E2SLA18-13.563975M RoHS Pb E2S L A 18 -13.563975M Series RoHS Compliant (Pb-free) Resistance Welded HC-49/UP SMD Crystal Nominal Frequency 13.563975MHz Load Capacitance 18pF Parallel Resonant Frequency Tolerance/Stability 15ppm at 25C, 20ppm over -20C to +70C Mode of Operation AT-Cut Fundamental ELECTRICAL SPECIFICATIONS Nominal Frequency 13.563975MHz Frequency Tolerance/Stability 15ppm at 25C, 20ppm over -20C to +70C Aging at 25C 5ppm/year Maximum Load Capacitance 18pF Parallel Resonant Shunt Capacitance (C0) 7pF Maximum Equivalent Series Resistance 70 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 1mWatt Maximum Storage Temperature Range -40C to +125C Insulation Resistance 500 Megaohms Minimum at 100Vdc ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Lead Termination Sn 2m - 6m Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) LINE MARKING 1 4.50 MAX E13.563M E=Ecliptek Designator M=MHz 13.30 MAX 0.50 MIN (x2) 4.88 0.20 4.85 MAX 0.80 0.30 (x2) 11.60 MAX NOTE: Coplanarity 0.360 MAX www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 1 of 4 E2SLA18-13.563975M Suggested Solder Pad Layout All Dimensions in Millimeters 5.5 (X2) 2.0 (X2) 4.0 Solder Land (X2) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 2 of 4 E2SLA18-13.563975M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 3 of 4 E2SLA18-13.563975M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 245C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 2 Times / 230C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 4 of 4