TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 FEATURES TYPICAL APPLICATIONS * * * * * * OPERATIONAL AMPLIFIER - Low Offset Voltage, Max of: * TSM104WA...3 mV (25C) and 4 mV (Full Temperature) * TSM104W...5 mV (25C) and 6 mV (Full Temperature) - Low Supply Current...375 A/Channel Typ at VCC = 5 V - Unity Gain Bandwidth...0.9 MHz Typ - Input Common-Mode Range Includes GND - Large Output-Voltage Swing...0 V to VCC - 2 V - Wide Supply-Voltage Range...3 V to 30 V - 2-kV ESD Protection (HBM) VOLTAGE REFERENCE - Adjustable Output Voltage...VREF to 36 V - VREF = 2.5 V With Tight Tolerance, Max of: * TSM104WA...0.4% (25C) and 0.8% (Full Temperature) * TSM104W...1% (25C) and 2% (Full Temperature) - Low Temperature Drift...7 mV Typ Over Operating Temperature Range - Wide Sink-Current Range...0.5 mA Typ to 100 mA - Output Impedance...0.2 Typ Battery Chargers Switch-Mode Power Supplies Linear Voltage Regulation Data-Acquisition Systems D (SOIC), N (PDIP), OR PW (TSSOP) PACKAGE (TOP VIEW) 1OUT 1 16 4OUT 1IN- 2 15 4IN- 1IN+ 3 14 4IN+ VCC+ 4 13 VCC- 2IN+ 5 12 3IN+ 2IN- 6 11 3IN- 2OUT 7 10 3OUT ADJUST 8 9 CATHODE DESCRIPTION/ORDERING INFORMATION The TSM104W combines the building blocks of a quad operational amplifier and an adjustable voltage reference, both of which often are used in the control circuitry of switch-mode power supplies. For the A grade, especially tight voltage regulation can be achieved through the low offset voltage for each operational amplifier (typically 0.5 mV) and tight tolerance for the voltage reference (0.4% at 25C and 0.8% over operating temperature range). The TSM104W and TSM104WA are characterized for operation from -40C to 105C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005-2006, Texas Instruments Incorporated TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 ORDERING INFORMATION TA MAX VIO AND VREF TOLERANCE (25C) PACKAGE (1) PDIP - N A grade 3 mV, 0.4% SOIC - D TSSOP - PW -40C to 105C PDIP - N Standard grade 5 mV, 1% SOIC - D TSSOP - PW (1) TOP-SIDE MARKING ORDERABLE PART NUMBER Tube of 25 TSM104WAIN Tube of 75 TSM104WAID Reel of 2500 TSM104WAIDR Tube of 75 TSM104WAIPW Reel of 2000 TSM104WAIPWR Tube of 25 TSM104WIN Tube of 75 TSM104WID Reel of 2500 TSM104WIDR Tube of 75 TSM104WIPW Reel of 2000 TSM104WIPWR PREVIEW TSM104WAI SM104AI PREVIEW TSM104WI SM104I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Absolute Maximum Ratings (1) over free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 36 V VID Operational amplifier input differential voltage 36 V VI Operational amplifier input voltage range IKA Voltage reference cathode current -0.3 D package JA Package thermal impedance (2) (3) Maximum junction temperature Tstg Storage temperature range (1) (2) (3) V mA 73 N package 67 PW package TJ 36 100 C/W 108 -65 150 C 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Selecting the maximum of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions 2 MIN MAX VCC+ - VCC- Supply voltage 3 30 V IK Cathode current 1 100 mA TA Operating free-air temperature -40 105 C Submit Documentation Feedback UNIT TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 Total Device Electrical Characteristics PARAMETER TEST CONDITIONS Total supply current, excluding cathode-current reference ICC VCC+ = 5 V, No load VCC+ = 30 V, No load TA MIN Full range TYP MAX 1.4 2.4 4 UNIT mA Operational Amplifier Electrical Characteristics VCC+ = 5 V, VCC- = GND, VO = 1.4 V, TA = 25C (unless otherwise noted) PARAMETER TEST CONDITIONS TSM104W VIO TA MIN 25C TYP MAX 1 5 Full range Input offset voltage 6 25C TSM104WA 0.5 Full range VIO Input offset voltage drift IIO Input offset current IIB Input bias current AVD Large-signal voltage gain VCC+ = 15 V, RL = 2 k, VO = 1.4 V to 11.4 V kSVR Supply-voltage rejection ratio VCC+ = 5 V to 30 V mV 4 25C 7 25C 2 Full range V/C 30 50 25C 30 Full range VCC+ = 30 V (1) 3 UNIT 150 200 25C 50 Full range 25 100 25C 65 25C 0 VCC+ - 1.5 Full range 0 VCC+ - 2 25C 70 Full range 60 20 Input common-mode voltage range CMRR Common-mode rejection ratio Isource Output source current VCC+ = 15 V, VO = 2 V, Vid = 1 V 25C ISC Short circuit to GND VCC+ = 15 V 25C Isink Output sink current VCC+ = 15 V, VO = 2 V, Vid = -1 V 25C 10 20 25C 27 28 Full range 27 dB 85 V dB 40 40 nA V/mV 100 VICR nA mA 60 mA mA VOH High-level output voltage VCC+ = 30 V, RL = 10 k VOL Low-level output voltage RL = 10 k SR Slew rate at unity gain VCC+ = 15 V, CL = 100 pF, RL = 2 k, VI = 0.5 V to 3 V, unity gain 25C 0.1 0.3 V/s GBW Gain bandwidth product VCC+ = 30 V, VI = 10 mV, CL = 100 pF, RL = 2 k, f = 100 kHz 25C 0.5 0.9 MHz THD Total harmonic distortion VCC+ = 30 V, VO = 2 Vpp, CL = 100 pF, RL = 2 k, f = 1 kHz, AV = 20 dB 25C 0.01 % Vn Equivalent input noise voltage VCC = 30 V, RS = 100 , f = 1 kHz 25C 25 nV/Hz Channel separation 1 kHz < f < 20 kHz 25C 120 dB (1) 25C 5 Full range V 20 20 mV The input common-mode voltage of either input should not be allowed to go below -0.3 V. The upper end of the common-mode voltage range is VCC+ - 1.5 V, but either input can go to VCC+ + 0.3 V without damage (absolute maximum ratings still must be observed). Submit Documentation Feedback 3 TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 Voltage Reference Electrical Characteristics PARAMETER TEST CONDITIONS TSM104W VREF IK = 10 mA Reference voltage TSM104WA IK = 10 mA MIN TYP MAX 2.5 2.525 25C 2.475 Full range 2.45 25C 2.49 Full range 2.48 2.55 2.5 VREF VKA = VREF, IK = 10 mA DVREF DVKA Ratio of change in reference voltage to change in cathode voltage VKA = 3 V to 36 V, IK = 10 mA IREF Reference input current IK = 10 mA IREF Reference input current deviation over temperature range Imin Minimum cathode current for regulation VKA = VREF 25C IK,OFF Off-state cathode current 25C 25C 0.2 (1) Dynamic impedance (1) The dynamic impedance is defined as Full range 25C 25C zka + VKA I K . Submit Documentation Feedback 30 -1.1 1.5 Full range Full range VKA = VREF, f < 1 kHz, IK = 1 mA to 100 mA 7 -2 2.51 UNIT V 2.52 Reference input voltage deviation over temperature range |zka| 4 TA mV mV/V 2.5 3 A 1.2 A 0.5 1 mA 180 500 nA 0.5 0.8 TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 TYPICAL OPERATING CHARACTERISTICS TA = 25C (unless otherwise noted) TOTAL HARMONIC DISTORTION (THD) vs FREQUENCY AMPLIFIER NOISE VOLTAGE vs FREQUENCY 250 Noise Voltage - nV/OHz 10 THD - % 1 0.1 0.01 0.001 10 200 150 100 50 0 100 1k Frequency - Hz 10k 100k 1 10 1k 100 10k 100k Frequency - Hz Figure 1. Figure 2. IK vs VREF VREF STABILITY vs CAPACITANCE 35 100 30 80 25 Current - mA IK - mA 60 40 20 15 10 20 5 0 0 1 -20 2.3 2.4 2.5 2.6 2.7 10 100 1000 10000 Capacitance - pF VREF - V Figure 3. Figure 4. Submit Documentation Feedback 5 TSM104W,, TSM104WA QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE www.ti.com SLOS478D - JULY 2005 - REVISED AUGUST 2006 TYPICAL OPERATING CHARACTERISTICS (continued) TA = 25C (unless otherwise noted) VREF vs TEMPERATURE 2.515 IO = 100 mA 2.510 2.505 VREF - V 2.500 IO = 10 mA 2.495 2.490 IO = 1 mA 2.485 2.480 -40 -25 -10 5 20 35 50 65 80 Temperature - C Figure 5. 6 Submit Documentation Feedback 95 110 125 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSM104WAID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WAIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSM104WIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.3 2.1 8.0 16.0 Q1 TSM104WAIDR SOIC D 16 2500 330.0 16.4 6.5 TSM104WAIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TSM104WIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TSM104WIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSM104WAIDR SOIC D 16 2500 367.0 367.0 38.0 TSM104WAIPWR TSSOP PW 16 2000 367.0 367.0 35.0 TSM104WIDR SOIC D 16 2500 367.0 367.0 38.0 TSM104WIPWR TSSOP PW 16 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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