date 02/13/2020
page 1 of 3
MODEL: HSS-B20-061H-03 │ DESCRIPTION: HEAT SINK
cuidevices.com
FEATURES
• TO-220 package
• solder pin for secure PCB mounting
• black anodized finish
• aluminum
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 23
45
Heat Dissipated (W)
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 31.07 5.72 4.10
2 54.97 12.61 8.99
3 77.04 19.56 14.04
4 95.24 27.21 19.43
5 110.74 34.70 24.50
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
MODEL thermal resistance1power
dissipation1
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSS-B20-061H-03 25.86 31.07 5.72 4.10 2.90
Note: 1. See performance curves for full thermal resistance details.
Additional Resources: Product Page | 3D Model | PCB Footprint
date 02/13/2020│ page 2 of 3
cuidevices.com
CUI Devices │ MODEL: HSS-B20-061H-03 │ DESCRIPTION: HEAT SINK
MECHANICAL DRAWING
units: mm
tolerance: ±0.5 mm MATERIAL AL5052
FINISH black anodized
THICKNESS 0.8 mm
PIN MATERIAL brass
PIN PLATING tin
WEIGHT 1.8 g
Additional Resources: Product Page | 3D Model | PCB Footprint
date 02/13/2020│ page 3 of 3CUI Devices │ MODEL: HSS-B20-061H-03 │ DESCRIPTION: HEAT SINK
cuidevices.com
CUI Devices oers a one (1) year limited warranty. Complete warranty information is listed on our website.
CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no
responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any
component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to aect its safety or
eectiveness.
rev. description date
1.0 initial release 03/29/2017
1.01 brand update 02/13/2020
The revision history provided is for informational purposes only and is believed to be accurate.
REVISION HISTORY
Additional Resources: Product Page | 3D Model | PCB Footprint