General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 1 of 3
Wire Bondable
Chip Resistors
• Discrete or tapped schematics
• MIL inspection available
• High resistor density
WBC Series
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil® tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil® resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Absolute Tolerance to ±0.1%
Absolute TCR to ±25ppm/°C
Package Power Rating
(@ 70°C) 250mW
Rated Operating Voltage
(not to exceed P x R ) 100V
Operating Temperature -55°C to +150°C
Noise <-30dB
Substrate Material Oxidized Silicon
(10KÅ SiO2 min)
Substrate Thickness 0.010˝ ±0.001
(0.254mm ±0.025)
Bond Pad
Metallization
Aluminum 10KÅ minimum
Gold 15KÅ minimum
Backside
R0202 and
T0303
Silicon
(Al / Au optional)
B0202 3KÅ Au minimum
10KÅ Al minimum
Passivation Silicon Dioxide or
Silicon Nitride
√
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
0.004˝ min bond pad size
Back contact
Top contact
Physical Data
R0202 - Discrete
T0303 - Tapped network ½R + ½R
B0202 - Discrete back contact
Top contact
pad chamfered
R
R
½R ½R
0.004˝ min bond pad size
Electrical Data
© IRC Advanced Film Division • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 3
Manufacturing Capabilities Data
Wire Bondable
Chip Resistors
Power Derating Data
Absolute TCR Commercial
Code
MIL Inspection
Code*
±300ppm/°C 00 04
±100ppm/°C 01 05
±50ppm/°C 02 06
±25ppm/°C 03 07
TCR/Inspection Code Table
Resistance Range Available Absolute
Tolerances
Available Ratio
Tolerances (T0303 only) Best Absolute TCR Tracking TCR
(T0303 only)
10Ω - 20ΩG J K F G J ±100ppm/°C ±50ppm/°C
21Ω - 50ΩF G J K F G J ±100ppm/°C ±50ppm/°C
51Ω - 100ΩC D F G J K C D F G J ±100ppm/°C ±25ppm/°C
101Ω - 200ΩC D F G J K C D F G J ±50ppm/°C ±10ppm/°C
201Ω - 500ΩB C D F G J K B C D F G J ±50ppm/°C ±5ppm/°C
501Ω - 999ΩB C D F G J K B C D F G J ±25ppm/°C ±2ppm/°C
1.0KΩ - 1.0MΩB C D F G J K A B C D F G J ±25ppm/°C ±2ppm/°C
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection
© IRC Advanced Film Division • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 3 of 3
Wire Bondable
Chip Resistors
Environmental Data
Prefix WBC - R0202 A S - 01 - 1002 - F B
Style
R0202 = Discrete Element
B0202 = Discrete Element with Back Contact
T0303 = Tapped Network
Bonding pads
A = Aluminum; G = Gold
Backside
A = Aluminum; G = Gold; S = Silicon
TCR/Inspection Code
Reference TCR/Inspection Code Table
Total Resistance (R)
4-Digit Resistance Code Ex: 1002 = 10KΩ; 50R1 = 50.1Ω
Absolute Tolerance Code
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (T0303 Only)
J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your
specific requirements, please contact our Applications Team using the contact details below.
Ordering Data
Test Method Max ∆R Typical ∆R
Thermal Shock
MIL-STD-202
Method 107
Test condition F
±0.1% ±0.02%
High Temperature Exposure
MIL-STD-883
Method 1008
150°C, 1000 hours
±0.1% ±0.05%
Low Temperature Storage -55°C, 1000 hours ±0.03% ±0.01%
Life
MIL-STD-202
Method 108
70°C, 1000 hours
±0.5% ±0.01%
Life at Elevated Temperature
MIL-STD-202
Method 108
125°C, 1000 hours
±0.5% ±0.05%
