin.

The TLE8458Gx can be transferred to Stand-By mode by the following options:

• After power - up on the supply VS, the TLE8458Gx starts in Stand-By Mode.

• From Sleep Mode or from Stop Mode the TLE8458Gx changes to Stand-By Mode if a Wake - Up event occurs

on the LIN bus.

• From Sleep Mode or from Stop Mode the TLE8458Gx changes to Stand-By Mode if a Wake - Up event occurs

on the local Wake input WK.

• In case of an under - voltage event on VS, the TLE8458Gx changes to Stand-By Mode regardless of selected

operation mode.

In Stand-By mode the external power supply VCC is active and LIN bus output stage is disabled. The TLE8458Gx

provides the following functionality in Stand-By Mode:

• The power supply VCC is active and functional.

• The LIN transceiver output stage is disabled, no communication to the LIN bus is possible.

• The LIN transceiver bus input receiver is disabled.

• The LIN bus is terminated by the 30 kΩ.

• Both digital pins, the TxD pin and the RxD pin act as output pins and indicate a Wake - Up or a Power - Up

event2).

• The EN input pin is active. By setting the EN pin to HIGH the TLE8458Gx changes the operation mode to

Normal Operation Mode (see Figure 3).

• The Wake - Up logic is disabled. Wake-Up events don’t trigger an operation mode change.

5.2.2 Normal Operation Mode

The

TLE8458Gx

enters the Normal Operation Mode after the microcontroller sets EN to “High” (see

Figure 4

). In

Normal Operation mode the LIN bus receiver and the LIN bus transmitter are active. The

TLE8458Gx

converts the

logical HIGH and LOW signals on the TxD input pin to DOMINANT and RECESSIVE signals to the LIN bus.

Simultaneously the input receiver of the

TLE8458Gx

converts the DOMINANT and RECESSIVE signals on the LIN

bus to HIGH and LOW signals to the RxD output. In Normal Operation mode the output voltage

is active and the

bus termination is set to 30 k

Ω

Normal Slope Mode and the Software Flash Mode are Normal Operation Modes. In these two sub-modes the

behavior of the power-supply VCC and the bus termination are the same. Per default the TLE8458G always enters

into Normal Slope Mode, either from Sleep Mode, Stop Mode or from Stand-By Mode. The Software Flash Mode

can only be entered from Normal Slope mode.

In order to avoid any bus disturbance during a mode change, the output stage of the TLE8458Gx is disabled and

set to recessive state during the mode change procedure. To release the TLE8458Gx for data communication on

the LIN bus, the TxD pin needs to be set to HIGH for the time ttorec after the operation mode change.

Table 6 Logic table for Wake - Up monitoring1)

1) The Wake - Up monitor is only active in Stand-By Mode

Power - Up Wake - Up event RxD TxD2)

2) The TxD input needs an external termination to indicate a “High” or a “Low” signal. The external termination could be a pull-

up resistor or an active microcontroller output.

Comments

Yes No HIGH LOW Power Up event

No Via LIN Bus LOW HIGH Wake - Up via LIN Bus

No Via WK Pin LOW LOW Wake - Up via local Wake pin WK

TLE8458Gx

Mode Control

Data Sheet 12 Rev. 1.01, 2009-04-28

5.2.2.1 Normal Slope Mode

In Normal Slope Mode the maximum data transmission rate of the LIN transceiver devices TLE8458G,

TLE8458GV33, TLE8458GU and TLE8458GUV33 is limited by the slope control mechanism of LIN output signal.

The limitation of the slew rate of the LIN output signal results in an optimized radiated emission fulfilling automotive

EMC requirements.

The data transmission rate of the TLE8458G and the TLE8458GV33 is limited to 20 kBaud in Normal Operation

Mode and the devices are compliant to the specification LIN2.1

The data transmission rate of the TLE8458GU and the TLE8458GUV33 is limited to 10,4 kBaud in Normal

Operation Mode. These two devices are compliant to the SAE-J2602-2 specification.

5.2.2.2 Software Flash Mode

Software Flash Mode is a Normal Operation Mode and it is possible to transmit data to the LIN bus and receive

data from the LIN bus. The slope control mechanism of the LIN transmitter output stage is disabled and therefore

it is possible to reach higher data transmission rates, disregarding the EMC limitation of the LIN network. The

Software Flash Mode can be used for programming the external microcontroller via the LIN bus, got example

during the production flow of the ECU.

The Software Flash Mode can only be entered from Normal Slope Mode (see Figure 3). By setting the EN pin to

low for the time tfl1 and by generating a falling and a rising edge at the TxD pin with the time tfl2 and tfl3 during the

low phase of the EN pin, the TLE8458Gx changes to the Software Flash Mode (see Figure 5). Vice versa, the

TLE8458Gx changes from Software Flash Mode to Normal Slope Mode by applying the same sequence to the EN

pin and the TxD pin.

In any case, regardless if the device is in Normal Slope Mode or in Software Flash Mode, a LOW signal on the EN

pin changes the operation mode to Sleep Mode or Stop Mode. The slope control mechanism will be activated,

when the device changes to the Normal Operation Mode again.

Figure 5 Software Flash Mode

TO20070515.vsd

Normal

Mode

TxD

tfl3

tfl1

Software

Flash Mode

tfl2 tfl3 tfl3

tfl1

tfl2 tfl3

Normal

Mode

Data Sheet 13 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.2.3 Stop Mode

The Stop Mode is a Low Power Mode, meaning the quiescent current of the TLE8458Gx is reduced to a minimum,

while the device is still able to recognized wake - up events. The following functions are available in Stop Mode:

• The power supply VCC is active and functional.

• The LIN transceiver output stage is disabled, no communication to the LIN bus is possible.

• The LIN transceiver input receiver is disabled.

• The internal LIN bus termination is switched off.

• The TxD input and the RxD output is inactive.

• The EN input is active. A HIGH signal on the EN pin changes the operation mode to Normal Operation Mode.

• The LIN bus Wake - Up receiver is active, a Wake - Up event on the LIN bus changes the operation mode to

Stand-By Mode.

• The wake input WK is active, a Wake - Up event on the WK pin changes the operation mode to Stand-By

Mode.

Entering Stop Mode is only possible from the Normal Operation Mode, regardless if the device is in Normal Slope

Mode or Software Flash Mode. Setting the signal on the EN pin to LOW, followed by a LOW signal on the TxD pin

for the time tMode1 changes the operation mode to Stop Mode (see Figure 4).

5.2.4 Sleep Mode

The Sleep Mode is a Low Power Mode as well, in comparison to the Stop Mode, the quiescent current of the

TLE8458Gx is even further reduced. In Sleep Mode the TLE8458Gx is able as well to recognized Wake - Up

events.

The Wake - Up behavior in Sleep Mode is the same as in Stop Mode. The only difference between Sleep Mode

and Stop Mode is, that in Stop Mode the output voltage VCC is active, in Sleep Mode the output voltage VCC is

disabled.

Sleep Mode can be entered from Normal Operation Mode by setting the EN pin to LOW and simultaneously setting

the TxD pin to HIGH for the time tMode1 (see Figure 4). The Sleep Mode can be also entered from Stop Mode, by

setting the signal on the TxD pin to HIGH for the time tMode1.

TLE8458Gx

Mode Control

Data Sheet 14 Rev. 1.01, 2009-04-28

5.2.5 Wake - Up Events in Sleep and Stop Mode

A Wake - Up event in Sleep Mode or Stop Mode changes the operation mode of the TLE8458Gx to Stand-By

Mode. There are 3 different options to wake-up the TLE8458Gx from Sleep Mode or Stop Mode:

• A bus Wake - Up event, caused by a message on the LIN bus.

• A local Wake - Up event, caused by a logical LOW signal on the WK pin.

• A signal change to logical HIGH on the EN pin.

5.2.5.1 Bus Wake - Up event

A falling edge on the LIN bus, followed by a dominant bus signal for the time t > twk,Bus causes a bus Wake - Up or

also called remote Wake - Up. The mode change becomes active with the following rising edge on the LIN bus

(see Figure 6). In Stand-By Mode the Wake - Up source is indicated by the TxD and RxD pins (see Table 6).

Figure 6 Bus Wake - Up

9%86

9%86GRP

9%86ZN

/,1%866LJQDO

9&&

W:.%XV

6OHHS0RGH 6WDQG%\0RGH

6WRS0RGH 6WDQG%\0RGH

9&&

1RWH,Q6OHHS0RGHWKH2XWSXW9ROWDJH9

LVGLVDEOHGDQGZLOOEHDFWLYHGE\

DPRGHFKDQJHWR6WDQG%\0RGH,Q6WRS0RGHWKH2XWSXW9ROWDJH9

LV

DFWLYHDQGUHPDLQVDFWLYHDIWHUWKHPRGHFKDQJHWR6WDQG%\0RGH

Data Sheet 15 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.2.5.2 Local Wake - Up Event

A wake - up via LOW signal on the pin WK is called local Wake - Up. A falling edge of the signal on the pin WK

followed by a LOW signal for the time t > tWK change the operation mode from Sleep Mode or Stop Mode to Stand-

By Mode. In the case the LOW signal is shorter then the time t < tWk, the wake - up is ignored and the TLE8458G

remains in Sleep Mode or Stop Mode. In Stand-By Mode the wake - up source is indicated by the TxD and RxD

pins (see Table 6).

Figure 7 Local Bus Wake . Up

5.2.5.3 Mode Transition via EN pin

The EN pin is used for the mode selection. In case the power supply VCC is present, like in Stop Mode or Sleep

Mode, the TLE8458Gx can be directly transferred into Normal Operation Mode by setting the EN pin to HIGH. An

integrated pull - down resistor at the EN pin avoids mode changes due to floating signals on the EN input. The

TLE8458Gx changes the operation mode to Normal Operation Mode, from Stop Mode or from Sleep Mode if the

EN pin is HIGH for the time t > tMode1 (see Figure 8). An integrated hysteresis on the EN pin avoids bit toggling.

The mode transition via the EN pin will not be indicated in Stand-By Mode.

Figure 8 Mode Transition via EN pin

:./

:.6LJQDO

6OHHS0RGH 6WDQG%\0RGH

6WRS0RGH 6WDQG%\0RGH

&& 1RWH,Q6OHHS0RGHWKH2XWSXW9ROWDJH9

LVGLVDEOHGDQGZLOOEHDFWLYHGE\

DPRGHFKDQJHWR6WDQG%\0RGH,Q6WRS0RGHWKH2XWSXW9ROWDJH9

LV

DFWLYHDQGUHPDLQVDFWLYHDIWHUWKHPRGHFKDQJHWR6WDQG%\0RGH

9(1

(16LJQDO

9(12))

6WRS0RGH

6WDQG%\0RGH

W0RGHB12

9(121

(1+\VWHUHVLV

6OHHS0RGH1RUPDO2SHUDWLRQ0RGH

W0RGH

TLE8458Gx

Mode Control

Data Sheet 16 Rev. 1.01, 2009-04-28

5.2.6 Power Up

After a power - up the device enters per default into Stand - By Mode. Above VS,PU the VCC output voltage follows

the supply VS closely. In Stand - By Mode, the power up is indicated by a HIGH signal on the RxD pin and a LOW

signal on the TxD pin.

Figure 9 Power Up Level

5.2.7 Over-Temperature Protection

The TLE8458Gx is protected against thermal over-heating. Over-heating could be caused by a short circuit on the

VCC power supply or by a permanent short on the LIN bus combined with a high ambient temperature. In case of

an over-temperature event, the TLE8458Gx eliminates the root cause of the over-temperature event. Two different

temperature sensors are implemented inside the TLE8458Gx. One temperature sensor protects the voltage

regulator and controls the output voltage VCC, the second temperature sensor protects the LIN transmitter output

stage.

In case the junction temperature on the LIN output stage raises above the threshold T > TSD,LIN, the temperature

sensor disables the LIN output stage. The TLE8458Gx is still able to receive data from the LIN bus. If the

temperature falls below the threshold, T < TSD,LIN, the output stage will be enabled and the communication can

start again. An integrated hysteresis on the temperature sensor avoids toggling during over-temperature events.

An over-temperature event on the LIN bus will not cause any operation mode change.

In case the junction temperature on the VCC power output stage raises above the threshold T > TSD,VCC, the

temperature sensor shuts down the output voltage VCC. If the junction temperature falls below the threshold,

T>TSD,VCC, the power supply VCC will be enabled again. An integrated hysteresis on the temperature sensor

avoids toggling during over-temperature events.

6WDQGE\0RGH3RZHU'RZQ

7['

5['

3RZHU'RZQ

638

95['+

9&&

638

Data Sheet 17 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.3 Current Consumption

Table 7 Electrical Characteristics: Current Consumption

VS= 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

Current Consumption

in Normal Mode

at VS in LIN Recessive State

IS_rec – 1.3 2.2 mA Recessive state,

without RL;

VTxD = VCC;

ICC = 100 µA

P_5.3.1

Current Consumption

in Normal Mode

at VS in LIN Dominant State

IS_dom – 1.8 3.2 mA Dominant state,

without RL;

VTxD = 0 V;

ICC = 100 µA

P_5.3.2

Current Consumption at VS

in Sleep Mode

IS_sleep –812µA Sleep Mode,

-40 °C < Tj < 85 °C;

VLIN = VS;

VCC = 0 V

P_5.3.3

Current Consumption at VS

in Stop Mode

IS_stop ––40µAStop Mode;

-40 °C < Tj < 85 °C;

VLIN = VS;

VCC = 5 V

P_5.3.4

Current Consumption

in Sleep Mode, Bus Shorted to

Ground

IS_sleep_short 64072µA Sleep Mode,

VLIN = 0 V

VCC = 0 V

P_5.3.5

TLE8458Gx

Mode Control

Data Sheet 18 Rev. 1.01, 2009-04-28

5.4 Electrical Characteristics EN and WK Pins

Table 8 Electrical Characteristics: Mode Pins

7V<VS<27V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

EN Pin

HIGH Level Input Voltage VEN,H 2––V– P_5.4.6

LOW Level Input Voltage VEN,L ––0.8V– P_5.4.7

EN Input Hysteresis VEN,hys –0.3–V– P_5.4.8

EN pull-down Resistance REN 20 40 80 kΩ–P_5.4.9

Filter Time for Mode Change tmode1 50 – 150 µs– P_5.4.10

TxD low delay time tmode2 0–50µs Stop Mode transfer P_5.4.11

TxD high time tmode3 10 – – µs Stop Mode transfer P_5.4.12

Time for Mode Change from

Stop or Sleep Mode to Normal

Operation Mode

tMode_NO –10–µs1)Transfer to Normal

Operation Mode

1) Not subject to production test, specified by design

P_5.4.1

Time for Flash Mode

activation

tfl1 25 – 50 µs1) EN pin low P_5.4.13

TxD Time for Flash Mode

activation

tfl2 5––µs1) P_5.4.14

TxD Time for Flash Mode

activation

tfl3 10 – – µs1) P_5.4.15

WK Pin

High Level Input Voltage VWK,H VS - 1 – VS + 3 V VS = 13.5 V P_5.4.16

Low Level Input Voltage VWK,L -0.3 – VS - 4 V VS = 13.5 V P_5.4.17

Pull-up Current IWK,PU -60 -30 -3 µAVWK = 0V

VS = 13.5 V

P_5.4.18

High Level Leakage Current IWK,L -5 – 5 µAVS = 0 V;

VWK = 40 V

P_5.4.19

Dominant Time for Wake-up tWK 30 – 150 µs– P_5.4.20

Data Sheet 19 Rev. 1.01, 2009-04-28

TLE8458Gx

Mode Control

5.5 Power Up, Power Down

Table 9 Electrical Characteristics: Power Up

Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

Vs Pin

VS Power Up Voltage

Threshold

VS,PU ––3.5VICC =40mA,

VCC >3.0V

P_5.5.21

TLE8458Gx

Voltage Regulator

Data Sheet 20 Rev. 1.01, 2009-04-28

6 Voltage Regulator

6.1 Description of Voltage Regulator

The TLE8458G has a monolithic integrated voltage regulator dedicated for microcontroller supplies under harsh

automotive environment conditions. Due to its ultra low current consumption, the TLE8458Gx is perfectly suited

for applications permanently connected to a battery. Additionally, the regulator is switched off in Sleep Mode to

achieve a very low quiescent current. The TLE8458Gx is equipped with protection functions against overloading,

short circuits, and over temperature.

6.2 Electrical Characteristics of the Voltage Regulator

Table 10 Electrical Characteristics: Voltage Regulator

VS = 5.5 V to 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note / Test Condition Number

Min. Typ. Max.

Output Voltage for

TLE8458G, TLE8458GU

VCC,5 4.95 5.1V1mA < ICC < 50 mA;

5.5 V < VS<18V

P_6.2.1

Output Voltage for

TLE8458G, TLE8458GU

VCC,5 4.95 5.1VICC = 10 mA;

5.5 V < VS<40V

P_6.2.8

Output Voltage for

TLE8458GV33,TLE8458GUV33

VCC,3.3 3.234 3.3 3.366 V 1 mA < ICC < 50 mA;

5.5 V < VS<18V

P_6.2.2

Output Voltage for

TLE8458GV33

TLE8458GUV33

VCC,3.3 3.234 3.3 3.366 V ICC = 10 mA;

5.5 V < VS<40V

P_6.2.9

Output Current Limitation

TLE8458G, TLE8458GU

ICC,lim 50 – – mA VCC,5 > 4.5V

VS=13.5V

P_6.2.3

Output Current Limitation

TLE8458GV33

TLE8458GUV33

ICC,lim 50 – – mA VCC3,3 > 2.8V

VS=13.5V

P_6.2.10

Output Voltage Drop VDR – 250 500 mV ICC = 40 mA1)

1) Measured when the output voltage has dropped 100 mV from the nominal value obtained at VS=13.5V;

P_6.2.4

Load Regulation ∆VCC,LO – 2550mV1mA < ICC < 50 mA

VS =13.5 V

P_6.2.5

Line Regulation ∆VCC,LI – 2550mVICC = 1 mA;

6V < VS < 28 V

P_6.2.6

Power Supply Ripple Rejection PSRR –60–dBf = 100 Hz;

Vr = 0.5 Vpp2)3)

2) Voltage of ripple Vr is 0.5 V peak-to-peak

3) Not subject to production test; specified by design.

P_6.2.7

Data Sheet 21 Rev. 1.01, 2009-04-28

TLE8458Gx

LIN Transceiver

7 LIN Transceiver

7.1 Functional Description

The LIN Bus is a single wire, bi-directional bus, used for in-vehicle networks. The LIN Transceiver implemented

inside the TLE8458Gx is the interface between the microcontroller and the physical LIN Bus. (see Figure 1 and

Figure 15). The digital output data from the microcontroller are driven to the LIN bus via the TxD input pin on the

TLE8458Gx. The transmit data stream on the TxD input is converted to a LIN bus signal with optimized slew rate

to minimize the EME level of the LIN network. The RxD output sends back the information from the LIN bus to the

microcontroller. The receiver has an integrated filter network to suppress noise on the LIN Bus and to increase the

EMI (Electro Magnetic Immunity) level of the transceiver.

Two logical states are possible on the LIN bus according to the LIN Specification 2.1 (see Figure 10):

In dominant state, the voltage on the LIN bus is set close to the GND level. In recessive state, the voltage on the

LIN bus is set close to the supply voltage VS. By setting the TxD input of the TLE8458Gx to LOW the transceiver

generates a dominant level on the LIN interface pin. The RxD output reads back the signal on the LIN bus and

indicates a dominant LIN bus signal with a logical LOW to the microcontroller. Setting the TxD pin to HIGH the

transceiver TLE8458Gx sets the LIN interface pin LIN to the recessive level, at the same time the recessive level

on the LIN bus is indicated by a logical “High” on the RxD output.

Every LIN network consists of a master node and one or more slave nodes. To configure the TLE8458Gx for

master node applications, a resistor in the range of 1 kΩ and a reverse diode must be connected between the LIN

bus and the power supply VS. (see Figure 15).

Figure 10 LIN Bus Signals

7['

9&&

5HFHVVLYH

/,1

5['

'RPLQDQW

9&&

5HFHVVLYH

5HFHVVLYH 'RPLQDQW 5HFHVVLYH

5HFHVVLYH'RPLQDQW5HFHVVLYH

TLE8458Gx

LIN Transceiver

Data Sheet 22 Rev. 1.01, 2009-04-28

7.1.1 Under-Voltage Detection

A dropping power supply VS on a local ECU can effect the communication of the whole LIN network. To avoid any

blocking of the LIN network by a local ECU the TLE8458Gx has an integrated Power - On reset at the supply VS

and an Under-Voltage detection at the supply VS. In case the supply voltage VS is dropping below the Power-On

reset level VS < VS,UV,PON, the TLE8458Gx changes the operation mode to Stand-By mode. In Stand-By mode the

output stage of the TLE8458Gx is disabled and no communication to the LIN bus is possible. The internal bus

termination remains active as well as the VCC output voltage. (see Figure 1 and Figure 11).

In Stand-By mode the RxD pin indicates the low power supply condition with a logical HIGH signal. Setting the EN

pin to logical HIGH changes the operation mode back to Normal Operation mode.

In case the supply voltage VS is dropping below the under - voltage reset level VS < VSUV (see Figure 11), the

TLE8458Gx disables the output and receiver stages. This feature secures the communication on the LIN bus. If

the power supply VS reaches a higher level as the under - voltage reset level VS > VSUV the TLE8458Gx continues

with normal operation. A mode change only applies if the power supply VS drops below the power on reset level

(VS<VS,UV,PON).

Figure 11 Under-Voltage Detection

6XSSO\YROWDJH9V

3RZHURQUHVHWOHYHO9

689321

3RZHU2QUHVHW

1RUPDO2SHUDWLRQ

0RGH

5HVHWDQG

&RPPXQLFDWLRQ

EORFNHG

6WDQG%\

0RGH

%ODQNLQJWLPHW

6XSSO\YROWDJH9V

3RZHURQUHVHWOHYHO9

689321

1RUPDO2SHUDWLRQ

0RGH

&RPPXQLFDWLRQ

EORFNHG

%ODQNLQJWLPHW

8QGHU9ROWDJHOHYHO9

689

1RUPDO2SHUDWLRQ

0RGH

8QGHU9ROWDJH

'HWHFWLRQ9

Data Sheet 23 Rev. 1.01, 2009-04-28

TLE8458Gx

LIN Transceiver

7.1.2 TxD Time - Out

If the TxD signal is dominant for the time t > ttimeout, the TxD time - out function deactivates the LIN transmitter

output stage. The device remains in recessive state. The TxD time - out functions prevents the LIN bus from being

blocked by a permanent LOW signal on the TxD pin, caused by a failure. The transmitter output stage is released

again, after a rising edge on the TxD pin has been detected (see Figure 12).

Figure 12 TxD Time-Out function

7.1.3 LIN Specifications

The LIN network is standardized by international regulations. The devices TLE8458G and the TLE8458GV33 are

compliant to the specification LIN 2.1. The physical layer specification LIN 2.1 is a super set of the previous LIN

specifications, like LIN 2.0 or LIN 1.3. The TLE8458G and the TLE8458GV33 have been qualified according to

the LIN 2.1 standard, conformance test results are available on request.

The devices TLE8458GU and TLE8458GUV33 are compliant to the physical layer standard SAE-J2602-2. The

SAE-J2602-2 standard differs from the LIN 2.1 standard mainly by the lower data rate (10.4 kbit / s) and the higher

hysteresis on the LIN output signals. The TLE8458GU and the TLE8458GUV33 have been qualified according to

the SAE-J2602-2 standard, conformance test results are available on request.

7['

/,1

WRUHF

WLPHRXW

1RUPDO&RPPXQLFDWLRQ

7['7LPH2XWGXHWR

PLFURFRQWUROOHUHUURU 5HOHDVHDIWHU7['

7LPHRXW

5HFRYHU\RIWKH

PLFURFRQWUROOHUHUURU

TLE8458Gx

LIN Transceiver

Data Sheet 24 Rev. 1.01, 2009-04-28

7.2 Electrical Characteristics of the LIN Transceiver

Table 11 Electrical Characteristics: LIN Transceiver Supply

VS = 7 V to 27 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note / Test Condition Number

Min. Typ. Max.

Voltage Supply

Undervoltage switch-off Vsuv 4–5V– P_7.2.1

Power-On Reset Level VS,UV,PON –3.5–V

1) P_7.2.52

Blanking Time for Under-

Voltage switch-off

tuv –10–µs1)

1) Not subject to production test; specified by design.

P_7.2.2

Table 12 Electrical Characteristics: LIN Transceiver

VS = 7 V to 27 V, Tj = -40 °C to +150 °C, RL=500Ω, all voltages with respect to ground, positive current flowing

into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note / Test Condition Number

Min. Typ. Max.

Receiver Output (RxD pin)

HIGH Level Output Voltage VRxD,H 0.8 ×

VCC

––VIRxD = -1.6 mA;

Vbus = VS

P_7.2.3

LOW Level Output Voltage VRxD,L – – 0.2 ×

VCC

VIRxD = 1.6 mA

Vbus = 0 V

P_7.2.4

Transmission Input (TxD pin)

HIGH Level Input Voltage VTxD,H 0.7 ×

VCC

– – V Recessive State P_7.2.5

TxD Input Hysteresis VTxD,hys – 0.12 ×

VCC

–mV– P_7.2.6

LOW Level Input Voltage VTxD,L – – 0.3 ×

VCC

V Dominant State P_7.2.7

TxD Pull-down Resistance RTxD – 300 – kΩVTxD = 0 V P_7.2.8

TxD Low Level Current

(Standby Mode, after

Wake-up via WK)

ITxD,L 1.5 3 10 mA VTxD = 0.9 V P_7.2.9

Data Sheet 25 Rev. 1.01, 2009-04-28

TLE8458Gx

LIN Transceiver

LIN Bus Receiver (LIN Pin)

Receiver Threshold Voltage,

Recessive to Dominant Edge

VBus,rd 0.4 ×

0.45 ×

–VVBus,rec < VBus < 27 V P_7.2.10

Receiver Dominant State VBus,dom – – 0.4 ×

V LIN2.1 Param. 17 P_7.2.11

Receiver Threshold Voltage,

Dominant to Recessive Edge

VBus,dr – 0.55 ×

0.60 ×

VVBus,rec < VBus < 27 V P_7.2.12

Receiver Recessive State VBus,rec 0.6 ×

– – V LIN2.1 Param 18 P_7.2.13

Receiver Center Voltage VBus,c 0.475

× VS

0.5 ×

0.525

× VS

V LIN2.1 Param 19 P_7.2.14

Receiver Hysteresis VBus,hys 0.07 ×

0.1 ×

0.175

× VS

VVbus,hys = Vbus,rec - Vbus,dom

LIN2.1 Param 20

P_7.2.15

Wake-up Threshold Voltage VBus,wk 0.40 ×

0.5 ×

0.6 ×

V– P_7.2.16

Dominant Time for Bus

Wake-up

tWK,Bus 30 – 150 µs– P_7.2.17

LIN Bus Transmitter (LIN Pin)

Bus Recessive Output

Voltage

VBUS,ro 0.8 ×

–VSVVTxD = high Level P_7.2.18

Bus Dominant Output Voltage VBUS,do ––1.2VVTxD = 0 V;

6.0 V

≤

VS≤7.3 V;

P_7.2.53

Bus Dominant Output Voltage VBUS,do – – 0.2 x

VVTxD = 0 V;

7.3 V

≤

VS≤10.0 V;

P_7.2.19

Bus Dominant Output Voltage VBUS,do ––2.0VVTxD = 0 V;

10.0 V

≤

VS≤18.0 V;

P_7.2.20

Bus Short Circuit Current IBUS,sc 40 100 150 mA VBUS = 13.5 V;

LIN2.1 Param 12

P_7.2.23

Leakage Current

Loss of Ground

IBUS,lk -1000 -450 0 µAVS = 0 V;

VBUS = -12 V;

LIN2.1 Param 15

P_7.2.24

Leakage Current

Loss of Battery

IBUS,lk ––5µAVS = 0 V;

VBUS = 18 V;

LIN2.1 Param 16

P_7.2.25

Leakage Current IBUS,lk -1––mAVS = 18 V;

VBUS = 0 V;

LIN2.1 Param 13

P_7.2.26

Leakage Current

Driver Off

IBUS,lk ––5µAVS = 8 V;

VBUS = 18 V;

LIN2.1 Param 14

P_7.2.27

Table 12 Electrical Characteristics: LIN Transceiver (cont’d)

VS = 7 V to 27 V, Tj = -40 °C to +150 °C, RL=500Ω, all voltages with respect to ground, positive current flowing

into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note / Test Condition Number

Min. Typ. Max.

TLE8458Gx

LIN Transceiver

Data Sheet 26 Rev. 1.01, 2009-04-28

Bus Pull-up Resistance RBUS 20 30 47 kΩNormal Mode

LIN2.1 Param 26

P_7.2.28

LIN Output Current IBUS -60 -30 -5 µA Sleep Mode

VS = 12 V;

EN = 0 V;VLIN = 0 V

P_7.2.29

LIN Input Capacitance CBUS 15 pF 1) P_7.2.55

Receiver propagation delay

bus dominant to RxD LOW

td(L),R –16µsVCC = 5 V;

CRxD = 20 pF;

LIN2.1 Param 31

P_7.2.38

Receiver propagation delay

bus recessive to RxD HIGH

td(H),R –16µsVCC = 5 V;

CRxD = 20 pF;

LIN2.1 Param 31

P_7.2.39

Receiver delay symmetry tsym,R -2 – 2 µstsym,R = td(L),R - td(H),R;

LIN2.1 Param 32

P_7.2.40

TxD Dominant Time Out ttimeout 6 1220msVTxD = 0 V P_7.2.44

TxD Dominant Time Out

Recovery Time

ttorec –10–µs1) P_7.2.45

Duty Cycle D1

(For worst case at 20 kbit/s)

Lin2.1 Normal Slope2)

D1 0.396 – – 3) THRec(max) = 0.744 × VS;

THDom(max) = 0.581 × VS;

VS = 7.0 … 18 V;

tbit = 50 µs;

D1 = tbus_rec(min)/2 tbit;

LIN2.1 Param 27

P_7.2.46

Duty Cycle D2

(for worst case at 20 kbit/s)

LIN2.1 Normal Slope

D2 – – 0.581 3)THRec(min.) = 0.422 × VS;

THDom(min.) = 0.284 × VS;

VS = 7.6 … 18 V;

tbit = 50 µs;

D2 = tbus_rec(max)/2 tbit;

LIN2.1 Param 28

P_7.2.47

Duty Cycle D3

(for worst case at 10.4 kbit/s)

SAE J2602 Low Slope4)

D3 0.417 – – 3)THRec(max) = 0.778 × VS;

THDom(max) = 0.616 × VS;

VS = 7.0 … 18 V;

tbit = 96 µs;

D3 = tbus_rec(min)/2 tbit;

LIN2.1 Param 29

P_7.2.48

Duty Cycle D4

(for worst case at 10.4 kbit/s)

SAE J2602 Low Slope

D4 – – 0.590 3)THRec(min.) = 0.389 × VS;

THDom(min.) = 0.251 × VS;

VS = 7.6 … 18 V;

tbit = 96 µs;

D4 = tbus_rec(max)/2 tbit;

LIN2.1 Param 30

P_7.2.49

1) Not subject to production test, specified by design.

Table 12 Electrical Characteristics: LIN Transceiver (cont’d)

VS = 7 V to 27 V, Tj = -40 °C to +150 °C, RL=500Ω, all voltages with respect to ground, positive current flowing

into pin

(unless otherwise specified)

Parameter Symbol Values Unit Note / Test Condition Number

Min. Typ. Max.

Data Sheet 27 Rev. 1.01, 2009-04-28

TLE8458Gx

LIN Transceiver

Figure 13 Simplified Test Circuit for Dynamic Characteristics

2) Valid for TLE8458G and TLE8458GV33,

3) Bus load conditions concerning LIN spec 2.1 CLIN, RLIN = 1 nF, 1 kΩ / 6.8 nF, 660 Ω / 10 nF, 500 Ω

4) Valid for TLE8458GU and TLE8458GUV33

*1'

/,1

Q)

/,1

7['

/,1

5['

TLE8458Gx

LIN Transceiver

Data Sheet 28 Rev. 1.01, 2009-04-28

Figure 14 Timing Diagram for Dynamic Characteristics

%LW

%XVBGRPPD[

%XVBUHFPLQ

7KUHVKROGVRI

UHFHLYLQJQRGH

7KUHVKROGVRI

UHFHLYLQJQRGH

5HFPD[

'RPPD[

5HFPLQ

'RPPLQ

%XVBGRPPLQ

%XVBUHFPD[

G/5

G+5

G+U

/5

683

7UDQVFHLYHUVXSSO\

RIWUDQVPLWWLQJ

QRGH

7['

LQSXWWR

WUDQVPLWWLQJQRGH

5['

RXWSXWRIUHFHLYLQJ

QRGH

5['

RXWSXWRIUHFHLYLQJ

QRGH

'XW\&\FOH W

%86BUHFPLQ

[W

%,7



'XW\&\FOH W

%86BUHFPD[

[W

%,7



Data Sheet 29 Rev. 1.01, 2009-04-28

TLE8458Gx

Application Information

8 Application Information

Note: The following information is given as a hint for the implementation of the device only and should not be

regarded as a description or warranty of a certain functionality, condition or quality o f the device.

Figure 15 Application Example

Note: This is a simplified example of an application circuit. The function must be verified in the actual application.

ECU 1

TxD

GND

TLE7259-2GE

Bus

100

XC22XX

GND

Master Node

WKINH

e. g. TLE 4263

5 V

GND

INH

100

µF

22 µF

1 kΩ

1 nF

100

nF RxD

TxD

GND

TLE8458G

LIN XC22XX

GND

Slave Node

100

RxD

VBat LIN Bus

µF

220

Vcc

µF

100

ECU X

TLE8458Gx

Application Information

Data Sheet 30 Rev. 1.01, 2009-04-28

8.1 ESD Tests

Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results

and test conditions are available in a separate test report (see Table 13).

8.1.1 EMC Measurement

The EMC performance has been qualified by an external test house according to the LIN EMC Test specification

Version 1.0 (August 1, 2004). For the DPI measurements according to the LIN EMC Test Specification, Section

4.2 (ISO62132 part 1: 2006, ISO62132 part 4: 2006) the verification limit for the output voltage VCC, was set to a

limit of +/- 100 mV. External test reports are available on request.

8.2 Pin Compatibility to Stand-Alone LIN transceivers

The TLE8458G is pin - and function compatible to the single LIN transceivers like the TLE7259-2GE and its

derivative the TLE7259-2GU (see Figure 16). Instead of the INH output pin on the single LIN transceiver

TLE7259-2GE the VCC power supply output can be connected to the external microcontroller. The TLE8458G

provides the same operation modes and feature s as single LIN transceiver TLE7259-2GE.

Figure 16 Pinning of TLE8458G versus the TLE7259-2GE

Table 13 ESD “Gun test”

Parameter Symbol Values Unit Note /

Test Condition

Number

Min. Typ. Max.

Performed Test

ESD at VS, LIN versus GND VESD,GUN -10 – 10 kV GUN1)

1) ESD susceptibility “ESD GUN” according LIN EMC Test Specification, Section 4.3 (IEC 61000-4-2:2001-12), tested by

external test house (IBEE Zwickau, EMC Test report Nr. 07-11-08)

P_8.1.1

ESD at WK PIN VESD,GUN -7–7kVGUN

1) P_8.1.1

RxD 1

TxD

LIN

GND

RxD 1

TxD

LIN

GND

INH

TLE 8458G TLE 7259-2GE

Data Sheet 31 Rev. 1.01, 2009-04-28

TLE8458Gx

Package Outlines

9 Package Outlines

Figure 17 PG-DSO-8-16 (SO-8 Standard, Green (RoHS compliant))

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with

government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e

Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

+0.06

0.19

0.35 x 45˚

-0.2

8 MAX.

0.64

±0.2

±0.25

0.2 8x

1.27

+0.1

0.41 0.2

-0.06

1.75 MAX.

(1.45)

±0.07

0.175

Index Marking

-0.21)

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Lead width can be 0.61 max. in dambar area

GPS01181

0.1

For further information on alternative packages, please visit our website:

htt

://www.infineon.com/

acka

es.Dimensions in mm

TLE8458Gx

Revision History

Data Sheet 32 Rev. 1.01, 2009-04-28

10 Revision History

Revision Date Changes

1.0 2009-03-23 Initial data sheet

1.01 2009-04-28 Editorial Change to the data sheet

Update table 13 on page 30.

P_8.1.1 performed test changed from:

“ESD at LIN Pin”

to:

“ESD at VS, LIN versus GND”

Edition 2009-04-28

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.