© 2018 IXYS CORPORATION, All Rights Reserved DS100679B(4/18)
X2-Class
Power MOSFET
IXTH62N65X2 VDSS = 650V
ID25 = 62A
RDS(on)
50m
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max.
BVDSS VGS = 0V, ID = 1mA 650 V
VGS(th) VDS = VGS, ID = 250μA 2.7 5.0 V
IGSS VGS = 30V, VDS = 0V 100 nA
IDSS VDS = VDSS, VGS = 0V 25 A
TJ = 125C 300 A
RDS(on) VGS = 10V, ID = 0.5 ID25, Note 1 50 m
Symbol Test Conditions Maximum Ratings
VDSS TJ= 25C to 150C 650 V
VDGR TJ= 25C to 150C, RGS = 1M650 V
VGSS Continuous 30 V
VGSM Transient 40 V
ID25 TC= 25C62A
IDM TC= 25C, Pulse Width Limited by TJM 124 A
IATC= 25C 10 A
EAS TC= 25C2J
dv/dt IS IDM, VDD VDSS, TJ 150°C 15 V/ns
PDTC= 25C 780 W
TJ-55 ... +150 C
TJM 150 C
Tstg -55 ... +150 C
TLMaximum Lead Temperature for Soldering 300 °C
TSOLD 1.6 mm (0.062in.) from Case for 10s 260 °C
MdMounting Torque 1.13 / 10 Nm/lb.in
Weight 6 g
N-Channel Enhancement Mode
Avalanche Rated
Features
International Standard Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
G = Gate D = Drain
S = Source Tab = Drain
TO-247
G
S
DD (Tab)
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTH62N65X2
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065B1 6,683,344 6,727,585 7,005,734B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123B1 6,534,343 6,710,405B2 6,759,692 7,063,975B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728B1 6,583,505 6,710,463 6,771,478B2 7,071,537
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max
ISVGS = 0V 62 A
ISM Repetitive, Pulse Width Limited by TJM 248 A
VSD IF = IS, VGS = 0V, Note 1 1.4 V
trr 445 ns
QRM 8.2 μC
IRM 36.7 A
IF = 31A, -di/dt = 100A/μs
VR = 100V
TO-247 (IXTH) Outline
R
L1
A2
Q
E
A
D
c
B
A
b
C
L
D
S D2
E1
A2 A2 A2
e
0P1
ixys option
A1
b4
b2
D1
0P O 0K M D B M
+
O J M C A M
+
12 3
4
+
+
PINS: 1 - Gate
2, 4 - Drain
3 - Source
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max
gfs VDS = 10V, ID = 0.5 • ID25, Note 1 25 56 S
RGi Gate Input Resistance 0.9
Ciss 5800 pF
Coss VGS = 0V, VDS = 25V, f = 1MHz 4260 pF
Crss 2.3 pF
Co(er) 210 pF
Co(tr) 890 pF
td(on) 28 ns
tr 11 ns
td(off) 56 ns
tf 5 ns
Qg(on) 100 nC
Qgs VGS = 10V, VDS = 0.5 VDSS, ID = 0.5 ID25 28 nC
Qgd 35 nC
RthJC 0.16 C/W
RthCS 0.21 C/W
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2 (External)
Effective Output Capacitance
Energy related
Time related
VGS = 0V
VDS = 0.8 • VDSS
© 2018 IXYS CORPORATION, All Rights Reserved
IXTH62N65X2
Fig. 1. Output Characteristics @ T
J
= 25
o
C
0
10
20
30
40
50
60
00.511.5 22.533.5
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
8V
7V
5V
6V
Fig. 3. Output Characteristics @ T
J
= 125
o
C
0
10
20
30
40
50
60
0123456789
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
7V
6V
5V
4V
Fig. 4. R
DS(on)
Normalized to I
D
= 31A Value vs.
Junction Temperature
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-50 -25 0 25 50 75 100 125 150
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
= 31A
I
D
= 62A
Fig. 5. R
DS(on)
Normalized to I
D
= 31A Value vs.
Drain Current
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 20 40 60 80 100 120 140 160
I
D
- Amperes
R
DS(on)
- Normalized
V
GS
= 10V
T
J
= 125
o
C
T
J
= 25
o
C
Fig. 2. Extended Output Characteristics @ T
J
= 25
o
C
0
20
40
60
80
100
120
140
160
180
0 5 10 15 20 25 30
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
7V
6V
5V
8V
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-60 -40 -20 0 20 40 60 80 100 120 140 160
T
J
- Degrees Centigrade
BV
DSS
/ V
GS(th)
- Normalized
BV
DSS
V
GS(th)
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTH62N65X2
Fig. 8. Input Admittance
0
10
20
30
40
50
60
70
80
90
3.54.04.55.05.56.06.57.0
V
GS
- Volts
I
D
- Amperes
T
J
= 125
o
C
25
o
C
- 40
o
C
Fig. 7. Maximum Drain Current vs. Case Temperature
0
10
20
30
40
50
60
70
-50 -25 0 25 50 75 100 125 150
T
C
- Degrees Centigrade
I
D
- Amperes
Fig. 9. Transconductance
0
10
20
30
40
50
60
70
80
90
100
0 102030405060708090
I
D
- Amperes
g
f s
- Siemens
T
J
= - 40
o
C
125
o
C
25
o
C
Fig. 10. Forward Voltage Drop of Intrinsic Diode
0
20
40
60
80
100
120
140
160
180
200
0.30.40.50.60.70.80.91.01.11.2
V
SD
- Volts
I
S
- Amperes
T
J
= 125
o
C
T
J
= 25
o
C
Fig. 11. Gate Charge
0
2
4
6
8
10
0 102030405060708090100
Q
G
- NanoCoulombs
V
GS
- Volts
V
DS
= 325V
I
D
= 31A
I
G
= 10mA
Fig. 12. Capacitance
1
10
100
1,000
10,000
100,000
1 10 100 1000
V
DS
- Volts
Capacitance - PicoFarad
s
f
= 1 MHz
Ciss
Crss
Coss
© 2018 IXYS CORPORATION, All Rights Reserved
IXTH62N65X2
IXYS REF: T_62N65X2(X7-S602) 10-08-15
Fig. 15. Maximum Transient Thermal Impedance
0.001
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1 10
Pulse Width - Seconds
Z
(th)JC
- K / W
Fig. 15. Maximum Transient Thermal Impedance
aaaa
0.4
Fig. 14. Forward-Bias Safe Operating Area
0.1
1
10
100
1000
10 100 1,000
V
DS
- Volts
I
D
- Amperes
TJ = 150oC
TC = 25oC
Single Pulse
25μs
10ms
100μs
RDS(
on
) Limit
1ms
Fig. 13. Output Capacitance Stored Energy
0
5
10
15
20
25
30
35
40
45
0 100 200 300 400 500 600
V
DS
- Volts
E
OSS
- MicroJoules
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