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1. Product profile
1.1 General description
Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small
SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to
protect one signal line in rail-to-rail configuration from the damage caused by ESD
and other transients.
1.2 Features
nESD protection of one signal line (rail-to-rail configuration)
nUltra low diode capacitance: Cd= 0.6 pF
nVery low reverse leakage current: 30 nA
nESD protection up to 30 kV
nIEC 61000-4-2; level 4 (ESD)
nIEC 61000-4-5 (surge); IPP = 11 A at tp= 8/20 µs
nAEC-Q101 qualified
1.3 Applications
nTelecommunication networks
nVideo line protection
nMicrocontroller protection
nI2C-bus protection
nAntenna power supply
nAnalog audio
nClass-D amplifier
1.4 Quick reference data
NUP1301
Ultra low capacitance ESD protection array
Rev. 01 — 11 May 2009 Product data sheet
Table 1. Quick reference data
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRRM repetitive peak reverse
voltage --80V
Cddiode capacitance f = 1 MHz;
VR=0V - 0.6 0.75 pF
IRreverse current VR= 80 V - - 100 nA
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 2 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 2. Pinning
Pin Symbol Description Simplified outline Graphic symbol
1 GND ground
2V
CC supply voltage
3 I/O input/output
12
3
006aaa763
12
3
Table 3. Ordering information
Type number Package
Name Description Version
NUP1301 - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking
Type number Marking code[1]
NUP1301 LJ*
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRRM repetitive peak reverse
voltage -80V
VRreverse voltage - 80 V
IFforward current [1] - 215 mA
IFRM repetitive peak forward
current tp1 ms; δ≤0.25 - 500 mA
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 3 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
[1] Pulse test: tp300 µs; δ≤0.02.
[2] Tj=25°C prior to surge.
[3] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[4] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
[5] Single diode loaded.
[6] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
IFSM non-repetitive peak
forward current square wave [2]
tp=1µs-4A
tp=1ms - 1 A
tp= 1 s - 0.5 A
Per device
PPP peak pulse power tp= 8/20 µs[3][4] - 220 W
IPP peak pulse current tp= 8/20 µs[3][4] -11A
Ptot total power dissipation Tamb 25 °C[5][6] - 250 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature 55 +150 °C
Tstg storage temperature 65 +150 °C
Table 6. ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
VESD electrostatic discharge
voltage IEC 61000-4-2
(contact discharge) [1][2] -30kV
machine model - 400 V
MIL-STD-883
(human body model) -10kV
Table 7. ESD standards compliance
Standard Conditions
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3B (human body model) > 8 kV
Table 5. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 4 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
6. Thermal characteristics
[1] Single diode loaded.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5 Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (µs)
0403010 20
001aaa630
40
80
120
IPP
(%)
0
et
100 % IPP; 8 µs
50 % IPP; 20 µs
001aaa631
IPP
100 %
90 %
t
30 ns 60 ns
10 %
tr = 0.7 ns to 1 ns
Table 8. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1][2] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point - - 360 K/W
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 5 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
7. Characteristics
[1] Pulse test: tp300 µs; δ≤0.02.
[2] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[3] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
Table 9. Electrical characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VBR breakdown voltage IR= 100 µA 100 - - V
VFforward voltage [1]
IF= 1 mA - - 715 mV
IF= 10 mA - - 855 mV
IF=50mA --1V
IF= 150 mA - - 1.25 V
IRreverse current VR=25V --30nA
VR= 80 V - - 100 nA
VR=25V;
Tj= 150 °C--25µA
VR=80V;
Tj= 150 °C--35µA
Cddiode capacitance f = 1 MHz; VR= 0 V - 0.6 0.75 pF
Per device
VCL clamping voltage IPP =1A [2][3] --3V
IPP =11A [2][3] --20V
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 6 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
(1) Tamb = 150 °C
(2) Tamb =85°C
(3) Tamb =25°C
(4) Tamb =40 °C
Based on square wave currents.
Tj=25°C; prior to surge
Fig 3. Forward current as a function of forward
voltage; typical values Fig 4. Non-repetitive peak forward current as a
function of pulse duration; typical values
(1) Tamb = 150 °C
(2) Tamb =85°C
(3) Tamb =25°C
(4) Tamb =40 °C
Tamb =25°C; f = 1 MHz
Fig 5. Reverse current as a function of reverse
voltage; typical values Fig 6. Diode capacitance as a function of reverse
voltage; typical values
006aab132
1
10
102
103
IF
(mA)
101
VF (V)
0 1.41.00.4 0.80.2 1.20.6
(1) (2) (3) (4)
mbg704
10
1
102
IFSM
(A)
101
tp (µs)
110
4
103
10 102
006aab133
102
IR
(µA)
VR (V)
0 1008040 6020
10
1
101
102
103
104
105
(1)
(2)
(3)
(4)
0816124
0.8
0.6
0
0.4
0.2
mbg446
VR (V)
Cd
(pF)
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 7 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
Fig 7. ESD clamping test setup and waveforms
006aab567
50
RZ
CZDUT
(DEVICE
UNDER
TEST)
GND
450 RG 223/U
50 coax
ESD TESTER
acc. to IEC 61000-4-2
CZ = 150 pF; RZ = 330
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped 8 kV ESD pulse waveform
(IEC 61000-4-2 network), pin 3 to 1 and 2
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
unclamped 8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 10 A/div
horizontal scale = 15 ns/div
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network), pin 3 to 1 and 2
GND
GND
vertical scale = 10 V/div
horizontal scale = 15 ns/div
vertical scale = 10 V/div
horizontal scale = 15 ns/div
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 8 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
8. Application information
Protection of a single (high-speed) data line in rail-to-rail configuration. The protected data
line is connected to pin 3. Pin 1 is connected to ground (GND) and pin 2 is connected to
the supply rail (supply voltage VCC.) When the transient voltage exceeds the forward
voltage drop of one diode, the transient is directed either to the supply rail or to GND.
The advantages of these solutions are: low line capacitance (0.6 pF typically), fast
response time, and low clamping voltage.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the NUP1301 as close to the input terminal or connector as possible.
2. The path length between the NUP1301 and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 - Stress test qualification for discrete semiconductors
, and is
suitable for use in automotive applications.
Fig 8. Typical application for the protection of one signal line
006aab568
Audio
interface
D2
NUP1301
D1
NUP1301
VCC
VCC
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 9 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
10. Package outline
11. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Fig 9. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
NUP1301 SOT23 4 mm pitch, 8 mm tape and reel -215 -235
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 10 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
12. Soldering
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 11 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
13. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
NUP1301_1 20090511 Product data sheet - -
NUP1301_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 11 May 2009 12 of 13
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors NUP1301
Ultra low capacitance ESD protection array
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 May 2009
Document identifier: NUP1301_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Application information. . . . . . . . . . . . . . . . . . . 8
9 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
11 Packing information. . . . . . . . . . . . . . . . . . . . . . 9
12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15 Contact information. . . . . . . . . . . . . . . . . . . . . 12
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13